Abstract: A power conversion device includes a first electrical component, a second electrical component, a housing, a board, and a guide part. The first and second electrical components are accommodated in and fixed to the housing. The board has first through holes into which first signal terminals of the first electrical components are inserted, and second through holes into which second signal terminals of the second electrical components are inserted. The guide part is connected to the board so that guide holes formed therein are aligned with the second through holes. The first signal terminals are connected to the board through a first connection portion, and the second signal terminals are connected to the board through a second connection portion. A number of the first through holes disposed per unit area is greater than a number of second through holes disposed per unit area.

Abstract: The present disclosure provides a metal mesh array and a manufacturing method thereof, a thin film sensor and a manufacturing method thereof, and belongs to the field of electronic device technology. A method for manufacturing a metal mesh array includes: providing a base substrate; forming a first metal layer on the base substrate as a seed layer; forming a first interlayer dielectric layer on a side of the seed layer away from the base substrate such that the first interlayer dielectric layer includes first groove structures and second groove structures in working areas and arranged in an intersecting manner; and performing an electroplating process on the seed layer to form first metal lines in the first groove structures and second metal lines in the second groove structures. The first metal lines and second metal lines in each working area are arranged in an intersecting manner, thereby forming a metal mesh.

Abstract: A rack system which includes a rack frame and at least one reservoir for housing at least one rack-mounted immersion case is disclosed. The rack frame is configured to slidably accommodate racking and de-racking operations of the at least one rack-mounted immersion case. The at least one collapsible reservoir, which is configured to store a fluid therein, is fluidly connected to the at least one rack-mounted immersion case, has a first portion fixedly connected to the at least one rack-mounted immersion case, and a second portion fixedly connected to the rack frame. The at least one collapsible reservoir is configured to respectively collapse and expand along a racked space and a de-racked space, the racked and de-racked spaces being defined between a backplane of the at least one rack-mounted immersion case and a backplane of the rack frame, the de-racked space being larger than the racked space.

Abstract: The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.

Abstract: A heat dissipation connection structure of handheld device includes an outer frame main body and a two-phase flow heat exchange unit. The outer frame main body has a hollow receiving space at the center. The outer frame main body surrounds the hollow receiving space. The two-phase flow heat exchange unit is disposed in the hollow receiving space and connected with the outer frame main body by means of an injection molding structure member, whereby the outer frame main body and the two-phase flow heat exchange unit can be quickly and securely connected with each other.

Abstract: An example electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

Abstract: A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.

Abstract: An electronics assembly including a motor controller electronics arrangement includes a housing enclosing a solid-state switch array, a cold plate arranged within the housing and in thermal communication with the solid-state switch array, and a feeder cable. The feeder cable is electrically connected to the solid-state switch array, has a coolant jacket extending thereabout, is separated from the switch arrangement by the housing, and is in liquid communication with the cold plate to limit heat communicated by the feeder cable into the housing. Electrical systems and methods of cooling feeder cables are also described.

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a hybrid coolant distribution unit (HCDU) provides first stage cooling of secondary coolant returning from at least one cold plate in a liquid to air heat exchanger (L2AHE) and provides second stage cooling in a liquid to liquid heat exchanger (L2LHE) for secondary coolant exiting an L2AHE using varying flow rates of a primary coolant based in part on a residual temperature that is determined for such secondary coolant exiting an L2AHE.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.

Abstract: An electronic rack includes condensing, coolant distribution, and server regions. The condensing region includes a condensing container housing condensing coils and a coolant container to contain two phase coolant. The coolant distribution region includes a set of rack manifolds having at least a rack liquid supply line to receive coolant from the coolant distribution region, and a vapor line to return vapor to the coolant distribution region, a liquid return line. The server region is coupled to the condensing region and the coolant distribution region, the server region includes a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant, where, when the servers operate, the servers generate heat that is extracted by the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into a vapor.

Abstract: A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.

