Liquid Patents (Class 361/699)
  • Patent number: 11071238
    Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: July 20, 2021
    Assignee: ICEOTOPE GROUP LIMITED
    Inventors: Neil Edmunds, Andrew Young, David Amos
  • Patent number: 11071233
    Abstract: An auxiliary-cooled electronics assembly comprises a metal extrusion that includes: one or more cooling conduits extending axially along a length of the metal extrusion with a first open end in fluid communication with the cooling conduit(s); and a second open end in fluid communication with the cooling conduit(s); a first end cap coupled to the first open end forming a fluid-tight seal between the first end cap and the metal extrusion; a second end cap coupled to the second open end forming a fluid-tight seal between the second end cap and the metal extrusion; and one or more electrical circuit components, electrically linked together to form an electrical circuit, mounted to the metal extrusion.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: July 20, 2021
    Assignee: BORGWARNER, INC.
    Inventors: Dominique Robert, Glen Kozeli, Philippe Alain Clayton
  • Patent number: 11064634
    Abstract: The present application pertains to testing methods and apparatus useful in two-phase liquid immersion cooling systems. Such systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of two phase liquid immersion cooling so actual servers are not required to test various aspects of the two phase liquid immersion cooling units.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: July 13, 2021
    Assignee: TMGCore, LLC
    Inventors: John David Enright, Jacob Mertel, Taylor Monnig, William Hadala
  • Patent number: 11064626
    Abstract: Components selected from bare die, surface mount devices and stacked devices are assembled using flip chip assembly methods on a printed circuit board assembly (PCBA) with no components having a mounted height exceeding a preferred height. The preferred height may correspond with the components having the highest power rating, because the most effective thermal coupling to a heat sinking surface will then be provided to these high-power components. A blade server is configured with the back face of high-power components coupled to a metal tank carrying cooling water. An electronic system has laminate blocks comprising repeated laminations of PCBAs coupled to metal foils. The laminate blocks are coupled to heat sink surfaces in direct contact with cooling liquid. Power density is superior to existing high-performance computing (HPC) systems and data center servers.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: July 13, 2021
    Inventor: Peter C. Salmon
  • Patent number: 11056447
    Abstract: A power module includes a substrate having a first layer and a second layer which are connected to one another and arranged above one another. The first layer includes a first dielectric material having a metallization arranged on a side facing the second layer and the second layer includes a second dielectric material having a metallization arranged on a side facing away from the metallization of the first dielectric material. A power semiconductor having a first contact area and a second contact area opposite the first contact area is connected to the metallization of the first dielectric material via the first contact area and arranged in a first recess of the second layer. A metallic first encapsulation encapsulates the power semiconductor in a fluid-tight manner, with the second contact area of the power semiconductor being electrically conductively connected to the metallization of the second dielectric material via the first encapsulation.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: July 6, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Stefan Pfefferlein
  • Patent number: 11032939
    Abstract: An enclosure for an electronic system that is configured to act as a heat exchanger to remove heat from a cooling liquid that is circulated through the electronic system for cooling the electronic components thereof which are submerged in the cooling liquid in direct contact therewith. The enclosure uses an arrangement of a combination of external fins on one or more walls and fluid passages formed in one or more of the walls through which the cooling liquid is circulated for cooling. The fluid passages and the external fins are preferably formed on the same wall. The fins and the fluid passages can be formed on any number of walls of the enclosure.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: June 8, 2021
    Assignee: LiquidCool Solutions, Inc.
