With Housing Patents (Class 361/730)
  • Patent number: 9468093
    Abstract: A flexible midplane comprises: a printed circuit board including: a middle section and at least one side section; and a flexible region disposed between the middle section and each side section; wherein each flexible region permits the corresponding side section to be bent in relation to the middle section.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: October 11, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Eric C. Peterson, Christian L. Belady
  • Patent number: 9462715
    Abstract: A waterproof control unit is provided in which: connector housing is fixedly positioned onto circuit board that is mounted onto base; a first seal gap G1 formed of the connector housing and a cover, a second seal gap G2 formed of the connector housing and the base and a third seal gap G3 formed of the base and the cover are included; the first seal gap G1 is formed of a terrace slope portion gap G1b and an outer step flat portion gap G1a and an inner step flat portion gap G1c that are in communication with the terrace slope portion gap G1b; a gap setting protrusion for limiting the gap width is provided at least in the first seal gap G1; and, between the connector housing and the cover, a horizontal movement limitation member are provided for limiting the relative positional relationship between the connector housing and the cover.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: October 4, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Nobuaki Nuriya, Mitsunori Nishida, Osamu Nishizawa
  • Patent number: 9451719
    Abstract: A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: September 20, 2016
    Assignee: ABB Technology AG
    Inventors: Shamsi Ismayilov, Yaser A. Khalifa, Frantisek Koudelka, Arkady Oksengorn, Siu Lau, Hardik Patel, In Y. Choi
  • Patent number: 9426207
    Abstract: A solution for managing communicative interactions between network elements is described herein. A system incorporating teachings of the present disclosure may include a processor module that monitors communications between a program resident on a user machine and a server program resident on a computing device remote from the user. The processor module may be utilized to effectively reduce the number of communications actually transmitted between the client program and the server program. For example, the processor module may intercept certain client initiated communications intended for the server program, process those communications without server program involvement, and respond to the client program.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: August 23, 2016
    Assignee: QUALCOMM Incorporated
    Inventor: Harlan Titus Beverly
  • Patent number: 9042109
    Abstract: A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing 12 and a lower housing 22 coupled in a freely slidable manner are electrically connected to each other by a flexible printed circuit board folded back to be routed between slide facing surfaces 12b and 22a of both the housings and the height of a side wall surface 12c and 22c of the upper housing and lower housing changes in a bending manner along the direction of freely sliding and, in the slide facing surfaces of the upper housing and lower housing, concave space portions 15 and 25 to accommodate the change in curvature and in position of a folding-back portion 31a caused by sliding motion between the upper housing and lower housing are disposed.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 26, 2015
    Assignee: NEC CORPORATION
    Inventors: Takahiro Sakai, Toshiki Yamanaka, Hiroshi Yamada
  • Patent number: 9036337
    Abstract: An enclosure is provided for a device comprising one or more electronic assemblies where the enclosure deforms under a shock in one or more selected manners to dissipate the shock energy. The deformation, which is elastic deformation, occurs at selected parts of the enclosure and/or in selected translations and/or rotations where those selections are made by the designer of the enclosure. By being able to define where and how the deformations will occur, the electronic assemblies can be located, mounted and interconnect within the enclosure such that the deformation does not adversely affect the assemblies or device.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: May 19, 2015
    Assignee: PSION INC.
    Inventors: Gregory Ian Smyth, Nicholas John James
  • Patent number: 9030834
    Abstract: A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing 12 and a lower housing 22 coupled in a freely slidable manner are electrically connected to each other by a flexible printed circuit board folded back to be routed between slide facing surfaces 12b and 22a of both the housings and the height of a side wall surface 12c and 22c of the upper housing and lower housing changes in a bending manner along the direction of freely sliding and, in the slide facing surfaces of the upper housing and lower housing, concave space portions 15 and 25 to accommodate the change in curvature and in position of a folding-back portion 31a caused by sliding motion between the upper housing and lower housing are disposed.
