Selective Connections Patents (Class 361/733)
  • Patent number: 9980385
    Abstract: The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: May 22, 2018
    Assignee: International Business Machines Corporation
    Inventors: Andreas Huber, Harald Huels, Stefano S. Oggioni, Thomas Strach, Thomas-Michael Winkel
  • Patent number: 9640912
    Abstract: A bidirectional access portable flash drive includes a casing, which defines therein a receiving space that receives a circuit board mounted therein. The circuit board has a surface on which a memory unit is mounted. The casing has an end to which a double-side pluggable micro-USB connector is mounted. The double-side pluggable micro-USB connector includes a frame and a plate mounted at a predetermined location in the frame. The plate has two surfaces each including a plurality of conductor elements mounted thereon. The plate has two ends at which at least one fixing element is mounted. The memory unit enables effective access and storage of data and the double-side pluggable micro-USB connector provides functions of double-side plugging and protection to achieve an effect of convenient transmission, access, and use of data.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: May 2, 2017
    Inventors: Chang-Yih Chen, Chang-Lung Chen
  • Publication number: 20150138733
    Abstract: Each of semiconductor module includes a semiconductor chip, a case surrounding the semiconductor chip, and a main electrode connected to the semiconductor chip and led out to an upper surface of case. A connecting electrode is connected and fixed to the main electrodes of the adjacent semiconductor modules. The connecting electrode is formed only of a metal plate. The rated current, the rated voltage and the circuit configuration can easily be changed by changing the connection using the connecting electrode, thus enabling reduction of the design time and facilitating manufacture management. Only a malfunctioning one of the semiconductor modules may be replaced. There is, therefore, no need to replace the entire device. The connecting electrode is formed of an electrically conductive plate and, therefore, enables reduction of the number of component parts and reduction of the device in size in comparison with the conventional wiring bus bar.
    Type: Application
    Filed: August 24, 2012
    Publication date: May 21, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Ryo Tsuda, Kazuhiro Morishita
  • Patent number: 9025337
    Abstract: A wireless module includes a wireless signal transceiver and a transferring unit. The wireless module is assembled to a connector unit after the wireless signal transceiver is assembled to the transferring unit. Therefore, the connector unit transmits and receives wireless signals through the wireless module.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: May 5, 2015
    Inventor: Nai-Chien Chang
  • Publication number: 20150055305
    Abstract: A modular connector system allows a user to configure physical and functional aspects of a sensor or electrical connector assembly to suit the requirements of a particular installation or application. A header module houses an electrical component, such as a photo sensor, a proximity switch, a safety sensor, etc. A variety of field modules and adapter modules are provided that can be selectively added to the header module to accommodate a wide range of applications. These field and adaptor modules can include power modules, communication modules, or other types of signal processing modules. The housings and electronics of the header, field, and adapter modules are designed such that the field and adapter modules can be rotated relative to the header module to suit physical environment of the connector's location.
    Type: Application
    Filed: April 29, 2014
    Publication date: February 26, 2015
    Applicant: Rockwell Automation Technologies, Inc.
    Inventors: Dennis C. Mackey, JianHua Wang, Michael Burdenko, Robert M. Black, Eric Clinton Henefield, Derek Washington Gallon, Suresh R. Nair
  • Patent number: 8934254
    Abstract: A computer cart has segregated computer storage areas and adapter/cord management areas. This enables the adapters and cords to be stored in an orderly fashion and also prevents the cords and adapters from being accessed or removed from the cart when the computers are being accessed. In one embodiment, extensions of shelves on which the computers are stored extend through a dividing panel into a rear compartment of the cart to create AC adapter shelves for storage of the AC adapters. In another embodiment, the AC adapters are stored in bins in a separate compartment and cords from the AC adapters extend through a dividing panel to an area designed to hold the computers, to enable the computers to be plugged in to be charted while stored in the cart.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: January 13, 2015
    Assignee: Bretford Manufacturing, Inc.
    Inventors: Tad Petrick, Philip Sopicki, John Poremba, Brian Wixted, Jim Fisher, Harrison Yuan, Mike Hansen
  • Patent number: 8934252
    Abstract: A fiber panel system includes a chassis including a backplane; and at least a first blade configured to mount to the chassis. The first blade is moveable relative to the chassis between a refracted (closed) position and at least one extended position. The first blade includes a coupler arrangement for connecting together media segments. The first blade remains electrically connected to the backplane of the chassis when moving between the retracted and extended positions.
