Change Of Physical State Patents (Class 361/700)
  • Patent number: 11044838
    Abstract: Effectively control the temperature of a control unit of a railway equipment inspecting and measuring apparatus, and install the control unit of the railway equipment inspecting and measuring on the roof of the passenger car. The first space is formed between the control unit and the heat insulating case. The second space is formed between the heat insulating case and the cover. In the first space, heat is conducted between the air in the first space and the heat exchange element by the first heat conducting member, and the first fan causes circulation of the air in the first space. In the second space, heat is conducted between the air in the second space and the heat exchange element by the second heat conducting member, and the air inside the second space is diffused by blowing the air from a suction port into the second space with the second fan.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 22, 2021
    Assignee: HITACHI HIGH-TECH FINE SYSTEMS CORPORATION
    Inventors: Hideyasu Suzuki, Takeshi Kurokawa, Tomohiko Kai, Masaki Araki, Tomoya Sasaki, Takeshi Iga, Tomoharu Isozaki, Noritake Shizawa, Keishin Hamaoka, Takahiro Daikoku
  • Patent number: 11032950
    Abstract: A cooling system (100) for equipment is disclosed, the equipment comprising an air ingress (104) and an air egress (106). The cooling system comprises a compression chamber (108) arranged to compress air exiting the equipment from the equipment air egress (106), and a refrigerant circuit (110) comprising a condenser coil (112), an evaporator coil (114) and a conduit (116) arranged to convey refrigerant fluid between the condenser coil (112) and the evaporator coil (114). The evaporator coil (114) is arranged to cool air entering the equipment at the equipment air ingress (104) and the condenser coil (112) is located within the compression chamber (108). Also disclosed are methods (300, 400) and apparatus for cooling equipment.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: June 8, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Claudio D'Inca, Sergio Lanzone, Angelo Rivara
  • Patent number: 11017973
    Abstract: A heat sink apparatus for a microwave magnetron includes a thermal conduction seat, a first heat-fin set, and at least one first heat pipe. One end of the first heat pipe protrudes into the thermal conduction seat, while another end of the first heat pipe protrudes into the first heat-fin set. An antenna of the microwave magnetron is to penetrate through the thermal conduction seat.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 25, 2021
    Assignees: MASTEK TECHNOLOGIES, INC.
    Inventor: Ton-Rong Tseng
  • Patent number: 10969177
    Abstract: A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: April 6, 2021
    Assignee: HAMILTON SUNSTRAND CORPORATION
    Inventor: Scott R. Bouras
  • Patent number: 10966351
    Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: March 30, 2021
    Assignee: ELPIS TECHNOLOGIES INC.
    Inventors: Xiaojin Wei, Allan C. VanDeventer
  • Patent number: 10930579
    Abstract: A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: February 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Effendi Leobandung
  • Patent number: 10928867
    Abstract: In some examples, a system may include a plurality of cooling distribution units (CDUs) to control cooling of a plurality of computing devices based in part on average differential pressure between a supply and return for each of the plurality of CDUs, temperature of coolant in a loop flowing between each of the plurality of CDUs and computing devices, and facility valve position for each of the plurality of CDUs, wherein one CDU of the plurality of the CDUs is nominated lead CDU and broadcasts flow rate to the plurality of CDUs to follow.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: February 23, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Matthew Slaby, Aaron Childers, Tuong Tran, Tahir Cader
  • Patent number: 10907908
    Abstract: A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 2, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10890387
    Abstract: The heat sinks with vibration enhanced heat transfer are heat sinks formed from a first body of high thermal conductivity material. The first body of high thermal conductivity material is received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be a liquid heat source, including but not limited to water. The thermally conductive housing is disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 12, 2021
    Assignee: UNITED ARAB EMIRATES UNIVERSITY
    Inventors: Salah Addin Burhan Al Omari, Emad Elnajjar
  • Patent number: 10888032
    Abstract: An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: January 5, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Yukiko Wakino, Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe
  • Patent number: 10883770
    Abstract: A loop type heat pipe includes: an evaporator configured to evaporate a working fluid; a condenser configured to condense the evaporated working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. The vapor pipe includes: a lower-side metal layer; an intermediate metal layer disposed on the lower-side metal layer; an upper-side metal layer disposed on the intermediate metal layer; a pipe conduit formed by the lower-side metal layer, the intermediate metal layer and the upper-side metal layer; and a support column that is provided inside the pipe conduit, wherein the support column divides the pipe conduit into a first flow path and a second flow path. The pipe conduit has a first opening portion that communicates with the first flow path and the second flow path.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 5, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10881021
    Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: December 29, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Takeshi Shioga, Tomoyuki Abe
  • Patent number: 10866038
