Abstract: The present disclosure is concerned with bus bars that are provided with protrusions that allow them to be brought directly or indirectly in contact with a cooling system to remove heat generated in the bus bars themselves. The disclosure further provides a method of cooling a bus bar. The method includes providing at least one bus bar with at least one protrusion, and connecting the at least one protrusion to a cooling element.

Abstract: A power module for operating an electric vehicle drive may include one or more of the following: a plurality of semiconductor components; an intermediate circuit capacitor connected in parallel to the semiconductor components; a heatsink for the removal of heat generated by the semiconductor components, where the heatsink is located between the semiconductor components and the intermediate circuit capacitor; and an intermediate circuit line that electrically connects the intermediate circuit capacitor to the semiconductor components. The intermediate circuit line may extend perpendicular to a direction of flow for the coolant in the heatsink on a side of the semiconductor components facing away from the heatsink.

Abstract: A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

Abstract: An aircraft includes electrical components and a ducted fan with a cooling coil. The aircraft is designed to discharge heat from the electrical components to the cooling coil.

Abstract: A power converter includes a capacitor and a substrate on which a plurality of switching elements for power conversion are mounted. The power converter includes a cooler for cooling the plurality of switching elements and a housing that accommodates the capacitor, the substrate, and the cooler. The power converter includes a power connector exposed from the housing and an output connector exposed from the housing. The power converter includes a plurality of lines that include a plurality of power lines each electrically connected to the capacitor, given switching elements, and the power connector. The plurality of lines include a plurality of output lines each electrically connected to given switching elements and the output connector. At least one among the plurality of lines is a line that includes a conductive pattern formed on the substrate.

Abstract: A capacitor includes a case including a capacitor element, a first connection terminal, a second connection terminal, and a second insulating sheet formed between the first connection terminal and the second connection terminal, and the first connection terminal, the second insulating sheet, and the second connection terminal extend to the outside from the case. A semiconductor module includes a multi-layer terminal portion in which a first power terminal, a first insulating sheet, and a second power terminal are sequentially stacked. The first power terminal includes a first bonding area electrically connected to the first connection terminal, and the second power terminal includes a second bonding area electrically connected to the second connection terminal. The first insulating sheet includes a terrace portion that extends in a direction from the second bonding area towards the first bonding area in a planar view.

Abstract: In various embodiments, laser systems or resonators incorporate two separate cooling loops that may be operated at different cooling temperatures. One cooling loop, which may be operated at a lower temperature, cools beam emitters. The other cooling loop, which may be operated at a higher temperature, cools other mechanical and/or optical components, for example optical elements such as lenses and/or reflectors.

Abstract: A battery apparatus for an electrically driven vehicle, having at least one battery module including individual battery cells is provided. The battery module has a module housing, which, for the purpose of regulating the temperature of the battery cells, is at least partly filled with temperature-regulating liquid and has a primary sealing apparatus to prevent leakage of the temperature-regulating liquid from the module housing. The battery module is furthermore accommodated in a module space of an enveloping housing, which has a secondary sealing apparatus to prevent leakage of temperature-regulating liquid from the enveloping housing.

Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

Abstract: A robot, robotic systems, and methods for conducting a subterranean operation. In some embodiments, a robot may include a hazardous atmosphere controlled volume, such as an explosive (EX)-certified chamber, that is located within the body of the robot. In some embodiments, a robot may include a cooling system that is at least partially disposed to fully disposed within the body of the robot, such as partially to fully disposed within the EX-certified chamber located within the body.

Abstract: Systems and methods may provide for a serial fluidic flow loop in a liquid-assisted air cooled thermal control system, in order to balance thermal gradients in the thermal control system.

Abstract: The power conversion device includes a semiconductor module having a connection terminal, a cooler, a control board, a capacitor module, a cover, a case, and a connection busbar. The semiconductor module, the cooler, the control board, and the capacitor module are arranged in an overlapped manner as seen in the direction perpendicular to the top surface of the cooler. The capacitor module has a capacitor cell, a capacitor case, resin, and a capacitor busbar. The capacitor busbar has an inner extending portion, an opening-side extending portion, and an outer extending portion. The connection busbar extends from the connection terminal of the semiconductor module to an outer surface of the outer extending portion and has a part extending in parallel to the extending direction of the outer extending portion. The connection busbar has a capacitor connection portion at an end thereof on the outer extending portion side.

