By Specific Coating Patents (Class 361/705)
  • Patent number: 11508644
    Abstract: A semiconductor device package includes a substrate, a first heat-generating component positioned on a surface of the substrate, an encapsulant at least partially encapsulating the first heat-generating component, and one or more channels extending through a portion of the encapsulant toward the first heat-generating component. Each of the one or more channels contains a thermally conductive material having a thermal conductivity greater than a thermal conductivity of the encapsulant.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: November 22, 2022
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yazhou Zhang, Shineng Ma, Kent Yang, Hope Chiu
  • Patent number: 11489415
    Abstract: A drive unit includes: a rotating electric machine having a rotation axis extending in a horizontal direction; a rotating electric machine case; and a power conversion device. The power conversion device is arranged on one side of the rotating electric machine in an orthogonal direction. The power conversion device includes a first connector to which a first electric power line through which electric power supplied to the rotating electric machine and electric power supplied from the rotating electric machine flow are connected. The first connector is provided on a first end side and is arranged to protrude from the power conversion device at a predetermined angle in a direction away from the rotating electric machine in the orthogonal direction, as the first connector goes away from the power conversion device in the rotation axis direction, when viewed from above.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: November 1, 2022
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takeshi Hoshinoya, Heisuke Kobayashi
  • Patent number: 11489249
    Abstract: The invention relates to a communication system (1), comprising at least one housing (2) having a first and an additional housing part (201, 202). In the housing (2), a circuit board (10) having electronic components (11) is arranged, and outside the housing (2), at least one antenna element is arranged. The invention is characterized in that an antenna support (7) that is connectable to the housing (2) is provided, wherein the at least one antenna element (14) is arranged on the surface and/or inside the antenna support (7).
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: November 1, 2022
    Assignee: HIRSCHMANN CAR COMMUNICATION GMBH
    Inventors: Wolfgang Sautter, Thomas Adam, Dominik Schaich, Tobias Pfaeffle, Uwe Daum, Christian Schwarz, Markus Pfletschinger, Uwe Kreissig
  • Patent number: 11445632
    Abstract: Embodiments promote the maintenance of a designed flow of cooling air through a chassis during the servicing of one or more electronic components contained by the chassis. A top opening created by the removal of server chassis from a rack may be significantly reduced by internal lids that provide access to groups of components. Gaps created by the partial removal of groups of components may be significantly reduced by air dams attached to the components that inhibit the flow of air between the components. And the opening created by the removal of a circuit board may be significantly reduced by a flap configured to cover the opening upon removal of the circuit board. The various embodiments may be used individually or in combination to reduce openings in the chassis that may allow air to flow in paths that negatively affect the designed air flow.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: September 13, 2022
    Assignee: ZT Group Int'l, Inc.
    Inventors: Chen An, Asim Huda, Ting-Yu Lin, Haiyan Luo
  • Patent number: 11350518
    Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: May 31, 2022
    Assignee: Chipbond Technology Corporation
    Inventors: Chia-Sung Lin, Huan-Kai Chou, Chia-Hsin Yen, Wen-Fu Chou
  • Patent number: 11329006
    Abstract: Between an adhesive surface of a heat spreader lid and a top surface of a semiconductor package, in addition to a spreader adhesive layer, several warpage control adhesive layers are also provided. The warpage control adhesive layers are disposed on corner areas of the adhesive surface of the heat spreader lid to reduce high temperature warpage of the semiconductor device package.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: May 10, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Chih Yew, Fu-Jen Li, Po-Yao Lin, Kuo-Chuan Liu
  • Patent number: 11292507
    Abstract: A motor includes a shaft to rotate about a central axis extending in a vertical direction, a metal heat sink including a through-hole through which the shaft extends, a substrate disposed at an upper side of the heat sink through a gap, a sensor magnet fixed to an upper end of the shaft, a rotation sensor located at an upper side of the sensor magnet, and a heat dissipating material located in a gap between the substrate and the heat sink. The heat sink includes a heat sink main body portion and a wall portion located between the substrate and the heat sink main body portion and between the heat dissipating material and the through-hole when viewed from the vertical direction.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: April 5, 2022
    Assignee: NIDEC CORPORATION
    Inventor: Tomoyuki Takada
  • Patent number: 11189420
