Abstract: A vehicle includes: an electric device mounted on the vehicle; a functional component placed on the electric device to extend further rearward than the electric device in plan view when mounted on the vehicle; a cable connecting the electric device and a battery mounted on the vehicle; and a cable mount that is provided below and within a plane of projection of the functional component on the electric device and has a terminal port facing downward in a vertical direction when mounted in the vehicle. The vehicle reduces the risk of a human touching an electric terminal, improving safety.

Abstract: A heat sink for a solid-state drive (SSD) storage device for use as an extended memory in an expansion slot of a gaming console has a metal top plate of sufficient width and length to cover the exterior opening of the expansion slot. The top plate has fins on its upper surface that extend at a diagonal across the longitudinal extent of the top plate. The heat sink further includes a metal bulk body connected to the bottom of the top plate and having a sufficient width and length to nearly fill the interior of the expansion slot and a thickness so that when the heat sink is mounted on the SSD storage device, the top plate is positioned above the upper edge of the expansion slot. A thermal adhesive is provided on the bottom of the bulk body for fastening the heat sink to the top of the SSD storage device.

Abstract: A cooling system for the liquid immersion cooling of electronic components. The system includes a container containing, in an interior, liquid heat transfer fluid into which electronic components are immersed, the container having a gas space above the surface of the liquid heat transfer fluid, and a heat exchanger device in the gas space of the container for forming liquid heat transfer fluid. The cooling system further includes a lock device on the container for exchanging electronic components, and the lock device has a lock space, which lock space is hermetically sealed with respect to the gas space of the container to prevent gas exchange.

Abstract: A system includes a hot air vent extending about a heat source. The hot air vent is configured to produce an air flow by directing air heated by the heat source to rise upward along the hot air vent. The system further includes a wind turbine arranged at a top of the hot air vent configured to be operated by the heated air rising upward along the hot air vent.

Abstract: Some modular heat-transfer systems can have an array of at least one heat-transfer element being configured to transfer heat to a working fluid from an operable element. A manifold module can have a distribution manifold and a collection manifold. A decoupleable inlet coupler can be configured to fluidicly couple the distribution manifold to a respective heat-transfer element. A decoupleable outlet coupler can be configured to fluidicly couple the respective heat-transfer element to the collection manifold. An environmental coupler can be configured to receive the working fluid from the collection manifold, to transfer heat to an environmental fluid from the working fluid or to transfer heat from an environmental fluid to the working fluid, and to discharge the working fluid to the distribution manifold.

Abstract: A fluid vessel assembly is provided with a first vessel body with a first mating surface with a first plurality of generally planar nonparallel regions. The first vessel body forms a first portion of a fluid cavity. A second vessel body is provided with a second mating surface with a second plurality of generally planar nonparallel regions sized to engage the first mating surface. The second vessel body forms a second portion of the fluid cavity. The first mating surface and the second mating surface are friction stir welded together.

Abstract: A sensor unit includes a first connection bus bar to a seventh connection bus bar connected to switch modules. The sensor unit includes a base integrally molding the first connection bus bar to the seventh connection bus bar. The sensor unit includes a plurality of magnetic-electric conversion units which detects current of the first connection bus bar to the seventh connection bus bar, respectively. The sensor unit includes a nut box connected to the base. The base and the nut box extends in the x-direction. A plurality of pillars, which are separated each other in the x-direction, are formed on the base. The nut box is fixed to the plurality of pillars by fixing bolts.

Abstract: A liquid cooling structure for a server with low-force quickseal joints to carry the coolant includes a first support, a first joint, a second support, a second joint, a first magnet, and a second magnet. The first support is set on the cabinet body. The second support is set on the server body. The first joint is set on the first support. The second joint is arranged on the second support and can be coupled with the first joint. The first magnet is set on first support. The second magnet is set on second support. The first magnet and second magnet with opposite magnetism attract each other to reduce the amount of force required for coupling the first joint and the second joint, and is labor-saving.

Abstract: An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.