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: January 13, 2015
    Assignee: ADC Telecommunications, Inc.
    Inventors: Chad Anderson, Joseph C. Coffey, Ryan Kostecka, David Stone, Michael Wentworth
  • Patent number: 8922972
    Abstract: An integral solar module power conditioning system includes one or more solar module support frames. Each frame includes a plurality of plug-and-play electrical connectors integrated therewith. A microinverter or microinverter connector is also integrated with each frame. Each frame is configured to receive a respective solar electric module and to carry electrical power through a plurality of solar electric modules and corresponding microinverters connected together via a plurality of solar module support frames connected together via the plurality of integrated plug-and-play electrical connectors.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: December 30, 2014
    Assignee: General Electric Company
    Inventors: Charles Steven Korman, Neil Anthony Johnson, Michael Andrew de Rooij
  • Patent number: 8913756
    Abstract: A connector with an audio receiving module provided for being electrically coupled to a main board of an electronic device includes an insulating base, an audio receiving module and a jack. The insulating base has a containing space and a containing groove, and the containing space has an opening, and the containing groove has a port. The audio receiving module is contained in the containing space and disposed at a position corresponding to the opening and includes a microphone unit and a plurality of pins, and the microphone unit is electrically coupled to each pin. The jack is contained in the containing groove and disposed at a position corresponding to the port. Therefore, the connector can provide an audio receiving effect.
    Type: Grant
    Filed: November 22, 2012
    Date of Patent: December 16, 2014
    Inventor: Nai-Chien Chang
  • Patent number: 8913395
    Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: December 16, 2014
    Assignee: Apple Inc.
    Inventors: Scott Myers, Mattia Pascolini, Richard Dinh, Trent Weber, Robert Schlub, Josh Nickel, Robert Hill, Nanbo Jin, Tang Tan
  • Patent number: 8902595
    Abstract: An image display device which is provided with an image display panel, and a housing which houses the image display panel. In the front wall of the housing, an image display window makes the screen of the image display panel viewable from the outside. In the rear wall of the housing are two housing sections, each being configured by connecting together a recessed section provided in the rear wall, and a cover which covers the opening of the recessed section. On the recessed section-side connecting surface from the surfaces on which the recessed section and the cover of each housing section are connected, screw members are screwed at a plurality of areas along the inner circumference of the connecting surface by penetrating the cover. The distances between the adjacent screw members in the two housing sections are different from each other.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: December 2, 2014
    Assignee: Sanyo Electric Co., Ltd.
    Inventor: Masayoshi Mukaide
  • Patent number: 8867205
    Abstract: A fluid cooling system and associated fitting assembly for an electronic component such as a multi-processor computer offer easy and reliable connect and disconnect operations while doing so in a minimum amount of available space without damaging associated components of an electronic device, computer or cooling system. One exemplary fitting assembly includes a manifold mount with a port that is in fluid communication with a manifold tube. A fitting is sized and configured to mate with the port and is in fluid communication with associated cooling tubes of a cold plate. A latch is pivotally mounted to the manifold mount for movement to and between a first position in which the latch secures the fitting to the manifold mount and a second position in which the fitting is capable of being disconnected from the manifold mount.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: October 21, 2014
    Assignee: International Business Machines Corporation
    Inventor: Jason R. Eagle
  • Patent number: 8854821
    Abstract: According to one embodiment, an input-output (I-O) panel is transformed. The I-O panel is configured to couple to an array of first midplane connectors of a first shelf configured according to a first format, where the first shelf has rear access. The I-O panel comprises an array of I-O panel connectors and defines an xy-plane. An array of second midplane connectors of a second shelf is transformed to substantially align the second midplane connectors with the I-O panel connectors. The second shelf is configured according to a second format, where the second shelf has front access. The array of second midplane connectors is arranged in columns defining a midplane column axis and rows defining a midplane row axis.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: October 7, 2014
    Assignee: Fujitsu Limited
    Inventor: Stephen J. Brolin
  • Publication number: 20140240931
    Abstract: The present invention among other things relates to a housing and a construction kit for a control apparatus, e.g. in the form of a controller for a window lifter of a motor vehicle. A controller module with a printed circuit board here is to be accommodated in a housing at least in part, and there are provided two different types of controller modules, e.g. for a right vehicle side on the one hand and for a left vehicle side on the other hand. According to a first aspect of the invention the housing is suitable for both types of controller modules, so that the housing can selectively be combined with the one or the other type of controller module, in order to mount a control apparatus.