    Abstract: Assemblies having multi-functionalities of any combination of heat spreading, absorption of stray radiation, signal focusing, and shielding are provided. The assemblies may include a heat spreading layer of at least one sheet of a compressed particles of exfoliated graphite, graphitized polymers and combinations thereof. The assemblies may also include at least one magnetic layer, which may provide the benefits of magnetic flux management and/or stray radiation absorption. The assemblies may include an optional plastic coating on one or both of the exterior surfaces. The assemblies may be used to enable fast wireless charging of electronic devices by efficiently focusing magnetic flux for better power transmission efficiency.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: November 30, 2021
    Assignee: NEOGRAF SOLUTIONS, LLC
    Inventors: Parisa Faraji, Seungyoung Kwak, David Stuart, Bret Trimmer, Greg Kramer
  • Patent number: 11177217
    Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: November 16, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kamal K. Sikka, Jon A. Casey, Joshua Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin, Mark W. Kapfhammer, Steve Ostrander, Maryse Cournoyer, Valérie A. Oberson, Lawrence A. Clevenger
  • Patent number: 11140771
    Abstract: Provided is a method for compensating a stress-sensitive parameter, and the method is applied to an electronic devices. The method includes: calculating (51) a deformation value of a first panel according to a pressure borne by the first panel; calculating (52) according to the deformation value of the first panel a deformation value of a second panel that is deformed due to the deformation of the first panel; calculating (53) according to the deformation value of the second panel a change in a stress-sensitive parameter of a stress-sensitive element on the second panel; and compensating (54) the stress-sensitive parameter according to the change in the stress-sensitive parameter. The quality of the parameters of corresponding electronic elements and electronic modules are thereby improved, ultimately enhancing the performance of electronic device.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: October 5, 2021
    Assignee: XI'AN ZHONGXING NEW SOFTWARE CO., LTD.
    Inventors: Fengpeng Liu, Dongmei Liu
  • Patent number: 11069933
    Abstract: This disclosure details exemplary battery pack designs for use in electrified vehicles. An exemplary battery pack assembly process may include supporting one or more components, such as a heat exchanger plate, of the battery pack against deflection during the assembly process. Supporting the heat exchanger plate to keep the plate relatively flat during the battery pack assembly process improves the flow distribution of a thermal interface material (TIM), thereby achieving improved TIM coverage and improved heat transfer between battery cells and the heat exchanger plate of the battery pack.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: July 20, 2021
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Amar Marpu, Patrick Daniel Maguire
  • Patent number: 10797267
    Abstract: The present disclosure provides a package structure, a manufacturing method for the same, and a display device. The package structure includes a substrate, an organic light emitting device disposed on the substrate, and an encapsulation film layer disposed above the organic light emitting device, the encapsulation film layer encapsulating the organic light emitting device onto the substrate, wherein an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 6, 2020
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Lin Ge
  • Patent number: 10763416
    Abstract: A LED leadframe for securing a LED chip includes a metallic base and an insulating layer. The metallic base includes a die bonding region and a peripheral region surrounding the die bonding region, and the die bonding region is for securing the LED chip. The insulating layer is disposed on the metallic base and located in the peripheral region to define the die bonding region. The insulating layer includes a bar-shaped insulating section disposed in the metallic base and corresponding to the die bonding region. The metallic base includes a first groove(s) defined corresponding to the die bonding region. The first groove(s) is/are filled with a thermally conductive filler. The invention improves the LED leadframe to allow heat conducting efficiencies of various regions of the base to be controllable and adjustable so as to reduce temperature differences among various regions of the base and thereby unify the temperature.
    Type: Grant
    Filed: August 26, 2018
    Date of Patent: September 1, 2020
    Assignee: KAISTAR LIGHTING (XIAMEN) CO., LTD.
    Inventor: Jingqiong Zhang
  • Patent number: 10595429
    Abstract: An electronic device includes pairs of guide rails and elastic members. The pairs of guide rails are provided in a slot correspondingly to both ends of the circuit board in a direction intersecting the insertion direction, the guide rails of each pair extending along the insertion direction respectively on sides of both surfaces of the circuit board inserted in the slot, the pair of guide rails being configured to guide insertion of the circuit board into the slot. When the circuit board is inserted in the slot, each elastic member presses the circuit board against one or the other of the guide rails of the pair.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: March 17, 2020
    Assignee: FANUC CORPORATION
    Inventor: Daisuke Miura
  • Patent number: 10501671
    Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material includes at least one silicone oil, and at least one thermally conductive filler.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: December 10, 2019
    Assignee: Honeywell International Inc.
