Liquid Patents (Class 361/699)
  • Patent number: 11683913
    Abstract: A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: June 20, 2023
    Assignee: Google LLC
    Inventors: Feini Zhang, Madhusudan K. Iyengar, Reza H. Khiabani
  • Patent number: 11683914
    Abstract: An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: June 20, 2023
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Kai-Yang Tung, Hung-Ju Chen
  • Patent number: 11683918
    Abstract: A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: June 20, 2023
    Assignee: Rivian IP Holdings, LLC
    Inventors: Young Doo, Jason Huang, Yang Liu
  • Patent number: 11668323
    Abstract: A fluid compressor device includes a housing and a rotating group supported for rotation within the housing about an axis. The device also includes a compressor stage including a compressor wheel of the rotating group that is supported on a shaft of the rotating group. The device also includes an e-machine stage including an e-machine that is operably coupled to the shaft and that is configured to operate as at least one of a motor and a generator. Additionally, the device includes an integrated controller that extends at least partly over the e-machine stage in a circumferential direction about the axis. The integrated controller includes a coolant core that receives a flow of a coolant therethrough for cooling the integrated controller. The coolant core extends over the e-machine stage in a circumferential direction about the axis.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: June 6, 2023
    Assignee: GARRETT TRANSPORTATION I INC.
    Inventors: Valeriy Fedorikhin, Andrew Love, Ali Mohammadpour
  • Patent number: 11665866
    Abstract: An environmental control system is provided. The environmental control system can include a cooling device and a heating device. The cooling device can lower the temperature of fluid contained within a cold reservoir and the heating device can raise the temperature of fluid contained within a hot reservoir.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: May 30, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Zhiyong Lin, Peter Ross
  • Patent number: 11653481
    Abstract: An electric power conversion device includes: a cooler that includes a flow path through which a refrigerant flows, a first surface, and a second surface opposite to the first surface in a thickness direction; and multiple power modules that include a semiconductor device configuring an upper-lower arm circuit, and a capacitor connected to the upper-lower arm circuit in parallel. The capacitor and the semiconductor device are arranged in the thickness direction. The multiple power modules are placed on both of the first surface and the second surface of the cooler.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: May 16, 2023
    Assignee: DENSO CORPORATION
    Inventors: Tomohisa Sano, Ryota Tanabe, Yuta Hashimoto, Wataru Funatsu
  • Patent number: 11653473
    Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: May 16, 2023
    Assignee: Raytheon Company
    Inventors: James S. Wilson, Gordon R. Scott, James M. Giesey
  • Patent number: 11640946
    Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: May 2, 2023
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Denis Farison, Romain Coffy, Jean-Michel Riviere
  • Patent number: 11624776
    Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: April 11, 2023
    Assignee: ONE TEST SYSTEMS
    Inventors: Chen-Lung Tsai, Gene Rosenthal
  • Patent number: 11622479
    Abstract: This disclosure is directed to power systems for transferring power between electrical components. An exemplary power system includes a first electrical component (e.g., an electric motor), a second electrical component (e.g., an inverter system), and a terminal block assembly adapted to electrically couple the first and second electrical components. The terminal block assembly includes an internal cooling channel configured to receive coolant for providing direct liquid cooling of the bus bar.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: April 4, 2023
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Serdar Hakki Yonak, Fan Wang, Baoming Ge, Moon Young Lee
  • Patent number: 11609035
    Abstract: In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid r
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: March 21, 2023
    Assignee: NEC CORPORATION
    Inventors: Minoru Yoshikawa, Hisato Sakuma, Masaki Chiba
  • Patent number: 11597226
    Abstract: Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface of the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 7, 2023
    Assignee: APPLE INC.