Abstract: A detection apparatus and a server are provided, where the apparatus is configured to detect whether a coolant heat pipe or a solenoid valve on the coolant heat pipe in a device is abnormal, and the apparatus includes a control chip. The control chip can control a working state of the solenoid valve. The control chip can further obtain a temperature of a component in the device. When it is detected whether the coolant heat pipe or the solenoid valve is abnormal, the control chip may obtain a temperature difference of the component in the device when the working state of the solenoid valve is controlled, and relatively conveniently determine whether the coolant heat pipe or the solenoid valve is abnormal based on the temperature difference.

Abstract: A cooling device according to an embodiment includes a first heat exchanger, a first pipe, a second pipe, a bypass pipe, a flow changing mechanism, and a controller. The controller is configured to monitor a detection value related to at least one of a power loss of an electric device and the temperature of a first cooling water, configured to control the flow changing mechanism so that the quantity of a second cooling water flowing from the second pipe into the bypass pipe increases in a case where the detection value is smaller than a first threshold, and configured to control the flow changing mechanism so that the quantity of the second cooling water flowing from the second pipe into the bypass pipe decreases in a case where the detection value is equal to or larger than a second threshold.

Abstract: A power converter includes a capacitor and a substrate on which a plurality of switching elements for power conversion are mounted. The power converter includes a cooler for cooling the plurality of switching elements and a housing that accommodates the capacitor, the substrate, and the cooler. The power converter includes a power connector exposed from the housing and an output connector exposed from the housing. The power converter includes a plurality of lines that include a plurality of power lines each electrically connected to the capacitor, given switching elements, and the power connector. The plurality of lines include a plurality of output lines each electrically connected to given switching elements and the output connector. At least one among the plurality of lines is a line that includes a conductive pattern formed on the substrate.

Abstract: Methods and apparatus for thermal management of batteries are disclosed herein. An example battery disclosed herein includes a housing defining a cavity and a battery cell disposed in the cavity of the housing. The battery cell has a terminal. The battery further includes a bus bar disposed in the cavity of the housing. The bus bar is coupled to the terminal. A fluid channel formed in the bus bar. The fluid channel is to receive a cooling fluid to cool the bus bar and reduce a temperature of the battery.

Abstract: A power converter includes a power conversion module including a heat generation device, a cooling medium path through which a cooling medium for cooling the heat generation device flows, and a cooling medium collection unit disposed facing the power conversion module and collecting the cooling medium that has cooled the heat generation device. The power conversion module includes a first heat conductive member in which a first flow path forming a part of a cooling medium path is provided. The cooling medium path includes a first connecting pipe connecting a first flow path provided in the first heat conductive member with the cooling medium collection unit. The power converter further includes a first support tool provided in at least one of the cooling medium collection unit and the power conversion module and supporting the first connecting pipe.

Abstract: An inverter apparatus of a mobility has a structure in which a power module and a cooler are stacked so that an overall size of the inverter apparatus is reduced, and the cooler is pressed by a cover so that the cooler and the power module are in contact with each other, increasing the cooling performance of the cooler.

Abstract: In an inverter that includes a smoothing capacitor and a plurality of power modules, the smoothing capacitor includes a plurality of columnar unit capacitors each having electrodes at both ends thereof, a one-end-side bus plate connected to the electrode at one end of each unit capacitor, and an other-end-side bus plate connected to the electrode at the other end of the unit capacitor. The unit capacitors are arranged, with axes thereof parallel to each other, side by side in a direction perpendicular to the axes. The power modules are arranged at positions equally distant from a center of the inverter and equally distant from the smoothing capacitor.

Abstract: A capacitor includes a case including a capacitor element, a first connection terminal, a second connection terminal, and a second insulating sheet formed between the first connection terminal and the second connection terminal, and the first connection terminal, the second insulating sheet, and the second connection terminal extend to the outside from the case. A semiconductor module includes a multi-layer terminal portion in which a first power terminal, a first insulating sheet, and a second power terminal are sequentially stacked. The first power terminal includes a first bonding area electrically connected to the first connection terminal, and the second power terminal includes a second bonding area electrically connected to the second connection terminal. The first insulating sheet includes a terrace portion that extends in a direction from the second bonding area towards the first bonding area in a planar view.

