Stacked Patents (Class 361/735)
  • Patent number: 10442550
    Abstract: A layered construction is provided having a storage modulus G?t25 at 25° C., comprising: a) a cured polymeric composite having a storage modulus G?s25 at 25° C.; and b) a cured surfacing film bound thereto; wherein G?t25 is not greatly elevated over G?s25, typically not more than 118% of G?s25. In some embodiments the cured surfacing film comprises an electrically conductive layer, typically a metal layer. In some embodiments the cured surfacing film comprises a cured epoxy resin which may optionally be a chain-extended epoxy resin and may excludes phosphorus. The resulting layered construction may display high erosion resistance, high corrosion resistance, and high resistance to microcracking. In another aspect, methods of making the subject layered constructions are provided.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: October 15, 2019
    Assignee: 3M Innovative Properties Company
    Inventor: Dmitriy Salnikov
  • Patent number: 10418732
    Abstract: A board attaching structure includes a first board on which a first connector provided, a second board on which a second connector provided, a plate-like member extending parallel to the first board and covering at least part of an surface of the first board, a posture restricting portion formed by bending part of the plate-like member toward the first board and configured to restrict a posture of the second board with respect to the first board when the second connector is mounted on the first connector, and a position restricting portion formed by bending part of the plate-like member and configured to restrict a position at which the second board is arranged on the first board while the second connector is mounted on the first connector.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 17, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Naoki Arakawa
  • Patent number: 10064543
    Abstract: An imaging unit includes: a semiconductor package having an image sensor and having a connection electrode on a back side thereof; a circuit board having connection electrodes on front and back sides thereof, the connection electrode on the front side being connected to the connection electrode of the semiconductor package; a deformed circuit board having first, second, and third faces and having connection electrodes on the first, second, and third faces, respectively, a connection electrode on the first face being connected to the connection electrodes of the circuit board; an electronic component mounted on the back side of the circuit board; and cables connected to the connection electrodes on the second and third faces. The electronic component is housed in a recess of the deformed circuit board. The circuit board, the deformed circuit board, and the cables are located within a projection plane in an optical-axis-direction of the semiconductor package.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: September 4, 2018
    Assignee: OLYMPUS CORPORATION
    Inventors: Hiroyuki Motohara, Yasuhiro Kusano
  • Patent number: 9730339
    Abstract: A Common Bus Structure for Avionics and Satellites (CBSAS) (10) as shown in FIG. 1 is comprised of a module lid (14), module floor (38), module stack base (16), module compression bolts (22) and stackable modules (12). Stackable modules (12) are sub-dividable to create module scaled chamber volumes (45) individually as required, while stackable modules (12) simultaneously create at least one collectively continuous raceway sealed chamber volume (44) perpendicular to individual stackable modules (12) in the vertical direction where no module floor (38) is present, in order to internally electrically interconnect the contents of any stackable module (12) with the contents of any other stackable module (12) via internal connector raceway system (24). Raceway sealed chamber volume (44) therefore collectively and continuously traverses all present stackable modules (12) positioned between module lid (14) and module stack base (16).
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: August 8, 2017
    Inventor: Edmund David Burke
  • Patent number: 9673560
    Abstract: A laminated connector (1) includes a plurality of housings (2) in which terminal accommodating chambers (6) for accommodating terminal fittings (4) are arranged side by side in a predetermined direction and is structured such that the housings (2) are laminated. The laminated connector (1) includes at least a first housing (10) and a second housing (20) as the plurality of housings (2). A projection (first projections (14)) of the first housing (10) is inserted into a recess (second recesses (28)) of the second housing (20), arranged over a plurality of the terminal accommodating chambers (6) in the second housing (20) and capable of regulating movements of the respective terminal fittings (4) accommodated in the terminal accommodating chambers (6) at a position, where the projection is arranged, in a pull-out direction.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: June 6, 2017
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Shinji Iihoshi, Toshikazu Sakurai
  • Patent number: 9629266
    Abstract: A mounting device for a display module includes a positioning member and an installation member. The positioning member includes a limiting portion and a positioning piece. The limiting portion defines a first receiving slot. The positioning piece defines a cutout. The installation member is secured to the positioning member and includes an elastically deformable limiting block. The installation member defines a second receiving slot and a limiting slot. A limiting rib is located on the limiting block and in the limiting slot. The first receiving slot and the second receiving slot rotatably receive a rotating shaft of the display module therebetween. The limiting block abuts a connecting shaft connected to the rotating shaft and blocks the connecting shaft in the limiting slot. The cutout is adapted to receive the connecting shaft when the rotating shaft is rotated to rotate the connecting shaft out of the limiting slot.