    Inventors: Rick Tufty, Steve Shafer
  • Patent number: 11019750
    Abstract: A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: May 25, 2021
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Mu-Shu Fan, Chien-Yu Chen
  • Patent number: 10966354
    Abstract: According to one embodiment, a liquid cooling module includes a chassis, a supply liquid manifold and a return liquid manifold that are both fluidly coupled to a coolant source, a piece of information technology (IT) equipment that is mounted to the chassis and has an IT component, and a frame structure that includes: a pair of primary beams that are coupled to the chassis, a pair of secondary beams, each secondary beam being coupled to both primary beams, and a cold plate that is coupled to the pair of secondary beams. The plate is arranged to come into direct contact with the component. The plate is fluidly coupled to the supply liquid manifold to receive liquid coolant from the source and is fluidly coupled to the return liquid manifold to return warmed coolant to the source that is produced when heat generated by the component is transferred into the coolant.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: March 30, 2021
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 10955883
    Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: March 23, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Robert Mascia, Harvey Lunsman, Steven Dean, Michael Scott
  • Patent number: 10945333
    Abstract: Thermal management assemblies for cooling an electronic assembly disposed on a PCB are disclosed. The thermal management assembly includes a heatsink, a heatsink manifold formed through the heatsink and a thermal compensation base layer coupled to the heatsink. The heatsink manifold has a fluid inlet and a fluid outlet. The thermal compensation base layer thermally connects the heatsink and the electronic assembly. The thermal management assembly further includes a cooling manifold disposed through the PCB to form a fluid flow path. Two or more electrically insulated posts are disposed between the heatsink manifold and the cooling manifold. Individual electrically insulated posts have a vertical cooling channel. At least one electrically insulated post fluidly connects the fluid inlet to the cooling manifold to form an upward fluid path. At least one electrically insulated post fluidly connects the cooling manifold to the fluid outlet to form a downward fluid path.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: March 9, 2021
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Shohei Suenaga, Yanghe Liu
  • Patent number: 10935288
    Abstract: The present invention relates to a condenser, and more particularly, to a condenser in which a configuration and an assembly are simplified by forming a condensation region in which plates are stacked and refrigerant is condensed and a super cooling region in which the refrigerant is supercooled, arranging a connection plate to which a gas-liquid separator is coupled between the condensation region and the super cooling region, and forming the refrigerant and cooling water to flow between the condensation region and the super cooling region, in a water cooling condenser.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: March 2, 2021
    Assignee: Hanon Systems
    Inventors: Sang Yong Rhee, Jun-Il Jang, Seong Hun Kim, Hyun Keun Shin
  • Patent number: 10905031
    Abstract: In one embodiment, a cooling device for providing liquid cooling to an electronics circuit board includes an upper module having a cooling plate forming an upper surface to receive an external circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel. The cooling device further includes a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source, and the cooling device includes a plurality of tube channels positioned between the upper module and the lower module to receive the cooling liquid from the lower module and to supply the cooling liquid upwardly to the upper module.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: January 26, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10874030
    Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: December 22, 2020
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Kuo-Wei Lee
  • Patent number: 10874035
    Abstract: An example device in accordance with an aspect of the present disclosure includes a collection engine and a correlation engine to identify cooling loop characteristics. The collection engine is to collect data from devices associated with cooling loops. The correlation engine is to identify, based on the data collected, a common loop from among the cooling loops, and which of the devices are associated with the common loop.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: December 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Tahir Cader, David A. Moore, Greg Scott Long
  • Patent number: 10861646
    Abstract: A motor driving device includes a housing unit, a capacitor module, and a driving module. The housing unit includes a first compartment and a second compartment. The capacitor module is detachably mounted in the first compartment and includes a first circuit board, at least one capacitor electrically connected to the first circuit board, and two first conducting members electrically connected to the first circuit board. The driving module is mounted in the second compartment and includes a second circuit board and two second conducting members that are electrically connected to the second circuit board and that are respectively, electrically and detachably connected to the first conducting members.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: December 8, 2020
    Inventor: Yueh-Han Li
  • Patent number: 10851746
