Abstract: A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.

Abstract: The invention relates to an LOC type semiconductor device having improved heat radiation. The semiconductor device related to the present invention has a preferably metal heat-radiating element 7 that is in thermal contact with the surface opposite the principal surface of the semiconductor chip 3. One region of said heat-radiating element 7 is externally exposed from the package that encloses the semiconductor chip 3. The heat-radiating element 7 is in thermal contact with a metal pattern 12 that is formed on the substrate 10 on which the semiconductor device is mounted. The heat from the semiconductor chip is transferred to the mounting substrate 10 side via the heat-radiating plate 7, and heat dissipation is conducted efficiently.

Abstract: An electronic apparatus is provided with a main body having a heat generating component, a heat receiving portion thermally connected to the heat generating component, a display unit supported by the main body and having a display panel, a heat radiating portion contained in the display unit, and a circulation path which circulates a liquid refrigerant between the heat receiving portion and the heat radiating portion. The display unit contains a fan. The fan supplies cooling air to the heat radiating portion to cool the heat radiating portion by force.

Abstract: An electronic apparatus includes a main unit having a heat receiving portion which receives heat from a heat generating component, and a display unit supported by the main unit. The display unit accommodates a heat radiating portion. The heat radiating portion is connected to the heat receiving portion via a circulating path. The circulating path allows a liquid coolant to circulate between the heat receiving portion and the heat radiating portion to transfer the heat from the heat generating component to the heat radiating portion. A control device increases the amount of heat transferred from the heat receiving portion to the heat radiating portion when the display unit is moved to a closed position.

Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: An improved circuit board assembly includes a cover or other member disposed adjacent to the substrate and, for example, spaced therefrom so as to define a plenum. Self-aligning heat sinks (or other heat dissipative elements) are spring-mounted (or otherwise resiliently mounted) to the cover and, thereby, placed in thermal contact with one or more of the circuit components. Flow-diverting elements are provided, e.g., so that the overall impedance of the board substantially matches that of one or more of the other circuit boards in a common chassis. The circuit board cover can be adapted to provide thermal and/or electromagnetic emission control, as well as shock and vibration.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).

Abstract: An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.

Abstract: A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract: The heat sink is described which is used to cool an electronic component of a computer. The heat sink is constructed from a metal sheet which is bent so as to have a horizontal thermally conductive plate and four walls extending upwardly from the plate and jointly define an enclosure. Openings are formed in the walls through which air can flow by natural convection.

Abstract: An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.

Abstract: A method and apparatus for cooling a portable computer system using a computer cooler with a cold plate that comes into contact with the portable computer system to transfer heat from the portable computer system to the environment surrounding the computer cooler.

Abstract: A first apparatus includes a semiconductor device and a heat dissipating device (e.g., a heatsink) thermally coupled to the semiconductor device. The heat dissipating device is located and formed to screen the semiconductor device from external electromagnetic radiation or to contain radiation produced by the semiconductor device. A second apparatus includes a semiconductor device, a heat dissipating device thermally coupled to the semiconductor device, and a grounding structure having a capacitive coupling to the heatsink.

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract: A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

Abstract: A vehicle air intake system includes a noise cancellation assembly. A cooling member is provided at least partially within an air passageway for dissipating heat within an electronics module portion of the noise cancellation assembly. The cooling member preferably is a brass material insert that is supported at least partially within an air passageway by a housing that supports components of the noise cancellation assembly. A connecting member that thermally couples the electronics module to the cooling member also operates to secure the electronics module to the housing in one example embodiment.

Abstract: A circuit assembly has a heat sink assembly and a chip scale package assembly. The chip scale package assembly has an integrated circuit die coupled to a first printed wiring board. The heat sink assembly has an integrated circuit die coupled to a second printed wiring board. Preferably, the heat sink assembly and the chip scale package assembly are assembled separately then assembled together. The circuit pads on the first printed wiring board correspond with circuit pads on the second printed wiring board. The circuit pads may be coupled together by solder or adhesive bonding. The circuit pads on the first printed wiring board may have solder balls formed of high temperature solder that do not melt when the heat sink assembly is assembled with chip scale package assembly. The solder balls allow chip scale package assembly to maintain a predetermined distance from the circuit pads on the second printed wiring board.

Abstract: A heat dissipation device coupling structure includes of a heat sink and frame-type retaining tabs. The heat sink has a shoulder plate projecting outward from lower base thereof and L-shaped lock tabs are disposed on two ends at the lower extent of the positioner rod which is elevated thereby. A seat section having a stop tab at lower end thereof and tensile clip tabs curving outward from upper end thereof. A lip tab is folded downwardly along the outer rims of a frame plate forming upper and lower containment recesses. When assembling, a central processing unit is first inserted into the lower containment recess such that face plate is secured against the upper end of the frame plate, following which a shoulder plate of the heat sink is inserted into the lower extent of the positioner rod, with the other side of the heat sink held down by clip tabs in the upper containment recess thereby tightly secure the central processing unit.

