Abstract: The present invention relates to a cage for holding an optical transceiver module in electrical contact with a host circuit board. The cage includes front, middle and rear sections, and facilitates the insertion of the optical transceiver into the cage, as well as providing electromagnetic shielding and facilitating thermal dissipation. Typically, the cage is for use with an optical transceiver module including an integral heat sink cover or with an optical transceiver module including an external heat sink mounted over top of the cage. Various embodiments illustrate different schemes for maximizing heat dissipation by providing large openings in the middle section of the cage, as well as mounting surfaces on the front and rear sections for mounting external heat sinks. One or more crossbars are provided for guiding the transceiver module during insertion.

Abstract: A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature.

Abstract: A conductive paste based on an elastomer of the polyoxypolyolefin type or on a member of the polyolefin family is described, provided with an admixture of conductive particles for the production, in the electronics industry, of a sealing element, of a contact element or of a heat-conduction element. This material is particularly suitable for the production of EMI-RFI gaskets, and, compared with materials known hitherto and based on silicone, has improved performance characteristics and environmental properties.

Abstract: A substrate material for mounting an integrated circuit contains a non-electrically-conductive mesh of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces that are proximate to the substrate, thereby using the circuit traces as thermally-coupled heat sinks. In a preferred embodiment, the thermally-conductive mesh replaces the structural fiberglass mesh that is conventionally used in substrates, thereby allowing the mesh to serve a dual structural and thermal function.

Abstract: A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.

Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.

Abstract: Disclosed is a battery pack, comprising a secondary battery unit including at least one secondary battery, the at least one secondary battery comprising an electrode group and an insulating case having the electrode group housed therein, and the battery pack further comprising a heat conductive sheet which is provided at at least a part of the surface of the secondary battery unit and has a heat conductivity higher than a heat conductivity of the case.

Abstract: A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract: A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation.

Abstract: A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller than that of the metallic matrix. The radiator plate has a heat-receiving surface, on which an electric device serving as a heat generator is disposed, and a heat-radiating surface for radiating heat received from the heat-receiving surface. The dispersant is dispersed more on the heat-receiving-surface side than on the heat-radiating-surface side. Thus, the radiator plate is inhibited from warping, and is good in terms of the dimensional stability as a final product. Moreover, the thermal resistance is diminished between the heat-receiving surface and the heat-radiating surface. Accordingly, the heat-radiating ability of the radiator plate is secured. Also disclosed is a process for manufacturing the radiator plate.

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract: A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.

Abstract: Providing a layer of ZnCr intermediate a dielectric substrate and a heat spreader enhances the adhesion between the dielectric substrate and heat spreader.

Abstract: A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. There is then formed upon the first surface of the substrate a coating. The coating has an optimal density, an optimal thermal conductivity and an optimal thickness such that when the substrate having the coating formed thereupon is equilibrated at a non-body temperature differing from a body temperature and the coating is subsequently contacted with a body at the body temperature during handling, the temperature of the surface of the coating at a contact point of the body with the coating changes precipitously to a temperature near the body temperature and subsequently returns towards the non-body temperature at a rate which permits handling of the coating at the location of the first surface of the substrate by the body with attenuated thermal sensation.

Abstract: A thermally conductive conformable interface pad for inter-position between a heat generating solid state electronic device and a heat sinking surface. The interface comprises a laminate of at least two layers, including a relatively soft conformable body layer with at least one surface consisting of an integrally bonded anti-blocking layer. The conformable body layer preferably comprises a thermally stable wax consisting of an alkyl substituted poly (hydro, methyl-siloxane) wax and a thermally conductive particulate solid, while the anti-blocking layer may comprise a mixture of an alkyl substituted poly (hydro, methyl-siloxane) wax and a silicone wax, a glassy polyester layer, or a cross-linked acrylic layer.

Abstract: A semiconductor unit is provided, which includes a substrate, a plurality of semiconductor components loaded on the substrate, and a cooling device provided above the semiconductor components. A flat-bottomed dent, slightly smaller than the semiconductor component, is provided on a compound injection unit of the cooling device, and an injection hole for injecting a compound is formed in communication with the dent. The compound is injected through the injection hole into the dent and into a clearance provided between the compound injection unit and the semiconductor component, thus forming a compound layer in between the compound injection unit and the semiconductor component.