    Abstract: A controller of a fuel system for a vehicle is provided in which heat is dissipated outside from a printed circuit board to cool the controller. The dissipated heat is utilized to maximize the efficiency of the purge operation using a canister by waste heat. The controller is integrated with an air filter for removing foreign substances from air to be suctioned into a canister, and is configured to realize heat exchange between air passing through the air filter and a motor driver.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: December 1, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Chang Han Kim, Jong Ki Kim, Jae Min Lee
  • Patent number: 10840003
    Abstract: The present disclosure envisages an arrangement for maintaining desired temperature conditions on and within a transformer housing of an encapsulated transformer. The arrangement comprises at least one insulation plate disposed proximal to a transformer core and coil assembly of the encapsulated transformer such that the insulating element is in surface contact with a potting compound of the encapsulated transformer and adapted to substantially contain the heat emanating from the transformer core and coil assembly, thereby maintaining desired temperature conditions on and within the transformer housing.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: November 17, 2020
    Assignee: Appleton Grp LLC
    Inventors: Ajit Dilip Athavale, Dale Charles Corel
  • Patent number: 10827648
    Abstract: A cabinet liquid cooling system is configured to dissipate heat of a cabinet. A flow allocation unit is installed on a single side of the cabinet, is located in space between a side wall of the cabinet and a mounting bar of the cabinet, and is provided with a liquid inlet and a liquid outlet. A liquid cooling system (LCS) control unit is installed at the bottom of the cabinet and cyclically supplies liquid to the flow allocation unit using the liquid inlet and the liquid outlet. A liquid supply branch includes a liquid delivery pipe and a liquid return pipe. A node pipe includes a liquid inlet pipe and a liquid outlet pipe. Both the liquid inlet pipe and the liquid outlet pipe are connected to the corresponding liquid delivery pipe and liquid return pipe using the quick male connector and the quick female connector.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: November 3, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lianjun Liu, Yao Li
  • Patent number: 10818985
    Abstract: The present invention relates to a heat exchanger for cooling an electrical element and a heat exchanger assembly for cooling an electrical element, and more particularly, to a heat exchanger for cooling an electrical element and a heat exchanger assembly for cooling an electrical element into which the electrical element may be easily inserted and in which both surfaces of the electrical element and a tube through which a coolant flows are formed to contact each other to improve cooling performance.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: October 27, 2020
    Assignee: Hanon Systems
    Inventors: Hong-Young Lim, Jun Young Song, Wi Sam Jo, Hyun Hee Jung, Sun Mi Lee
  • Patent number: 10818575
    Abstract: A solid state drive is disclosed including a planar array of semiconductor devices for use in a datacenter, and a system for cooling the planar array of semiconductor devices. The semiconductor devices may be arranged in a grid pattern, spaced apart from each other so as to define rows and columns of flow pathways, or cooling tunnels, around and between the semiconductor devices.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: October 27, 2020
    Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
    Inventors: Chin-Tien Chiu, Zhongli Ji, Hem Takiar
  • Patent number: 10806021
    Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: October 13, 2020
    Assignee: NXP USA, Inc.
    Inventors: Lakshminarayan Viswanathan, Lu Li, Mahesh K. Shah, Paul Richard Hart
  • Patent number: 10806034
    Abstract: A circuit assembly 1 includes a semiconductor switching element, a main substrate, a plurality of bus bars and a sub-substrate that are overlaid on the main substrate, and a jumper wire. The main substrate includes a first insulating substrate and a first conductive path. The sub-substrate includes a second insulating substrate and a second conductive path, and is overlaid on the main substrate and arranged in the same layer as the bus bars. The jumper wire connects the first conductive path with the second conductive path. A plurality of terminals of the semiconductor switching element include a drain terminal 42 and a source terminal that are connected to the bus bar and a gate terminal connected to the second conductive path. A noise reduction element is mounted on the sub-substrate.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: October 13, 2020
    Assignees: AutoNetworks Technologies Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Yukinori Kita, Kyungwoo Kim
  • Patent number: 10765031
    Abstract: In some examples, a system includes a plurality of posts and a plurality of cage panels, wherein each of the cage panels is removably coupled to one or more of the plurality of posts, wherein a nominal width of each of the cage panels is congruent based on a modulus, wherein an actual width of each of the cage panels is equal to a difference between the nominal width of the cage panel and the width of one of the plurality of posts, and wherein any combination of a subset of the plurality of cage panels coupled in a common orientation to a subset of the plurality of posts has a combined width, between respective centers of end posts of the subset of the plurality of posts, that is congruent based on the modulus.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: September 1, 2020
    Assignee: Equinix, Inc.