    Type: Application
    Filed: November 2, 2012
    Publication date: August 28, 2014
    Applicant: Brose Fahrzeugteile GmbH & Co. Kommanditgesellscha ft, Hallstagt
    Inventors: Karl-Heinz Rosenthal, Sascha Keim
  • Patent number: 8755191
    Abstract: A server system includes at least one blade server, wherein the blade server has at least one processor and memory modules, as well as a plug connector on an upper side or an underside of the blade server, a server frame with an opening on a first side of the server frame for accommodating the at least one blade server, wherein the server frame includes guidance means and a circuit board and a lifting device for guiding the at least one blade server in the lifting direction up to the circuit board, and at least one cooling fan assembly arranged inside the server frame.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: June 17, 2014
    Assignee: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventor: Michael Riebel
  • Publication number: 20140146486
    Abstract: A power supply having one or more power electronic modules that may be replaced without shutting down the power supply. Each power electronic module may be enclosed in a separate compartment of the power supply. Each compartment may have stationary electrical connectors configured to electrically connect to the power electronic module. A racking mechanism connected to a handle outside the compartment may move a power electronic module out of electrical contact with the stationary electrical connectors and/or into electrical contact with the stationary electrical connectors. Movement of a power electronic module within the compartment may occur without shutting down the power supply. Methods of replacing power electronic modules without shutting down the power supply are also provided, as are other aspects.
    Type: Application
    Filed: November 29, 2012
    Publication date: May 29, 2014
    Inventor: Peter Willard Hammond
  • Patent number: 8724336
    Abstract: A cardguide to be disposed in a computer chassis during use. The cardguide includes a track to accept an edge of a printed circuit board of a modular computer device to be disposed in the computer chassis during use. The cardguide further comprises an integral clip configured to retain at least a portion of a temperature sensing device during use. The clip provides for positioning the temperature sensing device within the computer chassis during use.
    Type: Grant
    Filed: July 2, 2010
    Date of Patent: May 13, 2014
    Assignee: National Instruments Corporation
    Inventors: John N. Hanna, David M. Crowley
  • Patent number: 8582296
    Abstract: A laptop cooling pad having one or more heat-dissipating fans adjustable in position is disclosed. The laptop cooling pad is provided with a ventilation portion so that a heat-dissipating fan can be mounted on the ventilation portion through a fan support. The ventilation portion has a groove for receiving pushing nodes of the fan support so that a user can push the pushing nodes to move the heat-dissipating fan inside the laptop cooling pad and make the heat-dissipating fan close to a heat source, thereby ensuring the heat-dissipating effect of the laptop cooling pad.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: November 12, 2013
    Inventor: Cheng Yu Huang
  • Patent number: 8526189
    Abstract: A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: September 3, 2013
    Assignees: Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha
    Inventors: Gentaro Yamanaka, Hiroshi Osada, Yasushi Yamada, Naoto Kikuchi, Norifumi Furuta, Takashi Ueno
  • Patent number: 8462518
    Abstract: An electronics module docking system includes docking member removably coupled to a photovoltaic module. The docking system includes a first connector port electrically coupled to one or more photovoltaic cells of the photovoltaic module. The photovoltaic module is selectively coupleable to the docking member. The docking system includes a housing to enclose an electronics module. The housing may include second connector port that is selectively engageable to the power electronics module. The power electronics module and the photovoltaic cells are electrically coupled to one another upon selective engagement of the connector ports. The inverter housing is receivable by and removably coupleable to the docking member allowing the inverter housing to be removably coupleable to the photovoltaic module.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: June 11, 2013
    Assignee: SolarBridge Technologies, Inc.
    Inventors: Marco A. Marroquin, Stephen P. Wurmlinger, Thomas Paul Parker, Robert S. Balog
  • Publication number: 20130141876
    Abstract: A connector with an audio playing module provided for being electrically coupled to a main board of an electronic device includes an insulating base, an audio playing module and a jack. The insulating base has a containing space and a containing groove, and the containing space has an opening, and the containing groove has a port. The audio playing module is contained in the containing space and disposed at a position corresponding to the opening and includes a speaker unit and a plurality of pins, and the speaker unit is electrically coupled to each pin. The jack is contained in the containing groove and disposed at a position corresponding to the port. Therefore, the connector can provide an audio playing effect.
