Change Of Physical State Patents (Class 361/700)
  • Patent number: 11452235
    Abstract: A case heat dissipation structure is provided, which includes a case, a heat exchange assembly and a fan assembly. The case has a first heat dissipation chamber and a second heat dissipation chamber that are communicated with each other, and multiple heat sources are mounted in the first heat dissipation chamber and the second heat dissipation chamber, a liquid inlet for cooling liquid to flow in and a liquid outlet for cooling liquid to flow out are provided on the case. The heat exchange assembly is mounted in the first heat dissipation chamber, the heat exchange assembly comprises a heat exchanger, which is arranged between the liquid inlet and the liquid outlet. The fan assembly is mounted in the first heat dissipation chamber or the second heat dissipation chamber, and is used for driving the air in the first heat dissipation chamber and the second heat dissipation chamber to circulate mutually in operation.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: September 20, 2022
    Assignee: SUNGROW POWER SUPPLY CO., LTD.
    Inventors: Shengwei Gong, Xiaolei Shi, Pengli Ai, Gaozhou Tao
  • Patent number: 11441847
    Abstract: An evaporative cooling system having a heat conducting device, the heat conducting device being capable of coupling to a heating element to be cooled and the heat conducting device comprising a first medium; a heat dissipating device having one or more heat dissipating outlets; and an evaporator disposed in the heat dissipating device and arranged in relation to the heat conducting device that is arranged at least partially outside the heat dissipating device. The heat dissipating device comprises a second medium, and the evaporator is configured to receive heat from the heat conducting device to heat the second medium of the heat dissipating device and discharge the heat from the one or more heat dissipating outlets of the heat dissipating device.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: September 13, 2022
    Assignee: LENOVO (BEIJING) CO., LTD.
    Inventors: Ting Tian, Lianpei Zhang
  • Patent number: 11445636
    Abstract: A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fluid in the housing; a first wick in contact with the vapor flow pass; and a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet. The first wick defines a first liquid flow pass, the second wick defines a second liquid flow pass, and a first average diameter of the first liquid flow pass is smaller than or equal to 75% of a second average diameter of the second liquid flow pass.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: September 13, 2022
    Assignees: MURATA MANUFACTURING CO., LTD., KELVIN THERMAL TECHNOLOGIES, INC.
    Inventors: Takuo Wakaoka, Tatsuhiro Numoto, Keijiro Kojima, Ryan J. Lewis
  • Patent number: 11419246
    Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 16, 2022
    Assignee: Google LLC
    Inventors: Soheil Farshchian, Kenneth Dale Shaul
  • Patent number: 11388842
    Abstract: An electric device includes an electric component mounted on a circuit board, a cabinet, a heat conducting member, and an elastic portion. The cabinet faces the circuit board. The heat conducting member has heat conductivity, a first contact portion that is in contact with the electric component, and at least one second contact portion that is in contact with the cabinet. The elastic portion has elasticity in a direction in which the circuit board and the cabinet face each other. The first contact portion and the second contact portion are separated from each other in the direction in which the circuit board and the cabinet face each other. The elastic portion applies an elastic force to at least one of the first contact portion and the second contact portion in a direction in which the first contact portion and the second contact portion are separated from each other.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: July 12, 2022
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Akira Nagasawa, Kenta Kawashima, Masayuki Kihara, Masateru Ueki
  • Patent number: 11378286
    Abstract: An outdoor unit includes a casing including an air passage, an outdoor fan disposed in the air passage, a compressor disposed in the casing, an outdoor heat exchanger disposed in the casing and including fins and a heat transfer tube connected to the fins, a control board disposed in the casing and including a control unit that controls the compressor, and a heat sink disposed in the air passage in the casing and being in contact with the control board. The heat transfer tube of the outdoor heat exchanger includes a first region in which gas refrigerant or two-phase gas-liquid refrigerant flows when the outdoor heat exchanger is used as a condenser and a second region that is located downstream of the first region in a refrigerant flow direction and in which single-phase liquid refrigerant flows.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: July 5, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Atsushi Morita, Yusuke Tashiro, Komei Nakajima, Hiroaki Makino, Yusuke Tsuboi
  • Patent number: 11379019
    Abstract: A radiator of a display card includes a heat absorbing set, a main cooling set, and a pump assembly. The heat absorbing set has a heat absorbing base disposed on the display card and a heat exchanging tank disposed on the heat absorbing base. The main cooling set mainly includes two opposite containers disposed at two ends of a frame unit and filled with a cooling material, heat dissipating pipes communicating with the containers and inserting into the heat exchanging tank, and radiating fins disposed between the heat dissipating pipes to contribute to heat dissipation. The cooling material circulates between the containers and passes the heat exchanging tank via the heat dissipating pipes to dissipate heat and reduce the temperature of the display card effectively. The radiator is assembled with a compact structure whereby a small volume is provided to facilitate the development of computer miniaturization.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: July 5, 2022
    Assignee: SHENZHEN WAN JING HUA TECHNOLOGY CO., LTD.