    Inventors: Liqiang Zhang, Huifeng Duan, Kai Zhang, Ya Qun Liu, Ling Shen, Wei Jun Wang, Haigang Kang
  • Patent number: 10326221
    Abstract: An electric connection structure (1) is provided with: a glass plate (10); a power supply part (15) formed in the glass plate (10); a terminal (20) having a base part (21) opposing the glass plate (10); and a spring member (35) formed from a conductor and disposed between the power supply part (15) and the base part (21). The power supply part (15) and the base part (21) make contact with the spring member (35), whereby the power supply part (15) and the base part (21) are electrically connected via the spring member (35).
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: June 18, 2019
    Assignee: AGC INC.
    Inventors: Fumitaka Terashima, Hidehiko Watanabe
  • Patent number: 10310061
    Abstract: An ultrasound transducer array with at least one composite material layer. The layer having a polymer base in which polymer particles are embedded. The polymer particles are coated with a material that has a thermal conductivity that is higher than the thermal conductivity of the polymer base and the polymer particles.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: June 4, 2019
    Assignee: SURF Technology AS
    Inventor: Bjorn A. J. Angelsen
  • Patent number: 10222829
    Abstract: In one aspect, a device includes a processor and storage accessible to the processor. The storage bears instructions executable by the processor to determine that a trigger regarding an apparatus has been satisfied and, in response to the determination, activate a thermoelectric cooling element (TCE) accessible to the processor.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: March 5, 2019
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Song Wang, Jian Li, Jason Matteson, Ming Qian, Jianbang Zhang
  • Patent number: 10091866
    Abstract: Discussed generally herein are devices that include a switchable heat path. A device can include a device skin, a circuit board, a plurality of components on the circuit board, and a switchable heat path situated between the components and the device skin, the switchable heat path configured to be switched between an on state and an off state, the switchable heat path configured to conduct a first amount of heat from the components to the device skin when in the on state and configured to conduct a second, lesser amount of heat from the components to the device skin when in an off state.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: October 2, 2018
    Assignee: Intel IP Corporation
    Inventors: Sonja Koller, Georg Seidemann, Vishnu Prasad
  • Patent number: 10037948
    Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: July 31, 2018
    Assignee: APPLE INC.
    Inventors: Phillip R. Sommer, Kishore N. Renjan, Manoj Vadeentavida
  • Patent number: 9768095
    Abstract: A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: September 19, 2017
    Assignees: NIPPON SOKEN, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomo Sasaki, Akio Kitami, Tadafumi Yoshida, Masataka Deguchi, Kazunori Uchiyama, Naoki Hakamada
  • Patent number: 9754856
    Abstract: The invention relates to an apparatus comprising a functional component likely to be thermally overloaded during the operation thereof, and a system for cooling the component, comprising: a thermoelectric module comprising a cold surface and a hot surface, the cold surface being thermally coupled with the component; a heat sink thermally coupled with the hot surface of the module, the heat sink including an exchange surface with the surrounding environment and at least one cell containing a phase-change material (PCM), the PCM material contained in the cell or cells being suitable for melting when the heat released from the cold surface of the module is that of the thermally overloaded component, the exchange surface being suitable for bringing the PCM material from the molten phase to the solid phase thereof when the heat released from the cold surface of the module is that of the operational component which is not thermally overloaded.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: September 5, 2017
    Assignees: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES, SCHNEIDER ELECTRIC INDUSTRIES SAS
    Inventors: Tristan Caroff, Mitova Radoslava, Julia Simon
  • Patent number: 9742054
    Abstract: A holder is provided for holding an electrical component on a circuit board having a lead hole. The holder includes a body having a base for holding the electrical component and a connection member for mounting the body to the circuit board. The base includes a lead opening that is configured to hold a solder lead of the electrical component therein. The connection member extends from the base and is configured to mechanically connect to the circuit board such that the base holds an end of the solder lead of the electrical component within the lead hole of the circuit board.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: August 22, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Matthew E. Mostoller, Jeffrey W. Shaffer
  • Patent number: 9635784
    Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: April 25, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Masaaki Norimatsu, Yukie Sakita, Shinichi Hirose, Yohei Yagishita
  • Patent number: 9530714
    Abstract: An integrated circuit system includes a heat spreader that is thermally coupled to a semiconductor chip and has a cavity or opening formed in the heat spreader. The cavity or opening is positioned so that capacitors and/or other passive components mounted to the same packaging substrate as the semiconductor chip are at least partially disposed in the cavity or opening. Because the passive components are disposed in the cavity or opening, the integrated circuit system has a reduced package thickness.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: December 27, 2016
    Assignee: NVIDIA Corporation
    Inventors: Shantanu Kalchuri, Abraham F. Yee, Leilei Zhang
  • Patent number: 9504158
    Abstract: According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: November 22, 2016
    Assignee: Facebook, Inc.