Abstract: Apparatus and systems for cooling heat sinks, integrated circuit boards, and electronic components by providing internal passageways in the heat sinks, circuit boards, and electronic components that connect to a fluid manifold. The internal passageways connect to the surface of the heat sinks, circuit boards and electronic components. A cooling fluid capable of phase change is supplied to the internal passageways to conductively cool the interior of the heat sink, circuit board, and component and to cool the surface of the heat sink, circuit board, and/or component at least partially by evaporative cooling. A plurality of circuit boards, components, and/or heat sinks may be placed back to back with the fluid manifold therebetween. The heat sinks, circuit boards, and/or components are in an enclosed space so that cooling fluid can be contained, condensed and recycled to the fluid manifold.

Abstract: A heat dissipation device including a heat spreader or support structure having a first surface and a second surface with a flange extending from the heat spreader second surface. A heat exchanger is disposed within a housing and the housing is attached to the flange.

Abstract: A low cost computer is suitable for small size configuration. Casings 4 and 32 are formed by aluminum, which is a heat radiating material, and CPUs 6 and 36, hard disk devices 8 and 38, control ICs 40 and 42 and a memory IC are mounted on the casing 4 directly or by the heat radiating material. The casings 4 and 32 are utilized as heat radiators, thereby making the entire computer a smaller size.

Abstract: A wirebonded microelectronic package including a microelectronic die attached by a back surface to a mounting surface of a recess formed in a substrate and a heat dissipation device thermally contacting said microelectronic die active surface. A plurality of bond wires electrically connects bond pads on the microelectronic die active surface to a plurality of corresponding traces within the recess.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the extending part of the heat sink, and the first surface of the die adheres to the heat sink. In addition, the die is connected to the substrate by the wires, and the plastic mold encapsulates the die, the heat sink and the wires. The chip package according to the invention possesses the small size and high efficiency of heat dissipation; besides, it also decreases the production cost for eliminating the conventional procedures of taping and de-taping.

Abstract: A radial finned heat sink assembly for an electrical component is constructed from a graphite material, which may be resin impregnated. The assembly includes a base, and a plurality of spaced parallel planar fin members supported by the base. Each fin member includes a planar fin of an anisotropic graphite material having graphite layers aligned primarily with the plane of the fin. In a first construction the fin members include integral core portions. In a second construction the core portions are separately formed so that the graphene layers of the core portion are aligned primarily parallel to the core axis so that heat is efficiently transmitted from the base to the plate members along the core axis.

Abstract: An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.

Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: A semiconductor apparatus includes a semiconductor body in the form of a silicon substrate havng a plurality of active devices. A metal stack including a plurality of metal layers is operatively associated with the active devices. A plurality of conductive elements are connected to the metal stack and to a substrate in the form of for example a printed circuit board. Vias connect conductive elements with respective portions of at least some of the metal layers, with the conductive elements connected to heat absorbing members within the substrate, which is in turn connected to a heat sink external to the substrate, the vias being spaced at regular intervals so as to promote heat dissipation from the metal stack therethrough to the heat absoring members and the heat sink.

Abstract: A yarn processing system, e.g. a yarn feeder comprising a housing in which at least one semiconductor component is arranged on a printed circuit board. The semiconductor component lies on a heat conducting body which is in the form of at least one prolongation of the housing that extends through the printed circuit board up to the semiconductor component.

Abstract: A package according to the present invention includes a radiating substrate, a concave portion for a screw formed on a first side of the radiating substrate, a first groove formed on the first surface between a chip mounting portion and the concave portion of the radiating substrate, and a second groove on a second surface of the radiating substrate opposite to said first surface, thereby eliminating to occur a crack at the radiating substrate.

Abstract: An improved cold plate cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates. The component to be cooled is in thermal contact with a cold plate. A fin material is inserted in the cold plate and refrigerant is circulated through the fin, allowing the cold plate and fin to transfer heat from the electrical or electronic components, as the liquid refrigerant is at least partially evaporated by the heat generated by the components.

Abstract: A computer system is provided having a heat exchanger that is relatively large. Although the heat exchanger is large, it is still sufficiently light because of its plastic material. Because of the large size of the heat exchanger, a relatively large surface is provided by the cumulative outer surfaces of fins. The relatively large surface area results in a lower heat flux. The lower heat flux obviates the need for forced convection. There is thus no need to use fans when the computer system is at room temperature.

Abstract: The components of a multiphase converter, which contains semiconductor power components and a capacitor on a support containing cooling devices, are arranged in an optimally compact configuration, in which the support containing the cooling device is configured as a hollow body, the capacitor is or the capacitors are insertable in its interior in as tightly and precisely fitted fashion as possible, and the semiconductor power components are arranged on its outer side, where the height of the hollow body corresponds substantially to the height of the necessary capacitor. For a three-phase converter, the hollow body may be in the shape of a hexagon on the outer side, so that an overall shape approximating a cylinder is created, and a cylindrical cover protects everything and makes a compact component available, and for a two-phase converter, a parallelepipedal volume is optimally utilized.