Abstract: An embodiment cooling apparatus for a power module includes a manifold cover provided with an inner space that defines a flow path for a cooling fluid and in which the power module can be embedded, a fin plate embedded in the manifold cover so as to contact the power module and including a plurality of cooling fins on a surface facing an inner surface of the manifold cover, and a guide wall extending from the inner surface of the manifold cover in a flow direction of the cooling fluid to define a plurality of first channels having first closed ends and second channels having second closed ends, the guide wall overlapping the cooling fins and having an end portion in contact with the cooling fins to allow the cooling fluid to flow to the first channels and the second channels between the cooling fins in the manifold cover.

Abstract: A cooling system (50) including an immersion case, a bladder and a controller is disclosed. The immersion case (54) is configured to house an immersion cooling liquid, and an electronic component (80) configured to be submerged in the immersion cooling liquid. The bladder (56) is configurable between an expanded state and a contracted state and positioned such that the bladder (56) can be at least partially submerged in the immersion cooling liquid when in any one of the expanded state and the contracted state. The controller (58) is connected to the bladder (56) for modulating the bladder (56) between the expanded state and the contracted state to modulate a fluid level of the immersion cooling liquid in the immersion case (54).

Abstract: An electrical connector assembly includes a connector housing defining a cavity in which a pair of electrical terminals is disposed. The assembly also includes a cover that is configured to enclose the cavity, thereby protecting the pair of electrical terminals and thermally manage heat within the cavity. The cover has a thermal management mechanism including one or more liquid ports configured to receive a liquid coolant flow.

Abstract: A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Abstract: An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.

Abstract: Embodiments are disclosed of an immersion cooling device. The immersion cooling device includes a flow module adapted to be coupled to a heat-generating electronic component and immersed in an immersion cooling fluid. The flow module includes a housing with a channel therein, an inlet mounted the housing and fluidly coupled to the channel, the inlet being adapted to be submerged in the immersion cooling fluid, a pump positioned in the channel to accelerate the flow of immersion cooling fluid entering the channel through the inlet, and a fluid distribution interface mounted on the housing and fluidly coupled to the channel.

Abstract: An evaporator includes: a housing having a plurality of surfaces including a front surface and a back surface, at least one of the front and back surfaces having the largest area among the plurality of surfaces; and a heat-absorbing element disposed on at least one of the front and back surfaces and thermally connected to a heat source. The housing includes: at least one working fluid inlet located in a surface of the housing, the surface being other than a top surface of the housing; and at least one pair of working fluid outlets located respectively in opposite longitudinal end portions of the top surface.

Abstract: The present disclosure provides an unmanned aerial vehicle (UAV) having a housing containing electronic components required of the UAV and a heat transfer device for cooling heat generated by said electronic components; at least one boom for connecting said housing to at least one propeller. The boom includes one or more inlet located on a first surface of the boom and within an airflow of said at least one propeller; at least one outlet on a second surface of the boom; a hallow channel extending in interior of the boom from said at least one inlet to said at least one outlet, wherein said airflow generated by said at least one propeller passes into said at least one inlet through the hollow channel to said at least one outlet providing cooling for said heat transfer device.

Abstract: A field customizable airflow system, method, and communications box are provided. A communications box is located above an electronic display subassembly and includes one or more electronic components. The communications box includes one or more fans which cause a flow of ambient air to be accepted at an intake portion, forced through each of one or more apertures in a plate within the communications box, and be exhausted through said exhaust portion.

Abstract: An information technology (IT) enclosure includes an IT container having immersion coolant self-contained therein, one or more cooler trays and one or more dedicated battery spacings that are alternately arranged in a series manner within the IT container. Each cooler tray to house a cooler, each battery spacing to house one or more rows of battery packs. The IT enclosure includes a supply channel disposed at a first side of the IT container, and a return channel and a fluid pump disposed at another side of the IT container. Where, when in operation, the immersion coolant circulates amongst the alternate one or more rows of battery packs and coolers to transfer a thermal load from the one or more rows of battery packs to the coolers.