    Type: Grant
    Filed: March 21, 2013
    Date of Patent: April 18, 2017
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Zhan-Yang Li, Wen-Hu Lu, Po-Wen Chiu
  • Patent number: 9496633
    Abstract: Apparatuses and processes associated with a dual in-line memory module (DIMM) adaptor card. Specifically, the DIMM adaptor card may be configured to removeably couple with a slot of a printed circuit board (PCB). The DIMM adaptor card may further be configured to removeably couple with a first DIMM and a second DIMM. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: November 15, 2016
    Assignee: Intel Corporation
    Inventors: Shaowu Huang, Beom-Taek Lee
  • Patent number: 9490597
    Abstract: A submersible electrical connector that includes a first mating component that has a housing with at least one port that has a cable termination end and an opposite interface end, and the port defines a cavity that supports at least one first contact. A second mating component has a housing with at least one port that has a cable termination end and an opposite interface end configured to engage the interface end of the first mating component, and the port of the second mating component defines a cavity that supports at least one second contact configured to engage the at least one first contact. A rail engagement is disposed on at least one of the first and second mating components for mounting the connector on a DIN rail.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: November 8, 2016
    Assignee: AMPHENOL CORPORATION
    Inventors: Robert Raymond Arcykiewicz, William Joseph Gifford
  • Patent number: 9480161
    Abstract: A low profile strip dual in-line memory module (200) includes a passive interposer support structure (90) with patterned openings (91-97) formed between opposing top and bottom surfaces, a plurality of memory chips (D1-D8) attached to the top and bottom surfaces, and vertical solder ball conductors (98) extending through the patterned openings to electrically connect the plurality of memory chips, where each memory chip has an attachment surface facing the passive interposer structure and a patterned array of horizontal conductors (e.g., 82-86) formed on the attachment surface with contact pads electrically connected to the plurality of vertical conductors to define at least one bus conductor that is electrically connected to each memory die in the first and second plurality of memory die.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: October 25, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Perry H. Pelley, Michael B. McShane, Tim V. Pham
  • Patent number: 9236348
    Abstract: A method of forming a buried die module includes providing an initial laminate flex layer and forming a die opening through the initial laminate flex layer. A first uncut laminate flex layer is secured to the first surface of the initial laminate flex layer by way of an adhesive material and a die is positioned within the die opening of the initial laminate flex layer and onto the adhesive material. A second uncut laminate flex layer is secured to the second surface of the initial laminate flex layer by way of an adhesive material and the adhesive materials are then cured. Vias and metal interconnects are formed in and on the first and second uncut laminate flex layers, with each of the metal interconnects extending through a respective via and being directly metalized to a metal interconnect on the initial laminate flex layer or a die pad on the die.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: January 12, 2016
    Assignee: General Electric Company
    Inventors: Paul Alan McConnelee, Scott Smith, Elizabeth Ann Burke
  • Patent number: 9220180
    Abstract: The present invention provides an apparatus and/or method for modular, scalable and nestable parallel data processing and process control systems from molecular to module/enclosure level, comprised of calculable inter- and intra-modular processing time standards and shorter look-a-head propagation paths; based on regular and irregular hexagonal and dodecagonal prisms, derivative dumbbells and variants as actual and/or approximated tilings/tessellations which may be arranged in columns, rows, stacks and arrays with or without rounding and/or a sliding fit. Non-sliding fit systems are fundamentally solid. Sliding fit systems modules have a central cavity with systems as follows: cage assembly, optional patch panels, anchoring, thermal management, interconnect enclosures, power, hot swap, fail over, positioning, and interconnects with optional quick disconnects and retractors.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: December 22, 2015
    Inventor: Richard Anthony Dunn, Jr.