    Type: Grant
    Filed: November 6, 2009
    Date of Patent: May 12, 2015
    Assignee: NEC Corporation
    Inventors: Takahiro Sakai, Toshiki Yamanaka, Hiroshi Yamada
  • Patent number: 9025336
    Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: May 5, 2015
    Assignee: Denso Corporation
    Inventors: Hideki Minato, Hideki Kabune, Atsushi Furumoto
  • Patent number: 9019720
    Abstract: Components within a portable device are arranged around a perimeter of a display component to reduce the height of the portable device. Components such as a battery, a main logic board, a wireless networking interface, and so forth may be distributed around a display component such as an electrophoretic display. Distribution of components around the perimeter of the display component rather than behind the display component reduces the height. Furthermore, the placement of components in the perimeter provides a structure for a user to grip the portable device or for placement of user actuable controls.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: April 28, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: David C. Buuck, Chris T. Li
  • Patent number: 9007775
    Abstract: A housing for electronic components comprising at least one hardware module and a frame. The hardware module comprises a mounting element, wherein the frame connects the at least one hardware module through the mounting element mechanically stable to the housing. A labeling element is attached to the mounting element and the housing has at least one viewing opening so that at least one part of the labeling element can be seen from the outside of the housing.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: April 14, 2015
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventors: Gottfried Holzmann, Werner Mittermaier
  • Patent number: 8995139
    Abstract: Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: March 31, 2015
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventor: Hideyuki Sakamoto
  • Patent number: 8985345
    Abstract: A rack includes a rack body, at least one latch member secured to the rack body, and a supporting assembly. The supporting assembly includes at least one sliding lever and a supporting member secured to the at least one sliding lever. The at least one sliding lever is slidably engaged in the at least one latch member and the supporting assembly is extendable and retractable relative to the rack body, to provide a wider base for the rack when required where it rests on the floor, increasing stability and decreasing the likelihood that the rack might topple.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: March 24, 2015
    Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
    Inventors: Chen-Lu Fan, Li-Ping Chen
  • Patent number: 8982565
    Abstract: Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.
    Type: Grant
    Filed: May 15, 2008
    Date of Patent: March 17, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David W. Sherrod, Michael E. Taylor, Joseph R. Allen, John P. Franz
  • Patent number: 8976530
    Abstract: Data storage apparatus comprising a main housing containing an electric power supply, a panel supporting a plurality of electric connectors for connecting the power supply to other component parts of the apparatus and a plurality of units. Each of the units comprises a plurality of data storage elements and is mounted to slide from within the main housing to provide access to its data storage elements. The apparatus also comprises a plurality of cable modules each comprising a cable having a first connector at a first end connected to one of the units and a second connector at a second end connected to an electric connector on the panel. The cable modules also include a moveable rigid structure providing a barrier preventing manual access to the panel. The second connector is attached to the rigid structure such that movement of the rigid structure causes the second connector to be disconnected.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: March 10, 2015
    Assignee: Nexsan Technologies Limited
    Inventors: Alan Jeffery, Andrew Paul George Randall, David Ian Belcher, Alastair Bryers, Stephen Freeman
  • Publication number: 20150062832
    Abstract: A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 5, 2015
    Applicant: ABB Technology AG
    Inventors: Shamsi Ismayilov, Yaser A. Khalifa, Frantisek Koudelka, Arkady Oksengorn, Siu Lau, Hardik Patel, In Y. Choi
  • Publication number: 20150062833
    Abstract: An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.