Abstract: A packaged power module includes a case, and a metal structure that has first and second surfaces. A transistor is also included that has first and second terminals between which current is transmitted when the transistor is activated, and a control terminal controlling the transistor, wherein the first terminal is sintered to the first surface. A first opening through the case exposes the second surface.

Abstract: A motor drive device includes a single-phase inverter that converts a direct-current voltage into an alternating-current voltage applied to a motor. The motor drive device includes a control power supply outputting power having a voltage lower than the direct-current voltage. The motor drive device includes a drive signal generation unit driven by the power. The drive signal generation unit generates drive signals driving switching elements of the inverter. The motor drive device includes a power supply switch operating so as to allow supply of the power from the control power supply to the drive signal generation unit when a rotation speed of the motor is higher than a threshold. The power supply switch operates so as to stop the supply of the power from the control power supply to the drive signal generation unit when the rotation speed is lower than the threshold.

Abstract: A sample cell is provided for holding a sample to be placed in a cryogenically cooled environment. The sample cell comprises an airtight, openable and closable enclosure. Within said enclosure is a sample base for receiving the sample. A refrigerator attachment is provided for attaching the sample cell to a refrigerated body of a cryogenically cooled environment. The sample cell comprises a thermal connection between the sample base and the refrigerator attachment. One or more airtight connectors are provided for establishing electric connections between inside and outside of said enclosure.

Abstract: The present disclosure relates generally to methods and devices for the cooling (or removal of heat from) power electronics modules in automotive vehicles, wherein the cooling is done by positioning the power electronics module in a housing, directing a fluid into the housing, and impinging the fluid onto the power electronics module and/or an electrical connection in contact with the power electronics module.

Abstract: A semiconductor module assembly includes a cooling body having a cooling body main body and a cooling body attachment with a channel structure for a heat-transporting fluid. The channel structure is hermetically sealed with a cooling body main body surface so that the cooling body attachment and the cooling body main body are in direct contact with the heat-transporting fluid. The cooling body attachment includes a central piece having essentially parallel channels of the channel structure, and end pieces arranged on both sides of the central piece. Each end piece has deflection channels of the channel structure, which are arranged to establish a fluidic connection between the essentially parallel channels of the central piece. A semiconductor module contacts the cooling body, with the hermetically sealed channel structure of the cooling body attachment and the heat-transporting fluid forming a pulsating heat pipe which is thermally conductively connected to the semiconductor module.

Abstract: A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.

Abstract: The present disclosure is concerned with bus bars that are provided with protrusions that allow them to be brought directly or indirectly in contact with a cooling system to remove heat generated in the bus bars themselves. The disclosure further provides a method of cooling a bus bar. The method includes providing at least one bus bar with at least one protrusion, and connecting the at least one protrusion to a cooling element.

Abstract: A power module for operating an electric vehicle drive may include one or more of the following: a plurality of semiconductor components; an intermediate circuit capacitor connected in parallel to the semiconductor components; a heatsink for the removal of heat generated by the semiconductor components, where the heatsink is located between the semiconductor components and the intermediate circuit capacitor; and an intermediate circuit line that electrically connects the intermediate circuit capacitor to the semiconductor components. The intermediate circuit line may extend perpendicular to a direction of flow for the coolant in the heatsink on a side of the semiconductor components facing away from the heatsink.

Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: An aircraft includes electrical components and a ducted fan with a cooling coil. The aircraft is designed to discharge heat from the electrical components to the cooling coil.

Abstract: A power converter includes a capacitor and a substrate on which a plurality of switching elements for power conversion are mounted. The power converter includes a cooler for cooling the plurality of switching elements and a housing that accommodates the capacitor, the substrate, and the cooler. The power converter includes a power connector exposed from the housing and an output connector exposed from the housing. The power converter includes a plurality of lines that include a plurality of power lines each electrically connected to the capacitor, given switching elements, and the power connector. The plurality of lines include a plurality of output lines each electrically connected to given switching elements and the output connector. At least one among the plurality of lines is a line that includes a conductive pattern formed on the substrate.

