Abstract: A heat sink and an electronic apparatus using the same are disclosed. The heat sink comprises a fin structure and a fastening assembly; the fastening assembly comprises an adjustable positioning member, an elastic member, and a hooking member, the elastic member being disposed between the hooking member and the fin structure such that the adjustable positioning member combines the hooking member, the elastic member, and the fin structure; wherein the hooking member may secure the heat sink onto an electronic component, and the adjustable positioning member may be used to adjust the tightness between the heat sink and the electronic component.

Abstract: According to some embodiments, systems for an integrated pump and reservoir may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, a reservoir hydraulically coupled to the inlet, and a cold plate disposed at least partially within the housing.

Abstract: A thermal module includes a heat spreader (50) for contacting with a heat-generating electronic device mounted on a printed circuit board, a heat sink (60), a heat pipe (70) thermally connecting the heat spreader and the heat sink. A frame (80) is detachably mounted on the heat spreader, for fixing the heat spreader to the printed circuit board so that the heat spreader can thermally contact with the heat-generating device on the printed circuit board. The heat spreader has a simple polygonal configuration. The frame is formed by stamping a metal sheet or plastics injection molding.

Abstract: A heat-dissipating device includes a MOSFET heat dissipator, a south bridge heat dissipator, a north bridge heat dissipator and a water block connector. A heat pipe is provided between each heat dissipator to connect these heat dissipators in series. Further, the north bridge heat dissipator has a heat-dissipating bottom plate and a heat-dissipating body attached to a half portion of the heat-dissipating bottom plate. Further, the water block connector comprises a hollow base and two connecting tubes that are provided on two locations of the base and in communication with each other. The base of the water block connector is attached to the other half portion of the heat-dissipating bottom plate of the north bridge heat dissipater. When the water cooling is used, the two connecting tubes of the water block connector can be connected in series with a water-cooling circulation system.

Abstract: A light source (101) is provided which comprises (a) a housing element (107); (b) a heat sink (109); (c) a first flow channel element (111) which, alone or in combination with said housing element, creates (i) a first set of flow paths (221) for the flow of fluid in a first direction through the light source, and (ii) a second set of flow paths (223) for the flow of fluid in a second direction through the light source; (d) a set of synthetic jet actuators (143, 145) having at least one member and being in fluidic communication with said first set of flow paths; and (e) a set of LEDs (113) containing at least one member and being in thermal contact with said heat sink.

Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation.

Abstract: A power converter including a printed circuit board (PCB) having a plurality of heat conductive layers configured to sink heat generated by the power converter electronics. Each of these heat conductive layers are comprised of thermally conductive material configured as planar sheets, each of these heat conductive layers being coupled to at least one wire to sink heat therefrom, such as via a wire of an input cable and/or output cable. Advantageously, a more compact power converter is realized having improved power output while operating within safety guidelines.

Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: A card slot apparatus of a card and an electronic machine includes a slot body having a slot in which a card is inserted, and a heat radiating unit movable between a first position spaced apart from the card and a second position contacting the card. A moving unit moves the heat radiating unit to the second position while moving in an opposite direction to an inserting direction of the card in combination with an inserting operation of the card into the slot body. An elastic unit elastically urges the moving unit in a moving direction thereof. The heat radiating unit includes a heat sink, and an elastic member to press the heat sink when the heat sink is moved to the second position. The elastic unit elastically urges the moving unit in the moving direction thereof when the heat sink is moved to the second position.

Abstract: This invention provides a structure for holding cards having electronic and/or micromachined components. A chassis comprises a plurality of bays for receiving cards such that the cards are oriented parallel to one another. Each bay comprises a fin front-plate fabricated from thermally-conductive material(s). Each fin front-plate is coupled to or integrally formed with a base in a manner which permits thermal conductivity therebetween. For each bay holding a card, a backplane comprises an electrical connector for coupling to the card. When held in their respective bays, cards are thermally coupled to the fin front-plates. The base of the chassis preferably comprises an ingress port, an egress port and a network of conduits for conducting fluid which cools and/or redistributes heat created by the cards and their components. The network of conduits may extend from the base and into the fin front-plates.

Abstract: An arrangement having a cooling function is provided, comprising a circuit board, a plurality of heat generating devices attached to the circuit board, a cooling device thermally connected to one of the plurality of electronic devices, and a coolant plate. An example of the arrangement can include a source of pressurized coolant fluid connected to the coolant plate and adapted to cause the coolant fluid to be transferred between the coolant plate and the cooling device. In addition or alternatively, the arrangement can include a plurality of flexible conduits and an adjustment device adapted to selectively adjust he height of the cooling device. In addition or alternatively, a cooling apparatus within a cooling arrangement can comprise a cooling device, a coolant plate, and a coolant pathway including a first passage formed in the coolant plate and a second passage formed in the cooling device.