    Abstract: The heat sinks with vibration enhanced heat transfer for non-liquid heat sources are heat sinks formed from a first body of high thermal conductivity material received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be any non-liquid heat source, including a processor chip, an integrated circuit chip, a modular circuit package, or the like. The thermally conductive housing may be disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. Alternatively, the vibrating base may be attached to a support attached to the heat source. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: December 15, 2020
    Assignee: UNITED ARAB EMIRATES UNIVERSITY
    Inventors: Salah Addin Burhan Al Omari, Emad Elnajjar
  • Patent number: 10813249
    Abstract: An example tunable cold plate includes a body that is formed from a thermally conductive material and that includes a thermal interface surface to receive by conduction heat generated by a component of a computing device, such as a memory module. The cold plate includes a liquid coolant channel extending through the body. The cold plate also includes multiple orifices in the thermal interface surface that fluidly connect into the liquid coolant channel. The cold plate may also include one or more inserts that can be inserted into some or all of the orifices. The thermal performance of the cold plate, or a subsection thereof, may be tuned by varying the number of inserts that are inserted into the orifices of the cold plate or of the subsection.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: October 20, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Ernesto Ferrer Medina, Harvey Lunsman, Tahir Cader
  • Patent number: 10809011
    Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: October 20, 2020
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Kuang Yu Chu, Masaaki Yamamoto, Hung Wei Tseng, Masahiro Meguro, Masato Watanabe
  • Patent number: 10798854
    Abstract: Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 6, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner
  • Patent number: 10782200
    Abstract: A high-temperature pressure sensor includes a pressure sensor device and a heater shell body external to the pressure sensor device for providing heat to the pressure sensor device. A particle-generating insulation material is encapsulated within an encapsulation material to form an encapsulated insulation structure comprising the particle-generating insulation material within the encapsulation material, such that the encapsulation material substantially contains particles generated by the particle-generating insulation material within encapsulated insulation structure. The encapsulated insulation structure is disposed adjacent to an exterior of the heater shell body.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 22, 2020
    Assignee: MKS Instruments, Inc.
    Inventors: Orry Shamash, Alan Ludwiszewski, Clinton Percy, Boris Mandadzhiev
  • Patent number: 10779436
    Abstract: A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: September 15, 2020
    Assignee: International Business Machines Corporation
    Inventors: Shurong Tian, Todd E. Takken
  • Patent number: 10750639
    Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 18, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey J. Lunsman, Tahir Cader
  • Patent number: 10698458
    Abstract: A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: June 30, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew Delano, Taylor Stellman
  • Patent number: 10674635
    Abstract: A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: June 2, 2020
    Assignees: Baidu USA LLC, Baidu.com Times Technology (Beijing) Co., Ltd.
    Inventors: Tianyi Gao, Yan Cui, Xiaogang Sun, Ali Heydari
  • Patent number: 10663231
    Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 26, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Li-Kuang Tan, Shih-Kang Lin
  • Patent number: 10544707
    Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons
  • Patent number: 10405457
    Abstract: A appliance immersion tank system comprising: a generally rectangular tank adapted to immerse in a dielectric fluid a plurality of appliances, each in a respective appliance slot distributed vertically along, and extending transverse to, the long axis of the tank; a primary circulation facility adapted to circulate the dielectric fluid through the tank; a secondary fluid circulation facility adapted to extract heat from the dielectric fluid circulating in the primary circulation facility, and to dissipate to the environment the heat so extracted; and a control facility adapted to coordinate the operation of the primary and secondary fluid circulation facilities as a function of the temperature of the dielectric fluid in the tank. A plenum, positioned adjacent the bottom of the tank, is adapted to dispense the dielectric fluid substantially uniformly upwardly through each appliance slot.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: September 3, 2019
    Assignee: Midas Green Technologies, LLC
    Inventors: Christopher L. Boyd, James P. Koen, David Christopher Laguna, Thomas R. Turner, Kenneth D. Swinden, Mario Conti Garcia, John Charles Tribou
  • Patent number: 10381562
    Abstract: Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 13, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jorge Luis Rosales, Victor Chiriac, Sean Charles Andrews
  • Patent number: 10362704
    Abstract: An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: July 23, 2019
    Assignee: FUJITSU LIMITED
    Inventors: Yukihiro Hirano, Masanori Tachibana, Akira Shimasaki, Yoshimi Maekawa, Misao Umematsu, Naomi Fukunaga
  • Patent number: 10294433
    Abstract: A process for extracting a condensable vapor from a supplied gas, comprising the steps of: i) condensing the condensable vapor by cooling the supplied gas at a condensing surface, such that the supplied gas is divided into at least one condensed fraction and a product gas; while ii) removing the at least one condensed fraction from the condensing surface by mechanical scraping means.
