Air Patents (Class 361/690)
  • Patent number: 10411560
    Abstract: An electric machine having a tangential architecture comprising a rotor, rotating about an axis of rotation, a stator, coaxial to the rotor with respect to said axis of rotation, the stator comprising a casing which at least partially incorporates the rotor, a power supply body which incorporates a controller for the actuation, the power supply and the control of the electric machine. The power supply body is located outside the stator and parallel to the axis of rotation in a position substantially tangent to the casing of the stator. The controller includes a power module to power the electric machine. The power module is provided with a main heat sink, suitable to dissipate the thermal power emitted by the power module itself, and the power module is thermally insulated from the remaining controller.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: September 10, 2019
    Assignee: MAGNETI MARELLI S.P.A.
    Inventors: Francesco Leli, Marzio Lettich, Matteo Cataldi
  • Patent number: 10383260
    Abstract: The application relates to a power module (10) including: pieces of electrical equipment (12), at least first (14) and second (16) electronic cards, and a cooling device (20), able to discharge the heat given off by the pieces of electrical equipment and electronic cards. The cooling devices include first (34) and second (36) surfaces thermally insulated from one another, the pieces of electrical equipment (12) being in thermal contact with the first surface and separated from the second surface. The first electronic card (14) is fastened to a piece of electrical equipment (12) and thermally connected to the second surface (36) of the cooling device by a heat sink (42). The second electronic card (16) is positioned close to the second surface (36), or in contact with the second surface.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: August 13, 2019
    Assignee: ALSTOM Transport Technologies
    Inventor: Christophe Audemar
  • Patent number: 10375856
    Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: August 6, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chang-Han Tsai, Shui-Fa Tsai, Hsin-Hung Chen
  • Patent number: 10358048
    Abstract: An onboard battery includes predetermined members such as battery modules, and a housing case. An internal space of the housing case is partitioned by a partition plate into an upper space and a lower space in which the predetermined members are disposed, and the battery modules are disposed below the partition plate. The housing case has a bottom surface on which the battery modules are disposed, a front surface that has a front-side tightening part, and a rear surface that has a rear-side tightening part. The partition plate has a partition base that partitions the internal space of the housing case into the upper space and the lower space, a front-side fixation target part that is continuous with a front end of the partition base, and a rear-side fixation target part that is continuous with a rear end of the partition base.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: July 23, 2019
    Assignee: SUBARU CORPORATION
    Inventors: Toshiyuki Hara, Takayuki Tokunaga
  • Patent number: 10356933
    Abstract: A data center may be organized into modules, wherein the modules are purchased pre-configured to provide certain functionality of an information handling system. The modules may include utility modules, information technology (IT) modules, and air handling unit (AHU) modules. The utility module may provide infrastructure for other modules, such as electrical power service infrastructure. Electrical power may be provided by the utility module to other modules through two or more redundant busses connected to different electrical sources. The utility module may also include a control system that allows the utility services to be reconfigured to allow installation of new modules without interrupting service to existing modules.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: July 16, 2019
    Assignee: Dell Products L.P.
    Inventors: Mark Mcgrath Bailey, Trey S. Wiederhold, Ty R. Schmitt
  • Patent number: 10251315
    Abstract: One feature pertains to cooling of a high density array of non-volatile memory mass storage devices within a computer enclosure. A coolant is moved through the enclosure through two separate air paths, each serving approximately half of the mass storage devices. The two air paths are interleaved in a central duct ported to a frontal and a rear plenum. The central duct contains two groups of fans with a flow axis perpendicular to the plane of the server enclosure but with opposite flow direction with the two groups vertically offset relative to each other. The two paths are separated from each other through dividers. Both paths intake coolant from the cold isle and exhaust the coolant to the hot isle. The non-volatile memory mass storage devices include electromechanical and solid state devices.