  • Patent number: 9190391
    Abstract: An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and the conductive pillar extends through the overmold.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: November 17, 2015
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Amit Subhash Kelkar, Karthik Thambidurai, Viren Khandekar, Hien D. Nguyen
  • Publication number: 20150138732
    Abstract: A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 21, 2015
    Inventors: Keiji Okumura, Takukazu Otsuka, Masao Saito
  • Patent number: 9036360
    Abstract: A power casing apparatus of an image display module includes a display panel configured to have a Light-Emitting Diode module disposed in a front thereof; a bus bar unit installed in the rear of the display panel and configured to supply driving power to the LED module and to have a pair of electrode blades disposed on one side thereof; and a power casing unit disposed in the bus bar unit in such a way as to be attached to or detached from the bus bar unit and configured to supply the driving power to the bus bar unit and to have a pair of power supply connectors disposed at positions corresponding to the respective electrode blades on one side.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: May 19, 2015
    Assignee: EVERBRIGHTEN CO., LTD.
    Inventor: Yong Min Kim
  • Patent number: 9019709
    Abstract: A protection circuit board is disclosed. The protection circuit board includes a main printed circuit board and an auxiliary printed circuit board. In the auxiliary printed circuit board, a thermistor is electrically interposed between an external electrode terminal and auxiliary electrodes.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: April 28, 2015
    Assignee: Samsung SDI Co., Ltd.
    Inventor: Young-Cheol Jang
  • Patent number: 9007776
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: April 14, 2015
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 8953329
    Abstract: A server chassis bracket (SCB), including: a first set of holes configured to secure a first set of grommets gripping a first server component; a second set of holes configured to secure a second set of grommets gripping a second server component; a first shared guide configured to: guide a first grommet of the first set of grommets towards a first hole of the first set of holes; and guide a second grommet of the second set of grommets towards a second hole of the second set of holes; and a latch covering a portion of the first shared guide, including a tail, and configured to: generate a first audio verification of a successful installation of the first server component into the server chassis bracket; and generate a second audio verification of a successful installation of the second server component into the server chassis bracket.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: February 10, 2015
    Assignee: Twitter, Inc.
    Inventor: Ali Heydari
  • Patent number: 8941999
    Abstract: A microelectronic assembly includes a dielectric element that has oppositely-facing first and second surfaces and first and second apertures extending between the surfaces. The dielectric element further includes conductive elements. First and second microelectronic elements are stacked one on top of the another. The second microelectronic element has a plurality of contacts at a surface, which is spaced from the first surface of the dielectric element. Leads extend from contacts of the first and second microelectronic elements through respective apertures to at least some of the conductive elements. A heat spreader is thermally coupled to at least one of the first microelectronic element or the second microelectronic element.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: January 27, 2015
    Assignee: Tessera, Inc.
    Inventors: Belgacem Haba, Wael Zohni, Richard Dewitt Crisp
  • Patent number: 8929084
    Abstract: A compact radio core engine (CE) module uniquely small in size and power consumption, in which only two circuit boards provide all the modem and transceiver functions needed for modern military radios. A modem circuit board has modem devices and a first connector mounted on the board, and a radio frequency (RF) circuit board has RF devices and a second connector mounted on the board. A module frame has an interior wall, and a side wall about the periphery of the interior wall. The modem and the RF circuit boards are positioned on opposite sides of the interior wall, and the connectors on the two boards mate with one another through an opening in the interior wall to exchange operating data and signals between the devices on the boards. The modem circuit board is seated entirely within a recess formed by the interior and the side walls of the frame.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: January 6, 2015
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Michael S. Vogas, Boris Radovcic, Todd R. DeLuck, George M. Horihan, Minh Le, Kenneth E. Kolodziej
  • Patent number: 8929082
    Abstract: A module carrier unit comprises a plurality of passenger interface modules that perform different functions, the functions including at least one of inputting and outputting information, the modules having a common size, shape, and interface; an outer case portion comprising a plurality of receptacles, each having a common size, shape, and interface designed to receive one of the modules, the plurality of receptacles being such that a first module having a first function is operable in a first receptacle, and a second module having a second function is operable in the first receptacle, the modules being removably connected to the receptacles; and a communications interface that performs at least one of transmitting and receiving data to and from a processor located near a seat of a passenger in the vehicle.