Abstract: A motor driving inverter comprises a first printed circuit board provided with electronic components, a heat conduction plate made of a metal with high heat conductivity and adhered at one surface to the printed circuit board, thereby supporting the printed circuit board, a heat conduction member made of a material with high heat conductivity and connected to the heat conduction plate, thereby supporting the heat conduction plate, and a box made of a metal with high heat conductivity, accommodating the printed circuit board, the heat conduction plate and the heat conduction member, and connected to the heat conduction member, thereby supporting the heat conduction member.

Abstract: A clip (40) adapted to attach a heat sink (30) to an electronic device (20) includes a body (50) and a lever (70). The lever is fastened to the body with a pivot (96). The lever includes a pressing portion (74) and a bore (80). First and second contact points (76, 78) are defined at a lower edge of the pressing portion at different distances from the bore. The clip is initially placed in a groove (36) of the heat sink, whereupon the first contact point abuts a top surface of the groove. When the lever is fully depressed, the second contact point firmly abuts the top surface of the groove. Thus the clip securely attaches the heat sink to the electronic device.

Abstract: A temperature sensor for an integrated circuit is attached to a heat sink using a compliant member such as a spring. The spring attaches to the heat sink and extends across a slot in the thermal contact surface of the heat sink so that the temperature sensor coupled to the spring is centered nominally over an integrated circuit die when the heat sink is abutted against the integrated circuit.

Abstract: A heat sink clip (50) is formed from a single piece of resilient metal by stamping. The heat sink clip includes an operation portion (59), a pressing body (51), a first and second arms (54, 57) extending from the opposite ends of the pressing body. The first and second arms each defines an aperture (55, 58) for engaging with a catch (22) on a socket (20) on which an electronic device (30) is mounted. The pressing body presses a heat sink (40) onto the electronic device. The operation portion extends from an end of the pressing body for readily engaging/disengaging the clip.

Abstract: An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.

Abstract: A cooling arrangement facilitates the cooling of a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. In an example embodiment, the cooling arrangement provides cooling for a plurality of integrated circuit elements disposed on a plurality of substrates that are substantially perpendicularly mounted on a main substrate. The cooling arrangement includes a plurality of U-shaped thermally conductive members, each having a set of leg portions connected with a top portion and an open end disposed over a respective one of the substrates. In addition, a first inner surface of at least one of the leg portions is in thermal contact with at least one of the integrated circuit elements. The cooling arrangement further includes a housing member containing therein the U-shaped members and includes a cooling plate arrangement in thermal contact with the housing and the top portions of the U-shaped members.

Abstract: A fastening system and a method for retaining temperature control devices used on semiconductor dies transfers the load of the temperature control devices around the semiconductor dies using a spring collet arrangement. An elongated spring collet is installed in a hole in the temperature control device so as to extend outwardly from the temperature control device with the spring collet being movable in the hole relative to the temperature control device in the direction of elongation of the spring collet. An expansion spring resiliently biases the spring collet so as to extend outwardly. An outer end of the spring collet is positioned in a pocket of a retention mechanism of a support member. An electrical connection is made as the temperature control device with semiconductor die is forced down until a pin grid array thereon is properly seated in a socket on the support member.

Abstract: A device for assisting the cooling of computers, especially laptop computers, provides material having an upper surface distributed over at least two levels, preferably a corrugated surface, whereby it contacts the base of the laptop over only a part of said base, permitting the free passage of air across the support and between the laptop and the support, said support being formed from a material of high thermal conductivity, with a surface adapted for rapid transfer of heat between the material and air passing over said surface.

Abstract: A cooling apparatus using “low profile extrusions” is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion.

Abstract: A component (16) mounted on the board (20) is cooled by a cooling surface (15) in contact with a heat sink element in the form of a metal stud (8) which, in turn, may be connected to an outer cooling surface. One method of achieving this is to form holes (4) in a laminate (1), etching patterns (5), placing a metal stud (8) in the hole (4), applying a dielectric (9) to the upper and lower side of the laminate (1), forming openings (14) in the dielectric (9), and thereafter metal plating the entire circuit board and etching further patterns. Component 16 can then be mounted on the printed circuit board (20). A heat sink element (8) includes a cutting edge (18) and can be used beneficially in conjunction with one embodiment of the method.

Abstract: This invention concerns a liquid cooled dissipator for electronic components characterized by selectively arranged dissipation fins, namely fins positioned only in proximity of the areas against which the electric components to cool are mounted.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

Abstract: The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed channel formed in the base for carrying fluid into the cooling well; a drain channel formed in the base for carrying cooling fluid away from the cooling well; cooling well inlets and outlets formed in the cooling well and in communication with the feed channel and drain channels, respectively. The feed and drain channels are sufficiently large relative to the size and flow characteristics of the well and cooling well inlets and outlets such that when the cooling fluid flows through the device, the pressure drop across the feed channel is substantially less than the pressure drop across the well.