Abstract: The invention comprises a harmonic filter apparatus and method of use thereof for magnetically isolating and filtering individual phases of three-phase power comprising a delta circuit that includes: (1) a first leg connecting to a second leg and a third leg and (2) first circuitry on the first leg matching second circuitry on the second leg, the first circuitry comprising at least two contactors electrically wired in parallel, the harmonic filter magnetically isolating individual phases of three-phase power, where inductor—coupled inductor pairs couple apexes of the delta circuit to individual phases of the three-phase power.

Abstract: The cooling system for a data center includes an information technology (IT) container, secondary condensing system, and a coolant distribution unit. In particular, an IT container includes a liquid region to store cooling liquid, a vapor region to receive vapor evaporated from the cooling liquid, and a primary condenser disposed within the vapor region to condense the vapor. For example, the external cooling air or cooling liquid is controlled to be delivered to condensers. Further, a secondary condenser is coupled to the IT container via a vapor line to receive at least a portion of the vapor from the vapor region of the IT container and to condense the portion of the vapor. Furthermore, a coolant distribution unit is coupled to the IT container and the secondary condenser to store and to distribute the cooling liquid to the IT container.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system includes a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of each power device stack, and a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.

Abstract: A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.

Abstract: A power electronics system has a switching device and a liquid cooling device. A switching device has a plate element, and power semiconductor devices are arranged on conductor tracks and connected by means of a connecting device, wherein the liquid cooling device has a first partial body having an inlet volume region and an outlet volume region and a second partial body. A cooling volume region is formed between the two partial bodies, wherein heat transfer bodies protrude into the cooling volume region from the second partial body. The second partial body is arranged in a recess of the first partial body and the two partial bodies are connected to each other and have a common plane surface which forms a first main surface.

Abstract: A boiling cooler includes a boiling part, a condensing part arranged in a substantially horizontal direction with respect to the boiling part, and a connecting pipe that connects the boiling part to the condensing part. The condensing part includes a plurality of stages of refrigerant passages, a first external passage provided between the refrigerant passages, and a second external passage provided on an outer surface of at least one of an uppermost refrigerant passage and a lowermost refrigerant passage.

Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

Abstract: An apparatus to cool electronics in an autonomous vehicle, where the autonomous vehicle includes significant computing power to receive data from on-board sensor, cellular data and user interactions and to navigate an environment to a predetermined location. The cooling system includes a radiator, fan, pump and cold plate. The cold plate is formed from two plates with extended surfaces that are mated together so that the cavities around the extended surfaces form a flow passage. The electronics processing the data and navigating are mounted on the outside surface of the cold plate.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop having a heat exchanger coupled to the inlet port and the outlet port, and a buffer loop coupled to the inlet port and the outlet port. The main loop having a heat exchanger to receive fluid from the inlet port, to extract heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. In an embodiment, a cooling system includes a buffer loop, configured in parallel with the main loop, with a buffer unit to temporarily buffer at least a portion of the fluid, and a first pressure controllable valve, coupled to the main loop and the buffer loop, to selectively distribute at least a portion of the fluid to at least one of the main loop or the buffer loop based on a fluid pressure of the fluid.

Abstract: A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.

Abstract: A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.

Abstract: A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.

Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.

Abstract: A fluid compressor device includes a housing and a rotating group supported for rotation within the housing about an axis. The device also includes a compressor stage including a compressor wheel of the rotating group that is supported on a shaft of the rotating group. The device also includes an e-machine stage including an e-machine that is operably coupled to the shaft and that is configured to operate as at least one of a motor and a generator. Additionally, the device includes an integrated controller that extends at least partly over the e-machine stage in a circumferential direction about the axis. The integrated controller includes a coolant core that receives a flow of a coolant therethrough for cooling the integrated controller. The coolant core extends over the e-machine stage in a circumferential direction about the axis.

Abstract: An environmental control system is provided. The environmental control system can include a cooling device and a heating device. The cooling device can lower the temperature of fluid contained within a cold reservoir and the heating device can raise the temperature of fluid contained within a hot reservoir.

Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

Abstract: An electric power conversion device includes: a cooler that includes a flow path through which a refrigerant flows, a first surface, and a second surface opposite to the first surface in a thickness direction; and multiple power modules that include a semiconductor device configuring an upper-lower arm circuit, and a capacitor connected to the upper-lower arm circuit in parallel. The capacitor and the semiconductor device are arranged in the thickness direction. The multiple power modules are placed on both of the first surface and the second surface of the cooler.

Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.

Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

Abstract: This disclosure is directed to power systems for transferring power between electrical components. An exemplary power system includes a first electrical component (e.g., an electric motor), a second electrical component (e.g., an inverter system), and a terminal block assembly adapted to electrically couple the first and second electrical components. The terminal block assembly includes an internal cooling channel configured to receive coolant for providing direct liquid cooling of the bus bar.

Abstract: In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid r

Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface of the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.

Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

Abstract: A semiconductor device includes semiconductor modules disposed on a support member via a cooling plate; and a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules.

Abstract: Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.

Abstract: A rotating electrical machine such that a power supply unit can be efficiently cooled, with no increase in size in an axial direction of the rotating electrical machine, is provided. A rotating electrical machine main body and a power supply unit are integrally fixed, and a refrigerant passage is provided on the rotating electrical machine main body side of a metal frame configuring the power supply unit. The refrigerant passage and a control part that controls power supplied to the rotating electrical machine main body are disposed in the same plane in an axial direction of the rotating electrical machine main body, and the refrigerant passage is disposed farther to a radial direction outer side of the rotating electrical machine main body than the control part.

Abstract: A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.

Abstract: An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.

Abstract: An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing.

Abstract: A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.

Abstract: The present disclosure is directed to a direct liquid cooling system for cooling of electronic components and configured to maintain a predetermined thermostable environment for the electronic components. The system includes a reservoir and a rack removably placed in the reservoir and securely containing electronic components to be cooled. The system also includes a dielectric coolant which is configured to flow upward in parallel streams between the electronic components and a pump that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components and overflowing the dielectric coolant within the reservoir. A heat exchanger is also provided and coupled with the reservoir via an outlet pipeline. Additionally, a controller is provided to monitor the temperature of the dielectric coolant and adjust the flow of the coolant.

Abstract: A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.

Abstract: A converter assembly includes a converter with converter valves, each having power semiconductor switches. At least one fluid-tight encapsulation housing, in which at least some of the power semiconductor switches are disposed, forms a modular converter unit. The encapsulation housing is at least partially filled with an electrically insulating insulation fluid in order to electrically insulate the power semiconductor switches disposed in the encapsulation housing.

Abstract: A vehicular radar sensing system includes a radar sensor disposed at a vehicle so as to sense exterior of the vehicle and having at least one transmitter that transmits radio signals and at least one receiver that receive radio signals. The radar sensor includes at least one wave guide antenna, a PCB, and a processor disposed on an inboard side of the PCB and operable to process radio signals received by the at least one receiver. The wave guide antenna includes a first wave guide slot disposed at the inboard side of the PCB that guides the radio signals to the at least one receiver or from the at least one transmitter, a second wave guide slot that guides the radio signals to and from the environment, and an air wave guide that guides the radio signals between the first wave guide slot and the second wave guide slot.

Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed and an optimal processor clock rate based on a first relationship between cost of the electronic rack and clock rate of the processors and a second relationship between energy consumption of the electronic rack, clock rate of the processors and pump speed.

Abstract: The disclosure relates to control electronics in a modular design, comprising an electronic base module and a plurality of functional modules, wherein: the base module provides at least one DC link voltage UZK at a voltage supply output for the voltage supply of the functional modules and the functional modules are electrically and mechanically connected to the base module and are supplied with the DC link voltage UZK by the base module; the base module and the functional modules each have a carrier having electronic components, the electronic components of the base module producing the DC link voltage UZK, at least one functional module being fastened to the carrier of the base module; and the electronic components of the base module and of the functional modules are arranged separate from one another by means of a thermal decoupling and/or an EMC shield.

Abstract: A chassis can include a sliding liquid distributor that has blind mate connectors. The blind mate connectors mate with an IT rack in one direction and one or more electronic devices in an opposite direction. The liquid distributor circulates fluid to-and-from the electronic devices from-and-to the IT rack. Other embodiments are described and claimed.

Abstract: A cooling unit has a cold plate extending in a horizontal direction, and a tank and a pump disposed above the cold plate in a first direction perpendicular to the horizontal direction. The tank has a tank chamber which stores a refrigerant. The pump has a pump chamber in which a rotating body that transfers the refrigerant is accommodated, and an upper end of the tank chamber in the first direction is positioned at an upper side than an upper end of the pump chamber in the first direction.