    Type: Grant
    Filed: April 20, 2018
    Date of Patent: April 2, 2019
    Assignee: SANMINA CORPORATION
    Inventors: Matthew Phillip Mitchell, Eugene McCabe, Ritesh Kumar, Donald Chong Lee, Franz Michael Schuette
  • Patent number: 10238013
    Abstract: A cooling system for cooling electronic aircraft equipment comprises a primary cooling arrangement configured to provide basic cooling energy for cooling the electronic aircraft equipment and a supplemental cooling arrangement configured to provide supplemental cooling energy for cooling the electronic aircraft equipment. The supplemental cooling arrangement comprises a coolant supply system and a coolant distribution system. The coolant supply system is configured to supply a compressed coolant to the electronic aircraft equipment to be cooled, and the coolant distribution system is configured to selectively direct the compressed coolant supplied by the coolant supply system to at least one of a plurality of components of the electronic aircraft equipment.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: March 19, 2019
    Assignee: Airbus Operations GmbH
    Inventors: Jens Schult, J. Stephen M Whyte
  • Patent number: 10214952
    Abstract: Tubular drive apparatus for a panel of a vehicle, preferably a tailgate or door, comprising two tubes which are inserted into one another in a telescopic manner, the free ends of which are each hinged to the panel of the vehicle and to the vehicle itself, the tubes being capable of being separated from one another and brought together by means of a spindle which is driven by an electric motor and comprises a spindle nut arranged thereon, in order to thus open and close the panel, the electric motor, the spindle, the spindle nut and an electronic circuit board comprising sensor elements being arranged within the tubular drive apparatus, and a power electronics unit for actuating the electric motor also being arranged on the electronic circuit board.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: February 26, 2019
    Assignee: Stabilus GMBH
    Inventors: Markus Link, Dave Sabet, Michael Knopp
  • Patent number: 10178796
    Abstract: The present invention relates to electronic equipment data center or co-location facility designs and methods of making and using the same in an environmentally aware manner, and generally provides apparatus and methods for using novel support bracket structures, and thermal panels associated with the same, that allow for distinct partitioning of air flowing in hot aisles and cold aisles, as well as for holding wiring above cabinets that are used to store electronic equipment in the facility.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: January 8, 2019
    Assignee: Switch, Ltd.
    Inventor: Rob Roy
  • Patent number: 10165711
    Abstract: An electrical device comprising electrical components, the electrical components of the electrical device being arranged in at least two separate compartments (1, 2) having walls, wherein the at least two compartments are substantially closed and arranged at a distance from each other and the walls of the at least two compartments are arranged to form walls of a cooling channel (7) between the compartments (1, 2).
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 25, 2018
    Assignee: ABB Schweiz AG
    Inventors: Aaro Pallasmaa, Jaakko Hyytiä
  • Patent number: 10130005
    Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: November 13, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lei Zhong, Linfang Jin, Jie Zou, Nanbo Kang
  • Patent number: 10091912
    Abstract: A method and system for variable air cooling for data centers. The system may include: an enclosure to be cooled suitable for housing hardware components; a cooling system including: a first air input for controllably allowing input of outside air from outside the enclosure; a second air input for controllably allowing input of recycled air from the enclosure; a selectively activatable cooling mechanism; an air output for allowing output of air into the enclosure; a first temperature monitor for monitoring an outside air temperature of air outside the enclosure; a second temperature monitor for monitoring a blowing air temperature of air at the air output; and a control mechanism for controlling an operation of the first air input, the second air input, and the cooling mechanism dependent on a monitored outside air temperature at the first temperature monitor and a monitored blowing air temperature at the second temperature monitor.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: October 2, 2018
    Assignee: International Business Machines Corporation
    Inventors: Frederic Bauchot, Jean-Yves Clement, Jean-Marc Legrand, Francois-Rene Rougeaux
  • Patent number: 10078786
    Abstract: An occupancy-sensing apparatus a device control assembly including a detector configured to generate an image wherein the device control assembly includes one or more illumination sources configured to emit illumination including at least one wavelength of radiation measurable by the detector. The apparatus includes a controller communicatively coupled to the detector configured to detect occupants based on the image generated by the detector, wherein the controller is configured to determine an active state of the detected occupants, the activity state including at least one of a stationary state or moving state.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: September 18, 2018
    Assignee: Deako, Inc.
    Inventors: Derek Richardson, Patrick Prendergast, Cole Wilson, Erik Anderson, Dana Olson
  • Patent number: 10063002
    Abstract: A network includes a first device control assembly and at least one second device control assembly. The first device control assembly is electrically connected to a power distribution panel. The first device control assembly is further configured to regulate a load. The at least one second device control assembly is electrically connected to a power distribution panel. The first device control assembly is in data communication with the at least one second device control assembly. The first device control assembly regulating the load based on the data communication from the at least one second device control assembly.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: August 28, 2018
    Assignee: DEAKO, Inc.