    Type: Application
    Filed: November 22, 2012
    Publication date: June 6, 2013
    Inventor: Nai-Chien CHANG
  • Publication number: 20130141875
    Abstract: A connector with an audio receiving module provided for being electrically coupled to a main board of an electronic device includes an insulating base, an audio receiving module and a jack. The insulating base has a containing space and a containing groove, and the containing space has an opening, and the containing groove has a port. The audio receiving module is contained in the containing space and disposed at a position corresponding to the opening and includes a microphone unit and a plurality of pins, and the microphone unit is electrically coupled to each pin. The jack is contained in the containing groove and disposed at a position corresponding to the port. Therefore, the connector can provide an audio receiving effect.
    Type: Application
    Filed: November 22, 2012
    Publication date: June 6, 2013
    Inventor: Nai-Chien CHANG
  • Patent number: 8456845
    Abstract: A power module includes a power source comprising an end defining a socket, an external power line comprising a plug inserted into the socket, a fixing piece fixed at the end of the power source, and a clamping piece. The clamping piece includes a base mounted on the fixing piece, two parallel fixing portions extending from the base and defining a slot therebetween, a hook positioned on one of the fixing portions and extending in the slot, and a clamping band. The clamping band includes a fixed end fixed on the base and a slide end. The slide end includes spaced fixing teeth, a fixing groove is defined between each two of the fixing teeth, the clamping band winds around the external power line, the hook is engaged with one fixing groove to lock the slide end, and the clamping band and the base cooperatively hold the external power line.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: June 4, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Lei Liu
  • Patent number: 8400773
    Abstract: A mobile actuating device including a two shell housing, an interior chamber delimited by the shells, an electronic unit for data communication, an actuating member inside an opening of the first shell, a gap between the actuating member and the first shell, a carrier element, and a switching element connected to the electronic unit and associated with the actuating member, wherein the first shell includes a display having an opening in the first shell from which a light signal is emitted, the carrier element being translucent and made of a first material having a low modulus of elasticity, wherein the opening is completely filled by the carrier element, which conducts the light signal through the opening, and wherein the actuating member is made out of a second material with a larger modulus of elasticity than the first material.
    Type: Grant
    Filed: June 29, 2007
    Date of Patent: March 19, 2013
    Assignee: Huf Hulsbeck & Furst GmbH & Co. KG
    Inventor: Alexander Geldmacher
  • Patent number: 8306652
    Abstract: In one embodiment, a communication system for a multi-blade server system includes a multi-drop serial bus network interconnecting a management module with each of a plurality of servers in a multi-server chassis. A first transceiver subsystem is configured for communicating over the serial bus network between the management module and each server within a first frequency band. A second transceiver subsystem is configured for simultaneously communicating over the serial bus network between the management module and the servers within a second frequency band higher than the first frequency band. A first signal-filtering subsystem substantially filters out signals in the second frequency band from the first transceiver subsystem. A second signal-filtering subsystem substantially filters out the signals in the first frequency band from the second transceiver subsystem.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: November 6, 2012
    Assignee: International Business Machines Corporation
    Inventors: Justin Potok Bandholz, Clifton Ehrich Kerr, Pravin Patel, Bruce James Wilkie
  • Patent number: 8199523
    Abstract: Communication apparatus includes a case including a front panel and having a rear side opposite the front panel. A computer motherboard includes a processor and a bus having bus slots, and is mounted in the case so that the bus slots are located adjacent to the rear side of the case. One or more communication adapter cards, each of which includes a bus connector compatible with the bus and one or more ports for receiving a communication cable, are mounted in the case so that the ports are accessible at the front panel. Bus extension circuitry is connected inside the case between the bus slots on the motherboard and the one or more communication adapter cards, and includes a backplane including at least one backplane slot, for receiving the bus connector of the one or more communication adapter cards.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: June 12, 2012
    Assignee: Silicom Ltd.