Abstract: A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

Abstract: A movable data center is disclosed that comprises a movable enclosure having partitions that define a closed-loop air flow path. A plurality of fans and a plurality of data processing modules are disposed in the air flow path. A pipe network is disposed within the enclosure that includes a chilled water supply pipe that receives chilled water from a source of chilled water. A water return pipe is provided that circulates water back to the source of chilled water. A plurality of heat exchange modules is installed in the enclosure in the air flow path. The heat exchange modules receive the chilled water from the chilled water supply pipe. Each of the heat exchange modules has a water circulation tube that connects the chilled water supply pipe to the return water pipe.

Abstract: A heat sink including a compact cooling system, superior uniformity of heating, provides a compact cooling unit superior in uniformity of cooling. A heat sink includes a header for distribution connected to a cooling fluid inlet, a header for confluence connected to a cooling fluid outlet and parallel to and adjacent to the header for distribution and a heat transfer vessel including a heating element mounting surface as well as channels inside. The channels are connected to the header for distribution and the header for confluence.

Abstract: A cooling device (1) for an electronic component (3), especially for a microprocessor, includes a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). The heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9). A rack may store several electronic components (3) to be cooled, wherein each electronic component to be cooled is included in a respective system such as respective server for a data-processing system.

Abstract: An element support and thermal control arrangement for an active array antenna, preferably modular, using line-replaceable units (LRUs), includes a radiating-side liquid-cooled cold plate lying parallel with a liquid-cooled TR coldplate. Antenna elements are supported and cooled by the radiating cold plate, and a beamformer lies between the radiating and TR coldplates. A plurality of column coldplates are attached to the rear of the TR coldplate and define bays or volumes in which power LRUs can be fitted in thermal communication with the TR coldplate, the column coldplates, or both.

Abstract: A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.

Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.

Abstract: A heat dissipation device for dissipating heat of a heat source is provided. The heat dissipation device includes a first heat dissipation unit having a heat sink and a tank, a second heat dissipation unit, a pump, and a plurality of tubes. The heat sink has a heat dissipation base, and the tank is adapted to contain a heat exchange medium and has a liquid inlet, a liquid outlet and an opening. The heat sink is disposed at the tank. The heat dissipation base passes through the opening, and it contacts the heat source. The tubes connect the liquid inlet, the liquid outlet, the second heat dissipation unit and the pump to form a closed circulation flow loop. The heat exchange medium is driven to flow in the closed circulation flow loop by the pump, and the second heat dissipation unit is adapted to cool the heat exchange medium.

Abstract: One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source.

Abstract: An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.

Abstract: A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a fin module, a fan and a heat pipe. The fan is adapted for generating an air current. The fin module includes a plurality of first fins and a plurality of second fins. Each first fin includes a first edge facing the fan. The first edges are located on a first surface. Each second fin includes a second edge facing the fan. The second edges are located on a second surface not coinciding with the first surface. The air current passes through the first surface and the second surface and then passes by the first fins and the second fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the first fins and the second fins.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract: According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Abstract: The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.

Abstract: A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

Abstract: A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the cooling air to the nozzle. The assembly is distinguished by air bearings supporting the shaft in the casing on a thin film of air, thereby maintaining a contaminate free housing.

Abstract: A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.

Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

Abstract: A mobile terminal is provided that may conduct heat generated from a print circuit board when a mobile terminal is in operation to a wider area by use of a heat releasing member having excellent conductivity. This may release unpleasantness that a user feels when using the terminal by lowering a temperature of a key pad. The mobile terminal may include a main body including a plurality of key pads for receiving information from a user; a print circuit board mounted in the main body; a battery provided at the main body; a folder coupled to the main body; a display provided at the folder for displaying a text and other image information; a speaker unit provided at the folder; a microphone unit provided at the main body; and a heat releasing member for releasing heat generated from the print circuit board.

Abstract: An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125° C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: A lithographic apparatus having an electronics module and an electronics rack in which the electronics module is operationally housed is disclosed. The electronics rack includes an electrical connector to establish an electrical connection to a mating electrical connector of the electronics module and a cooling fluid connector to establish a cooling fluid connection to a mating cooling fluid connector of the electronics module, wherein a direction of insertion of the mating electrical connector substantially corresponds to a direction of insertion of the mating cooling fluid connector.

Abstract: On a first component built-in substrate having built-in electronic components, a second component built-in substrate having built-in electronic components is stacked, and further on the second component built-in substrate, a radiator is attached. The second component built-in substrate includes a wiring layer with electronic components mounted on a main surface thereof, and an insulating layer which is mainly composed of a mixture containing an inorganic filler and a thermosetting resin and in which the electronic components mounted on the wiring layer are embedded. The insulating layer of the second component built-in substrate conducts heat generated from the electronic components and the wiring layer to the radiator.