    Inventors: Derek Richardson, Patrick Prendergast, Cole Wilson, Erik Anderson, Dana Olson
  • Patent number: 10037061
    Abstract: A multi-stage air moving system for cooling servers in a rack includes a rack-level air moving device that moves air through the rack, one or more server-level air-moving devices that move air through one or more of the servers, one or more sensors, and an air flow control system. The sensors sense characteristics of air in the rack. The air flow control system includes one or more controllers. The one or more controllers control the rack-level air-moving device and the server-level air moving devices in response to one or more sensed characteristics.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: July 31, 2018
    Assignee: Amazon Technologies, Inc.
    Inventors: Rajan Panchapakesan, Peter George Ross
  • Patent number: 9974195
    Abstract: An electrical junction box includes a circuit assembly including a circuit board and a conductive plate, a engaging component (terminal block), a frame including an installation portion to which the engaging component is installed. A first engaging portion (first bus bar) is formed on one end side of the circuit assembly, and a second engaging portion (second bus bar) is formed on another end side of the circuit assembly. The frame includes a first engaged portion (receiving portion) that is engaged with the first engaging portion and receives the one end side of the circuit assembly. The engaging component includes a second engaged portion (auxiliary receiving portion) that is engaged with the second engaging portion and receives the other end side of the circuit assembly.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: May 15, 2018
    Assignees: AutoNetworks Technologies, Ltd., Summitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Tomohiro Ooi, Shigeki Yamane, Takehito Kobayashi, Yukinori Kita, Yoshikazu Sasaki
  • Patent number: 9967993
    Abstract: An enclosure assembly for housing printed circuit boards and related electrical components that provides secured component mounting in outdoor environments.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: May 8, 2018
    Assignee: Phoenix Contact Development and Manufacturing, Inc.
    Inventors: Kevin Walker, Tod M. Harlan, Gottlieb Oyster, Nathan Potteiger
  • Patent number: 9943005
    Abstract: A modular data center includes a plurality of first containers and a plurality of second containers. The plurality of first containers and second containers are partitioned into a plurality of functional modules respectively, the functional modules of the plurality of first containers being arranged in parallel, and the functional modules of the plurality of second containers being arranged in parallel on one side of the plurality of first containers and corresponding to the functional modules of the plurality of first containers respectively. The present disclosure combines the functional modules of the plurality of first containers and the plurality of second containers into modular data centers with different forms, capacities, and data center usability tiers, and the assembly of the plurality of first containers and second containers with standardized sizes may facilitate the transportation and reduce the time and cost of assembling and delivery of the modular data center.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: April 10, 2018
    Assignee: Alibaba Group Holding Limited
    Inventor: Yanchang Chen
  • Patent number: 9917452
    Abstract: A battery charger that is configured to charge a battery pack including a secondary battery includes: a housing; and a charging circuit unit disposed in the housing. The housing defines a first air passage in which air flows to cool the secondary battery and a second air passage in which air flows to cool the charging circuit unit. The second air passage is independent from the first air passage.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: March 13, 2018
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Yuji Kishima, Toshio Mizoguchi
  • Patent number: 9911702
    Abstract: A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° C. and 260° C. to be smaller than 560 ?m.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: March 6, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tien-Szu Chen, Sheng-Ming Wang, Kuang-Hsiung Chen, Yu-Ying Lee
  • Patent number: 9904741
    Abstract: An application processing system for placing applications and their associated data into a colocation data center, wherein an application placement module is configured to perform the method of steps including: constructing a facility communication node graph; constructing a composite elastic map which represents the compute nodes in the colocation data center; associating a force function between two nodes based on communication bandwidth; constructing an application usage data space; inserting the node graph into the application data space; assigning the applications to the compute nodes; associating a force function between each application and each compute node based on the assignment; determining an elastic map energy (EME) for the elastic map, wherein the EME is the total energy of the system; and assigning the real-world applications to the real-world compute nodes in the data center if the EME is less than a threshold energy.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: February 27, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lorraine M. Herger, Neal M. Keller, James R. Kozloski, Matthew A. McCarthy, Clifford A. Pickover