    Inventor: Jun-Yu Li
  • Patent number: 11366165
    Abstract: A DC monitoring system is configured to measure and analyze VFD (Variable Frequency Drive) operational characteristics. The VFD is configured to receive three-phase input power from a standardized source and to provide variable frequency three-phase output power to a three-phase motor. In some applications, the VFD and motor operate at a medium voltage. The VFD can include multiple inverter modules consisting of a DC section and switching section, also referred to as a multiple bus configuration. The DC monitoring system includes a measurement module coupled to each DC bus of the VFD, a data communication network, and a PQube monitoring device for transmitting data signals corresponding to voltage values of the VFD DC bus obtained in a medium voltage compartment to a low voltage compartment for processing and analysis. Processing of the data signals enables comparative and predictive analysis to determine early warning for possible capacitance failure in the VFD.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: June 21, 2022
    Assignee: Power Standards Lab, Inc.
    Inventors: Mark Richter, Robert Pompeani, Arya Bannazadeh-Mahani, Edward Winterberger
  • Patent number: 11346617
    Abstract: The present disclosure relates to a wick structure accommodated in a container of a heat pipe having plural foils and a structure holding portion for fixing the foils. The respective foils are held by the structure holding portion, whereby the foils are positions and arrange in parallel. The foil is connected to the other foils including the other adjacent foils via the structure holding portion.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: May 31, 2022
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tomomi Kaibuchi, Tomoaki Toratani
  • Patent number: 11330734
    Abstract: A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: May 10, 2022
    Assignee: HTC CORPORATION
    Inventors: Chih-Kuang Wang, Chin Kai Sun, Chun-Lung Chu, Tung-Hsin Yeh
  • Patent number: 11324106
    Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: May 3, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Patent number: 11304335
    Abstract: Conditioning systems and methods for providing cooling to a heat load can include an evaporative cooler arranged in a scavenger plenum with a recovery coil downstream of the evaporative cooler. The conditioning systems can operate in various modes, including an adiabatic mode and an evaporative mode, depending on outdoor air conditions. The systems can operate in a blended mode between the adiabatic mode and the evaporative mode by varying the distribution of return water from the recovery coil into at least partially isolated sections of a storage tank, and selectively directing cold water from the evaporative cooler into the tank. The mix of warm and cold water exiting the tank can be varied to maintain the cold-water supply at or near a set point temperature for the heat load. In an example, the systems can include a pre-cooler in the plenum upstream of the evaporative cooler for pre-conditioning the scavenger air.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: April 12, 2022
    Assignee: Nortek Air Solutions Canada, Inc.
