Abstract: A modular power distribution device includes a base that is snap-fit onto DIN rail. The base includes a first mounting section, configured to receive a circuit protection device, and a second mounting section configured to receive an electronically actuated power distribution device. The circuit protection device slides on to the first mounting section and includes multiple output connections. The power distribution device slides on to the second mounting section and includes multiple input connections configured to engage the output connections of the circuit protection device as the power distribution device slides on to the second mounting section. An electronic control module is snap-fit to the assembly establishing electrical connections between the electronic control module and both the circuit protection device and the power distribution device. The electronic control module includes a port by which control signals are received and feedback signals may be transmitted.

Abstract: A display motherboard includes a motherboard body, wherein n recess structures for guiding the motherboard body to fracture are provided on a surface of the motherboard body, n being greater than 1; wherein the n recess structures are arranged in sequence and centers of the n recess structures are collinear.

Abstract: An information handling system may include at least one processor; a first and a second backplane, wherein the first and second backplanes are Peripheral Component Interconnect Express (PCIe) backplanes; and a physical storage resource. The physical storage resource may be coupled to the at least one processor via a first port of the physical storage resource and via the first backplane, and the physical storage resource may be further coupled to the at least one processor via a second port of the physical storage resource and via the second backplane.

Abstract: A semiconductor unit includes transistor chips; first main circuit terminals that are electrically connected to first main electrodes of the transistor chips; second main circuit terminals that are electrically connected to second main electrodes of the transistor chips; and a sealing body that has two sides and positioned on opposite sides from one another in one direction and that seals the transistor chip and the first and second main circuit terminals except for a portion of each of the first and second main circuit terminals. Moreover, the first main circuit terminals are respectively arranged in both corners of the one side and in a center of the other side of the two sides of the sealing body, and the second main circuit terminals are respectively arranged in a center of the one side and in both corners of the other side of the sealing body.

Abstract: A sensor module includes a sensor, a first substrate on which the sensor is mounted, a second substrate coupled to an external connector, conductive members that couple the first substrate and the second substrate, an accommodator that accommodates the first substrate, the second substrate, and a conductive member therein, a lid that closes an opening of the accommodator, a first elastic member in contact with a first main surface of the first substrate and the accommodator, and a second elastic member in contact with a second main surface of the first substrate and the lid. A resonance frequency f1 of the sensor, a resonance frequency f2 of the conductive member, a resonance frequency f3 of the first elastic member, and a resonance frequency f4 of the second elastic member satisfy f2<f3<f1 and f2<f4?f1.

Abstract: An on-board control device relays data communication between a vehicle module and a vehicle ECU which generates a signal for commanding a driving mode of a vehicle. The on-board control device includes a first interface via which communication with the vehicle ECU is performed, and a second interface via which communication with the vehicle modules is performed. The first interface relies on specifications for communication with the vehicle ECU, and the second interface does not rely on the specifications for communication with the vehicle ECU.

Abstract: A semiconductor device includes a conductive pad over an interconnect structure, wherein the conductive pad is electrically connected to an active device. The semiconductor device includes a dielectric layer over the conductive pad, wherein the dielectric layer comprises silicon oxide. The semiconductor device includes a first passivation layer directly over the dielectric layer, wherein the first passivation layer comprises silicon oxide. The semiconductor device includes a second passivation layer directly over the first passivation layer, wherein the second passivation layer comprises silicon nitride.

Abstract: This disclosure describes a head-mounted display with a display assembly configured to display content to most or all of a user's field of view. The display assembly can be configured to display content in far-peripheral regions of the user's field of view differently than content upon which a user can focus. For example, spatial resolution, color resolution, refresh rate and intensity (i.e. brightness) can be adjusted to save resources and/or to bring attention to virtual content positioned within a far-peripheral region. In some embodiments, these changes can save processing resources without detracting from the user's overall experience.

Abstract: The invention relates to sensor (900) for use as a pressure and/or a force sensor. The sensor (900) comprises a elastic and stretchable layer (050, 100, 200) with material having a first Young's modulus (Y200) and a first yield strain (?y,200); at least a first stretchable electrode (301) and a second stretchable electrode (302) attached to the elastic and stretchable layer (050, 100, 200) and arranged a first distance (d1, d1,301,302) apart from each other; a flexible foil (500) having a second Young's modulus (Y500); and electrically conductive wiring (400) attached to the flexible foil (500). At least a part of the electrically conductive wiring (400) is coupled to the stretchable electrodes (301, 302) in an electrically conductive manner; the first yield strain (?y,200) is at least 10 percent; the first Young's modulus (Y200) is less than the second Young's modulus (Y500).