    Type: Grant
    Filed: May 17, 2011
    Date of Patent: January 6, 2015
    Assignees: Thales Avionics, Inc., Phitek Systems, Ltd.
    Inventors: Christopher K. Mondragon, Nigel Greig, Edward Scholten, Roy Moody, Paul Simmonds, Elaine Clarke, Thomas Allen Darbonne
  • Patent number: 8922972
    Abstract: An integral solar module power conditioning system includes one or more solar module support frames. Each frame includes a plurality of plug-and-play electrical connectors integrated therewith. A microinverter or microinverter connector is also integrated with each frame. Each frame is configured to receive a respective solar electric module and to carry electrical power through a plurality of solar electric modules and corresponding microinverters connected together via a plurality of solar module support frames connected together via the plurality of integrated plug-and-play electrical connectors.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: December 30, 2014
    Assignee: General Electric Company
    Inventors: Charles Steven Korman, Neil Anthony Johnson, Michael Andrew de Rooij
  • Patent number: 8923776
    Abstract: A system and method for connecting an external RF connector on an electrical module housing to a PCB within an electronic module is presented. The electronic module is configured to operate within a Department of Defense Joint Tactical Radio System in altitudes up to 15000 feet, at operating temperatures between ?40 to +55 degrees Celsius, in driving rain and dust storms, in a corrosive salt-sea atmosphere and to withstand indirect shock. The electronic module comprises a module housing, a housing connector on an external wall of the housing, a PCB within the housing, a PCB connector for a coaxial cable mounted on the PCB and a coaxial cable with first and second ends that is looped 360 degrees between the housing connector and the PCB connector. The first end of the cable is connected to the housing connector and the second end is connected to the PCB connector.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: December 30, 2014
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Eric G. Nelson
  • Patent number: 8916963
    Abstract: The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: December 23, 2014
    Assignee: Valeo Etudes Electroniques
    Inventors: Jean-Michel Morelle, Ky Lim Tan, Laurent Vivet, Sandra Dimelli, Stéphane Thomelin, Hervé Lorin, Patrick Dubus
  • Publication number: 20140355221
    Abstract: A power converter is equipped with a semiconductor module stack, a positive bus bar stack, and a negative bus bar stack. The positive bus bar stack has a first positive bus bar and a second positive bus bar stacked. The negative bus bar stack also has a first negative bus bar and a second negative bus bar stacked in a stacking direction Z of the positive bus bar stack. The first semiconductor modules of the semiconductor module stack are connected to the first positive bus bar and the first negative bus bar, while the second semiconductor modules of the semiconductor module stack are connected to the second positive bus bar and the second negative bus bar. This results in a decreased variation in mutual inductance among the semiconductor modules, which leads to a decrease in overall inductance of the power converter.
    Type: Application
    Filed: May 29, 2014
    Publication date: December 4, 2014
    Applicant: DENSO CORPORATION
    Inventors: Hiroyoshi SAWADA, Makoto Okamura
  • Patent number: 8901730
    Abstract: Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device is formed by connecting a top package and a bottom package together using a plurality of PoP connectors on the bottom package connected to corresponding connectors of the top package. The PoP device further comprises a plurality of dummy connectors contained in the bottom package and not connected to any corresponding connector in the top package.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: December 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Kai Liu, Shih-Wei Liang, Hsien-Wei Chen, Kai-Chiang Wu
  • Patent number: 8902598
    Abstract: A programmable logic controller (PLC) assembly includes a bottom housing with a base, a first plurality of elongate alignment features extending from the bottom housing transverse to the base, and a first connection feature. The PLC assembly includes a central processing unit with a circuit board and at least two receptacles therethrough configured to engage and slide along at least two of the first plurality of alignment features. The at least two of the first plurality of alignment features are positioned asymmetrically with respect to the base. The PLC assembly includes an upper housing with a second connection feature configured to slidably couple with the first connection feature and a second plurality of elongate alignment features configured to slidably engage at least two of the first plurality of alignment features, which are positioned asymmetrically with respect to the base.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: December 2, 2014
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Karen Chin, Chee Lim Wong
  • Patent number: 8902607
    Abstract: A testing apparatus and method of extending the life of a testing apparatus may comprise a chassis including a case having a testing module receptacle receiving a plurality of testing modules comprising at least one processor module and a plurality of test modules, each having the same physical footprint, including respective racking mechanisms and inter-module interface connectors; and a backplane with connectors connecting with a respective inter-module connector, and bus-work interconnecting the respective modules through the inter-module interface connectors and the backplane connectors. The backplane may comprise a battery and display connector. The chassis may comprise a display mounting receptacle configured to receive a display unit having a display connector configured to interface with the backplane display connector. A battery receptacle may receive a battery unit, such as a rechargeable battery.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: December 2, 2014
    Assignee: VeEX Inc.