    Inventor: Thomas M McNair
  • Patent number: 10763758
    Abstract: A power converting apparatus according to the present disclosure includes: a capacitor being supplied with a DC from a battery of a vehicle; at least one or more power converting modules including a power terminal through which a current is input and output and a signal terminal through which signals are input and output, and disposed perpendicular to the capacitor with the power terminal facing the bottom of the capacitor and the signal terminal facing the top of the capacitor; a control unit disposed over the capacitor and controlling the power converting module; and a housing assembled with the capacitor, the power converting module, and the control unit.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: September 1, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Yun Ho Kim
  • Patent number: 10721843
    Abstract: One example of a system includes a blade enclosure and a midplane within the blade enclosure. The midplane supports a first sleeve connector and a second sleeve connector, where each of the first and second sleeve connectors have a first side and a second side. A server blade installed in the blade enclosure includes an air duct coupled to the first side of the first sleeve connector. A cooling module including an air manifold is coupled to the second side of the first sleeve connector to deliver cool air to the air duct of the server blade.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: July 21, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin Leigh, George Megason
  • Patent number: 10672739
    Abstract: A first member of a first semiconductor module and a second member of a second semiconductor module are disposed adjacent to each other along a crossing line segment crossing a longitudinal direction of the first semiconductor module as seen in a plan view. The first member is provided with a first circuit. The second member is provided with a second circuit. The first circuit does not drive when the second circuit is driving. The second circuit does not drive when the first circuit is driving.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: June 2, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yumie Kitajima, Shota Saito
  • Patent number: 10667427
    Abstract: Embodiments of the invention provide a system design for immersion cooling. The design utilizes a single cooling loop design. An external cooling unit, such as an indirect evaporative cooling (IDEC) system, is utilized to transfer the heat to the atmosphere from the cooling loop. The fluid in the cooling loop is driven by a centralized pump or pumps and the local pumps. The fluid is supplied to the immersion cooling rack or device. The design introduces several innovations on the cooling loop infrastructure by adding heat recovery system. Under different operating conditions, both the heat recovery system and external cooing unit can be connected into or bypassed from the main immersion cooling loop. At least some of the advantages include simplified infrastructure, a total system solution, high reliability, fast deployment, feasible system operation adjustment, cost reduction, and high operating efficiency.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 26, 2020
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10651761
    Abstract: A phase leg for an inverter includes a switching module having a switch device, a power lead connected to the switching module and in electrical communication with the switch device, and a drive lead. The drive lead is connected to the switching module, is in electrical communication with the switch device, and is segregated from the power lead to limit heating of a drive module connected to the drive lead from current flowing through the power lead. Multilevel inverters and methods of making phase legs for inverters are also described.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: May 12, 2020
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Debabrata Pal
  • Patent number: 10645841
    Abstract: A cooling device includes a cooling tank, a support frame, and a rotary shaft. The cooling tank accommodates coolant and an electronic device. The electronic device is immersed in the coolant. The support frame defines an opening in a first side plate and a receiving space communicating with the opening. The cooling tank is received in the receiving space. The cooling tank includes a base plate and a sidewall. The rotary shaft is rotationally mounted to a bottom corner of the cooling tank formed by the base plate and the sidewall. The rotary shaft serves as a rotating axis of the cooling tank to rotate the cooling tank out of the opening.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: May 5, 2020
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Yao-Ting Chang, Chih-Hung Chang, Yen-Chun Fu, Li-Wen Chang, Chao-Ke Wei
  • Patent number: 10637224
    Abstract: An electrical junction box configured to be disposed between a power supply and a load includes a cooling case that has an opening, a circuit assembly that is disposed closing the opening of the cooling case, and a liquid coolant that is stored in the cooling case. The circuit assembly has a case-facing surface that faces the cooling case, and includes a plurality of busbars that are disposed on the case-facing surface and constitute a conductive path between the power supply and the load. The busbars are immersed in the liquid coolant R.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: April 28, 2020
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hiroomi Hiramitsu, Tomotaka Kurozu, Masato Tsutsuki
  • Patent number: 10638645
    Abstract: An assembly for containing and detecting leaks from a coolant line includes a basin with side and end walls, and at least one U-shaped cavity in an end wall for receiving a coolant line of a liquid cooling system. A bottom of the basin includes at least one sloped interior surface arranged to divert water in the basin to a local low point, where a sensor is positioned and operable to detect liquid in the collection basin. A leak detection system can employ a leak detection assembly to detect and/or locate a leak.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: April 28, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Jon Moen, Vijay Patel, Felipe Enrique Ortega Gutierrez, Yaotsung Lee