    Inventor: Philip Paul LePoudre
  • Patent number: 11277938
    Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit. Robotic components facilitate automation.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: March 15, 2022
    Assignee: TMGCore, INC
    Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala
  • Patent number: 11252844
    Abstract: According to one embodiment, a liquid distribution system includes a main liquid supply and return unit, a mounting rail that extends along at least a portion of a height of the electronic rack, and a connecting unit that is slidably coupled to the mounting rail and is coupled to the main liquid supply and return unit via a flexible supply line and a flexible return line, the connecting unit is arranged to couple to a piece of information technology (IT) equipment to circulate coolant from the main liquid supply and return unit through the piece of IT equipment to create a heat-transfer loop that transfers thermal energy away from the piece of IT equipment and into the coolant.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: February 15, 2022
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11231590
    Abstract: An apparatus includes a frame component of a head-mounted device (HMD), an eyepiece, a battery, a processor, a heat pipe, and a hinge. The frame component includes a first compartment, a second compartment, and a channel connecting the first compartment and the second compartment. The heat pipe may extend from the first compartment to the second compartment through a channel and may be configured to transfer heat from the processor to the battery. A rate of heat transfer through the hinge may be greater than a threshold value when the hinge is in an open conformation that configures the frame component to be positioned along the side of the head. The heat transfer through the hinge may be smaller than the threshold value when the hinge is in a folded conformation that configures the frame component to be positioned for storage.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: January 25, 2022
    Assignee: Google LLC
    Inventors: Christopher Hoover, Jay Kothari, Alberto Vidal, Kenneth Robertson, Jacques Gagne
  • Patent number: 11219957
    Abstract: A controller 50 that controls a power tool such as, for example, a portable circular saw includes a controller case 70 that houses an electric circuit board 60. Electric elements 61, 62 that generate heat and/or are to be cooled on the electric circuit board 60 contact a thick wall portion 73b of the controller case 70, resulting in heat dissipation resulting in effective cooling of the controller 50.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: January 11, 2022
    Assignee: MAKITA CORPORATION
    Inventor: Fumitoshi Numata
  • Patent number: 11215666
    Abstract: A method may include receiving, via one or more processors, back electromotive force (EMF) data associated with each motor electrically coupled to a printed circuit board and determining, via the processors, a corresponding motor controller associated with each motor based on the EMF data. The motor controllers may be electrically coupled to the printed circuit board. The method may also include automatically adjusting, via the processors, circuit connections associated with the printed circuit board to route wiring that controls each motor to the corresponding motor controller.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: January 4, 2022
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Ahmad K. Omari, Andrew J. Jaap, Randall S. Langer
  • Patent number: 11219141
    Abstract: A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 4, 2022
    Assignees: BAIDU USA LLC, BAIDU.COM TIMES TECHNOLOGY (BEIJING) CO., LTD.
    Inventors: Tianyi Gao, Yan Cui, Xiaogang Sun, Ali Heydari
  • Patent number: 11206745
    Abstract: Disclosed are row cooling units and connecting units with a network of integrated fluid distribution piping that may be interconnected to construct a liquid cooling system to carry way heat generated by servers housed within the server racks used in data centers. The assembly of row cooling units and connecting units may be connected to the supply and return loops of the data center facility to distribute cooling liquid to the electronic components of the servers and to return heated liquid for heat removal. The network of fluid distribution piping integrated into the row cooling units and connecting units enables the configuration of the liquid cooling system to be independent of the fixed infrastructure of the facility, affording ease of scalability, serviceability, maintenance, while increasing efficiency, resiliency, availability and reliability of the liquid cooling system critical to the operation and performance of the data center.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: December 21, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11178799
    Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 16, 2021
    Inventors: Hae-Jin Lee, Oh-Hyuck Kwon, Min Park, Jung-Je Bang, Jae-Deok Lim, Kyung-Ha Koo, Jae-Heung Ye, Chang-Tae Kim, Chi-Hyun Cho
  • Patent number: 11173558
    Abstract: A controller 50 that controls a power tool such as, for example, a portable circular saw includes a controller case 70 that houses an electric circuit board 60. Electric elements 61, 62 that generate heat and/or are to be cooled on the electric circuit board 60 contact a thick wall portion 73b of the controller case 70, resulting in heat dissipation resulting in effective cooling of the controller 50.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: November 16, 2021
    Assignee: MAKITA CORPORATION
    Inventor: Fumitoshi Numata
  • Patent number: 11162744
    Abstract: A heat sink may comprise a core body having a phase change material cavity enclosed therein; and a phase change material disposed within the phase change material cavity comprising a paraffin wax and/or a fatty acid ester.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: November 2, 2021
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Gregory John Quinn, Daniel J Kehoe
  • Patent number: 11119544
    Abstract: A mobile hardware heat dissipating and protection device is disclosed. The device comprises a front layer, back layer, and protective housing into which a mobile device may be installed. The front layer and back layer attach around the mobile device, and are then enclosed by the protective housing. The back layer may comprise a series of heat-dissipating devices, which may include a thermal gel layer and a plurality of heat-dissipating fins. The protective layer may encompass the heat-dissipating fins so as to protect them from damage and contamination, and may create an open space into which air may flow. The protective layer also incorporates a plurality of vents or openings through which the air may flow into the case and over the fins. The device may also incorporate a micro fan to assist with air flow.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: September 14, 2021
    Inventor: Ricardo Perez
  • Patent number: 11112189
    Abstract: A cold plate includes: a base plate including a plurality of fins aligned in parallel; and a cover that covers the plurality of fins and that forms an internal space between the base plate and the cover. The plurality of fins includes: a first fin group in which a plurality of first fins having a first width are disposed on the base plate with a fixed gap in a parallel direction between each of the first fins and a second fin group in which a plurality of second fins having a width wider than the first width are disposed on the base plate with the fixed gap in the parallel direction between each of the second fins. The second fin group is disposed on both sides of the first fin group.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: September 7, 2021
    Assignee: Fujikura Ltd.
