Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: A leadframe that exhibits improved thermal dissipation and that can be incorporated into standard integrated circuit (IC) packages is provided by increasing the thermal cross-section between the leadframe paddle and the lead fingers (leads) so that the leads are utilized for conducting a significant amount of heat away from the IC. A larger thermal cross-section can be achieved by making the shape of the paddle perimeter nonlinear to increase the surface area of its edge. In the preferred embodiment, the paddle perimeter has a "serpentine" shape and the inner ends of the leads are placed in close proximity to the paddle perimeter and are shaped to substantially follow its serpentine shape. The shaped paddle and lead ends increase the thermal cross-section between the paddle and the leads, resulting in improved thermal conduction. The leads conduct the heat to the outside of the package, where it is dissipated into the circuit board on which the leadframe package is mounted.

Abstract: A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.

Abstract: A leadframe that exhibits improved thermal dissipation and that can be incorporated into standard integrated circuit (IC) packages is provided by increasing the thermal cross-section between the leadframe paddle and the lead fingers (leads) so that the leads are utilized for conducting a significant amount of heat away from the IC. A larger thermal cross-section can be achieved by making the shape of the paddle perimeter nonlinear to increase the surface area of its edge. In the preferred embodiment, the paddle perimeter has a "serpentine" shape and the inner ends of the leads are placed in close proximity to the paddle perimeter and are shaped to substantially follow its serpentine shape. The shaped paddle and lead ends increase the thermal cross-section between the paddle and the leads, resulting in improved thermal conduction. The leads conduct the heat to the outside of the package, where it is dissipated into the circuit board on which the leadframe package is mounted.

Abstract: A semiconductor chip package is manufactured comprising a heatsink bonded to an aluminum nitride insulative layer by a thermally conductive and electrically nonconductive epoxy. The aluminum nitride insulative layer is bonded to several portions of a leadframe by an epoxy which is thermally conductive and electrically nonconductive and another epoxy which is thermally conductive and electrically conductive. A semiconductor die is bonded to the aluminum nitride insulative layer by a thermally conductive and electrically conductive epoxy.

Abstract: An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package.

Abstract: A lead-on-chip integrated circuit package comprising at least one extremely thin adhesive layer transferred from a carrier onto the face of integrated circuit chips, and a lead frame laminated to the last adhesive layer, with cured adhesive acting as an insulator, integrated circuit chip connection pads bonded to and encapsulating the chip and lead frame. Thermally conductive and electrically insulating filling may be included with the adhesive to improve heat conduction from the IC. Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated package improves the reliability of the integrated circuit package.

Abstract: A heat sink incorporated into an electronic package. The package contains an integrated circuit enclosed by a dielectric housing. Coupled to the circuit is a lead frame which has a plurality of leads that extend from the outer edges of the housing. The heat sink has a bottom surface pressed against the lead frame and an opposite top surface that is exposed to the ambient. The heat sink also has a pair of oblique steps which engage the housing and insure that the sink does not become detached from the package.

Abstract: An electronic package which has a heat sink that is attached to the lead frame of the package with a material that is both electrically and thermally conductive. The lead frame is also coupled to a first surface of an integrated circuit die with tape automated bonded (TAB) leads. The low thermal resistance of the heat sink increases the thermal performance of the package. The heat sink may also be mounted directly to the die with a conductive material so that the die is electrically grounded to the heat sink. The heat sink is then bonded to the leads of the lead frame that are dedicated to ground. In this embodiment, the heat sink provides the dual functions of a ground plate and a heat spreader.

Abstract: A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. One or more holes are formed in the lead frame and are engaged by corresponding studs on the heat sink. The stud has a shoulder portion which engages the lead frame to prevent the stud from further passing through the hole in the lead frame.

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are nonfunctional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate.

Abstract: A molded plastic package for an integrated-circuit die includes a lead frame having inwardly extending tie bars and a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. At least one holes is formed through a portion of the lead frame and is engaged by a corresponding elongated stud on the heat sink. The elongated stud extends upwardly through the layer of thermal grease through the holes in the lead frame and terminates at the top of the molded plastic package. By extending to the top of the plastic package, the elongated stud firmly holds the heat sink against the bottom of the mold cavity during the encapsulation process. As a result, the bottom surface of the heat sink remains exposed after the encapsulation process.

Abstract: An integrated circuit package which utilizes a standard TAB tape that can couple a lead frame to one of a number of integrated circuit dies that have different outer dimensions. The TAB tape includes a sheet of polyimide which supports a plurality of conductive leads. The sheet has a rectangular center opening which provides clearance for the IC die. Adjacent to each edge of the center opening are a plurality of equally spaced contact openings which expose portions of the leads. The leads are coupled to the integrated circuit by attaching the contact portions to the surface pads of the die. The contact openings are located at various distances from the center opening so that the tape can accommodate different die sizes. The leads of the TAB tape are also attached to a lead frame through lead frame openings in the polyimide.

Abstract: In semiconductor packing, a method and device for reducing thermal stress on a die and for reinforcing the strength of a die, A thermally-conductive member is positioned in a cooperating manner with the die during the packaging process.

Abstract: Integrated circuits having electrical interconnection in a multi-chip module or package is provided. Connections involving topological cross overs are achieved in the absence of multi-layers of metalization or vias. A plurality of metal traces in a single metalization layer are provided. Wire bonding issued to connect pads from two or more chips to a common metalization trace. Because the wire bonds can be vertically spaced from substrate traces, crossover connections can be achieved without an unwanted contact between traces and pads. A similar scheme can be used to provide connection to substrate pads.

Abstract: A substantially planar insulating sheet of high temperature printed circuit board material (11) is used to form a leadframe strip (18, 19, 21) for a semiconductor package (20). The leadframe strip (18, 19, 21) includes a die attach opening (12) through the insulating sheet (11). A plurality of metallized areas (13, 22, 23) on the insulating sheet (11) form bonding pads (13) and package leads (22). Conductive holes (14) electrically connect the bonding pads (13) and the package leads (22).

Abstract: A packaged semiconductor device has, according to one embodiment of the present invention, a semiconductor pellet having an electronic circuit therein and electrode pads formed on a principal surface of the pellet, a plurality of electrical connection bumps provided on the electrode pads, a plurality of heat dissipation bumps provided at the principal surface of the pellet and electrically insulated from the electronic circuit and the electrode pads, electrical connection leads for the electronic circuit, heat dissipators for the electronic circuit and a packaging material for sealing pellet, the electrical connection bumps, the heat dissipation bumps and parts of the electrical connection leads and the heat dissipator. One or more of the heat dissipation bumps are arranged relatively nearer to the electronic circuit than the electrical connection bumps for thermal coupling to the electronic circuit.

Abstract: An integral heat sink-terminal structure for a hybrid circuit assembly includes a heat dissipating plate for bonding to a substrate of the hybrid integrated circuit and terminals for connection to the substrate. The heat dissipating plate and the terminals are unitary with a common frame in the same predetermined positional relationship relative to the substrate before and after they are connected to the substrate. When this structure is used in fabricating a hybrid integrated circuit assembly, the heat dissipating plate is first bonded to the substrate and then the terminals are connected to the substrate.