    Type: Application
    Filed: August 29, 2013
    Publication date: March 5, 2015
    Applicant: ABB Technology AG
    Inventors: Shamsi Ismayilov, Yaser A. Khalifa, Frantisek Koudelka, Arkady Oksengorn, Siu Lau, Hardik Patel, In Y. Choi
  • Publication number: 20150055281
    Abstract: A modular device and method are disclosed. The modular device includes individual modular units. A first modular unit includes a pivot member and a connector and a second modular unit includes a matching connector and a first mating point. The first mating point is configured to fit a portion of the pivot member. A third modular unit may also be included, where the third modular unit has a second mating point which is configured to fit another portion of the pivot member. The matched connectors align and connect when the second modular unit is rotated about the pivot member into contact with the first modular unit. The third modular unit can also be rotated about the same pivot member with or without the second modular unit connected. The second and third modular units can be rotated independently and/or removed independently.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Applicant: General Electric Company
    Inventors: Joshua Paul David DeRosa, Richard A. Monroe, Gerard Frederick Beckhusen, Nicholas Anthony Stancato, Clark Alexander Bendall
  • Patent number: 8964397
    Abstract: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: February 24, 2015
    Inventor: Edgar Davin Salatandre
  • Patent number: 8958210
    Abstract: A modular converter cabinet system of a converter having phase modules with upper and lower converter valves, wherein each converter valve has at least two converter cells and a branch inductor connected in series, includes a first valve cabinet, a second valve cabinet, and an inductor cabinet. The first and second valve cabinets each have several vertically spaced valve levels and several honeycomb cells arranged next to one another. The inductor cabinet has several vertically spaced phase levels. Two valve levels of at least one of the first and second valve cabinets are electrically connected to a respective phase level of the inductor cabinet that is arranged next to the at least one valve cabinet. A converter cabinet system which can be individually adapted to different converter output voltages in a simple manner is thus obtained.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: February 17, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventors: Marc Hiller, Anton Pfauser
  • Patent number: 8953330
    Abstract: A security protection device includes a cover circuit board comprising at least one inner wiring layer and a base circuit board comprising at least one inner wiring layer. The device further includes a security frame between the base circuit board and the cover circuit board, at least one electrically conductive wire being wound and included within the security frame to form at least one winding protection layer around sides of the security frame. The cover circuit board, the security frame, and the base circuit board form an enclosure enclosing a security zone, and the at least one inner wiring layer within the cover circuit board, the at least one inner wiring layer within the base circuit board, and the at least one electrically conductive wire within the security frame are connectable to a security mechanism configured to detect an intrusion into the security zone.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: February 10, 2015
    Assignee: PAX Computer Technology Co., Ltd.
    Inventors: Shuxian Shi, Hongtao Sun
  • Patent number: 8953328
    Abstract: An electronic device includes a chassis, a detachable module received in the chassis, and a latching member. The detachable module includes an end plate defining an opening. One end of the latching member is fixed in the detachable module, and the other end of the latching member extends out of the detachable module through the opening. The detachable module defines a through hole. The chassis defines a latching hole corresponding to the through hole. A latching block protrudes out from one side of the latching member and extends through the through hole to engage in the latching hole. A shielding piece comes across to block and shield the opening.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: February 10, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Hao Lin
  • Patent number: 8946567
    Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: February 3, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
  • Patent number: 8947872
    Abstract: A holding frame includes a base plate, a first resisting wall, a second resisting wall, two first elastic arms and two second elastic arms. The base plate includes a first surface and a second surface opposite to the first surface. The first resisting wall extends from the first surface, and the second resisting wall extends from the second surface. The two first elastic arms are formed on the first surface, and face the first resisting wall. The two first elastic arms and the first resisting wall define a first receiving space configured for receiving a first hard disk drive. The two second elastic arms are formed on the second surface, and face the second resisting wall. The two second elastic arms and the second resisting wall define a second receiving space configured for receiving a second hard disk drive.
    Type: Grant
    Filed: August 29, 2012
    Date of Patent: February 3, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chin-Ming Chang
  • Patent number: 8942001
    Abstract: A seal structure for an electronic control device having a circuit board housed in a watertight space a housing that is formed by fitting a plurality of fitting members together, has first and second seal portions which are formed at a fitting surface portion between the fitting members that are fitted together. One side of a pair of the fitting members of each of the first and second seal portions is provided with a seal groove, the other side is provided with a protruding line. An auxiliary seal groove and an auxiliary protruding line are formed on opposing surfaces of the seal groove and the protruding line at a merged part where the first and second seal portions meet each other. The auxiliary seal groove and the auxiliary protruding line continuously extend from the seal groove up to an end surface of the protruding line.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: January 27, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshio Kawai, Yuichi Yanagisawa, Hironori Ohhashi
  • Patent number: 8929084
    Abstract: A compact radio core engine (CE) module uniquely small in size and power consumption, in which only two circuit boards provide all the modem and transceiver functions needed for modern military radios. A modem circuit board has modem devices and a first connector mounted on the board, and a radio frequency (RF) circuit board has RF devices and a second connector mounted on the board. A module frame has an interior wall, and a side wall about the periphery of the interior wall. The modem and the RF circuit boards are positioned on opposite sides of the interior wall, and the connectors on the two boards mate with one another through an opening in the interior wall to exchange operating data and signals between the devices on the boards. The modem circuit board is seated entirely within a recess formed by the interior and the side walls of the frame.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: January 6, 2015
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Michael S. Vogas, Boris Radovcic, Todd R. DeLuck, George M. Horihan, Minh Le, Kenneth E. Kolodziej
  • Patent number: 8922972
    Abstract: An integral solar module power conditioning system includes one or more solar module support frames. Each frame includes a plurality of plug-and-play electrical connectors integrated therewith. A microinverter or microinverter connector is also integrated with each frame. Each frame is configured to receive a respective solar electric module and to carry electrical power through a plurality of solar electric modules and corresponding microinverters connected together via a plurality of solar module support frames connected together via the plurality of integrated plug-and-play electrical connectors.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: December 30, 2014
    Assignee: General Electric Company
    Inventors: Charles Steven Korman, Neil Anthony Johnson, Michael Andrew de Rooij
  • Publication number: 20140355220
    Abstract: A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.