    Inventors: Yuta Nakano, Yuji Saito
  • Patent number: 11112840
    Abstract: An electronic chassis for enclosing and cooling electronic equipment is described that includes an oscillating heat pipe (OHP), wherein a first portion of the OHP extends into a rail of the chassis and a second portion of the OHP extends into the side panel on which the rail is located so that at least a portion of heat from operation of electronic equipment on a circuit card assembly (CCA) in contact with the rail passes through the rail to the OHP and from the OHP to a side panel of the chassis on which the rail is located where it is dissipated into an environment. In some instances, the side panel includes cooling fins. Also described is a method for forming such a chassis substantially of metal such as aluminum or its alloys using 3D printing or additive manufacturing.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: September 7, 2021
    Assignee: Abaco Systems, Inc.
    Inventors: Joo Han Kim, Jonathan Anderson, Brian Hoden
  • Patent number: 11044838
    Abstract: Effectively control the temperature of a control unit of a railway equipment inspecting and measuring apparatus, and install the control unit of the railway equipment inspecting and measuring on the roof of the passenger car. The first space is formed between the control unit and the heat insulating case. The second space is formed between the heat insulating case and the cover. In the first space, heat is conducted between the air in the first space and the heat exchange element by the first heat conducting member, and the first fan causes circulation of the air in the first space. In the second space, heat is conducted between the air in the second space and the heat exchange element by the second heat conducting member, and the air inside the second space is diffused by blowing the air from a suction port into the second space with the second fan.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 22, 2021
    Assignee: HITACHI HIGH-TECH FINE SYSTEMS CORPORATION
    Inventors: Hideyasu Suzuki, Takeshi Kurokawa, Tomohiko Kai, Masaki Araki, Tomoya Sasaki, Takeshi Iga, Tomoharu Isozaki, Noritake Shizawa, Keishin Hamaoka, Takahiro Daikoku
  • Patent number: 11032950
    Abstract: A cooling system (100) for equipment is disclosed, the equipment comprising an air ingress (104) and an air egress (106). The cooling system comprises a compression chamber (108) arranged to compress air exiting the equipment from the equipment air egress (106), and a refrigerant circuit (110) comprising a condenser coil (112), an evaporator coil (114) and a conduit (116) arranged to convey refrigerant fluid between the condenser coil (112) and the evaporator coil (114). The evaporator coil (114) is arranged to cool air entering the equipment at the equipment air ingress (104) and the condenser coil (112) is located within the compression chamber (108). Also disclosed are methods (300, 400) and apparatus for cooling equipment.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: June 8, 2021
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Claudio D'Inca, Sergio Lanzone, Angelo Rivara
  • Patent number: 11017973
    Abstract: A heat sink apparatus for a microwave magnetron includes a thermal conduction seat, a first heat-fin set, and at least one first heat pipe. One end of the first heat pipe protrudes into the thermal conduction seat, while another end of the first heat pipe protrudes into the first heat-fin set. An antenna of the microwave magnetron is to penetrate through the thermal conduction seat.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: May 25, 2021
    Assignees: MASTEK TECHNOLOGIES, INC.
    Inventor: Ton-Rong Tseng
  • Patent number: 10969177
    Abstract: A pin fin heat sink includes a plurality of pin fins extending from a base plate, at least one of the plurality of pin fins defining a hollow portion therein. The pin fin heat sink also includes an annular ring of metal foam material disposed within the hollow portion, the annular ring of metal foam material having a radially outer surface in direct contact with an inner diameter of the pin fin, the annular ring of metal foam material defining a central cavity. The pin fin heat sink further includes a phase change material disposed within the central cavity.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: April 6, 2021
    Assignee: HAMILTON SUNSTRAND CORPORATION
    Inventor: Scott R. Bouras
  • Patent number: 10966351
    Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: March 30, 2021
    Assignee: ELPIS TECHNOLOGIES INC.