Abstract: A net-shape moldable U-shaped heat sink assembly formed by injection molding of a thermally conductive polymer composite material is shown. The heat sink assembly includes a base member with a number of integrated fins members thereon. A right upstanding wall extends from a first side of the base member and a left upstanding wall extends from a second side of the base member to form a substantially U-shaped heat sink assembly. To enhance thermal conductivity, fins members may be integrally formed into the base member, right wall and/or left wall during the molding of the heat sink assembly. Also, a flexible metallic substrate or hinges may be embedded within the U-shaped heat sink assembly to permit positioning of the right wall and left wall relative to the base member for custom configuration of the heat sink assembly.

Abstract: An ignition system including an improved power circuit and a timing circuit. The timing circuit includes a microprocessor or microcontroller to provide for engine control. The microcontroller supervises, for example, multispark, revlimit and retard controls. The power circuit includes a variety of overvoltage protection circuitry and employs a reduced size toroid flyback transformer and employs an IGBT (insulated gate bipolar transistor) ignition coil switch.

Abstract: A solid heat circuit comprises an adhesive elastic body (4) that has a stronger tendency to conduct heat than the air, contacts with both an electrically conductive solid heat source body (20, 21a, 22a) of a PTC device (2) and a metallic or ceramic heat sink body (5) for the PTC device, and supports the heat source body or the heat sink body.

Abstract: Solder compositions are introduced to interface between an IC chip and its associated heat exchanger cover. The solder compositions have a solidus-liquidus temperature range that encompasses the IC chip operational temperature range. The solder composition has the desired property of absorbing and rejecting heat energy by changing state or phase with each temperature rise and decline that result from temperature fluctuations associated with the thermal cycles of the integrated circuit chips. A path for high thermal conduction (low thermal resistance) from the IC chip to the heat exchanger to the ambient air is provided by an electronic module cover, configured as a cap with a heat exchanger formed or attached as a single construction, and made of the same material as the substrate, or made with materials of compatible thermal coefficients of expansion to mitigate the effects of vertical displacement during thermal cycling.

Abstract: The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.

Abstract: A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a “U” shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.

Abstract: An apparatus and method are provided that remove sufficient heat from both SOI and non-SOI semiconductor devices to prevent the devices from overheating during operation. A plurality of thermally conductive pads such as electrically conductive studs are coupled to a first side of a semiconductor device having circuit elements formed thereon. The thermally conductive pads also are coupled to a substrate comprising an apparatus for extracting heat from the thermally conductive pads. The apparatus for extracting heat from the thermally conductive pads preferably comprises one or more metallic planes. A module cover having a thermally conductive path formed therein also may be coupled between the apparatus for extracting heat and a heat sink to further aid in heat removal from the semiconductor device. Thermally conductive pads may be coupled between the semiconductor device and I/O pins of the substrate to improve heat dissipation via the I/O pins.

Abstract: A thin, compliant, electrically and thermally conductive aluminum shim for providing minimum distance circuit path from a power amplifier (or transistor) to the underside of the circuit board (ground). The aluminum shim creates an interference fit between the underside of the circuit board and chassis, which guarantees an electrical connection with the bottom of amplifier and underside of the circuit board. Additionally, with the present invention, post-machining of the chassis during assembly of components is not required since the aluminum shim is sufficiently compliant to conform to both the bottom surface of the amplifier and the existent flatness and surface finish on the chassis produced from the initial machining step. This ensures superior electrical and thermal contact to the chassis regardless of slight imperfections in chassis flatness and surface finish at the seat location, thereby improving reliability and decreasing cost of manufacture and assembly.

Abstract: An electronic package (10) designed to be mounted in a space vehicle includes active electronic components that produce heat energy during operation and has a shear plate (12) attached to a heat sink (13). A heat spreader (11) includes an L-shaped plate of thermal pyrolitic graphite encapsulated in aluminum, which has a long arm (20) attached to the shear plate (12) by a heat conductive adhesive and a short arm (21) attached to the heat sink (13) for transferring heat energy from the package (10) to the heat sink (13). Whereby the heat sink (13) and the package (10) produce a dynamic load and the heat sink (13) and the package (10) are designed to carry the dynamic load with the heat spreader (11) providing only thermal enhancement.

Abstract: A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.