    Inventor: David Castiel
  • Patent number: 8149582
    Abstract: A detachable module system includes a plurality of modules that couple to a corresponding plurality of module mounts on a mounting plate. To install a selected module into the module system, a user translates the selected module to an engage position on its respective module mount to engage the selected module with a immediately preceding adjacent module. Any one of the modules may be identified and removed from its module mount, without requiring removal of the remaining modules. The modules may house various types of electronic devices.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: April 3, 2012
    Assignee: Ecolab Inc.
    Inventors: Brian Philip Carlson, William Martin Christensen, Chris James Steep, Ryan Jacob Urban
  • Patent number: 8149588
    Abstract: The present invention provides a circular electronic apparatus. The circular electronic apparatus includes a circular crust and a plurality of isosceles trapezoid circuit boards. The isosceles trapezoid circuit boards are put together to form an equilateral polygon. Each isosceles trapezoid circuit board is connected with an adjacent isosceles trapezoid circuit board by a plurality of electrical lines and all the isosceles trapezoid circuit boards are connected together. The circular crust covers the equilateral polygon circuit board.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: April 3, 2012
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Kim-Yeung Sip
  • Publication number: 20120039048
    Abstract: A module carrier unit comprises a plurality of passenger interface modules that perform different functions, the functions including at least one of inputting and outputting information, the modules having a common size, shape, and interface; an outer case portion comprising a plurality of receptacles, each having a common size, shape, and interface designed to receive one of the modules, the plurality of receptacles being such that a first module having a first function is operable in a first receptacle, and a second module having a second function is operable in the first receptacle, the modules being removably connected to the receptacles; and a communications interface that performs at least one of transmitting and receiving data to and from a processor located near a seat of a passenger in the vehicle.
    Type: Application
    Filed: May 17, 2011
    Publication date: February 16, 2012
    Applicants: Phitek Systems, Ltd., Thales Avionics, Inc.
    Inventors: Christopher K. Mondragon, Nigel Greig, Edward Scholten, Roy Moody, Paul Simmonds, Elaine Clarke, Thomas Allen Darbonne
  • Publication number: 20110242771
    Abstract: The present invention relates to a flexible modular assembly (100) comprising at least two flexible electronic modules (110 and 111) supported by a textile support (130). The two flexible electronic modules and the textile support each comprise a set of electrical conductors. The flexible modular assembly further comprises flexible connectors (140) for interconnecting two sets of electrical conductors. The flexible modular assembly of the invention is a modular textile assembly for use in large-area applications of electronic textiles.
    Type: Application
    Filed: December 3, 2009
    Publication date: October 6, 2011
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Rabin Bhattacharya, Martijn Krans, Liesbeth Van Pieterson, Thomas Schuler, Guido Lamerichs, Erwin Altewischer
  • Publication number: 20110216510
    Abstract: Electronic equipment includes a first water cutoff member and a second water cutoff member on the periphery of a hole communicating from outside with a space in which an electric component such as an electric circuit board is provided. This can prevent liquid, dust, and the like, which enter a first housing from outside, from entering the space. Thus, the electric component, etc. placed in the space can be prevented from being damaged due to an electric short-circuit.
    Type: Application
    Filed: February 25, 2011
    Publication date: September 8, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Reiji MATSUMURA, Takeshi MORI, Masato MURAKATA, Kenichi SHINDO
  • Patent number: 7858886
    Abstract: The present invention is directed to a bracket for mounting housing for accommodating electrical components. The bracket comprises a base member capable of being mounted to a surface. The bracket may also comprise a sidewall extending from the base member and a system for mounting the electrical component housing to the sidewall of the base member, so that when the electrical component housing is connected to the bracket, a space is defined between the base member and the electrical component housing.
    Type: Grant
    Filed: April 7, 2008
    Date of Patent: December 28, 2010
    Assignee: Clarolux, L.L.C.
