Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.

Abstract: An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink.

Abstract: A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case.

Abstract: Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

Abstract: A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatuses include a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple fluid-boiling fins of a heat spreader coupled to one or more of the electronic components immersed within the dielectric fluid. The interleaved fins facilitate localized cooling and condensing of dielectric fluid vapor within the sealed compartment.

Abstract: In an embodiment, a medium voltage drive system includes a transformer, multiple power cubes each coupled to the transformer, and a manifold assembly. Each power cube includes cold plates each coupled to a corresponding switching device of the cube, an inlet port in communication with a first one of the cold plates and an outlet port in communication with a last one of the cold plates. The manifold assembly can support an inlet conduit and an outlet conduit and further support first and second connection members to enable blind mating of each of the first connection members to the inlet port of one of the power cubes and each of the second connection members to the outlet port of one of the power cubes to enable two phase cooling of the plurality of power cubes.

Abstract: An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer.

Abstract: A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated.

Abstract: A heat dissipation system is provided. The heat dissipation system includes: an evaporator having a plate chamber with the wick structures which has a plurality of pore sizes arranged in the plate chamber, a condenser, a vapor line, and a liquid line. The two-phase circulation of the vapor-condensate in the heat dissipation system, especially in the heat dissipation system with a plate evaporator, can effectively increase the heat conductivity of the plate heat source such as electronic chip. The design and composition of the wick structures are enormously decreased the turning-on temperature of the heat dissipation system and maintained the heat dissipation system in the balancing state under the low heat source power.

Abstract: A method and apparatus for removing vapor inside a liquid pump at the start up operation of the pump. In addition, a method and apparatus for removing liquid inside a compressor at the start up operation of the compressor. The pump and compressor each include a sensor attached to them that determines the physical state (i.e., liquid or vapor) of a material inside the pump or compressor. If vapor is detected inside the pump, a thermoelectric module connected to the pump is powered to condense the vapor into a liquid. Likewise, if liquid is detected inside the compressor a heater connected to the compressor is powered to evaporate the liquid into a vapor. After the state of the material inside the pump or compressor is changed, the pump or compressor is powered up for operation in a cooling system.

Abstract: A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.

Abstract: A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

Abstract: An exemplary portable electronic device includes a printed circuit board, a heat generating electronic component mounted on the printed circuit board, a shell housing the printed circuit board, the heat generating electronic component and a heat pipe therein. The heat pipe includes an evaporating side and a condensing side. The evaporating side thermally contacts the heat generating electronic component, and the condensing side thermally contacts the shell.

Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

Abstract: A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.

Abstract: A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coolant through the evaporators. The coolant loop includes a plurality of coolant branches coupled in parallel, with each coolant branch being coupled in fluid communication with a respective evaporator. The cooling system further includes a control unit for maintaining pressure of system coolant at a system coolant supply side of the coolant branches within a specific pressure range at or above saturation pressure of the system coolant for a given desired saturation temperature of system coolant into the evaporators to facilitate two-phase heat transfer in the plurality of evaporators from the electronic devices to the system coolant at the given desired saturation temperature.

Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

Abstract: Protective enclosure and method for protecting heat sensitive, data recording devices in high temperature environments. The protective enclosure has a housing having at least one compartment for containing a heat sensitive, data recording device, e.g., a temperature recording device, and a jacket configured to contain a phase change material. The jacket may be vented and configured to at least partially surround the compartment. The housing may be sealed with an endcap. The recording device and a heat absorbing element are disposed within the same or within adjoining or adjacent sub-compartments within the enclosure. In a method, the enclosure with heat absorbing element and temperature recording device is placed within a heated environment or environment to be heated, e.g., a furnace. The recording device is connected to a thermal couple.

Abstract: A starter motor controller for an auxiliary power unit transfers thermal energy from low thermal capacity electric components to high thermal capacity electric components to control temperature without active cooling systems.

Abstract: Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.

Abstract: A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.

Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.