Abstract: A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating substrate; semiconductor chips disposed on the copper film; a container arranged on the bottom plate, surrounding the insulating substrate; an external terminal supported through the container and connected electrically with the semiconductor chips; and a silicone gel filled within the container, wherein a solidified insulating material is disposed on an outer edge region of the copper film and the peripheral region of the insulating substrate. Thus, reducing an electric field across the interface and making it difficult to cause a creeping discharge. A notch is formed in the bottom plate, and the notch is filled with a high heat conductive resin. The notch is located outwardly apart from a region where the semiconductor chips are mounted.

Abstract: A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive layer for attaching the substrate to the heat sink. The substrate is formed of multiple layers of printed circuit boards which are attached to each other, and have a cavity formed at the center thereof. A plurality of thermal vias is formed surrounding the substrate. The head sink is divided into a chip mount area and a thermal via joint area. The chip mount area is used for a chip mount pad to be disposed thereon, wherein a chip is connected to the heat sink through the chip mount pad. The thermal via area is electrically coupled to the thermal vias thereby to form an approximate short path or a short path. Thus, heat energy is transferred not only by the heat sink directly, but also from the heat sink to the substrate through the thermal vias.

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

Abstract: The present invention relates to a method and device for making a temperature-compensated bedding for chips on printed boards, at which a temperature-compensated device is totally or partly recessed in a carrier in the printed board. The chips is placed over the temperature-compensated device.The temperature-compensated device includes a piece of metal recessed in the carrier under the chip. A layer of copper is fixed against the upper side of the carrier and the upper side of the metal piece. The thickness of the copper layer and the thickness of the metal piece are dimensioned so that the resulting coefficient of linear expansion at the upper side of the copper layer is equally big as or a bit bigger than the coefficient of linear expansion of the chip.The temperature-compensated device can as an alternative to the above include a module recessed in the carrier under the chip.

Abstract: Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.

Abstract: Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.

Abstract: An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite embedded within a metallic casing and intimately contacting an interior wall of the metallic casing. The heat sink assembly is substantially fully dense. The heat sink assembly is fabricated by assembling the piece of pyrolytic graphite within the disassembled elements of the metallic casing, and then simultaneously heating and pressing the initial assembly until it is substantially fully dense.

Abstract: A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel with alumina as a heat conductive filler dispersed therein, and a potentially adhesive layer. The potentially adhesive layer consists of a hot melt layer, with alumina as a heat conductive filler dispersed therein, and a heat resistant film, to facilitate formation of the hot melt layer, adhered to the heat conductive layer on one face of the heat resistant film. The heat conductor is set on the electronic parts so that the potentially adhesive layer abuts them, and is made to adhere to the electronic parts due to heating by means of reflow soldering to reach the phase change temperature of the adhesive.

Abstract: A circuit card unit comprising a memory card and attached heat exchanger comprising a thin, flexible, laminated strip of foil clad plastic, or wire mesh, affixed in thermally conductive contact to each card module and extended therefrom to facilitate removal of heat from the modules. In some embodiments, the exchanger strip extends from the modules on one side of the card to those of the other side in a self supporting, heat exchanger loop spaced over the memory card. In a somewhat more compact embodiment, the strip extends from modules on one card face, along the card itself, to the modules of the other card face. In a still further embodiment, the heat exchanger strip extends from the modules of the card to a heat sink such as the housing of the computer. Additionally, the heat exchanger strips may also function as a carrier for an identifying label printed on, or attached to, the planar surface of the strip.

Abstract: In a heat sink, a portable electronic apparatus using this heat sink, and a method for forming this heat sink, an abutting member is arranged on an inside surface of a casing and the casing and the abutting member are covered with a heat spreader sheet. The heat spreader sheet is made to abut against an exothermic device by means of an abutting member. The heat generated in the exothermic device is transmitted to the inside wall surface of the casing via the heat spreader sheet, with a portion being transmitted via the abutting member. When an anisotropic thermal conductivity material is used for the abutting member, it is possible to realize characteristics such as a low peak casing temperature under the exothermic device.

Abstract: A package for power converters in which a multilayers circuits board holds the components. The winding of the magnetic elements are incorporated in the multilayers circuit board. The top and some portion of the bottom layer are also support for electronic components. Some of the components are placed on the top layer, which may not be utilized for magnetic winding, reducing the footprint of the magnetic elements to the footprint of the magnetic core. The power dissipating devices placed on pads which have a multitude of copper coated via connecting the top to bottom layers. Through these via the heat is transferred from the power devices to the other side of the PCB. In some of the embodiment of this invention the heat can be further transferred to a metal plate connected to the multilayers circuit board via a thermally conductive insulator. The baseplate has cutouts or cavities to accommodate the magnetic cores.