    Inventor: David G. Findley
  • Patent number: 9490201
    Abstract: Methods of forming microelectronic interconnect under device structures are described. Those methods and structures may include forming a device layer in a first substrate, forming at least one routing layer in a second substrate, and then coupling the first substrate with the second substrate, wherein the first substrate is bonded to the second substrate.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: November 8, 2016
    Assignee: Intel Corporation
    Inventors: Patrick Morrow, Don Nelson, M. Clair Webb, Kimin Jun, Il-Seok Son
  • Patent number: 9373563
    Abstract: A semiconductor assembly, power semiconductor module, a housing and methods for assembling the power semiconductor housing is disclosed. One embodiment provides an electrically insulating substrate has an inner housing having a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim. The pressure element is resiliently coupled to the inner housing.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: June 21, 2016
    Assignee: Infineon Technologies AG
    Inventor: Thilo Stolze
  • Patent number: 9332632
    Abstract: Systems and methods in accordance with embodiments of the invention implement graphene-based thermal management cores and printed wiring boards incorporating graphene-based thermal management cores. In one embodiment, a graphene-based thermal management core includes: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; where the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: May 3, 2016
    Assignee: Stablcor Technology, Inc.
    Inventors: Douglas Schneider, William E. Davis
  • Patent number: 9301429
    Abstract: The described embodiments relate generally to thermal management and more particularly to a method and apparatus for providing thermal insulation from relatively small heat sources in small form factor electronic devices. An insulator layer can be placed between a small heat source and an exterior surface of the device, such as a cover glass layer. In one embodiment, a graphite layer can also be included between the cover glass layer and the insulator layer to spread any transmitted heat across the cover glass layer.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: March 29, 2016
    Assignee: Apple Inc.
    Inventors: Lian Zhang, Amaury J. Heresztyn, Frank F. Liang
  • Patent number: 9293428
    Abstract: Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: March 22, 2016
    Assignee: Intel Corporation
    Inventor: Ioan Sauciuc
  • Patent number: 9253932
    Abstract: An image display device having improved properties, comprising an image display panel, heat dispersion material positioned proximate to the image display panel, an open frame positioned proximate to the heat dispersion material opposite the image display panel, and a plurality of electronic components engaging the open frame, the image display device exhibits a support factor of less than about 375 mm-W/m° K.
    Type: Grant
    Filed: July 8, 2015
    Date of Patent: February 2, 2016
    Assignee: GrafTech International Holdings Inc.
    Inventors: Gary D. Shives, Gerald Hoffert, William Varela
  • Patent number: 9230882
    Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: January 5, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Yoshinori Sunaga, Yoshiaki Ishigami, Hidetaka Kawauchi, Hidenori Yonezawa, Kinya Yamazaki
  • Patent number: 9230880
    Abstract: An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.
    Type: Grant
    Filed: January 28, 2014
    Date of Patent: January 5, 2016
    Assignee: Infineon Technolgies AG
    Inventors: Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Teck Sim Lee, Xaver Schloegel, Klaus Schiess
  • Patent number: 9144183
    Abstract: A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: September 22, 2015
    Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Jen-Chun Chen, Xiao-Wen Cao, He- Yi Chang
  • Patent number: 9128685
    Abstract: A mobile terminal is provided. The mobile terminal includes a terminal body, a display module located in the terminal body, a printed circuit board located within the terminal body, at least one electric device mounted on the printed circuit board, a sealing unit coupled to the printed circuit board to shield the electric device, a frame having a first surface contacting the sealing unit and a second surface coupled to the display module and a first heat transfer portion to radiate heat generated by the electric device.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 8, 2015
    Assignee: LG Electronics Inc.