Abstract: A power adaptor includes a main electric unit, a transformer unit and a bus capacitor unit. The main electric unit is disposed on a first surface. The transformer unit is configured on the main electric unit and disposed on a second surface. The first surface is perpendicular to the second surface. The main electric unit and the transformer unit form a containing space. The bus capacitor unit includes at least one bus capacitor. The bus capacitor unit is disposed in the containing space.

Abstract: The invention concerns a rack module for forming a support column, such as a rack, by stacking at least two rack modules, the rack module having at least one site for receiving a device for administering a medical product, this site comprising at least one plug for electric current supply to the administering device and for data transfer. It is also provided with an inlet connector and an outlet connector for connecting two successive modules to each other, power lines and data transfer lines connecting the inlet connector with the plug of the sites on the one hand side and with the outlet connector on the other hand side.

Abstract: A dynamic random access memory is provided, including a main body and a transmission port. The main body has a substrate, a light-emitting module and a light-guiding portion. The substrate is provided with a memory module, the light-emitting module has a carrier board and a light-emitting portion disposed on the carrier board, the light-guiding portion is arranged corresponding to the light-emitting portion, and at least a part of light from the light-emitting portion is projected to outside of the dynamic random access memory through the light-guiding portion. The transmission port is disposed on the substrate, and the transmission port is electrically connected with the memory module.

Abstract: A backplane (1) comprising —a first module connector (2d) configured to receive a first printed circuit board module (5d) and including a first connector portion (23d-26d); —a second module connector (2e) configured to receive a second printed circuit board module (5e) and including a second connector portion (23e-26e), the first connector portion (23d-26d) being connected to the second connector portion (23e-26e) through a backplane bus.

Abstract: An electronic device with a hinge structure is provided, including a first member and a second member. The first member includes a signal connection unit. The signal connection unit includes a plurality of conductive elements and a plurality of spacers. The conductive elements include a first conductive element and a second conductive element. The first conductive element includes a first annular portion and a first extending portion. The second conductive element includes a second annular portion and a second extending portion. The spacers include a first spacer and a second spacer. The first spacer separates the first annular portion from the second annular portion. The second spacer abuts the second annular portion. The second member is connected to the first member, and is adapted to be rotated relative to the first member.

Abstract: A printed circuit board with a two-dimensional torus topology provided herein. The printed circuit board includes an array of board connectors, an input port and an output port, and a set of interconnections. Each board connector of the array of board connectors is formed to receive an electronic connector. The input port and the output port are formed on each board connector to provide an identical trace routing direction. The set of interconnections are formed to connect each board connector to another board connector. The signal path between each of the interconnections has a length less than a distance between a first board connector and a last board connector in the array of board connectors.

Abstract: A speaker system is removably attached to a cellular telephone or telephone case to augment or supplant audio output of the phone. In one example, the system includes a protective telephone case with built in speakers. The attachment mechanism may alternatively or additionally be used as a universal attachment for cellular telephone accessories. The system may include a fastening mechanism configured to attach any accessory to a phone surface.

Abstract: An electronic device includes a base plate, and a plurality of modules detachably attached to the base plate. The modules comprise a terminal block module. The terminal block module has an openable and closable door at a pullout end portion-side. The door has an attribute information display part configured to display attribute information of a device to be connected to the terminal block module.

Abstract: An electronic circuit board unit for an electronic module installed in a vehicle rear view device. The electronic circuit board unit has a base plate, at least one printed circuit board, and at least one plug connection for an electronic and physical connection between the printed circuit board and the base plate. The electronic circuit board has at least one first receiver for mounting an electronic consumer unit of the electronic module and being attachable or attached to the base plate or to one of the at least one printed circuit board. There is at least one second connector attachable or attached to the base plate or to the at least one printed circuit board for connecting at least one further electronic consumer unit of the electronic module to the driver circuit of the base plate.

Abstract: A light guide mechanism of a fingerprint recognition plate includes a frame, a light guide plate, first electrodes, second electrodes and light emitting diodes. The frame has a hollow portion and receiving troughs. Each of the receiving troughs forms a first through hole and a second through hole penetrating the frame. The light guide plate covers the hollow portion. The first electrodes are in the first through holes, and the second electrodes are in the second through holes. Each of the light emitting diodes is in the receiving trough and includes a first electrode pin and a second electrode pin. The first electrode pin pierces the first through hole to be connected to the first electrode. The second electrode pin pierces through the second through hole to be connected to the second electrode. The first electrode pin and second electrode pin are exposed from the bottom of the frame.