Abstract: The present disclosure provides a liquid cooling seal box, a box cover thereof, and an in-vehicle cooling system. The liquid cooling seal box includes a sealed heat conduction box body, an inner cavity of the heat conduction box body includes a heating device and an insulating liquid in which the heating device is immersed, the insulating liquid absorbs heat of the heating device and vaporizes, vaporized steam rises to the top of the inner cavity of the heat conduction box body to be cooled and liquefied, and a liquefied insulating liquid falls back into the insulating liquid at the bottom of the inner cavity. The liquid cooling seal box of the present disclosure resolves problems of reliability, harsh environment, balance of volume and computation power, etc., is suitable for an in-vehicle system, and may implement stable and reliable running of a server in an in-vehicle environment.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

Abstract: The present invention provides a gravity high-efficiency heat dissipation apparatus comprising an evaporator and a condenser. The evaporator comprises a housing, an evaporation chamber arranged at the housing, and a skived structure arranged inside the evaporation chamber. The condenser comprises an upper circulating main pipe, a lower circulating main pipe and one or a plurality of condensation pipes having an upper opening and a lower opening fluidly connected to the upper circulating main pipe and the lower circulating main pipe respectively. The upper circulating main pipe is fluidly connected to an upper side of the evaporator via a first connecting pipe and is fluidly connected to an upper side of the evaporation chamber. The lower circulating main pipe is fluidly connected to one side of the evaporator via a second connecting pipe and is fluidly connected to the evaporation chamber. A circumferential side of each of the condensation pipes has one or a plurality of heat dissipation fins formed thereon.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously, a pH indicator is employed to monitor the dielectric fluid.

Abstract: A case heat dissipation structure is provided, which includes a case, a heat exchange assembly and a fan assembly. The case has a first heat dissipation chamber and a second heat dissipation chamber that are communicated with each other, and multiple heat sources are mounted in the first heat dissipation chamber and the second heat dissipation chamber, a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case. The heat exchange assembly is mounted in the first heat dissipation chamber, the heat exchange assembly comprises a heat exchanger, which is arranged between the liquid inlet and the liquid outlet. The fan assembly is mounted in the first heat dissipation chamber or the second heat dissipation chamber, and is used for driving the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate mutually in operation.

Abstract: A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fluid in the housing; a first wick in contact with the vapor flow pass; and a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet. The first wick defines a first liquid flow pass, the second wick defines a second liquid flow pass, and a first average diameter of the first liquid flow pass is smaller than or equal to 75% of a second average diameter of the second liquid flow pass.

Abstract: An evaporative cooling system having a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device. The heat dissipating device comprises a second medium, and the evaporator is configured to receive heat from the heat conducting device to heat the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device.

Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

Abstract: An electric device includes an electric component mounted on a circuit board, a cabinet, a heat conducting member, and an elastic portion. The cabinet faces the circuit board. The heat conducting member has heat conductivity, a first contact portion that is in contact with the electric component, and at least one second contact portion that is in contact with the cabinet. The elastic portion has elasticity in a direction in which the circuit board and the cabinet face each other. The first contact portion and the second contact portion are separated from each other in the direction in which the circuit board and the cabinet face each other. The elastic portion applies an elastic force to at least one of the first contact portion and the second contact portion in a direction in which the first contact portion and the second contact portion are separated from each other.

Abstract: An outdoor unit includes a casing including an air passage, an outdoor fan disposed in the air passage, a compressor disposed in the casing, an outdoor heat exchanger disposed in the casing and including fins and a heat transfer tube connected to the fins, a control board disposed in the casing and including a control unit that controls the compressor, and a heat sink disposed in the air passage in the casing and being in contact with the control board. The heat transfer tube of the outdoor heat exchanger includes a first region in which gas refrigerant or two-phase gas-liquid refrigerant flows when the outdoor heat exchanger is used as a condenser and a second region that is located downstream of the first region in a refrigerant flow direction and in which single-phase liquid refrigerant flows.

Abstract: A radiator of a display card includes a heat absorbing set, a main cooling set, and a pump assembly. The heat absorbing set has a heat absorbing base disposed on the display card and a heat exchanging tank disposed on the heat absorbing base. The main cooling set mainly includes two opposite containers disposed at two ends of a frame unit and filled with a cooling material, heat dissipating pipes communicating with the containers and inserting into the heat exchanging tank, and radiating fins disposed between the heat dissipating pipes to contribute to heat dissipation. The cooling material circulates between the containers and passes the heat exchanging tank via the heat dissipating pipes to dissipate heat and reduce the temperature of the display card effectively. The radiator is assembled with a compact structure whereby a small volume is provided to facilitate the development of computer miniaturization.