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: May 21, 2019
    Assignee: Sage & Time LLP
    Inventors: John Grainger, Geoff Smith
  • Patent number: 10229862
    Abstract: A heat dissipation system, comprising: (a) an electronic device comprising a heat source, wherein the heat source transmits heat to a second component or an external surface of the device; (b) a heat-conducting layer being positioned such that one of its major surfaces is in operative contact with the heat source such that it is interposed between the heat source and the second component or the external surface. The heat-conducting layer comprises at least one graphene oxide-coated graphitic foil laminate which thermally shields the second component or the external surface from heat generated by the heat source, and wherein the laminate is composed of a graphitic substrate/core layer with at least one primary surface coated with a graphene oxide coating layer. This graphene oxide-coated laminate exhibits a combination of exceptional thermal conductivity, electrical conductivity, mechanical strength, surface hardness, and scratch resistance, making this the most effective heat dissipation system.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: March 12, 2019
    Assignee: Nanotek Instruments, Inc.
    Inventors: Aruna Zhamu, Mingchao Wang, Wei Xiong, Bor Z. Jang
  • Patent number: 10177066
    Abstract: A thermal management solution may be provided for a microelectronic system including a flexible integrated heat spreader, wherein the flexible integrated heat spreader may comprise a plurality of thermally conductive structures having a flexible thermally conductive film attached to and extending between each of the plurality of thermally conductive structures. The flexible integrated heat spreader may be incorporated into multi-chip package by providing a microelectronic substrate having a plurality of microelectronic devices attached thereto and by thermally contacting each of the plurality of thermally conductive structures of the flexible integrated heat spreader to its respective microelectronic device on the microelectronic substrate.
    Type: Grant
    Filed: March 2, 2017
    Date of Patent: January 8, 2019
    Assignee: Intel Corporation
    Inventors: Ameya Limaye, Shubhada Sahasrabudhe
  • Patent number: 10123463
    Abstract: Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: November 6, 2018
    Assignee: Green Revolution Cooling, Inc.
    Inventors: Christiaan Scott Best, Mark Garnett
  • Patent number: 10103521
    Abstract: Electrical power distribution plate comprising a distribution bar, a first mounting board to which the distribution bar is attached and a contactor connected to the distribution bar. The plate comprises a second mounting board attached to the distribution bar so that the distribution bar is placed between the first mounting board and the second mounting board.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: October 16, 2018
    Assignee: Zodiac Aero Electric
    Inventor: Olivier Deshayes
  • Patent number: 10008475
    Abstract: Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include a substrate, a first die, and a second die coupled to the first die and the substrate. The substrate may include an opening. At least a portion of the die may occupy at least a portion of the opening in the substrate. Other embodiments including additional apparatuses and methods are described.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: June 26, 2018
    Assignee: Intel Corporation
    Inventor: Chia-Pin Chiu
  • Patent number: 9992882
    Abstract: The present invention relates to an electronic control unit. The present invention provides an electronic control unit including: a housing which has an opening opened at one side of the housing; a printed circuit board which is accommodated in the housing and has electronic control elements mounted on the printed circuit board in order to perform a control operation; and a connector which is connected with the printed circuit board and coupled to the opening of the housing, in which a pressure correcting means, which connects an interior of the housing and an exterior of the housing and corrects pressure in the housing, is provided in the connector.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: June 5, 2018
    Assignee: Hyundai Autron Co., Ltd.