Abstract: A capacitor includes a case including a capacitor element, a first connection terminal, a second connection terminal, and a second insulating sheet formed between the first connection terminal and the second connection terminal, and the first connection terminal, the second insulating sheet, and the second connection terminal extend to the outside from the case. A semiconductor module includes a multi-layer terminal portion in which a first power terminal, a first insulating sheet, and a second power terminal are sequentially stacked. The first power terminal includes a first bonding area electrically connected to the first connection terminal, and the second power terminal includes a second bonding area electrically connected to the second connection terminal. The first insulating sheet includes a terrace portion that extends in a direction from the second bonding area towards the first bonding area in a planar view.

Abstract: In various embodiments, laser systems or resonators incorporate two separate cooling loops that may be operated at different cooling temperatures. One cooling loop, which may be operated at a lower temperature, cools beam emitters. The other cooling loop, which may be operated at a higher temperature, cools other mechanical and/or optical components, for example optical elements such as lenses and/or reflectors.

Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

Abstract: A battery apparatus for an electrically driven vehicle, having at least one battery module including individual battery cells is provided. The battery module has a module housing, which, for the purpose of regulating the temperature of the battery cells, is at least partly filled with temperature-regulating liquid and has a primary sealing apparatus to prevent leakage of the temperature-regulating liquid from the module housing. The battery module is furthermore accommodated in a module space of an enveloping housing, which has a secondary sealing apparatus to prevent leakage of temperature-regulating liquid from the enveloping housing.

Abstract: Systems and methods may provide for a serial fluidic flow loop in a liquid-assisted air cooled thermal control system, in order to balance thermal gradients in the thermal control system.

Abstract: A robot, robotic systems, and methods for conducting a subterranean operation. In some embodiments, a robot may include a hazardous atmosphere controlled volume, such as an explosive (EX)-certified chamber, that is located within the body of the robot. In some embodiments, a robot may include a cooling system that is at least partially disposed to fully disposed within the body of the robot, such as partially to fully disposed within the EX-certified chamber located within the body.

Abstract: The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

Abstract: The cooling system for a data center includes an information technology (IT) container, secondary condensing system, and a coolant distribution unit. In particular, an IT container includes a liquid region to store cooling liquid, a vapor region to receive vapor evaporated from the cooling liquid, and a primary condenser disposed within the vapor region to condense the vapor. For example, the external cooling air or cooling liquid is controlled to be delivered to condensers. Further, a secondary condenser is coupled to the IT container via a vapor line to receive at least a portion of the vapor from the vapor region of the IT container and to condense the portion of the vapor. Furthermore, a coolant distribution unit is coupled to the IT container and the secondary condenser to store and to distribute the cooling liquid to the IT container.

Abstract: The invention comprises a harmonic filter apparatus and method of use thereof for magnetically isolating and filtering individual phases of three-phase power comprising a delta circuit that includes: (1) a first leg connecting to a second leg and a third leg and (2) first circuitry on the first leg matching second circuitry on the second leg, the first circuitry comprising at least two contactors electrically wired in parallel, the harmonic filter magnetically isolating individual phases of three-phase power, where inductor—coupled inductor pairs couple apexes of the delta circuit to individual phases of the three-phase power.

Abstract: A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system includes a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of each power device stack, and a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.

Abstract: A power electronics system has a switching device and a liquid cooling device. A switching device has a plate element, and power semiconductor devices are arranged on conductor tracks and connected by means of a connecting device, wherein the liquid cooling device has a first partial body having an inlet volume region and an outlet volume region and a second partial body. A cooling volume region is formed between the two partial bodies, wherein heat transfer bodies protrude into the cooling volume region from the second partial body. The second partial body is arranged in a recess of the first partial body and the two partial bodies are connected to each other and have a common plane surface which forms a first main surface.