  • Patent number: 9888606
    Abstract: Panels are extended from housings affixed to equipment racks that abut a cold aisle, during normal operation of the electronic equipment installed in the racks, in order to fully or partially contain the cold aisle (e.g., within a data center). The panels may extend automatically (e.g., during powering up of the equipment) and/or in response to a specific control. In response to an emergent condition (e.g., fire), and/or activation or deactivation of a control, the panels automatically retract. The retraction allows a fire suppression agent (e.g., water, foam) to enter the aisle, may allow easier access to the equipment, and/or provide other benefits. The panels are generally transparent in order to allow light to enter the aisle even when the panels are extended. In its extended orientation, a given panel may engage or be in contact with an opposing panel (e.g., across the cold aisle) and/or an adjacent panel.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: February 6, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Eric Wendorf, Ileana M. Aquino-Otero
  • Patent number: 9839156
    Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: December 5, 2017
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kris H. Campbell, Shin Katsumata, Mark H. Severson
  • Patent number: 9817202
    Abstract: A telecommunications cable management assembly (100) for a distribution frame (10) is disclosed. The cable management assembly (100) includes a front plate (110) extending between first and second ends (110a, 110c) and is provided with apertures (112) for mounting telecommunications components (20). A first side bracket (120) is mounted with the first end (110a) of the front plate (110) to the distribution frame (10). The first side bracket (120) supports cables (26) extending laterally from components (20). A second side bracket (130) is mounted with the second end (110c) of the front plate (110) to the distribution frame (10). The second side bracket (130) can also support cables (28) extending laterally from components (20).
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 14, 2017
    Assignee: COMMSCOPE CONNECTIVITY BELGIUM BVBA
    Inventors: Danny Ghislain Thijs, Heidi Bleus, Willem De Vis
  • Patent number: 9820406
    Abstract: An enclosure and a method for dispersing heat generated by an electrical component within the enclosure is provided and includes associating the electrical component with a conductive via/trace such that the conductive via/trace absorbs the heat generated by the electrical component, wherein the conductive via/trace is constructed from a heat conducting material; directing heat generated by the electrical component away from the electrical component by associating the conductive via/trace with a column having a column wall that defines a column cavity communicated with a column first opening and a column second opening, wherein the column wall is thermally conductive to receive heat flowing into the at least one of the plurality of columns; and allowing an airflow to flow through the column first opening into the column cavity and out of the column second opening, such that the airflow contacts the column wall within the column cavity.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: November 14, 2017
    Inventors: Andrew Errato, Jr., Tyrone Mellon, Philip C. Black
  • Patent number: 9820382
    Abstract: A connector is provided and includes a bottom, a top case positioned above the bottom case, and a partition is positioned between the top case and the bottom case. A plurality of ports is provided between the top case and the bottom case and the ports are separated by the partition. A temperature exchange device is mounted on the bottom case.
    Type: Grant
    Filed: April 1, 2015
    Date of Patent: November 14, 2017
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Honghao Wu, Marshall Chen, Tim Xue, Polly Liu, Helena Sun
  • Patent number: 9814160
    Abstract: A modular data center includes a cooling module with a cooling module enclosure and a first cooling unit housed within the cooling module enclosure. The cooling module enclosure includes a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit. The center further includes a data module with a data module enclosure for housing data equipment. The data module enclosure includes a second interface side wall with a first data module supply opening that receives the first portion of cooling air from the first cooling module supply opening such that the first portion of cooling air flows into the data module enclosure and removes heat from the data equipment.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: November 7, 2017
    Assignee: Baselayer Technology, LLC
    Inventors: William Slessman, Andreas Zoll
  • Patent number: 9769957
    Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: September 19, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Richard Chadwick Towner, Kraig Knight, John William Eichelberg, Peter George Ross
  • Patent number: 9750164
    Abstract: Described herein is an integrated data center that provides for efficient cooling, as well as efficient wire routing.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: August 29, 2017
    Assignee: Switch, Ltd.