    Inventor: Dong Gi Lee
  • Patent number: 9986662
    Abstract: A cooling system includes a device to be cooled and a cooling device integrated with the device to be cooled. A cooling volume has cavities and active coolant flow controls configured to adjust coolant flow through the cavities. A reservoir is in fluid communication with the cavities and has a liquid outlet and an inlet for a gas or gas-liquid mixture. A two-phase coolant is in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A capacitance sensor is configured to determine a coolant capacitance in the cavities. A control module is configured to determine a vapor quality and void fraction of the coolant based on the measured capacitance and to increase coolant flow if the determined vapor quality and void fraction indicate a dry-out condition. A secondary cooling line removes heat from the cooling device.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 29, 2018
    Assignee: International Business Machines Corporation
    Inventors: Timothy J. Chainer, Pritish R. Parida, Joel A. Silberman
  • Patent number: 9903665
    Abstract: A heat dissipation unit and a thermal module thereof. The heat dissipation unit includes a metal main body having a chamber, an oxide coating and a working fluid. The oxide coating is coated on wall surface of the chamber instead of capillary structure. The oxide coating serves to enhance vapor/liquid circulation efficiency of the working fluid in the chamber of the heat dissipation unit so as to increase heat dissipation efficiency.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: February 27, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang
  • Patent number: 9835382
    Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: December 5, 2017
    Assignee: Acer Incorporated
    Inventors: Yung-Chih Wang, Jau-Han Ke, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 9797660
    Abstract: A heat sink assembly includes a base block having a straight mounting groove on the middle and two U-shaped mounting grooves at two opposite lateral sides, cooling fins installed in the top wall of the base block, each cooling fin having multiple tight-fit mounting holes, a U-shaped heat pipe having a lower segment peripherally press-fitted into the straight mounting groove in flush with the bottom wall of the base block and an upper segment tightly inserted into one respective tight-fit mounting hole of each cooling fin, and two symmetrical, curved heat pipes with respective U-shaped lower segments thereof respectively and peripherally press-fitted into the U-shaped mounting grooves in flush with the bottom wall of the base block and respective upper segments thereof tightly inserted into respective tight-fit mounting holes of each cooling fin. Thus, heat can be drawn upwards from a heat source and evenly distributed through the cooling fins.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: October 24, 2017
    Inventor: Tsung-Hsien Huang
  • Patent number: 9728481
    Abstract: An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: August 8, 2017
    Assignee: NVIDIA Corporation
    Inventors: Abraham F. Yee, Joe Greco, Jun Zhai, Joseph Minacapelli, John Y. Chen
  • Patent number: 9723753
    Abstract: A cooling system for cooling an electronic component has a heat pipe defined by an inner wall and an outer wall with an intermediate fluid chamber. The heat pipe has a wall to be put in contact with a cold plate and extends away from the cold plate to define a cup shape with a fluid movement member positioned within the chamber to move the fluid from an end of the chamber adjacent to the cold plate to a spaced end of the cup shape.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: August 1, 2017
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Michael J. Andres, Robert Scott Downing
  • Patent number: 9681589
    Abstract: A data center includes an air handling system and a thermal energy receptacle system. The air handling system moves air across heat producing components of electrical systems in the data center. The thermal energy receptacle system is coupled to the air handling system. The thermal energy receptacle system includes one or more heat exchangers that exchange heat between air moving through the air handling system and a fluid, one or more phase change material modules including phase change material, and a fluid transport system that transports fluid between the phase change material modules and the heat exchangers. The thermal energy receptacle system transfers heat from air passing over the one or more heat exchangers to at least one of the phase change material modules such that at least a portion of the phase change material changes phase.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: June 13, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Peter G. Ross, James R. Hamilton, Michael P. Czamara
  • Patent number: 9655281
    Abstract: Technologies for modular cooling systems for cooling electronic components installed in equipment racks are provided herein. A modular cooling system comprises a cold plate and a support manifold connected to the cold plate. Together, the support manifold and cold plate define a fluid path for cooling fluid from the support manifold to the cold plate. The modular cooling system also includes an equipment carrier including equipment cooled by the cold plate.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: May 16, 2017
    Assignee: Seagate Technology LLC
    Inventors: Laurence A. Harvilchuck, Alex Carl Worrall
  • Patent number: 9622380
    Abstract: Two-phase jet impingement cooling devices and electronic device assemblies are disclosed. In one embodiment, a cooling device includes a manifold having a fluid inlet surface, a fluid outlet surface defining an outlet manifold, and a fluid outlet. The fluid inlet surface includes an inlet channel fluidly coupled to a first jet region and a second jet region each including a plurality of jet orifices and a plurality of surface features extending from the fluid inlet surface. A target plate is coupled to the fluid outlet surface of the manifold that includes a target surface, a first heat sink, and a second heat sink. A cover plate is coupled to the fluid inlet surface of the manifold, which includes a fluid inlet port fluidly coupled to the inlet channel of the manifold, and a fluid outlet port fluidly coupled to the fluid outlet of the manifold.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: April 11, 2017
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Ercan M. Dede
  • Patent number: 9546764
    Abstract: A display device is provided. The display device includes a light engine having light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the light emitting components for improved cooling of the heat generated by the light emitting component and surrounding devices.