Abstract: A mobile terminal and a mobile terminal audio signal processing system including the same are disclosed. The mobile terminal includes a first body including an opening, a main circuit board, and a main earphone jack, a first audio signal processing body including a first circuit board, on which a sub-sound module receiving a digital audio signal from the first body and converting the digital audio signal into an analog audio signal is mounted, and a sub-earphone jack outputting the analog audio signal, and a controller outputting a first audio signal to the sub-earphone jack and outputting a second audio signal to the main earphone jack. The first audio signal processing body is a first state where the first audio signal processing body is coupled with the opening, or a second state where the first audio signal processing body is separated from the first body.

Abstract: A server rack includes a rack management controller (RMC) configured to manage a first function and a backplane including a backplane controller (BPC). The BPC is configured to monitor the RMC, determine that the RMC is unavailable, and manage the first function, in response to determining that the RMC is unavailable.

Abstract: The present disclosure provides a cover for an electronic device and a biometric data apparatus for communication with an electronic device, wherein the biometric data apparatus comprises: a body; and a biometric data input element formed on the body; wherein at least part of the body is configured such that the biometric data apparatus may be releasably coupled to the electronic device when the cover for the electronic device is fitted to the electronic device.

Abstract: The present invention relates to a communication module assembly. The present invention is a communication module assembly which is electrically connected to a communication device and is supplied with power and signal, and can include a connection port unit that is supplied with the power and the signal from the communication device; a cable connection portion which is provided in the connection port unit, and to which cables electrically connected to the communication device is connected; a plurality of communication modules that is stacked on and connected to the connection port unit in a plug-in type; and a guide means for guiding the communication module such that the communication modules are connected to the connection port unit in a central direction.

Abstract: Connector receptacles having protective structures for connector contacts. One example may provide a connector receptacle having one or more contacts that are reinforced with a protective piece around a portion of the contact. Another example may provide a connector receptacle having two or more contacts reinforced with adjacent protective pieces to provide additional protective reinforcement. Another example may provide a connector receptacle having two or more contacts reinforced with interlocking protective pieces. These protective pieces may protect contacts in a connector receptacle from damage when a device, module, or connector insert is inserted into the connector receptacle at an oblique angle, when a device, module, or insert is stressed while in the receptacle, or when a device, module, or insert is removed from the receptacle at an oblique angle.

Abstract: A method for automatically orienting passive motion detection sensors in a given area, the method including capturing an image of at least a first portion of the given area, and responsive to capturing of an image of the first portion of the given area, superimposing, onto the image, a multiplicity of virtual passive sensor sensitivity beams virtually originating from at least one passive motion detection sensor, the at least one passive motion detection sensor being operable for passively detecting motion in at least a second portion of the given area, the sensitivity beams demarcating the second portion of the given area, thereby enabling ascertaining a measure of overlap between the first and second portions of the given area.

Abstract: The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with the first circuit board, and a second slot in which a second connector is connected with the second circuit board. The first connector and the second connector are arranged so that pin arrangement of the first connector may be shifted by at least one column in a longitudinal direction against pin arrangement of the second connector.

Abstract: A receptacle assembly includes a guide assembly and at least one communication connector. The guide assembly has a guide frame extending from a connector housing. The guide frame includes a front panel and multiple frame members that extend between the front panel and a front wall of the connector housing. The frame members are spatially separated to allow air to flow through the guide frame. The frame members define first and second stacked channels that are each configured to guide a corresponding pluggable module that is received through the front panel through the guide frame to the connector housing. The communication connector is within the connector housing. The communication connector has first and second mating interfaces that extend through respective first and second apertures in the front wall of the connector housing into the first and second channels, respectively, to mate with the corresponding pluggable module within each channel.

Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

Abstract: A storage system including a panel having a surface, and a storage component or partition configured to be releasably attached to the panel and supported on the surface to at least partially define a cavity. The system also includes a sensor configured to sense at least one of a removal, placement, presence or absence of an item in the cavity. The system further includes a wire configured to be operatively coupled to the sensor. The panel is configured to receive the wire such that the wire extends along a same side of the panel as the storage component or partition and is recessed relative to the surface.