    Inventor: Rob Roy
  • Patent number: 9681565
    Abstract: Systems, processes, and manufactures are provided that employ a casing associated with an electrical component to provide some, most, substantially all or all electrical insulative protection necessary for the electrical component. This casing may be further employed with potting or other materials to supplement and add additional or different protections for the component. These additional protections can include additional insulative resistance, thermal protection, moisture protection and other buffers to and from the environment.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: June 13, 2017
    Assignee: SunPower Corporation
    Inventors: Eduardo Escamilla, Marco Marroquin, William John Morris, John Trevor Morrison, Thomas Paul Parker, Stephen Wurmlinger
  • Patent number: 9664203
    Abstract: A fan serial connection structure includes a series fan assembly and a connection member assembly. The series fan assembly includes a first fan frame and a second fan frame serially connected with the first fan frame. The connection member assembly includes a first connection member and a second connection member. The first connection member has a first locating section and two first side sections respectively connected with two ends of the first locating section. The second connection member has a second locating section and two second side sections respectively connected with two ends of the second locating section. The first and second locating sections are respectively assembled and connected with two opposite sides of the series fan assembly in the serial connection position. The first and second side sections are respectively assembled and connected with two other opposite sides of the series fan assembly in the serial connection position.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: May 30, 2017
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventor: Wen-Hao Liu
  • Patent number: 9658662
    Abstract: Resource management for data centers is disclosed. In an exemplary embodiment, a method includes determining electrical power usage for the data center, and determining cooling fluid usage for the data center. The method also includes processing a resource utilization cap for the data center, and adjust ng at least one of the electrical power and the cooling fluid for the data center based on the resource utilization cap.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: May 23, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, Ratnesh Kumar Sharma, Cullen E. Bash
  • Patent number: 9642287
    Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: May 2, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Shunichi Kikuchi, Yoshihisa Iwakiri, Naoaki Nakamura, Hiroshi Onuki
  • Patent number: 9629233
    Abstract: Methods and apparatus for implementing a synthetic jet to cool a device are provided. Examples of the techniques keep a device case cool enough to be hand-held, while allowing a higher temperature of a circuit component located in the case, to maximize circuit performance. In an example, provided is a mobile device including a synthetic jet configured to transfer heat within the mobile device. The synthetic jet can be embedded in a circuit board inside the mobile device such that the circuit board defines at least a portion of a chamber of the synthetic jet and defines an orifice of the synthetic jet. The device case can define at least one fluid channel inside the mobile device. Also, the circuit board can define a synthetic jet outlet configured to direct a fluid at the at least one fluid channel. Also provided are methods for controlling a synthetic jet.
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: April 18, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Mehdi Saeidi, Arpit Mittal, Emil Rahim, Rajat Mittal, Kambiz Samadi
  • Patent number: 9612509
    Abstract: Provided is a vibrating body mounting structure capable of reducing vibrations generated from a plurality of vibrating bodies. Vibrating body mounting structure (48) includes base member (40), a plurality of retaining members (39, 45), and connecting damper (49). The retaining members include first portions (39a, 45a) secured to the base member, and second portions (39b, 45b) adjacent to the first portions and retaining vibrating bodies (24, 25). The connecting damper connects second portion (39b) of one retaining member (39) of the plurality of retaining members to second portion (45b) of the other retaining member (45) of the plurality of retaining members.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: April 4, 2017
    Assignee: NEC DISPLAY SOLUTIONS, LTD.
    Inventor: Motoyasu Utsunomiya
  • Patent number: 9606589
    Abstract: Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: March 28, 2017
    Assignee: Intel Corporation
    Inventors: Mark J. Gallina, Jason B. Chesser, Mike G. Macgregor, Mark J. Luckeroth, Brian S. Jarrett, Thu Huynh, Eric D. Mcafee, Barrett M. Faneuf, Michelle Goeppinger
  • Patent number: 9608231
    Abstract: Provided is a display apparatus. The display apparatus includes a display panel, a back cover disposed on a rear side of the display panel, the back cover having a curved shape of which both ends protrude forward, and a fixing part fixing the back cover to maintain the curved shape of the back cover. The display panel is curved in a shape corresponding to that of the back cover.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: March 28, 2017
    Assignee: LG ELECTRONICS INC.
    Inventors: Moungyoub Lee, Sangdon Park, Choongsuk Park, Inkeun Ryu, Hyukjin Nam, Seunghyun Yun, Jaehyun Sung, Jaegi Lee
  • Patent number: 9578786
    Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be established by one surface of a component that supports one or more heat-producing components in the separate plenum, including an underside of a circuit board mounted in the interior. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.