    Inventors: Brandon Lowry Helms, Robert Brian Groat
  • Patent number: 7782632
    Abstract: When a module is inserted into a bay of an electronic system, an electrical signal connector on the electronic system engages a mating signal connector on the module and an electrical power connector on the electronic system engages one of two mating power connectors on the module. The electrical power connector on the electronic system is on either a first side or a second side of the electrical signal connector. The mating power connectors are on the first and second sides of the mating signal connector on the module.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: August 24, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Troy A. Della Fiora, Gregory L. Gibson, David W. Sherrod, John R. Grady
  • Publication number: 20100208435
    Abstract: Described herein are various embodiments of a power distribution unit having modular components. For example, according to one embodiment, a power distribution unit can include a component portion that comprises at least two modules including outlet modules, circuit protection modules, power input modules, communications I/O modules, and display modules. Each of the at least two modules of the component portion can comprise at least one connection element and can be removably secured to one or more other of the at least two modules via the connection elements. The power distribution unit can also include a housing that defines an interior cavity. The component portion can be removably secured to the housing at least partially within the interior cavity.
    Type: Application
    Filed: April 26, 2010
    Publication date: August 19, 2010
    Applicant: SERVER TECHNOLOGY, INC.
    Inventors: Carrel W. Ewing, Andrew J. Cleveland, James P. Maskaly, Dave Greenblat, Brandon W. Ewing
  • Patent number: 7778042
    Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: August 17, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Jun Lee, Joo-Sun Choi, Kyu-Hyoun Kim, Kwang-Soo Park
  • Publication number: 20100195289
    Abstract: A system and method for constructing a housing, such as a rack-mountable housing, for computer and telecommunications equipment, and for arranging modules, circuit boards, and other components within such a housing, to enable integration of telecommunications and information technology (IT) application services for delivering next generation, converged, network and multimedia services. The system and method provides a rack-mount server system with one or more line interface modules accessible from the front panel of the system housing, and a motherboard and a backplane with a switch fabric for allowing interconnection of the motherboard with any of the line interface modules. The rack-mount server system provides access to the high level of computing power, advanced storage technology, and standard operating systems of rack-mount server platforms, while retaining the modularity and front-panel connectivity of conventional rack-mountable telecommunications equipment.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 5, 2010
    Applicant: DIALOGIC CORPORATION
    Inventor: Winfried Hubal
  • Publication number: 20100182754
    Abstract: A tray keying mechanism is mounted on a backplane inside a modular chassis and has a protrusion that stands out like a post for each of several equipment bays. A modular tray can be inserted into each of the equipment bays, but it will not be allowed to be fully inserted and to engage the electrical connectors on the backplane if the corresponding post meets an obstruction on the rear apron of the tray. If the particular tray is the correct type, and is not upside down, the post will encounter no obstructions during the insertion of the tray, and the electrical connectors will be allowed to engage. In one embodiment, the keying mechanism comprises a bracket of molded plastic that fits all around the several connectors on the backplane, and could be patterned to fit an already existing and in-service backplane and chassis.
    Type: Application
    Filed: January 16, 2009
    Publication date: July 22, 2010
    Applicant: International Business Machines Corporation
    Inventors: Michael Allen Curnalia, Kenji Hidaka, Michihiro Okamoto, Yasuhiro Yamamoto, Takeshi Wagatsuma
  • Patent number: 7755906
    Abstract: An electronic apparatus comprising: a unit which is mountable and removable at an electronic apparatus main body; a locking component; a mounted component which is mounted at the unit; a stopper member which is mounted at the unit and impedes removal of the mounted component from the unit; a first engaged portion which is provided at one of the unit and the stopper member; and a first engaging portion which is provided at the other of the unit and the stopper member, the first engaging portion engaging with the first engaged portion when the stopper member is mounted at the unit and impeding removal of the stopper member from the unit, being operable for releasing the engagement with the first engaged portion, and being inoperable in a state in which the unit is mounted at the electronic apparatus main body, is provided.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: July 13, 2010
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Naruhiko Sato
  • Patent number: 7660128
    Abstract: A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.
    Type: Grant
    Filed: September 30, 2004
    Date of Patent: February 9, 2010
    Assignee: Emcore Corporation
    Inventors: Darren S. Crews, Lee L. Xu
  • Patent number: 7656669
    Abstract: A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and/or side-by-side connections.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: February 2, 2010
    Assignee: Mitac International Corp.