Abstract: An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise.

Abstract: A heat dissipation apparatus includes a heat absorption device coupled to a board, the heat absorption device configured to absorb heat generated by an electrical device mounted on the board, a heat dispersion device configured discretely from the heat absorbing device and the board for dispersing heat input thereto and a heat transporting device coupled between the heat absorption device and the heat dispersion device for transporting heat absorbed by the heat absorption device to the heat dispersion device.

Abstract: A retaining device for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is actuated to rotate for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively.

Abstract: A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module.

Abstract: Various embodiments are directed to cooling heat generating components. In one embodiment, a method cools a heat generating component in an electronic device below an ambient temperature to produce condensation. Heat is transferred from the heat generating component to a thermal dissipation device, and the condensation is dispensed onto a thermal dissipation device to cool the thermal dissipation device.

Abstract: A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (42), a first condensing portion (46) and a second condensing portion (44). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.

Abstract: A power regulator with a bypass and splice capacity includes at least one phase member and a driver. Each one of the at least one phase member includes two cooling fins, two SCR thyristors, a conductive resilient tab and a conductive rigid tab. The cooling fins are conductive and adjacent to each other. The SCR thyristors are mounted on the cooling fins and are inversely connected in parallel to each cooling fin. The conductive resilient tab is mounted on one of the cooling fins and has a moveable contact. The conductive rigid tab is mounted on the other cooling fin and has a stationary contact aligned with the movable contact. When the driver is energized, the driver drives the conductive resilient tab and the moveable contact is contacts the stationary contact and power is bypassed and spliced through the cooling fins.

Abstract: An improved rail includes two side portions, and a mid portion interconnected between the two side portions. The mid portion and the two side portions form a component that defines three sides of a transceiver module space. The rail further includes a blocking structure coupled to the component. The blocking structure is adapted to (i) permit a connecting portion of a transceiver module to connect with a connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a circuit board side of the transceiver module faces the printed circuit board, and (ii) prevent the transceiver module from contacting the connector when the transceiver module engages the rail and moves into the transceiver module space toward the connector and when a heat dissipation side of the transceiver module faces the printed circuit board.

Abstract: A semiconductor element mounting substrate excellent in cooling performance and simple in structure is provided. The semiconductor element mounting substrate is a substrate 1B for mounting a semiconductor element 2, and has an insulating layer 3 and a conducting layer 4 for attaching a semiconductor element 2 on one surface of the insulating layer 3. To the other surface of the insulating layer 3, a heat releasing device 5 is directly attached. The heat releasing device 5 is preferably a liquid-cooling type cooling plate 7 having a plurality of fine passage 7a for cooling fluid. The insulating layer is preferably a composite member that an insulating cloth is impregnated with insulating resin or insulating resin composite in which thermally conductive filler is added to insulating resin.

Abstract: According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.

Abstract: A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The piercing body includes a piercing part piercing through the engaging part, and a latching part below the piercing part. The operating member includes a cam pivotally connected to the piercing part and rotatable between locked and unlocked positions. At the locked position, a protrusion formed on the cam abuts a lateral edge of the piercing part to prevent the operating member from spontaneously rotating back to the unlocked position. A bent flange is formed at a periphery of the cam and engages with the engaging part.

Abstract: A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a motherboard including a central processing unit and electronic elements. The thermal module comprises a first heat sink, at least one second heat sink, and a heat conductive plate. The first heat sink is disposed above the central processing unit. The second heat sink is disposed above one of the electronic elements. The heat conductive plate is coupled to the second heat sink, extends from the second heat sink to the central processing unit, and is engagingly sandwiched between the central processing unit and the first heat sink.

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: A device which is used to cool the power electronics of a vehicle, by circulating a liquid through a cooling circuit which is mounted under a plate bearing the power electronics. According to the invention, the cooling circuit can include deflectors and/or turbulators in order to increase the exchange coefficient between the cooling circuit and the cooling liquid. The invention also relates to a method of producing the device.

Abstract: In an embodiment, a heat conduction apparatus includes a heat sink. A coupling member is located on the heat sink. The coupling member is operable to releaseably and interchangeably couple one of a selected blank member and a cold plate to the heat sink in response to a cooling requirement of the heat sink. In an embodiment, a method of cooling an information handling system includes providing cooling by coupling a heat sink to a heat generating component. The method further provides selectably coupling a blank member to the heat sink providing cooling by a first fluid coolant. The method further provides selectably coupling a cold plate to the heat sink providing cooling by a first fluid coolant and a second fluid coolant.