Abstract: The invention relates to an accommodating device having a one-piece support that prevents damage to a circuit board and its contacts even with frequent installation and dismantling of mounting rail module cases. This is achieved in particular by the fact that the module case can be detached from an integral mounting rail of the support by pivoting it in the direction of the circuit board. This special pivoting is made possible by the fact that the integral mounting rail and the holding area of the circuit board are separated from one another spatially so that even in the installed state, the mounting rail module case and the circuit board are mechanically decoupled.

Abstract: Provided is an electronic component assembly that can reduce a housing space in a fitting direction of a bus bar and a terminal fitting. An electronic component assembly includes a relay, a diode, a plurality of bus bars, and a plate-shaped resin member. The relay has a relay main body having a rectangular parallelepiped outer shape, and a plurality of terminal portions protruding from a bottom surface of the relay main body. The plurality of bus bars is configured such that one end side is soldered to a terminal portion of the relay or a terminal portion of the diode, and the other end is fitted to a terminal fitting. The one end sides of the plurality of bus bars are embedded in the resin member.

Abstract: The present invention relates to a carrier module (100) for fieldbus modules that can be snapped onto a carrier profile and is movable on the carrier profile, with a first plug connector (101L) for electrically and mechanically connecting a left-side fieldbus module to the carrier module (100) and with a second plug connector (101R) for electrically and mechanically connecting a right-side fieldbus module to the carrier module (100).

Abstract: In accordance with embodiments of the present disclosure a method of configuring an information handling system comprises configuring a base platform of an information handling system. The method further comprises installing a personality module on the base platform. The personality module is configured to store personality information associated with an information handling resource of the information handling system. The method additionally comprises executing the personality module and installing software associated with the information handling system after executing the personality module.

Abstract: Various embodiments provide a circuit board module include a primary cover, a secondary cover and a circuit board sandwiched between the primary cover and the secondary cover. A first set of fins or channels may be provided on a surface of the primary cover. The first set of fins or channels guide cooling air flowing on the surface of the primary cover. A second set of fins or channels may be provided on a surface of the second cover. The second set of fins or channels guide the cooling air flowing on the surface of the secondary cover. The second set of fins or channels intermates with the first set of fins or channels to form a sealed casing enclosing the circuit board. The sealed casing forms a Faraday cage to protect the circuit board from electromagnetic interference.

Abstract: Embodiments of the invention relates to a process and assembly for a dual sided and staggered connector arrangement on a substrate. Surface mount connector technology is employed to enable a flush connection of connector leads to the surface of the substrate. Retaining pins are provided with each connector and are sized to be received by the substrate, but not to extend through the substrate. The retaining pins are sized and configured to hold each connector in a set position, while mitigating interference with an opposing side of the PCB.

Abstract: The present invention is related to a voltage conversion apparatus having a first loop circuit and a second loop circuit which share an inductance component, in which a current passes through the first and second loop circuits alternately in accordance with ON/OFF operation of a first switching element provided in the first loop circuit, characterized in that a direction of a magnetic field through the first loop circuit generated at the ON operation of the first switching element in the first loop circuit is the same as a direction of a magnetic field through the second loop circuit generated at the OFF operation of the first switching element in the first loop circuit subsequent to the ON operation.

Abstract: Disclosed are a multi connector, a wiring method thereof and a display apparatus having the same that is configured to use a common interface (CI) module for data communication between an electronic apparatus and an external apparatus or a plug used for an electronic connection of elements, regardless of standard conditions such as the number of terminals. The multi connector includes a body portion including a first slot portion and a second slot portion; a substrate portion including a substrate having a first surface; a plurality of first connection terminals provided on the first surface and extending to an inside of the first slot portion; and a plurality of second connection terminals provided on the first surface and extending to an inside of the second slot portion.

Abstract: An accessory is provided that includes power supply module, a first functional module, and a second functional module. The power supply module can be configured to be suspended beneath an overhead support, such as a hub of an umbrella. The first functional module is configured to affix to the power supply module and to be powered by the power supply module to provide a user directed function. The second functional module is configured to be detachably coupled to either the power supply module or the first functional module to receive power from the power supply module directly or through the first functional module.