    Inventors: Michael S. Nashner, John T. Payne, Jody R. Akana
  • Patent number: 11594470
    Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: February 28, 2023
    Assignee: Massachesetts Institute of Technology
    Inventors: James Paul Smith, Bernard A. Malouin, Jr., Eric A. Browne
  • Patent number: 11557521
    Abstract: Provided are a heat sink capable of suppressing overcooling of an electronic component which should not be overcooled and highly efficiently cooling only an electronic component which should be cooled, and a circuit device including the same. A heat sink includes a pipe and a cooling block. At least one projection is formed in the cooling block. The pipe is in contact with the projection. The pipe is arranged with a spacing from a portion of the cooling block other than the projection.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: January 17, 2023
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keiji Harada, Shuhei Mizutani, Yoshihiro Taniguchi, Masaki Takata
  • Patent number: 11557528
    Abstract: A semiconductor device includes semiconductor modules disposed on a support member via a cooling plate; and a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: January 17, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventor: Hiroharu Oka
  • Patent number: 11552525
    Abstract: A rotating electrical machine such that a power supply unit can be efficiently cooled, with no increase in size in an axial direction of the rotating electrical machine, is provided. A rotating electrical machine main body and a power supply unit are integrally fixed, and a refrigerant passage is provided on the rotating electrical machine main body side of a metal frame configuring the power supply unit. The refrigerant passage and a control part that controls power supplied to the rotating electrical machine main body are disposed in the same plane in an axial direction of the rotating electrical machine main body, and the refrigerant passage is disposed farther to a radial direction outer side of the rotating electrical machine main body than the control part.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: January 10, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Jun Tahara, Takashi Hashiba, Satoshi Mitsunaga, Hiroyuki Higashino, Mitsunori Ishizaki, Toshiaki Kashihara, Tadashi Murakami, Yoshinobu Utsumi
  • Patent number: 11533830
    Abstract: A cooling arrangement for an electronic device comprises a primary cooling device and a secondary cooling device. The primary cooling device includes a fluidic input line receiving a cooling fluid from a cooling fluid source and a fluidic output line returning the cooling fluid toward a drain. The primary cooling device is thermally connected to the electronic device, receives the cooling fluid from the fluidic input line and transfers heat from the electronic device to the cooling fluid before returning the cooling fluid via the fluidic output line. A flow detection device monitors a flow of the cooling fluid in the primary cooling device. The secondary cooling device is thermally connected to the electronic device. A processor activates the secondary cooling device to absorb and dissipate heat from the electronic device when the flow detection device detects a lack of flow of the cooling fluid in the primary cooling device.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: December 20, 2022
    Assignee: OVH
    Inventors: Christophe Maurice Thibaut, Patrick-Gilles Maillot, Henryk Klaba
  • Patent number: 11527788
    Abstract: An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: December 13, 2022
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Charles Patrick Shepard, Kris H. Campbell, Scott R. Bouras, Shin Katsumata
  • Patent number: 11522494
    Abstract: An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: December 6, 2022
    Assignee: SMA Solar Technology AG
    Inventors: Stefan Buchhold, Jens Friebe, Michael Kotthaus, Ephraim Moeser, Torsten Soederberg, Thomas Wappler
  • Patent number: 11516941
    Abstract: A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Seagate Technology LLC
    Inventors: Mohamad El-Batal, David Copeland
  • Patent number: 11516943
    Abstract: The present disclosure is directed to a direct liquid cooling system for cooling of electronic components and configured to maintain a predetermined thermostable environment for the electronic components. The system includes a reservoir and a rack removably placed in the reservoir and securely containing electronic components to be cooled. The system also includes a dielectric coolant which is configured to flow upward in parallel streams between the electronic components and a pump that facilitates continuous pumping of the dielectric coolant thereby forcing the dielectric coolant upwards through the electronic components and overflowing the dielectric coolant within the reservoir. A heat exchanger is also provided and coupled with the reservoir via an outlet pipeline. Additionally, a controller is provided to monitor the temperature of the dielectric coolant and adjust the flow of the coolant.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: November 29, 2022
    Assignee: INPRO TECHNOLOGIES LIMITED LIABILITY COMPANY
    Inventors: Alexey Petrovich Bilan, Viktor Yurievich Zhilko, Viktor Mikhailovich Kaufman, Alexander Nikolaevich Nikitin
  • Patent number: 11470741
    Abstract: A cooling system including a cooling unit that cools a heat-generating component; a supply connection tube that is connected to the cooling unit and that supplies a cooling medium to the cooling unit; and a discharge connection tube that is connected to the cooling unit and that discharges the cooling medium from the cooling unit, wherein the supply connection tube and the discharge connection tube have different lengths.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: October 11, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Yasuhito Nakamura
  • Patent number: 11454720
    Abstract: A vehicular radar sensing system includes a radar sensor disposed at a vehicle so as to sense exterior of the vehicle and having at least one transmitter that transmits radio signals and at least one receiver that receive radio signals. The radar sensor includes at least one wave guide antenna, a PCB, and a processor disposed on an inboard side of the PCB and operable to process radio signals received by the at least one receiver. The wave guide antenna includes a first wave guide slot disposed at the inboard side of the PCB that guides the radio signals to the at least one receiver or from the at least one transmitter, a second wave guide slot that guides the radio signals to and from the environment, and an air wave guide that guides the radio signals between the first wave guide slot and the second wave guide slot.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 27, 2022
    Assignee: MAGNA ELECTRONICS INC.