    Type: Grant
    Filed: June 10, 2014
    Date of Patent: February 21, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Christopher Strickland Beall, Darin Lee Frink, David Edward Bryan
  • Patent number: 9570847
    Abstract: The invention provides a fixed structure for an interface card. The interface card is fixed within an interface slot by the fixed structure. The interface slot is provided on a front side therefore with at least one protruding block. The fixed structure comprises a metal shell, which is assembled to a surface of the interface card, and comprises a pressing portion and an engaging portion. When the interface card is to be inserted into the interface card, the user presses the pressing portion of the metal shell so as to expand the engaging portion. When the interface card has been inserted into the interface card, the user will release the pressing portion of the metal shell so that the engaging portion can engage with the protruding block of the interface slot. Therefore, the interface card is steady fixed within the interface slot by means of the fixed structure.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: February 14, 2017
    Assignee: INNODISK CORPORATION
    Inventors: Hsin-Jung Hung, Hsiao-Yu Wang
  • Patent number: 9572288
    Abstract: A modular data center is disclosed. The modular data center may have a plurality of unit structures arranged generally parallel to one another. A plurality of supports may be used for supporting the unit structures elevationally above a floor, and wherein adjacent ones of the unit structures form hot aisles therebetween through which hot air generated from data center components may be channeled. Each unit structure may form an elongated structure having a frame structure, a roof panel supported by the frame structure, and a ceiling panel. The unit structures may be used to channel cold air to the data center components and hot air from the hot aisles out from the unit structures.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: February 14, 2017
    Assignee: Liebert Corporation
    Inventors: Eric Wilcox, John Hoeffner, Stjepan Sinkovic, Denis Rancic, Zeljko Gjuranic
  • Patent number: 9572290
    Abstract: A modular data center includes a plurality of first containers and a plurality of second containers. The plurality of first containers and second containers are partitioned into a plurality of functional modules respectively, the functional modules of the plurality of first containers being arranged in parallel, and the functional modules of the plurality of second containers being arranged in parallel on one side of the plurality of first containers and corresponding to the functional modules of the plurality of first containers respectively. The present disclosure combines the functional modules of the plurality of first containers and the plurality of second containers into modular data centers with different forms, capacities, and data center usability tiers, and the assembly of the plurality of first containers and second containers with standardized sizes may facilitate the transportation and reduce the time and cost of assembling and delivery of the modular data center.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: February 14, 2017
    Assignee: Alibaba Group Holding Limited
    Inventor: Yanchang Chen
  • Patent number: 9541818
    Abstract: Disclosed is a cooling device including a blower including an exhaust port; and a radiator including heat radiation fins, wherein the heat radiation fins include a first heat dissipation area and a second heat dissipation area, wherein a first surface area of the heat radiation fins disposed in the first heat dissipation area is greater than that of the heat radiation fins disposed in the second heat dissipation area, wherein the exhaust port of the air blowing part includes first and second exhaust areas for exhausting cooling air, wherein an amount of the cooling air exhausted from the second exhaust area is greater than that of the first exhaust area, and wherein the first heat dissipation area is disposed in the first exhaust area, and the second heat dissipation area is disposed in the second exhaust area.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: January 10, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Akihisa Mikawa, Tetsuya Fujioka, Hideo Kanai, Yasunari Mikutsu, Satoshi Tsuchiya, Yukimi Nishi, Jun Mashimo
  • Patent number: 9523829
    Abstract: Fiber optic cable sub-assemblies having a fiber optic cable including at least one optical fiber attached to a circuit board are disclosed. The circuit board includes an active optical component in operable communication with the optical fiber for forming an active optical cable (AOC) assembly. A strain relief device attaches an end portion of the fiber optic cable to the circuit board, thereby forming the cable sub-assembly. Methods of assembling the fiber optic cable sub-assembly are also disclosed and include the step of attaching an end portion of the fiber optic cable to the circuit board.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: December 20, 2016
    Assignee: CORNING OPTICAL COMMUNICATIONS LLC
    Inventors: John Austin Keenum, Brett Allen Menke, Edward Joseph Reed, Rodger Alan Tenholder, Gary Richard Trott
  • Patent number: 9510485
    Abstract: An Expandable Modular Information Technology (EMIT) Facility (EMITF) includes: an EMIT Building Infrastructure (EMITBI) having an initial enclosure that includes: a base pad providing a fixed usable space area on which one or more modular IT components are placed; and a plurality of exterior walls, including at least one removable expansion wall (REW) that enables expansion of the usable space area of the EMITBI; a plurality of modular IT components placed within the EMITBI on the usable space, and which dissipate heat; and at least one air handling unit (AHU) in fluid communication with the enclosure to support cooling of one or more of the IT components within the enclosure. As the EMITBI is expanded to include more IT components, additional AHUs are added to the EMITF in fluid communication with a respective area of the EMITBI to provide cooling to the added IT components.