    Inventors: Xiaojin Wei, Allan C. VanDeventer
  • Patent number: 10928867
    Abstract: In some examples, a system may include a plurality of cooling distribution units (CDUs) to control cooling of a plurality of computing devices based in part on average differential pressure between a supply and return for each of the plurality of CDUs, temperature of coolant in a loop flowing between each of the plurality of CDUs and computing devices, and facility valve position for each of the plurality of CDUs, wherein one CDU of the plurality of the CDUs is nominated lead CDU and broadcasts flow rate to the plurality of CDUs to follow.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: February 23, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Matthew Slaby, Aaron Childers, Tuong Tran, Tahir Cader
  • Patent number: 10930579
    Abstract: A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: February 23, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Effendi Leobandung
  • Patent number: 10907908
    Abstract: A cooler includes a plurality of loop heat pipes. Each of the plurality of loop heat pipes includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid, a liquid pipe that connects the evaporator and the condenser, and a vapor pipe that connects the evaporator and the condenser, and forms a loop-shaped passage together with the liquid pipe. Evaporators of the plurality of loop heat pipes overlap each other, and a pressure inside the loop-shaped passage is different among the plurality of loop heat pipes.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 2, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10890387
    Abstract: The heat sinks with vibration enhanced heat transfer are heat sinks formed from a first body of high thermal conductivity material. The first body of high thermal conductivity material is received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be a liquid heat source, including but not limited to water. The thermally conductive housing is disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 12, 2021
    Assignee: UNITED ARAB EMIRATES UNIVERSITY
    Inventors: Salah Addin Burhan Al Omari, Emad Elnajjar
  • Patent number: 10883770
    Abstract: A loop type heat pipe includes: an evaporator configured to evaporate a working fluid; a condenser configured to condense the evaporated working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. The vapor pipe includes: a lower-side metal layer; an intermediate metal layer disposed on the lower-side metal layer; an upper-side metal layer disposed on the intermediate metal layer; a pipe conduit formed by the lower-side metal layer, the intermediate metal layer and the upper-side metal layer; and a support column that is provided inside the pipe conduit, wherein the support column divides the pipe conduit into a first flow path and a second flow path. The pipe conduit has a first opening portion that communicates with the first flow path and the second flow path.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: January 5, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10888032
    Abstract: An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: January 5, 2021
    Assignee: FUJITSU LIMITED
    Inventors: Yukiko Wakino, Satoshi Inano, Hiroyuki Fukuda, Minoru Ishinabe
  • Patent number: 10881021
    Abstract: A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: December 29, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Takeshi Shioga, Tomoyuki Abe
  • Patent number: 10866038
    Abstract: The heat sinks with vibration enhanced heat transfer for non-liquid heat sources are heat sinks formed from a first body of high thermal conductivity material received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be any non-liquid heat source, including a processor chip, an integrated circuit chip, a modular circuit package, or the like. The thermally conductive housing may be disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. Alternatively, the vibrating base may be attached to a support attached to the heat source. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: December 15, 2020
    Assignee: UNITED ARAB EMIRATES UNIVERSITY
    Inventors: Salah Addin Burhan Al Omari, Emad Elnajjar
  • Patent number: 10813249
    Abstract: An example tunable cold plate includes a body that is formed from a thermally conductive material and that includes a thermal interface surface to receive by conduction heat generated by a component of a computing device, such as a memory module. The cold plate includes a liquid coolant channel extending through the body. The cold plate also includes multiple orifices in the thermal interface surface that fluidly connect into the liquid coolant channel. The cold plate may also include one or more inserts that can be inserted into some or all of the orifices. The thermal performance of the cold plate, or a subsection thereof, may be tuned by varying the number of inserts that are inserted into the orifices of the cold plate or of the subsection.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: October 20, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Ernesto Ferrer Medina, Harvey Lunsman, Tahir Cader
  • Patent number: 10809011
    Abstract: Provided is a heat sink where the formation of a boundary layer on surfaces of heat radiating fins is suppressed so that portions other than on the windward side along the cooling air flow can also exhibit excellent heat radiation property. The heat sink includes: a base plate; a first heat radiating fin thermally connected to the base plate; and a second heat radiating fin disposed adjacently to a side end portion of the first heat radiating fin, and thermally connected to the base plate, wherein a surface of the first heat radiating fin is not parallel to a surface of the second heat radiating fin, and at least one of the second heat radiating fins is disposed at a position lower than at least one of the first heat radiating fins in a vertical direction with respect to a front surface of the base plate.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: October 20, 2020
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Kuang Yu Chu, Masaaki Yamamoto, Hung Wei Tseng, Masahiro Meguro, Masato Watanabe
  • Patent number: 10798854
    Abstract: Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 6, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner
  • Patent number: 10782200
    Abstract: A high-temperature pressure sensor includes a pressure sensor device and a heater shell body external to the pressure sensor device for providing heat to the pressure sensor device. A particle-generating insulation material is encapsulated within an encapsulation material to form an encapsulated insulation structure comprising the particle-generating insulation material within the encapsulation material, such that the encapsulation material substantially contains particles generated by the particle-generating insulation material within encapsulated insulation structure. The encapsulated insulation structure is disposed adjacent to an exterior of the heater shell body.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 22, 2020
    Assignee: MKS Instruments, Inc.