    Type: Application
    Filed: August 20, 2014
    Publication date: December 4, 2014
    Inventor: Georgios Metaxas
  • Patent number: 8901730
    Abstract: Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: December 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Kai Liu, Shih-Wei Liang, Hsien-Wei Chen, Kai-Chiang Wu
  • Patent number: 8897020
    Abstract: An integral cable guide for an electronic module is provided. The electronic module includes a top housing with a ridge formed on one side. The top housing is configured to removably couple with a bottom housing to enclose electronic components. The electronic module further includes a receptacle within the top housing configured to receive a removable terminal block (RTB), such that a channel is formed between the ridge and the RTB when the RTB is placed within the receptacle. The channel guides cables coupled to the RTB to an outside edge of the module. The electronic module further includes at least one anchor that provides support for the cables.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: November 25, 2014
    Assignee: Rockwell Automation Asia Pacific Business Center Pte. Ltd.
    Inventors: Soon Seng Kang, Xiaofan Chen
  • Patent number: 8873240
    Abstract: An information handling system motherboard overlaps a component with a mezzanine card to provide additional room for components to couple to the motherboard. A mezzanine card bracket holds the mezzanine card in a parallel configuration over the motherboard. The mezzanine card bracket includes a rotating portion that supports the mezzanine card in a closed position and rotates to an open position to allow access to components disposed on the motherboard beneath the rotating portion, such as a memory module that is partially covered by the mezzanine card when the mezzanine card is installed on the mezzanine card bracket support surface.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: October 28, 2014
    Assignee: Dell Products L.P.
    Inventors: Salvador D. Jimenez, III, Ku Hao Cheng
  • Patent number: 8873241
    Abstract: An intrinsically safe serviceable transmitter apparatus and method includes a sensor module composed of at least a sensor and a sensor electronic module in order to transmit an electrical signal from the sensor module to a dual cap electronic housing module. The dual cap electronic housing module includes an electronics module, a terminal block, and an intrinsically safe circuit and noise rejection unit. The electronic housing module includes a meter cap and a field-wiring cap in order to permit a user to open either side of the transmitter housing in an intrinsically sale environment. Once open, a local integral meter can be added to calibrate and reconfigure the apparatus and/or to replace a communications board. The terminal block located in a field-wiring compartment acts as an intrinsically safe barrier for the rest of the transmitter electronics and simplifies board replacement.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: October 28, 2014
    Assignee: Honeywell International Inc.