Abstract: A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly includes a heat sink having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip. It also includes a deformable circuit board having a first side and a second side, wherein the first side is secured to a side of the heat sink in thermal communication therewith. The flip chip is bonded to the second side of the deformable circuit board without underfill or with weak bond strength underfill to facilitate removal of the flip chip in the event of a rework.

Abstract: A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.

Abstract: Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal contact includes a metallic trace including a raised feature of thermally conductive material. A solder ball or fillet may be used to make a connection between the raised feature and the heat generating component or between the raised feature and the underlying heat sink or both.

Abstract: A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical components are held in relation to a module housing. The module housing, generally, not only provides support but also acts as a heat sink for heat generating electrical components. The electrical components are covered by a potting compound. The potting compound protects the electrical components from dust or any other particles that could affect the function of the electrical component. The present invention discloses a heat sinking module cover with a support portion and a thermal transfer portion. The heat sinking module cover is positioned with respect to the module housing to form a box-like structure. The thermal transfer portion contacts the potting material directly to provide an additional heat sinking means for the electronic module assembly.

Abstract: An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or chromate conversion or the copper may be coated with nickel or gold on chromium. Such structures are especially useful for flip chip attachment to flexible or rigid organic circuit boards or modules such as CQFP, CBGA, CCGA, CPGA, TBGA, PBGA, DCAM, MCM-L, and other chip carrier packages in which the back side of chips are connected directly to heat sinks. These adhesive materials withstand wet or dry thermal cycle tests of -65.degree. to 150.degree. C. for 1,000 cycles and 85.degree. C. and 85% relative humidity for 1000 hours while maintaining a tensile strenth of at least 500 psi. The adhesive contains materials having high thermal conductivity and a low coefficient of thermal expansion (CTE) in order to provide increased thermal performance.

Abstract: Conductive cooling of a heat-generating electronic component disposable in spaced-apart adjacency with a surface of a thermal dissipation member to define a gap of predetermined width therebetween. A curable composition is provided as formed of an electrically-insulating polymeric binder having thermally-conductive, electrically-insulating filler particles dispersed therein. At least a portion of the filler particles is of a maximum average diameter about equal to the predetermined width of the gap. A layer of the composition is disposable in conductive heat transfer contact with the electronic component and the surface of the thermal dissipation member, and is cured to form an interlayer within the gap.

Abstract: A thermally efficient circuit board has a base layer with high thermal conductivity and a thermal expansion coefficient close to that of silicon, such as aluminum silicon carbide. Above the base layer is a layer of anodized metal, either a separate material, such as aluminum, which is formed on the base and then anodized, or an anodized portion of the base itself. To the anodized metal is then applied a sealant material of lower thermal conductivity, but good electrically insulative and adhesive qualities, such as Teflon FEP. The sealant flows into cavities in the porous anodized metal structure, creating a well-anchored bond. A metal foil layer is then bonded to the surface of the sealant, and used to pattern conductive circuit paths using conventional methods.

Abstract: A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as the substrate, is added to the outside surface of the encapsulant. The purpose of the layer is to provide a second opposing surface to balance and thereby reduce the stress originating from the encapsulant/substrate interface. The second layer is applied prior to the curing of the encapsulant material.

Abstract: An LOC type semiconductor package and a fabricating method thereof comprises first and second through holes formed at inner leads and bus bars of the LOC-type lead frame, and third through holes formed at the tape which is bonded with the lower side of the inner leads and the bus bars, by pins at a tape cutter. Thus, air existing at both tape during the bonding process effectively flows out so as to prevent the trapping of air bubbles. Accordingly, during the wire bonding process, wire shorting and damage to the package body can be prevented. Since EMC is deposited into the first and the second through holes and supports the inner leads and the bus bars during the molding of the semiconductor package, the reliability of the semiconductor package can be improved.

Abstract: Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.

Abstract: An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the encapsulant and reduces stresses applied to the electronic components therewithin. The selected encapsulant provides mechanical stability from shock and vibration, thermal conductivity to the surroundings, and freedom from deterioration of electrical performance. Critically, the encapsulant is readily excised for repair and replacement of defective components, thus allowing rework and salvage of the assembly. A potting tool is adapted for selectively refilling the housing to replace the excised portions.

Abstract: An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.