    Inventors: Holger Hess, Wilhelm Johann Wolfgang Wöhlte
  • Patent number: 11456674
    Abstract: A converter assembly includes a converter with converter valves, each having power semiconductor switches. At least one fluid-tight encapsulation housing, in which at least some of the power semiconductor switches are disposed, forms a modular converter unit. The encapsulation housing is at least partially filled with an electrically insulating insulation fluid in order to electrically insulate the power semiconductor switches disposed in the encapsulation housing.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: September 27, 2022
    Assignee: Siemens Energy Global GmbH & Co. KG
    Inventors: David Doering, Gerald Franz Giering, Alexander Rentschler, Klaus Wuerflinger
  • Patent number: 11445631
    Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed and an optimal processor clock rate based on a first relationship between cost of the electronic rack and clock rate of the processors and a second relationship between energy consumption of the electronic rack, clock rate of the processors and pump speed.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: September 13, 2022
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11425836
    Abstract: The disclosure relates to control electronics in a modular design, comprising an electronic base module and a plurality of functional modules, wherein: the base module provides at least one DC link voltage UZK at a voltage supply output for the voltage supply of the functional modules and the functional modules are electrically and mechanically connected to the base module and are supplied with the DC link voltage UZK by the base module; the base module and the functional modules each have a carrier having electronic components, the electronic components of the base module producing the DC link voltage UZK, at least one functional module being fastened to the carrier of the base module; and the electronic components of the base module and of the functional modules are arranged separate from one another by means of a thermal decoupling and/or an EMC shield.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: ebm-papst Mulfingen GmbH & Co. KG
    Inventors: Christian Kranz, Alex Schneider, Malte Pils, Oliver Bollgönn
  • Patent number: 11397039
    Abstract: A cooling unit has a cold plate extending in a horizontal direction, and a tank and a pump disposed above the cold plate in a first direction perpendicular to the horizontal direction. The tank has a tank chamber which stores a refrigerant. The pump has a pump chamber in which a rotating body that transfers the refrigerant is accommodated, and an upper end of the tank chamber in the first direction is positioned at an upper side than an upper end of the pump chamber in the first direction.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: July 26, 2022
    Assignee: NIDEC CORPORATION
    Inventors: Toshihiko Tokeshi, Takehito Tamaoka, Nobuya Nakae
  • Patent number: 11399448
    Abstract: A chassis can include a sliding liquid distributor that has blind mate connectors. The blind mate connectors mate with an IT rack in one direction and one or more electronic devices in an opposite direction. The liquid distributor circulates fluid to-and-from the electronic devices from-and-to the IT rack. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: July 26, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11382241
    Abstract: In one embodiment, a cooling device for providing liquid cooling to a processor or a computing hardware/system includes a first cooling plate having a first liquid distribution channel integrated therein. The first cooling plate is to be positioned on a top surface of a processor to extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel. The cooling device further includes a second cooling plate having a second liquid distribution channel integrated therein. The second cooling plate is to be positioned at a bottom surface of the processor to extract heat from the bottom surface of the processor using cooling liquid flowing through the second liquid distribution channel. The cooling device further includes a mounting mechanism to mount the first and second cooling plates onto top and bottom of the processor to sandwich the process in between with good thermal contact.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 5, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11357138