    Inventors: Mark L. Muldowney, Keith Sayuk
  • Patent number: 8873238
    Abstract: A chassis system includes a body, a lid, a cavity, a backplane, and an electrically conductive connector. The lid is removably attached to the body such that when the lid is attached to the body a cavity within the body is completely enclosed by the body and the attached lid. The lid and the body are made of at least one material that does not allow electromagnetic waves to enter the cavity. The backplane is attached to the body or the lid. The electrically conductive connector is attached to the body or lid. The connector is in wired or wireless communication with the backplane for allowing electricity or data to flow between the electrically conductive connector and the backplane. The chassis system may be used to environmentally protect one or more electronic modules inserted into the cavity of the chassis system.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: October 28, 2014
    Assignee: The Boeing Company
    Inventor: Donald Frank Wilkins
  • Patent number: 8872025
    Abstract: A waterproof structure of an electronic unit includes a case that defines a housing portion housing a first terminal, and a connector that includes an insulating body attached to the case. The connector includes a second terminal that is supported by the insulating body and connects a conductor end portion of a cable to the first terminal. The insulating body includes a wall portion that partitions a part of the housing portion by covering an open portion of the case. The insulating body includes a cable lead-in portion that defines a cable lead-in hole for leading the cable into the case and is joined to the wall portion. A potting resin is filled in a space between the inner periphery of the cable lead-in hole and the outer periphery of the cable and the housing portion and cured.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: October 28, 2014
    Assignee: Jtekt Corporation
    Inventors: Toshio Tamai, Takahiro Sanada
  • Patent number: 8873242
    Abstract: Automotive control unit having two connectors is provided in an uncomplicated configuration that allows holding durability to be ensured against high external force upon insertion of the connectors, watertightness in a severer environment, and high reliable connecting portions. The automotive control unit includes a board 100 on which an electronic device is mounted; a first connector directly inserted into and attached to a device to be controlled; a second connector 200 for connecting to another control unit; and a housing which holds the board and includes a cover 130 and a case 500 to which the first and second connectors 300 and 200, respectively, are attached. The first connector 300 is configured to be secured to the housing from the outside of the housing. The second connector 200 is held by and secured onto the board and then secured to the housing from the inside of the control unit.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: October 28, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yoshinori Wakana, Masaru Kamoshida, Takeshi Igarashi
  • Patent number: 8854825
    Abstract: A terminal box is provided having a terminal plate body and a fixed attachment portion to which at least one lead terminal portion of the diode is fixed, and the fixed attachment portion is connected to the terminal plate body via a displacement-allowing connecting portion. An output cable connection arrangement for a solar cell module terminal box is further provided in which an output cable is inserted to a cable insertion portion such that an inner coating portion coating a core wire of the output cable and an outer coating portion coating the inner coating portion are engaged within the cable insertion portion. An output cable fixation arrangement for a solar cell module terminal box is further provided in which an output cable is fixed to the terminal box by means of a cable fastener having a first fixing portion to be fixed to a barrel portion of the output cable.
    Type: Grant
    Filed: September 22, 2011
    Date of Patent: October 7, 2014
    Assignee: Hosiden Corporation
    Inventor: Masakazu Yamazaki
  • Patent number: 8854827
    Abstract: An electronic control unit is configured in such a way that the groove-shaped concave portion of the second case member includes a first concave portion, in which a groove width at a bottom surface side is narrow, and a second concave portion, in which a groove width at an aperture surface side is wide, and the first concave portion and the second concave portion are linked by an inclined step portion in such a way that a groove width at the step portion is increased in a direction from the bottom surface side to the aperture surface side, and moreover, a tip of the rail-shaped convex portion of the first case member is fitted into the first concave portion at the bottom surface side of the second case member.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: October 7, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Takaaki Tanaka, Yasuhiro Takahashi, Toru Kubo, Seiji Kato, Hideki Umemoto
  • Publication number: 20140293553
    Abstract: The invention relates to a solar box (1) with a connection box (2) and at least one extension module (3, 20), which can be operatively connected to the connection box (2) via a first and a second connector part (9, 10) of a standardized interface (8). The connection box includes a connection shaft (5), into which contacts (7) lead from a shaft wall (11). The contacts (7) and the standardized interface (9) are arranged on the same shaft side.
    Type: Application
    Filed: May 30, 2012
    Publication date: October 2, 2014
    Inventors: Daniel Stanelli, Markus Zahner
  • Patent number: 8848382
    Abstract: The instant disclosure relates to a data access module, which includes a plurality of data access devices, a circuit board defining a plurality of holes, a base frame, a plurality of partition panels, a cover frame, and a plurality of locking pieces. The base frame includes a bottom plate and a pair of sidewalls. A plurality of fixing pieces and ridges are formed on the bottom plate. The partition panels are directed along the retrieving direction of the data access devices and fixed on the bottom plate. Each partition panel has a hooking portion for engaging the corresponding hole of the circuit board. The cover frame includes a top plate and a pair of side plates. The locking pieces are rotatably disposed on the cover frame. Each locking piece has a pressing portion selectively pressing against the circuit board. A chassis is also discussed.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 30, 2014
    Assignee: Wistron Corp.