    Type: Grant
    Filed: July 25, 2015
    Date of Patent: January 17, 2017
    Assignee: GrafTech International Holdings Inc.
    Inventors: Alexander J. Augoustidis, Gregory P. Kramer, Robert Anderson Reynolds, III
  • Patent number: 9464849
    Abstract: A cooling device which is provided with an evaporator with a built-in wick, a condenser, and a loop type heat pipe which connects the evaporator and condenser in a loop and is provided with a liquid pipe and vapor pipe, wherein the evaporator is divided into a liquid-pipe-side case and a vapor-pipe-side case and wherein a plurality of discharge ports of working fluids and a wick in which the working fluid from the discharge ports is completely permeated are arranged between the two cases. The wick is provided with projecting parts which have recessed parts corresponding to the discharge ports, while the outer circumferential surfaces of the projecting parts are provided with grooves. The working fluid which permeates the wick is changed to a vapor inside the vapor-pipe-side case, collects in the evaporation chamber, and is discharged to the liquid pipe, and thus, dry out of the wick is prevented.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: October 11, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Hiroki Uchida, Susumu Ogata
  • Patent number: 9420729
    Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: August 16, 2016
    Assignee: Cray Inc.
    Inventors: Douglas P. Kelley, Wade J. Doll, Alexander I. Yatskov
  • Patent number: 9405335
    Abstract: A method of using a heat pipe to spot cool a component in a computer case involves disposing an evaporator portion of the heat pipe to be laterally or horizontally adjacent to, but not in direct contact with, the component in the computer case. The method further involves thermally coupling the laterally adjacent component and the evaporator portion of the heat pipe with a bridging heat transfer component.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: August 2, 2016
    Assignee: Google Inc.
    Inventors: Joshua Boilard, Daniel Fourie, William Riis Hamburgen
  • Patent number: 9335802
    Abstract: A system for cooling hard disk drives (HDDs) includes: an enclosure having a lower volume within which a cooling liquid is heated to a boiling point temperature to cause some of the cooling liquid to evaporate into a plume of rising vapor; a HDD cooling area with at least one HDD placed in the direct path of the rising vapor, which cools the at least one HDD during functional operation of the at least one HDD; and a heat source that dissipates heat into the lower volume of the enclosure, sufficient to heat the cooling liquid to the boiling point temperature. The system can also include a condenser located above both the HDD cooling area. A substantial portion of the rising vapor that passes through the HDD cooling area and cools the at least one HDD is condensed back into liquid phase on contact with the condenser.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: May 10, 2016
    Assignee: DELL PRODUCTS, L.P.
    Inventors: Austin Michael Shelnutt, James D. Curlee, Edmond I. Bailey, Richard Steven Mills
  • Patent number: 9299686
    Abstract: A method and structures are provided for implementing individual integrated circuit chip attach in a three dimensional (3D) stack. A plurality of hollow copper pillars is formed, and the hollow copper pillars are coated with lead free solder using vapor deposition.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: March 29, 2016
    Assignee: International Business Machines Corporation
    Inventors: Phillip V. Mann, Kevin M. O'Connell, Arvind K. Sinha, Karl Stathakis
  • Patent number: 9288933
    Abstract: A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein the base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.
    Type: Grant
    Filed: December 28, 2013
    Date of Patent: March 15, 2016
    Assignee: Intel Corporation
    Inventors: Gavin D. Stanley, Michael T. Crocker
  • Patent number: 9265178
    Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: February 16, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Amilcar R. Arvelo, Levi A. Campbell, Michael J. Ellsworth, Jr., Eric J. McKeever, Richard P. Snider