    Abstract: A cooling structure of a vehicle drive inverter includes: a switching element disposed in the vehicle drive inverter; a heat dissipation fin connected to and heat-exchangeable with the switching element; a cooling flow path in which a coolant flows and heat-exchanges with the heat dissipation fin; and an auxiliary cooling module connected to and heat-exchangeable with the switching element to be heated by a heat generation of the switching element or to be cooled together with the switching element.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: June 7, 2022
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Sang Shin Lee, Man Ju Oh, So La Chung, Jae Woong Kim
  • Patent number: 11346741
    Abstract: An information handling system may include an information handling resource, a liquid cooling system for providing cooling of the information handling resource, and a leak detection system for detecting a leak of fluid from the liquid cooling system, the leak detection system comprising a leak detection circuit having at least one moisture-sensitive portion configured to detect the presence of moisture proximate to the leak detection circuit and circuitry configured to communicate one or more electrical signals indicative of the presence or absence of moisture proximate to the leak detection circuit and a moisture wicking material mechanically coupled to the leak detection circuit and configured to transport moisture within the moisture wicking material to the at least one moisture-sensitive portion of the leak detection circuit.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: May 31, 2022
    Assignee: Dell Products L.P.
    Inventors: Robert B. Curtis, Lawrence A. Kyle
  • Patent number: 11338670
    Abstract: A transmission may include a housing and also a power electronics module, the power electronics module including a carrier element with at least one power switching element with a cooling surface and also a cooling body, which may be connected in a thermally conductive manner to the cooling surface of the at least one power switching element. The housing may have an oil space for at least partially accommodating transmission components. The power electronics module may be at least partially arranged inside the oil space of the transmission.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: May 24, 2022
    Assignee: ZF Friedrichshafen AG
    Inventors: Thomas Maier, Hermann Josef Robin
  • Patent number: 11337340
    Abstract: A cooling system for a computer server is disclosed. The system includes a flow divider within the server enclosure interior constructed to create a continuous flow path. At least one fan is positioned within the flow path. An inlet air valve is positioned to regulate airflow across the server input air vent. Likewise an outlet air valve is positioned to regulated airflow across the server output air vent. A controller is connected to the fan and the systems has two configurations.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: May 17, 2022
    Assignee: Chilldyne, Inc.
    Inventor: Steve Harrington
  • Patent number: 11329009
    Abstract: A method for producing a semiconductor device includes providing a carrier configured to carry at least one semiconductor chip on a first side, and dispensing a polymer onto a second side situated opposite the first side in order to produce a sealing ring. The polymer is dispensed in such a way that the sealing ring produced has different heights perpendicular to the second side along its circumference.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: May 10, 2022
    Assignee: Infineon Technologies AG
    Inventors: Stefan Klockenkaemper, Martin Schulz, Ajay Kumar Tejaswi Konakanchi
  • Patent number: 11297738
    Abstract: This disclosure describes systems for cooling one or more data halls of a data center that include one or more sections of a cooling spine. Each section of the cooling spine includes a riser module, a manifold module, and one or more arrays of cooling units. The riser module includes riser piping configured to fluidically couple to a liquid cooling system. The manifold module includes manifold piping fluidically coupled to the riser piping. Each array of cooling units is positioned toward a data hall of the one or more data halls of the data center and includes a heat exchanger assembly and a circulation assembly. The heat exchanger assembly is fluidically coupled to the manifold piping and configured to cool return air from a hot aisle adjacent a row of cabinets. The circulation assembly is configured to discharge supply air to a cold aisle adjacent the row of cabinets.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: April 5, 2022
    Assignee: Equinix, Inc.