Abstract: A DC monitoring system is configured to measure and analyze VFD (Variable Frequency Drive) operational characteristics. The VFD is configured to receive three-phase input power from a standardized source and to provide variable frequency three-phase output power to a three-phase motor. In some applications, the VFD and motor operate at a medium voltage. The VFD can include multiple inverter modules consisting of a DC section and switching section, also referred to as a multiple bus configuration. The DC monitoring system includes a measurement module coupled to each DC bus of the VFD, a data communication network, and a PQube monitoring device for transmitting data signals corresponding to voltage values of the VFD DC bus obtained in a medium voltage compartment to a low voltage compartment for processing and analysis. Processing of the data signals enables comparative and predictive analysis to determine early warning for possible capacitance failure in the VFD.

Abstract: The present disclosure relates to a wick structure accommodated in a container of a heat pipe having plural foils and a structure holding portion for fixing the foils. The respective foils are held by the structure holding portion, whereby the foils are positions and arrange in parallel. The foil is connected to the other foils including the other adjacent foils via the structure holding portion.

Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.

Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.

Abstract: Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, depending on outdoor air conditions. The systems can operate in a blended mode between the adiabatic mode and the evaporative mode by varying the distribution of return water from the recovery coil into at least partially isolated sections of a storage tank, and selectively directing cold water from the evaporative cooler into the tank. The mix of warm and cold water exiting the tank can be varied to maintain the cold-water supply at or near a set point temperature for the heat load. In an example, the systems can include a pre-cooler in the plenum upstream of the evaporative cooler for pre-conditioning the scavenger air.

Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit. Robotic components facilitate automation.

Abstract: According to one embodiment, a liquid distribution system includes a main liquid supply and return unit, a mounting rail that extends along at least a portion of a height of the electronic rack, and a connecting unit that is slidably coupled to the mounting rail and is coupled to the main liquid supply and return unit via a flexible supply line and a flexible return line, the connecting unit is arranged to couple to a piece of information technology (IT) equipment to circulate coolant from the main liquid supply and return unit through the piece of IT equipment to create a heat-transfer loop that transfers thermal energy away from the piece of IT equipment and into the coolant.

Abstract: An apparatus includes a frame component of a head-mounted device (HMD), an eyepiece, a battery, a processor, a heat pipe, and a hinge. The frame component includes a first compartment, a second compartment, and a channel connecting the first compartment and the second compartment. The heat pipe may extend from the first compartment to the second compartment through a channel and may be configured to transfer heat from the processor to the battery. A rate of heat transfer through the hinge may be greater than a threshold value when the hinge is in an open conformation that configures the frame component to be positioned along the side of the head. The heat transfer through the hinge may be smaller than the threshold value when the hinge is in a folded conformation that configures the frame component to be positioned for storage.

Abstract: A controller 50 that controls a power tool such as, for example, a portable circular saw includes a controller case 70 that houses an electric circuit board 60. Electric elements 61, 62 that generate heat and/or are to be cooled on the electric circuit board 60 contact a thick wall portion 73b of the controller case 70, resulting in heat dissipation resulting in effective cooling of the controller 50.

Abstract: A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.

Abstract: A method may include receiving, via one or more processors, back electromotive force (EMF) data associated with each motor electrically coupled to a printed circuit board and determining, via the processors, a corresponding motor controller associated with each motor based on the EMF data. The motor controllers may be electrically coupled to the printed circuit board. The method may also include automatically adjusting, via the processors, circuit connections associated with the printed circuit board to route wiring that controls each motor to the corresponding motor controller.