    Inventors: Mario J. D. Lee, Tomonori Hirai, Jyh Ming Jong
  • Patent number: 7644250
    Abstract: An orientation detector within a device package is used to establish the device orientation. A host controller coupled to the device supplies a control signal to at least one of the pins on the device during a setup phase. The pin that receives the control signal is used for active signaling during normal operations of the device. Based on the control signal, the orientation detector generates an orientation signal within the device. An analog or digital selector circuit connects the pins to correct internal circuit components according to the device orientation.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: January 5, 2010
    Assignee: Intel Corporation
    Inventors: David J. Zimmerman, Jun Shi, Aaron Martin
  • Patent number: 7482073
    Abstract: A fuel cell installation includes a cascaded fuel cell block, for essentially waste gas-free operation. An installation of this type presents the problem that the cascaded fuel cell block is complex to produce and therefore expensive. To solve this problem, the fuel cell installation has several steps which are arranged in a cascade, each of the steps comprising one or more non-cascaded similar fuel cell blocks. A fuel cell installation construction including modular similar fuel cell blocks is economical and simple to produce in series.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: January 27, 2009
    Assignee: Siemens Aktiengesellschaft
    Inventors: Willi Bette, Detlev Coerlin, Herbert Stenger
  • Patent number: 7453699
    Abstract: A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: November 18, 2008
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hideho Inagawa, Hiroyuki Yamaguchi, Shin'ichi Nishimura, Daishiro Sekijima, Tsunao Hombo, Masafumi Kamei
  • Patent number: 7433201
    Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environments such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: October 7, 2008
    Inventor: Gabe Cherian
  • Patent number: 7405949
    Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: July 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Jun Lee, Joo-Sun Choi, Kyu-Hyoun Kim, Kwang-Soo Park
  • Patent number: 7352587
    Abstract: A power semiconductor module having a carrier plate, on which at least four substrates are arranged, and having a first and a second busbar having two conductive plates is disclosed. The conductive plates are arranged such that they are at a distance from one another and are insulated from one another, for respectively carrying a lower and an upper electrical potential, said busbars each being fitted with outer connecting lugs which lead away from the substrates and inner connecting lugs on the substrate side. Symmetrization of the current during dynamic commutation operations is achieved by correctly selecting the order of the outer connecting lugs of the respective first busbar for a lower potential and of the second busbar for an upper potential in accordance with the order of the inner connecting points of the parallel-connected half-bridge circuits and also of the inner connecting lugs of the first busbar and of the second busbar.
    Type: Grant
    Filed: November 2, 2006
    Date of Patent: April 1, 2008
    Assignee: Infineon Technologies AG
    Inventors: Oliver Schilling, Martin Woelz
  • Publication number: 20080062655
    Abstract: An equipment rack panel system using one or more rack extension panels with optional raceway to interconnect equipment cables to service cables through connectors within the rack extension panel. The rack extension panel is either fastened to or integral with one of the posts of the equipment rack or otherwise adjacent to the equipment rack and extends away from the equipment rack so as not to occupy space within the equipment rack normally reserved for equipment.
    Type: Application
    Filed: September 10, 2007
    Publication date: March 13, 2008
    Applicant: LEVITON MANUFACTURING CO., INC.
    Inventors: Erik Laursen, Jennifer M. Waite, Mark E. Dearing, Keith B. Kosanovich, Mark A. Guymon
  • Patent number: 7333019
    Abstract: An adapter has a cradle portion that can removably receive a radio frequency identification tag. A first electrical connector is positioned in the cradle portion so that, when a tag is removably received in the cradle portion, the first electrical connector electrically couples the adapter to the tag. A second electrical connector is disposed on the adapter at a location spaced from the cradle portion, and the adapter includes structure that electrically couples the first and second electrical connectors.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: February 19, 2008
    Assignee: Savi Technology, Inc.
    Inventors: Timothy R. Redler, Nikola Cargonja, Steven J. Farrell
  • Patent number: 7289326
    Abstract: A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: October 30, 2007
    Assignee: Sun Microsystems, Inc.
    Inventors: Ali Heydari, Ji L. Yang
  • Patent number: 7259683
    Abstract: A rack has a plurality of LEDs arranged on the front surface thereof correspondingly to respective units. The rack is provided with an LED lighting circuit which lights these LEDs, on the back of a display section and an input section. The LED lighting circuit has an LED lighting control section and a memory. The LED lighting control section acquires correspondence relation information indicating correspondence between servers and apparatuses from the input section, and stores the information in the memory. When a server is selected, the LED lighting circuit lights some of the plurality of LEDs based on the correspondence relation information stored in the memory.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: August 21, 2007
    Assignee: NEC Corporation
    Inventor: Takashi Abe