    Inventors: Hai-Nan Qiu, Chia-Hsin Hsieh
  • Publication number: 20140268565
    Abstract: A modification kit for converting an existing signage mounting structure to an electronic sign generally includes a plurality of weatherized display modules; a plurality of sign sections each having a front-facing portion and a rear-facing portion, the front facing portion defining a two dimensional array of bays arranged in a plurality of rows along a vertical direction and a plurality of columns along a horizontal direction, each bay configured to receive one of the display modules, the rear-facing portion for mounting to a surface of the existing signage mounting structure and a plurality of wiring assemblies each having a first end for coupling to a power junction located adjacent to a rear surface of one of the rear-facing portions and a plurality of power extensions for coupling the power source to the plurality of weatherized display modules.
    Type: Application
    Filed: March 15, 2014
    Publication date: September 18, 2014
    Applicant: ADTI MEDIA, LLC
    Inventors: David Franklin COX, Richard J. Romano, Arne E. Carlson
  • Patent number: 8837156
    Abstract: The present disclosure includes a protective sleeve assembly and a battery module, wherein the protective sleeve assembly includes a frame and a terminal fixing plate, a terminal circuit board and a connector port are arranged on the terminal fixing plate, an end of a conduction sheet is connected to the terminal circuit board, the other end of the conduction sheet is in a limiting hole of the terminal fixing plate; the battery module includes a upper cover, a lower cover and a charge-discharge control circuit board, a conduction electrode is arranged on the charge-discharge control circuit board and connected with a battery. When the mobile phone is fixed with the protective sleeve assembly, a special port of the mobile phone is transformed into a general port by the conversion circuit of the terminal circuit board, so it's easy to charge the mobile phone by the general port.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: September 16, 2014
    Assignee: Shenzhen Win-Top Electronic Tech Co., Ltd.
    Inventors: Zhongwei Sun, Houquan Zhang, Yongli Zhou, Zhuangzhong Yi
  • Patent number: 8837155
    Abstract: A mobile terminal includes a first body and a second body, a first display unit mounted to the first body, and a slide module configured to move the first body and the second body with respect to each other. Further, the slide module includes a first slide member coupled to the first body, and a second slide member having a first bending portion and a second bending portion extending from a side end thereof in directions crossing each other, and configured to encompass at least part of side surfaces of the first slide member. In addition, the first bending portion and the second bending portion are spaced from at least one side surface of the first display unit with a predetermined gap from the side surface of the first display unit.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: September 16, 2014
    Assignee: LG Electronics Inc.
    Inventors: Kyoungjoon Park, Jinsoo Jeong, Daewon Yoo
  • Patent number: 8807364
    Abstract: There is provided a receptacle for a modular telematic unit. An exemplary receptacle comprises a body, at least one housing, and at least one solar panel. The body comprises at least two rails positioned opposite from each other. The housing is configured to be detachably slid into the rails. The solar panel is configured to be detachably slid into the rails. An outer surface of the solar panel, when slid into the rails, is slanted at an angle ? relative to at least one outer surface of the body. The outer surface of the body is positioned opposite the solar panel.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: August 19, 2014
    Assignee: Deutsche Post AG
    Inventors: Frank Josefiak, Hassan Aftabruyan, Stefan Heimerl, Julian Baugatz, Andreas Wiechmann
  • Patent number: 8804352
    Abstract: A circuit board assembly includes a motherboard, a first daughterboard, and a first metal bar. Two ends of the first metal bar are respectively fastened to the motherboard and the first daughterboard, and are electrically connected between the motherboard and the first daughterboard. The first metal bar is supported between the motherboard and the first daughterboard, so as to position the first daughterboard separately over the motherboard and enable the first daughterboard to be substantially perpendicular to the motherboard.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: August 12, 2014
    Assignee: Delta Electronics, Inc.