Abstract: Disclosed are row cooling units and connecting units with a network of integrated fluid distribution piping that may be interconnected to construct a liquid cooling system to carry way heat generated by servers housed within the server racks used in data centers. The assembly of row cooling units and connecting units may be connected to the supply and return loops of the data center facility to distribute cooling liquid to the electronic components of the servers and to return heated liquid for heat removal. The network of fluid distribution piping integrated into the row cooling units and connecting units enables the configuration of the liquid cooling system to be independent of the fixed infrastructure of the facility, affording ease of scalability, serviceability, maintenance, while increasing efficiency, resiliency, availability and reliability of the liquid cooling system critical to the operation and performance of the data center.

Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

Abstract: A controller 50 that controls a power tool such as, for example, a portable circular saw includes a controller case 70 that houses an electric circuit board 60. Electric elements 61, 62 that generate heat and/or are to be cooled on the electric circuit board 60 contact a thick wall portion 73b of the controller case 70, resulting in heat dissipation resulting in effective cooling of the controller 50.

Abstract: A heat sink may comprise a core body having a phase change material cavity enclosed therein; and a phase change material disposed within the phase change material cavity comprising a paraffin wax and/or a fatty acid ester.

Abstract: A mobile hardware heat dissipating and protection device is disclosed. The device comprises a front layer, back layer, and protective housing into which a mobile device may be installed. The front layer and back layer attach around the mobile device, and are then enclosed by the protective housing. The back layer may comprise a series of heat-dissipating devices, which may include a thermal gel layer and a plurality of heat-dissipating fins. The protective layer may encompass the heat-dissipating fins so as to protect them from damage and contamination, and may create an open space into which air may flow. The protective layer also incorporates a plurality of vents or openings through which the air may flow into the case and over the fins. The device may also incorporate a micro fan to assist with air flow.

Abstract: A cold plate includes: a base plate including a plurality of fins aligned in parallel; and a cover that covers the plurality of fins and that forms an internal space between the base plate and the cover. The plurality of fins includes: a first fin group in which a plurality of first fins having a first width are disposed on the base plate with a fixed gap in a parallel direction between each of the first fins and a second fin group in which a plurality of second fins having a width wider than the first width are disposed on the base plate with the fixed gap in the parallel direction between each of the second fins. The second fin group is disposed on both sides of the first fin group.

Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.

Abstract: Effectively control the temperature of a control unit of a railway equipment inspecting and measuring apparatus, and install the control unit of the railway equipment inspecting and measuring on the roof of the passenger car. The first space is formed between the control unit and the heat insulating case. The second space is formed between the heat insulating case and the cover. In the first space, heat is conducted between the air in the first space and the heat exchange element by the first heat conducting member, and the first fan causes circulation of the air in the first space. In the second space, heat is conducted between the air in the second space and the heat exchange element by the second heat conducting member, and the air inside the second space is diffused by blowing the air from a suction port into the second space with the second fan.

Abstract: A cooling system (100) for equipment is disclosed, the equipment comprising an air ingress (104) and an air egress (106). The cooling system comprises a compression chamber (108) arranged to compress air exiting the equipment from the equipment air egress (106), and a refrigerant circuit (110) comprising a condenser coil (112), an evaporator coil (114) and a conduit (116) arranged to convey refrigerant fluid between the condenser coil (112) and the evaporator coil (114). The evaporator coil (114) is arranged to cool air entering the equipment at the equipment air ingress (104) and the condenser coil (112) is located within the compression chamber (108). Also disclosed are methods (300, 400) and apparatus for cooling equipment.

Abstract: A heat sink apparatus for a microwave magnetron includes a thermal conduction seat, a first heat-fin set, and at least one first heat pipe. One end of the first heat pipe protrudes into the thermal conduction seat, while another end of the first heat pipe protrudes into the first heat-fin set. An antenna of the microwave magnetron is to penetrate through the thermal conduction seat.

Abstract: A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.

Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.

Abstract: In some examples, a system may include a plurality of cooling distribution units (CDUs) to control cooling of a plurality of computing devices based in part on average differential pressure between a supply and return for each of the plurality of CDUs, temperature of coolant in a loop flowing between each of the plurality of CDUs and computing devices, and facility valve position for each of the plurality of CDUs, wherein one CDU of the plurality of the CDUs is nominated lead CDU and broadcasts flow rate to the plurality of CDUs to follow.

Abstract: A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.

Abstract: A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.