Abstract: A thermal system is disclosed in thermal communication with an electrical device. In one form the thermal system is a refrigeration system having a compressor, condenser, and evaporator. The electrical device can be disposed within the thermal system such that a working fluid of the thermal system exchanges heat with the electrical device. In one embodiment the thermal system includes a container in which the electrical device is disposed. The working fluid in the container can, but need not, remain in substantially the same physical state when transferring heat with the electrical device.

Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.

Abstract: There is disclosed a manufacturing method of a liquid discharge head including a substrate in which a first energy generating element and a second energy generating element that generate energy used for discharging liquid are provided, a discharge port member in which a first discharge port discharging the liquid is provided corresponding to the first energy generating element and a second discharge port discharging the liquid is provided corresponding to the second energy generating element, and a flow path wall member having a portion of the liquid flow path wall that communicates with the first discharge port and the second discharge port, in which a distance between the second energy generating element and the second discharge port is larger than that between the first energy generating element and the first discharge port.

Abstract: The present invention provides an apparatus including aluminum alloy vessel, the vessel including aluminum in combination with a gettering metal and a method for making such apparatus.

Abstract: A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate.

Abstract: A heat dissipating system adapted to dissipate heat generated from an IC package mounted onto a socket connector, comprises a heat dissipating device comprising a heat spreader embedded with at least one heat pipe and a supporting plate flexibly seated upon an upper face of the heat spreader, and a clip located upon the heat dissipating device for pressing the heat dissipating device downward toward the socket connector.

Abstract: A 3-Dimensional multi-layered modular computer (3DMC) is disclosed that comprises removable layers of at least one CPU layer, at least one volatile memory layer, and at least one Input/Output (I/O) interface layers. The layers are stacked in parallel and are electrically connected to create a computing apparatus. Each of the layers is formed from encapsulating material having one or more internal cavities for chip dice, passive components, active components, and conductor's traces. A plurality of Thermal Conducting Rods (TCRs) is capable of conducting and removing heat generated by the components in the layers from the 3DMC apparatus to an external medium. Each TCR perpendicularly passes through the layers.

Abstract: A display device according to the present invention comprises a housing having a waterproof structure and provided with an accommodation room formed therein, a ventilation part defined outside the accommodation room and leading to outside of the housing, a display panel arranged inside the accommodation room and including a display screen viewable from a front surface side of the housing, and one or a plurality of heat pipes arranged on a rear surface side of the display panel. The heat pipe passes through a side surface wall forming the accommodation room and extends from inside of the accommodation room to inside of the ventilation part.

Abstract: A thermal interposer for a heat-generating electronic component includes a thermally conducting body that is configured to be thermally coupled to the electronic component. The thermally conducting body may include a first region that is located on a first face of the thermally conducting body. The first region may be adapted to be in thermal contact with a surface of the electronic component. The thermally conducting body may also include a second region located on a second face that is opposite the first face of the thermally conducting body. The thermal interposer may also include a cold plate assembly that is removably coupled to the thermally conducting body. The cold plate assembly may be in thermal contact with the second region of the thermally conducting body. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

Abstract: An electronic apparatus has a case having a bottom wall in which a first vent is formed and a circumferential wall connected to a perimeter of the bottom wall; a printed circuit board housed in the case; an electronic component which is mounted on the printed circuit board and generates heat when powered; a fan which has an air outlet and sends out a wind through the air outlet in such a direction that the wind goes away from a rotation axis of a rotor; a heat radiation member opposed to the first vent and the air outlet of the fan; and a heat pipe which is disposed between an associated part of the circumferential wall and the heat radiation member and transmits heat generated by the electronic component from the electronic component to the heat radiation member.

Abstract: A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.

Abstract: A display apparatus includes an accommodation chamber having a sealed structure, a display panel accommodated in the accommodation chamber, a cooling part which cools the air inside the accommodation chamber, a drain pipe extending from a bottom part of the accommodation chamber, and a check valve provided in the drain pipe.