Abstract: An apparatus for performing communication control includes a control module implemented with at least one integrated circuit (IC) whose package includes a plurality of sets of terminals, each set of the plurality of sets of terminals corresponding to one of a plurality of sub-modules of the control module, and within the sets of terminals, a set of terminals corresponding to a specific sub-module of the sub-modules include a power-input terminal arranged to input power from outside the control module. For example, on a printed circuit board (PCB) of the apparatus, arrangement of some modules is similar to that of some contact pads associated to the sets of terminals. In another example, the control module includes a power distribution system including at least one power distribution wire. In another example, a PCB within the apparatus includes at least one signal transmission wire and at least one set of co-plane ground wires.

Abstract: A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method.

Abstract: A solar energy collection and power generation element is described. The solar energy and collection element includes: a photovoltaic (PV) panel having a set of DC outputs; and a power management module coupled to the PV panel. The power management module includes: a base module having a connector adapted to receive electrical energy produced by the PV panel from the set of DC outputs; and a removable inverter that is able to be coupled to the base module via the connector, the removable inverter adapted to receive a DC voltage from the connector, generate an AC voltage, and provide the generated AC voltage to the connector. A solar energy collection system includes: a support structure and multiple PV panels mounted to the support structure. A method of manufacturing an integrated solar panel product includes: retrieving a panel body; retrieving a power module; and attaching the power module to the body.

Abstract: An alternating current (AC) harness for a photovoltaic (PV) system includes a wire assembly having a first end and a second end, the wire assembly having a plurality of lead wires, and at least one AC connection module positioned at a location along a length of the wire assembly between the first end and the second end. Further, the at least one AC connection module includes a first connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a first PV module of the PV system. The at least one AC connection module also includes a second connection terminal electrically coupled to the plurality of lead wires of the wire assembly and constructed to electrically couple the wire assembly with an output of a second PV module of the PV system.

Abstract: A housing for electronic components comprising at least one hardware module and a frame. The hardware module comprises a mounting element, wherein the frame connects the at least one hardware module through the mounting element mechanically stable to the housing. A labeling element is attached to the mounting element and the housing has at least one viewing opening so that at least one part of the labeling element can be seen from the outside of the housing.

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract: Base modules are provided over a backplane network for high availability control of industrial processes or machines. The base modules may include, for example, an I/O base module, which may control the industrial processes or machines and which may releasably receive an I/O function card, an adapter base module, which may communicate with an industrial controller over a separate control network, and a bus expansion base module, which may provide coupling to another bank of base modules. The base modules may be arranged side-by-side via electrical and mechanical connections. Logic of the I/O base module may detect the presence or absence of the I/O function card to allow coupling or bypassing of the I/O function card with respect to the backplane network.

Abstract: A reusable electronic circuit assembling system facilitates assembly and testing of electronic circuits. The system has at least one baseboard and one or more assembling blocks magnetically or mechanically attached to the baseboard. Each assembling block has at least two electrically connected conductive clips located separately in the opening holes of the assembly block. Discrete electronic components are connected by selectively inserting the electrodes of the to-be-connected electronic components into the clips of the assembling blocks. A complete circuit is constructed by attaching the above block-component assemblies on the baseboard and connecting them in accordance with the desired circuit diagram.

Abstract: A memory module pair includes first and second memory modules. Each of the first and second memory modules includes a circuit board having opposite first and second side edges and a front edge, along which a plurality of pins are arranged. Each circuit board of the first and second memory modules has a key notch formed closer to the first side edge than to the second side edge. The circuit board of the first memory module has a corner notch that is formed on the front edge and the first side edge, while the circuit board of the second memory module has a corner notch that is formed on the front edge and the second side edge.

Abstract: Included are embodiments for toolless configuration of a computer enclosure. At least one embodiment of an apparatus includes a computer enclosure configured to support a plurality of components, the computer enclosure including a plurality of dividing walls, the dividing walls including a first opening and a second opening. Some embodiments include a divider configured for insertion into the computer enclosure and between the dividing walls, the divider including a first tab for coupling with the first opening, the divider including a second tab for coupling with the second opening, the divider further including a locking tab for locking the divider in place within the computer enclosure.

Abstract: A circuit module includes a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, the insulating protective layer being formed on the mount surface, the insulating protective layer covering the mount surface and the conductor pattern; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductive pattern; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.

Abstract: A platform for a military radio with a vehicle adapter amplifier has been developed. The apparatus includes a base for supporting dual AN/VRC-110 radio systems. The platform has a first power supply system that converts 110/220 alternating current into +6.75 Volts direct current, +13 Volts direct current and +200 Volt direct current. The platform includes a vehicle adapter power amplifier that provides range extension to said dual AN/VRC-110 radio systems.