    Inventor: Chealhoon Choi
  • Patent number: 9117792
    Abstract: Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: August 25, 2015
    Assignee: PRINCO MIDDLE EAST FZE
    Inventor: Chih-kuang Yang
  • Patent number: 9054119
    Abstract: According to an exemplary embodiment, a dual compartment semiconductor package includes a conductive clip having first and second compartments. The first compartment is electrically and mechanically connected to a top surface of the first die. The second compartment electrically and mechanically connected to a top surface of a second die. The dual compartment semiconductor package also includes a groove formed between the first and second compartments, the groove preventing contact between the first and second dies. The dual compartment package electrically connects the top surface of the first die to the top surface of the second die. The first die can include an insulated-gate bipolar transistor (IGBT) and the second die can include a diode. A temperature sensor can be situated adjacent to, over, or within the groove for measuring a temperature of the dual compartment semiconductor package.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 9, 2015
    Assignee: International Rectifier Corporation
    Inventor: Henning M. Hauenstein
  • Patent number: 9012785
    Abstract: A flexible multilayer substrate includes a multilayer body including a plurality of laminated resin layers. The multilayer body includes an innermost surface, which is a surface on an inner side when the substrate is bent, and an outermost surface, which is a surface on an outer side when the substrate is bent. Each of the plurality of resin layers includes a skin layer on one surface. Lamination of the multilayer body includes a skin layer joint plane at one location at a central portion in the thickness direction, and the skin layer and other surface come in contact with each other at another location along the central portion in the thickness direction. A skin layer joint plane is arranged on a side closer to the innermost surface than a central plane in the thickness direction of the multilayer body.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: April 21, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Yoshihito Otsubo
  • Publication number: 20150098191
    Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 9, 2015
    Inventor: Gerald Ho Kim
  • Patent number: 8976527
    Abstract: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.
    Type: Grant
    Filed: September 29, 2012
    Date of Patent: March 10, 2015
    Inventors: Kevin D. Gibbs, Amy Qian, John Raff, Derek Wright
  • Patent number: 8971038
    Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: March 3, 2015
    Assignee: Lear Corporation
    Inventors: Nadir Sharaf, Dilip Daftuar, George Kaminski, Venkat Yalamanchili, Richard J. Hampo
  • Patent number: 8958207
    Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
    Type: Grant
    Filed: May 7, 2012
    Date of Patent: February 17, 2015
    Assignee: Fujitsu Limited
    Inventors: Yoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8953314
    Abstract: A fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer and a second layer of the microelectronic device. In one embodiment, the second layer is another active layer of the microelectronic device. The movable pins are formed of a material that has a surface tension that decreases as temperature increases such that, in response to a temperature gradient on the surface of the active layer, the movable pins move by capillary flow in the directions of decreasing temperature. By moving in the direction of decreasing temperature, the movable pins move away from hot spots on the surface of the active layer, thereby opening a pathway for preferential flow of a coolant through the cooling plenum at a higher flow rate towards the hot spots.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: February 10, 2015
    Assignee: Georgia Tech Research Corporation
    Inventor: Andrei G. Fedorov
  • Patent number: 8929079
    Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: January 6, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hirofumi Watanabe, Kazuhiko Nakano, Daisuke Yasukawa
  • Publication number: 20150003019
    Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.
    Type: Application
    Filed: November 9, 2012
    Publication date: January 1, 2015
    Inventors: Eiichi Ide, Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Nobutake Tsuyuno, Toshiya Satoh, Masahiko Asano
  • Patent number: 8917510
    Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: December 23, 2014
    Assignee: International Business Machines Corporation
    Inventors: Dylan J. Boday, Joseph Kuczynski, Robert E. Meyer, III
  • Patent number: 8913383
    Abstract: An apparatus includes an electrically-powered component, a hermetically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermetically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: December 16, 2014
    Assignee: Heatmine LLC
    Inventors: Wendi Goldsmith, James M. Kramer
  • Patent number: 8902582
    Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: December 2, 2014
    Assignee: Lear Corporation
    Inventors: Venkat Yalamanchili, Rutunj Rai