    Inventors: Ming-Hsien Hsieh, Kuo-Hua Lin, Yi-Min Chen
  • Patent number: 8804356
    Abstract: A mounting apparatus for an expansion card includes a bottom plate, a circuit board, and mounting bracket. The bottom plate defines mounting hole. The circuit board is secured to the bottom plate, and a gap is defined between the bottom plate and the circuit board. The mounting bracket includes a base secured to the bottom plate. The base includes two positioning pieces and an elastically deformable mounting portion. The two positioning pieces are received in the gap, to prevent the mounting bracket from moving along a first direction substantially perpendicular to the bottom plate, and the elastically deformable mounting portion is engaged in the mounting hole, to prevent the mounting bracket from moving along a second direction substantially parallel to the bottom plate.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: August 12, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Lung-Sheng Tsai, Yao-Chung Chen
  • Patent number: 8802983
    Abstract: A signal interface includes a support structure having a pivotally supported cover and side wings. A latching mechanism is provided to secure the cover to the side wings in both stowed and deployed positions.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: August 12, 2014
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Christopher Clifton, Dean Jones, Philip Mitchell, David Myers, James Pruett
  • Patent number: 8802982
    Abstract: The invention relates to a housing for protecting an electronic device (1) to be fitted to a motor vehicle, the housing comprising a plurality of shells (2, 3) forming a front (2) and a cap (3), these being assembled together to define jointly an enclosure (4) for housing an electronic card (1) provided with remote connectors (13), wherein at least one first shell (3) is formed from at least two elementary shells (18) and said first shell (3) includes, moulded into it, at least one mobility means allowing relative movement between the elementary shells. The first shell (3) is formed in one piece, the two elementary shells (18) are situated side by side, each comprising a window for the passage and/or reception of a connector (13), and said mobility means comprises an elastically deformable member (26).
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: August 12, 2014
    Assignee: Valeo Systemes Thermiques
    Inventors: Henry Beraud, Patrick Corduan, Bernard Cuny
  • Patent number: 8797736
    Abstract: A casing includes a casing module and a support module. The casing module includes two side plates spaced apart from each other, a top-plate unit disposed between and perpendicular to the side plates, and a bottom plate spaced apart from and parallel to the top-plate unit. The side plates, the top-plate unit and the bottom plate define a first accommodating space for receiving a first electronic device. The support module is disposed between the top-plate unit and the bottom plate, and is removably caught in the top-plate unit to divide the first accommodating space into two second accommodating spaces for receiving two second electronic devices that differ in size from the first electronic device.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: August 5, 2014
    Assignee: Wistron Corporation
    Inventors: Chong-Xing Zhu, Te-Hsiung Hsieh
  • Publication number: 20140211420
    Abstract: A portable electronic device includes a main body, a motherboard, at least one connector, and at least one external graphics card module. The motherboard is disposed within the main body and equipped without a built-in graphics chip. The connector is disposed on the motherboard. The main body has at least one slot, and the slot is disposed at a position corresponding to the position of the connector. The external graphics card module includes a circuit board, and a graphic processing unit and a first connecting interface are electrically disposed on the circuit board. The external graphics card module is removable and selectively inserts into the slot, and the external graphics card module electrically connects to the motherboard via the first connecting interface.
    Type: Application
    Filed: January 30, 2013
    Publication date: July 31, 2014
    Applicant: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Ting Kang Ou, Yi Yuan Liu, Mou Ming Ma
  • Patent number: 8792249
    Abstract: A waterproofing structure for a mobile terminal, includes an annular groove that surrounds an outer edge of a predetermined waterproof area of a mobile terminal. A waterproof lid covers an entire surface of the waterproof area, and includes an annular protrusion that fits into the annular groove in the waterproof area, and an elastic resin portion that covers the annular protrusion. The elastic resin portion press-contacts and adheres to only one of two side wall surfaces of the annular groove when the annular protrusion is fitted into the annular groove.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: July 29, 2014
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Keiichi Sasamori, Mizuho Ikeda, Hiroshi Yamamoto, Katsumi Saito
  • Patent number: 8787024
    Abstract: An electronic device includes a casing with a side plate and encasing a power module. The power module includes a locking member and a sliding member sandwiched between the base and the cover and abutting the locking member. The sliding member is movable relative to the locking member, between a locked position in which the locking portion of the locking member is pushed by the sliding member to extend through the cover to be locked by the side plate of the casing, and an unlocked position in which the locking portion of the locking member is pressed by the sliding member to withdraw from the side plate to allow removal of the power module from the casing.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: July 22, 2014
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Xin-Hu Gong, Si-Wen Shu, Zheng-Bing Song