    Inventor: Chad McCarthy
  • Patent number: 11297741
    Abstract: A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: April 5, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11296614
    Abstract: A power conversion device for a vehicle, may include a power conversion module assembly having a capacitor configured to receive a direct current (DC) current from a battery of the vehicle, a power conversion module configured to convert the DC current supplied from the capacitor, into an alternating current (AC) current, and a control unit connected to the power conversion module and configured to control the power conversion module; a housing assembled with the power conversion module assembly; and an output terminal assembly including a plurality of output terminals through which the AC currents converted through the power conversion module assembly are output, a core, and a Hall integrated circuit (IC) configured to detect a variation in magnetic flux of the core when the AC currents flow in the output terminals and measure the AC currents of the output terminals.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: April 5, 2022
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Yun Ho Kim
  • Patent number: 11280565
    Abstract: The disclosure relates to a heat dissipation system including cabinet, coolant distribution units and adapting device. The adapting device includes casing and switch valves. The casing has first liquid inlets, first liquid outlets, second liquid inlet and second liquid outlet. The first liquid inlets are connected to distribution outlets of coolant distribution units, first liquid outlets are connected to distribution inlets of coolant distribution units, second liquid inlet is connected to cabinet, and second liquid outlet is connected to cabinet. The switch valves are connected to first liquid inlets, first liquid outlets, second liquid inlet and second liquid outlet so as to change a connection among first liquid inlets, first liquid outlets, second liquid inlet and second liquid outlet to change a connection between coolant distribution units.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: March 22, 2022
    Assignee: WISTRON CORP.
    Inventor: Hua Chen
  • Patent number: 11284504
    Abstract: A power electronic module having reduced mass and/or reduced package size as compared with conventional modules employing die cast materials, secondary machining, and/or welding operations includes a housing, a discrete cooling channel positioned in the housing and having opposing cooling surfaces, and first and second printed circuit board assemblies disposed on opposite sides of the cooling channel.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: March 22, 2022
    Assignee: Kostal of America, Inc.
    Inventors: Steven R. Hoskins, Kenneth S. Koscielniak
  • Patent number: 11275415
    Abstract: A dissipating interconnection module for an M.2 form factor expansion card, includes a heat sink, which includes an enclosure including an upper wall for being in thermal contact with the first heat exchange surface of the expansion card and two tabs, each tab for being in thermal contact with the upper wall of the heat sink and for being in thermal contact with the fluid cooling system of the first electronic board, and the upper wall and the two tabs of the enclosure being arranged to form a space in which the expansion card can be received; a mechanical attachment system for removably mechanically attaching the expansion card to the heat sink; an interconnection electronic board including the second M.2 connector, a third electrical connector to be connected to a fourth electrical connector of the first electronic board.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: March 15, 2022
    Assignee: BULL SAS
    Inventor: Luc Dallaserra
  • Patent number: 11268173
    Abstract: A magnesium alloy containing Al, Sr, Ca, and Mn, with the balance being Mg and inevitable impurities, the magnesium alloy having: a structure having an ?-Mg phase, and a precipitate dispersed in at least one of a grain boundary of the ?-Mg phase and a cell boundary, the precipitate including: at least one phase selected from a group A consisting of an Al2Sr phase, an Al4Sr phase, a (Mg, Al)2Sr phase, and a (Mg, Al)4Sr phase; and at least one phase selected from a group B consisting of an Al2Ca phase and a (Mg, Al)2Ca phase, the magnesium alloy having, in a cross section, a total area rate of a group A precipitate and a group B precipitate of greater than or equal to 2.5% and less than or equal to 30%.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: March 8, 2022
    Assignees: Sumitomo Electric Industries, Ltd., National University Corporation University of Toyama
    Inventors: Manabu Mizutani, Katsuhito Yoshida, Seiji Saikawa
  • Patent number: 11266012
    Abstract: A circuit board includes an electrically insulating part and an electrically conductive part. At least one semiconductor chip is embedded into the electrically insulating part in a part of the circuit board. Through openings in the part of the circuit board provide for passage of a cooling liquid. The through openings extend from a first surface of the circuit board to a second surface of the circuit board. The electrically conductive part includes a first outer conductive layer on the first surface and a second outer conductive layer on the second surface. The electrically conductive part also includes a first inner conductive layer which is electrically connected to the semiconductor chip. The first inner conductive layer is electrically insulated from the first outer conductive layer and from the second outer conductive layer by the electrically insulating part in the part of the circuit board.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: March 1, 2022