  • Patent number: 10617031
    Abstract: An electronic device includes a housing filled with a liquid coolant, a first electronic device accommodated in the housing and immersed in the liquid coolant, a first heat sink provided with the first electronic device and exposed to the liquid coolant filled in the housing, a suction pipe configured to have an inlet that sucks the liquid coolant filled in the housing, a discharge pipe configured to have an outlet that faces the first heat sink via the liquid coolant filled in the housing and discharges the liquid coolant sucked from the inlet toward the first heat sink, and a pump provided in the housing to be coupled between the suction pipe and the discharge pipe, and configured to suck the liquid coolant from the inlet and discharge the liquid coolant from the outlet.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: April 7, 2020
    Assignee: FUJITSU LIMITED
    Inventors: Michimasa Aoki, Masumi Suzuki
  • Patent number: 10617042
    Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: April 7, 2020
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Travis C. North, Christopher M. Helberg, Steven Embleton, Edmond I. Bailey, James D. Curlee
  • Patent number: 10617032
    Abstract: A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: April 7, 2020
    Assignee: TMGCore, LLC
    Inventors: John David Enright, Jacob Mertel
  • Patent number: 10581339
    Abstract: A power conversion system at least includes a filter capacitor, a DC-DC converter, a smoothing capacitor, a housing and a refrigerant flow channel. The refrigerant flow channel is disposed between the housing and a flow channel cover. The refrigerant flow channel includes a converter facing portion at least partially facing the DC-DC converter. The filter capacitor at least partially overlaps with the DC-DC converter when viewed in a first direction from an opposite side of the refrigerant flow channel to the converter facing portion. The smoothing capacitor does not overlap with the DC-DC converter when viewed in the first direction and partially overlaps with the DC-DC converter when viewed in a second direction. At least two fastening sections fasten the flow channel cover to the housing and do not overlap with the smoothing capacitor when viewed in the first direction.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: March 3, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kodai Yamaura, Hiroki Umeda
  • Patent number: 10568234
    Abstract: A liquid-immersion cooling device includes a reservoir, a partition board, and a heat exchanger. The reservoir contains coolant to immerse the electronic device. The partition board and the heat exchanger are mounted within the reservoir. The partition board is arranged parallel to the electronic device. The heat exchanger and the electronic device are respectively arranged on opposite sides of the partition board within the reservoir. The partition board is configured to guide a flow of the coolant within the reservoir. When the coolant flows through the electronic device and carries away heat generated by the electronic device, the coolant carrying the heat is guided by the partition board to flow through the heat exchanger. After exchanging heat with the heat exchanger, the coolant is guided by the partition board to flow through the electronic device.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: February 18, 2020
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Chih-Hung Chang, Yen-Chun Fu, Yao-Ting Chang, Li-Wen Chang, Chao-Ke Wei
  • Patent number: 10559515
    Abstract: An electronic device includes a first electronic component, a substrate on which the first electronic component is mounted, which includes an additional region formed on one side of the first electronic component in a first direction for adding a second electronic component, and onto which cooling air flows, and a wall member partially surrounding the additional region, wherein the wall member includes one opening for allowing the air to flow over the additional region.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: February 11, 2020
    Assignee: FUJITSU LIMITED
    Inventor: Yoichi Sato
  • Patent number: 10507604
    Abstract: A nanotransfer printing method, including the steps of coating a polymer thin film on a template substrate where a surface pattern is formed, fabricating the polymer thin film into a thin-film replica mold by using the polymer thin film and an adhesive film, forming nanostructures on the thin-film replica mold, selectively weakening an adhesive force between the adhesive film and the thin-film replica mold, and transferring the nanostructures into a target object, is provided.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: December 17, 2019
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Yeon Sik Jung, Jae Won Jeong, Kwang Min Baek, Jong Min Kim, Tae Won Nam
  • Patent number: 10512193
    Abstract: The present disclosure describes a cooling chassis for a cooling system of a computer system. The cooling chassis includes a housing configured to allow air to pass through in a housing air flow direction. A first radiator is within the housing. The first radiator is oriented at a first oblique angle relative to the housing air flow direction. A first fan is configured to direct air through the first radiator in a first fan air flow direction oblique to the housing air flow direction.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 17, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Tsung-Ta Li
  • Patent number: 10499488
    Abstract: A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: December 3, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Pinche Tsai, Minh H. Nguyen
  • Patent number: 10421421