Abstract: An electronic apparatus includes a circuit board, a first and a second electronic components installed on the circuit board, and a heat dissipation device. The heat dissipation device includes a centrifugal fan defining a first air outlet and a second air outlet, a first fin assembly disposed at the first outlet of the centrifugal fan, a second fin assembly disposed at the second outlet of the centrifugal fan and thermally contacting the second electronic component, and a heat pipe. The heat pipe includes an evaporating section, a first condensing section and a second condensing section located at two ends of the evaporating section. The evaporating section thermally contacts the first electronic component. The first condensing section is thermally attached to the second fin assembly, and the second condensing section is thermally attached to the first fin assembly.

Abstract: A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liquid tank defines a liquid injection hole therein. A clip assembly is connected to the liquid tank. When pressed against the clip assembly by a user, the liquid tank is fastened by the clip assembly and thus retained in position. When pressed again toward the clip assembly, the liquid tank is released from the clip assembly and ejected in a direction away from the heat-generating electronic component. An electronic device using the liquid cooling system is also provided.

Abstract: A heat dissipation device includes a heat sink, a fan having a flange and a plurality of brackets mounting the fan on the heat sink. Each of the brackets includes two pair of spaced buckles extending from a top thereof toward the fan. A bottom of each bracket is fixed on a bottom of the heat sink. The two pair of buckles of the bracket are buckled on the flange of the fan.

Abstract: A heat dissipation device is provided. The heat dissipation device includes an integrated heat spreader and a base plate coupled to the integrated heat spreader, wherein tile base plate comprises a plurality of metal pellets to dissipate heat from the integrated heat spreader.

Abstract: In a cooling system for an electronic device of the present invention, server rooms in which a plurality of servers are placed, an evaporator which is provided close to each of the servers, and cools exhaust air from the server by vaporizing a refrigerant with heat generating from the server, a cooling tower which is provided at a place higher than the evaporator, cools the refrigerant by outside air and water sprinkling, and condenses the vaporized refrigerant, and a circulation line in which the refrigerant naturally circulates between the evaporator and the cooling tower. According to the cooling system, an electronic device which is required to perform a precise operation with a heat generation amount from itself being large, such as a computer and a server, can be efficiently cooled at low running cost.

Abstract: A heat dissipation device for dissipating heat from an electronic component. The heat dissipation device includes a shroud having a bottom wall and a sidewall partially surrounding the bottom wall, a base mounted on a bottom of the bottom wall, a bracket fixed on a top of the bottom wall, an impeller rotatably mounted on the bracket, a fin assembly arranged on the bottom wall, a plurality of heat pipes connecting the fin assembly with the base, and a cover secured on the sidewall. An end of the bottom wall extends beyond the sidewall to support the fin assembly thereon. An opening and a window are respectively defined in the bottom wall and the cover. A plate is formed within the opening of the bottom wall and connects the bracket with the base.

Abstract: A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

Abstract: According to one embodiment, a heat radiation block is pressed in contact with a heat receiving plate of an apparatus body, a heat receiving block receives its reaction force via a heat pipe and thus moves. A drawer section and the heat radiation block are fixed and held in the apparatus body after the movement of the heat receiving block.

Abstract: Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

Abstract: An exemplary electronic device includes an enclosure, two electronic components received in the enclosure, a heat sink, and a thermal insulation member. The enclosure defines a receiving space for receiving the electronic components and the thermal insulation member. Two ventilating holes are defined in the enclosure. The thermal insulating member defines a heat dissipating passage therein, communicating with the exterior via the ventilating holes of the enclosure. The heat sink is received in the heat dissipating passage and thermally coupled to the electronic components for dissipating heat from the electronic components. The heat dissipating passage is substantially thermally insulated from the part of the receiving space of the enclosure having the electronic components by the thermal insulation member.

Abstract: A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: A cooling assembly comprises an electronic component, a thermal spreader, a cold plate, and a phase change thermal capacitor. The thermal spreader conducts heat freely between the electronic component, the phase change thermal capacitor, and the cold plate. The cold plate dissipates heat. The phase change thermal capacitor stores undissipated heat in a phase transition of a phase change material.

Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.