    Type: Grant
    Filed: January 6, 2015
    Date of Patent: November 29, 2016
    Assignee: Dell Products, L.P.
    Inventors: Ty Schmitt, Mark Bailey
  • Patent number: 9510484
    Abstract: A system that includes four racks arranged in a cruciform arrangement having a center, when viewed from above. Each rack has a front and a rear, with the rear of each rack facing the center of the cruciform arrangement. Each rack includes at least two electronic components, a cooling system connected to the rack and arranged to draw cool air into the rack to cool the electronic components and expel hot air from the rack via the rear of the rack, a panel movable from a first position not blocking the rear of an adjacent rack to a second position blocking the rear of the adjacent rack, and a rail system connected to the rack and for moving the rack from an operating position forward to a non-operating position.
    Type: Grant
    Filed: November 10, 2015
    Date of Patent: November 29, 2016
    Assignee: International Business Machines Corporation
    Inventor: Jean-Michel Rodriguez
  • Patent number: 9471708
    Abstract: An application processing system for placing applications and their associated data into a colocation data center, wherein an application placement module is configured to perform the method of steps including: constructing a facility communication node graph; constructing a composite elastic map which represents the compute nodes in the colocation data center; associating a force function between two nodes based on communication bandwidth; constructing an application usage data space; inserting the node graph into the application data space; assigning the applications to the compute nodes; associating a force function between each application and each compute node based on the assignment; determining an elastic map energy (EME) for the elastic map, wherein the EME is the total energy of the system; and assigning the real-world applications to the real-world compute nodes in the data center if the EME is less than a threshold energy.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: October 18, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lorraine M. Herger, Neal M. Keller, James R. Kozloski, Matthew A. McCarthy, Clifford A. Pickover
  • Patent number: 9451729
    Abstract: A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: September 20, 2016
    Assignee: DELL PRODUCTS, L.P.
    Inventor: Edmond Bailey
  • Patent number: 9439332
    Abstract: A power module includes a sealed body in which a semiconductor chip-mounted conductor plate is sealed by a resin in such a manner that a heat dissipating surface of the conductor plate is exposed, a heat dissipating member that is arranged to face the heat dissipating surface, and an insulation layer that is arranged between the sealed body and the heat dissipating member. The insulation layer has a laminated body that is made by laminating an impregnation resin-impregnated ceramic thermal spray film and a bonding resin layer in which a filler having good thermal conductivity is mixed, and that is provided to be in contact with the heat dissipating member and at least the entirety of the heat dissipating surface, and a stress relief resin portion that is provided in a gap between the heat dissipating member and the sealed body to cover an entire circumferential end portion of the laminated body.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: September 6, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Tokihito Suwa
  • Patent number: 9419268
    Abstract: Disclosed are a secondary battery and a circuit board assembly suitable for the secondary battery. The secondary battery includes a bare cell including an electrode terminal, a circuit board electrically connected to the electrode terminal and arranged on a top surface of the bare cell. The circuit board includes an installation part having a smaller thickness than rest of the circuit board. The secondary battery further includes a temperature device installed on the installation part of the circuit board to sense temperature variation of the bare cell.
    Type: Grant
    Filed: September 20, 2010
    Date of Patent: August 16, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Seongjoon Lee, Myungjun Lee
  • Patent number: 9414531
    Abstract: A modular computing system for a data center includes one or more data center modules including rack computer systems. An electrical module is coupled to the data center modules and provides electrical power to computer systems in the data center modules. The data center modules do not include any internal active cooling systems and cannot be coupled with any external active cooling systems. A data center module directs ambient air to flow into intake air plenums extending along intake sides of the rows of racks, through the rows of racks into exhaust plenums extending along exhaust sides of the rows of racks, and out into the ambient environment to cool computer systems in the racks. Directed airflow can be lateral, vertical, at least partially driven by air buoyancy gradients, at least partially induced by air moving devices internal to computer systems in the rows of racks, thereof, etc.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: August 9, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Richard Chadwick Towner, Kraig Knight, John William Eichelberg, Peter George Ross