    Abstract: A housing for a control unit of a motor vehicle has a housing element and a further element attached to the housing element by way of a joining technique that does not include a joining layer or by way of a joining layer. The housing element has a main body composed of a light metal and a protective layer applied to the main body. The protective layer is arranged between the main body and the attached further element. The invention further relates to a method for producing a housing and to a control unit.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: September 24, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Hermann Haemmerl, Gregory Drew, Thomas Riepl
  • Patent number: 10374414
    Abstract: A semiconductor power module with which it is possible to suppress the influence of noise given from a main terminal to a control terminal is provided. At least any one of main terminals (positive electrode terminal, negative electrode terminal, alternating current terminal) is so configured that the main terminal includes two parts extended in a common direction. The two parts are, for example, formed of a single component having such as a shape that the component is bifurcated from the outside toward the inside of the semiconductor power module or two different components. The two parts are so structured that the parts are extended in a common direction. Control terminals (gate signal terminal and emitter signal terminal) are so arranged that a laminated portion of the control terminals is sandwiched between one and the other of the two parts to configure the semiconductor power module.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: August 6, 2019
    Assignee: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
    Inventors: Keisuke Horiuchi, Daisuke Kawase, Masamitsu Inaba, Katsuaki Saito
  • Patent number: 10342122
    Abstract: An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: July 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bruce J. Chamberlin, Scott B. King, Joseph Kuczynski, David J. Russell
  • Patent number: 10312214
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 4, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu, Jiang Wen Deng
  • Patent number: 10290791
    Abstract: A lighting device includes a heat sink, through which air can flow transversely to its longitudinal extension and a plurality of semiconductor light sources, in particular light-emitting diodes, arranged on the heat sink, wherein at least two of the semiconductor light sources are aligned in different directions.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: May 14, 2019
    Assignee: LEDVANCE GMBH
    Inventors: Nicole Breidenassel, Klaus Eckert, Johannes Hoechtl, Henrike Streppel
  • Patent number: 10177675
    Abstract: An object of the present invention is to achieve reduction in height of an electric power conversion device while maintaining high performance of the electric power conversion device.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: January 8, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yuta Numakura, Akira Ishii
  • Patent number: 10165708
    Abstract: A cooling mechanism used inside a gimbal includes a heat dissipating module, a main board and fasteners. The main board is fixed to a lower surface of the heat dissipating module through the fasteners. The main board includes a main chip. The heat dissipating module includes an upper sealing cover; a lower sealing cover fixedly connected to the upper sealing cover, wherein a lower surface of the lower sealing cover has a hole for accommodating the main chip; an air storehouse, wherein a bottom surface of the air storehouse contacts with the main chip, a side surface of the air storehouse is adjacent to a cooling chamber; and sealing rings located between the upper sealing cover and the lower sealing cover. A cooling chamber is formed by the upper sealing cover, the lower sealing cover and a baffle, the cooling liquid is provided in the cooling chamber.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: December 25, 2018
    Assignee: Haoxiang Electric Energy (Kunshan) Co., Ltd.
    Inventors: Yu Tian, Wenyan Jiang
  • Patent number: 10136527
    Abstract: A power conversion device includes a casing, a structural plate, a converter module, an auxiliary circuit board module and a top cover. The casing includes a base plate and a side wall, and the base plate and the side wall form a chamber. The structural plate is located in the chamber. The converter module is located between the base plate and the structural plate. The auxiliary circuit board module is located at a side of the structural plate in the chamber away from the base plate, and is electrically connected with the converter module. The top cover seals the chamber.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: November 20, 2018
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Pei-Ai You, Gang Liu, Jin-Fa Zhang
  • Patent number: 10113755
    Abstract: Provided is an outdoor unit of an air conditioner capable of obtaining efficient air blowing performance by optimizing a length dimension of a heat exchanger and a relative position of a blower. A front end portion is disposed closer to the left side panel than a rotation shaft of the first blower, and a rear end portion is disposed closer to the right side panel than a rotation shaft of the first blower in the first heat exchanger, and a front end portion is disposed closer to the right side panel than a rotation shaft of the second blower, and a rear end portion is disposed closer to the left side panel than a rotation shaft of the second blower in the second heat exchanger.
    Type: Grant
    Filed: February 2, 2017
    Date of Patent: October 30, 2018
    Assignee: FUJITSU GENERAL LIMITED
    Inventors: Kenta Nezu, Satoshi Kasugai
  • Patent number: 10108233
    Abstract: A computer cooling assembly for a computer of a vehicle, such as an autonomous driving vehicle, includes a shell that defines an interior space. The shell is configured to house the computer. A cooling loop is positioned in the interior space proximate to the computer. The cooling loop is configured to couple to an air conditioning system of the vehicle. A heat transfer medium is positioned in the interior space. The heat transfer medium is in contact with the cooling loop and the computer. The heat transfer medium is configured to transfer heat that is generated by the computer to the cooling loop.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: October 23, 2018
    Inventor: Johann Wischnesky