    Assignee: Infineon Technologies AG
    Inventors: Tomas Manuel Reiter, Mark Nils Muenzer, Andre Uhlemann
  • Patent number: 11259448
    Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: February 22, 2022
    Assignee: SEMIKRON ELEKTRONIK GmbH & Co. KG
    Inventors: Roland Bittner, Sandro Bulovic, Johannes Klier
  • Patent number: 11251163
    Abstract: A semiconductor device having a semiconductor module that includes a first conductor layer and a second conductor layer facing each other, a group of semiconductor elements that are formed between the first and second conductor layers, and are connected to the second conductor layer respectively via a group of conductor blocks, and a circuit board having one end portion thereof located in a space between the semiconductor elements and the second conductor layer. Each semiconductor element includes first and second main electrodes respectively formed on first and second main surfaces thereof, and a control electrode that is formed on the second main surface. The first main electrode is electrically connected to the first conductor layer. The second main electrode is electrically connected to the second conductor layer via the respective conductor block. The circuit board includes a first wiring layer electrically connected to the control electrodes of the semiconductor elements.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: February 15, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Motohito Hori, Yoshinari Ikeda, Akira Hirao
  • Patent number: 11251108
    Abstract: A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device has: an input terminal; a wiring portion that includes a first end portion, and a second end portion, and extends in one direction, the first end portion being connected to the input terminal; a circuit substrate that includes a top surface, and a bottom surface, the top surface being provided with a first circuit board and a second circuit board along the one direction, the bottom surface being arranged on a top surface of the cooling device; a metal body connected between the wiring portion, and a top surface of the first circuit board; and a semiconductor chip that includes a top surface electrode, and a bottom surface electrode, the top surface electrode being connected to the second end portion, the bottom surface electrode being connected to a top surface of the second circuit board.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: February 15, 2022
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Nobuhide Arai
  • Patent number: 11223305
    Abstract: A vehicle driving device includes a case that accommodates therein a first rotary electric machine and a second rotary electric machine arranged with rotation axes thereof parallel to each other and radially adjacent to each other, and a power control device that controls electric power supplied to the first rotary electric machine and the second rotary electric machine. In the power control device, a control board, a power card and a cooler, a reactor and a capacitor, and a water jacket are disposed in order from top in a height direction.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: January 11, 2022
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Naoyuki Kishimoto, Hiroshi Yaguchi, Shuichi Iwata, Naoki Marukawa, Hirotaka Koyanagi
  • Patent number: 11218081
    Abstract: A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: January 4, 2022
    Assignee: DENSO CORPORATION
    Inventors: Masataka Deguchi, Akihiro Ueda, Koji Yasui, Hirotaka Ohno
  • Patent number: 11202395
    Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: December 14, 2021
    Assignee: Astrodyne TDI
    Inventors: Gary Mulcahy, Matthew Joseph Fuhrmann, Tunc Icoz
  • Patent number: 11183949
    Abstract: A power conversion device includes a semiconductor stack, a reactor, and a capacitor. The semiconductor stack includes a plurality of semiconductor modules stacked on one another in a stacking direction. Each semiconductor module includes a semiconductor element. The reactor constitutes a boost circuit that boosts a direct-current voltage. The capacitor is electrically connected to the plurality of semiconductor modules. The semiconductor stack, the reactor, and the capacitor each include a coolant flow passage, and the reactor and the capacitor are located adjacent to each other.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 23, 2021
    Assignee: DENSO CORPORATION
    Inventors: Hiromi Ichijo, Kazuya Takeuchi, Kenichi Hasegawa
  • Patent number: 11177742
    Abstract: A power converter includes: a plurality of power modules that houses semiconductor elements for electric power conversion; a pair of holding plates sandwiching a stacked body of the plurality of power modules in the first direction; a pair of connecting beams that connects the pair of holding plates respectively on both side ends of the stacked body in the second direction intersecting the first direction; and a substrate connected to control terminals of the power modules. At least one of the pair of holding plates is provided with a positioner to position the substrate.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: November 16, 2021
    Assignee: DENSO CORPORATION
    Inventors: Masataka Deguchi, Akihiro Ueda, Koji Yasui, Hirotaka Ohno