    Inventors: Orry Shamash, Alan Ludwiszewski, Clinton Percy, Boris Mandadzhiev
  • Patent number: 10779436
    Abstract: A cooling apparatus includes a chamber and a pressure-relief element. The chamber includes a coolant in a liquid phase disposed near a heat-generation object. The coolant in the liquid phase dissipates heat from the heat-generation object and is converted from the liquid phase to a vapor phase upon the coolant in the liquid phase reaching a boiling temperature. The pressure-relief element has a conduit. A first end of the conduit is submerged in the coolant in the liquid phase internal to the chamber and a second end of the conduit is connected to atmosphere external to the chamber.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: September 15, 2020
    Assignee: International Business Machines Corporation
    Inventors: Shurong Tian, Todd E. Takken
  • Patent number: 10750639
    Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: August 18, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey J. Lunsman, Tahir Cader
  • Patent number: 10698458
    Abstract: A vapor chamber may be integrated with one or more components of a computing device to provide thermal management. The vapor chamber may include upper and lower portions forming the vapor chamber, and an annular space between the upper and lower portions that includes a fluid. The vapor chamber may be configured to absorb heat from a heat source of the computing device. Subsequently, the uniform heat transfer may enable the external surfaces of the computing device to achieve substantially isothermal external surface conditions, which may maximize a power dissipation of the computing device for a given ambient temperature ensuring a temperature of the computing device remains at or below safe limits while in use.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: June 30, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew Delano, Taylor Stellman
  • Patent number: 10674635
    Abstract: A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: June 2, 2020
    Assignees: Baidu USA LLC, Baidu.com Times Technology (Beijing) Co., Ltd.
    Inventors: Tianyi Gao, Yan Cui, Xiaogang Sun, Ali Heydari
  • Patent number: 10663231
    Abstract: A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: May 26, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Li-Kuang Tan, Shih-Kang Lin
  • Patent number: 10544707
    Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: January 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Roger R. Schmidt, Robert E. Simons
  • Patent number: 10405457
    Abstract: A appliance immersion tank system comprising: a generally rectangular tank adapted to immerse in a dielectric fluid a plurality of appliances, each in a respective appliance slot distributed vertically along, and extending transverse to, the long axis of the tank; a primary circulation facility adapted to circulate the dielectric fluid through the tank; a secondary fluid circulation facility adapted to extract heat from the dielectric fluid circulating in the primary circulation facility, and to dissipate to the environment the heat so extracted; and a control facility adapted to coordinate the operation of the primary and secondary fluid circulation facilities as a function of the temperature of the dielectric fluid in the tank. A plenum, positioned adjacent the bottom of the tank, is adapted to dispense the dielectric fluid substantially uniformly upwardly through each appliance slot.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: September 3, 2019
    Assignee: Midas Green Technologies, LLC
    Inventors: Christopher L. Boyd, James P. Koen, David Christopher Laguna, Thomas R. Turner, Kenneth D. Swinden, Mario Conti Garcia, John Charles Tribou
  • Patent number: 10381562
    Abstract: Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: August 13, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jorge Luis Rosales, Victor Chiriac, Sean Charles Andrews