    Inventors: Paul Ker Chin Chang, Cyrille Morelle
  • Patent number: 8879241
    Abstract: A server rack configured for a plurality of servers is disclosed, in which each of the servers has a power supply circuit board. The server rack includes: a case having a first face and a second face opposed to each other, the first face having an opening for the servers to be arranged in the case in an orientation; a power supply module provided on the second face of the case; and a power transmission assembly composed of a busbar provided on the second face in the orientation and electrically connected to the power supply module; and a plurality of electrical connectors provided on the busbar and coupled respectively with the power supply circuit boards of the servers. Through the power transmission assembly, the servers may be powered in a centralized way by the power supply module.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: November 4, 2014
    Assignee: Giga-Byte Technology Co., Ltd.
    Inventors: Tung-Ke Lu, Chin-Han Tsai
  • Patent number: 8872324
    Abstract: Some embodiments include a device having a number of memory cells and associated circuitry for accessing the memory cells. The memory cells of the device may be formed in one or more memory cell dice. The associated circuitry of the device may also be formed in one or more dice, optionally separated from the memory cell dice.
    Type: Grant
    Filed: May 14, 2014
    Date of Patent: October 28, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Paul A. Farrar, Hussein I Hanafi
  • Patent number: 8867231
    Abstract: An electronic module package that includes an electronic module configured to receive input signals and process the input signals to provide output signals. The module package also includes an interposer having a board substrate with opposite mounting and substrate surfaces. The mounting surface has a mounting array of electrical contacts. The substrate surface has a module array of electrical contacts and a component array of electrical contacts. The electronic module is attached to the substrate surface and electrically coupled to the module array. The interposer includes first conductive pathways that electrically couple the module array and the mounting array and also includes second conductive pathways that electrically couple the module array and the component array.
    Type: Grant
    Filed: January 13, 2012
    Date of Patent: October 21, 2014
    Assignee: Tyco Electronics Corporation
    Inventors: Lee Jacobo Jose Roitberg, Terry R. Billger
  • Patent number: 8837155
    Abstract: A mobile terminal includes a first body and a second body, a first display unit mounted to the first body, and a slide module configured to move the first body and the second body with respect to each other. Further, the slide module includes a first slide member coupled to the first body, and a second slide member having a first bending portion and a second bending portion extending from a side end thereof in directions crossing each other, and configured to encompass at least part of side surfaces of the first slide member. In addition, the first bending portion and the second bending portion are spaced from at least one side surface of the first display unit with a predetermined gap from the side surface of the first display unit.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: September 16, 2014
    Assignee: LG Electronics Inc.
    Inventors: Kyoungjoon Park, Jinsoo Jeong, Daewon Yoo
  • Patent number: 8792244
    Abstract: A power converter equipped with a semiconductor stack made up of semiconductor modules, bus bars coupled to power terminals of the semiconductor modules, a capacitor, and an input terminal table. The capacitor is disposed in alignment with a first direction in which the semiconductor modules are stacked. The capacitor has a first end and a second end opposed to the first end in a second direction in which the power terminals extend from the semiconductor modules. The first end faces in the second direction. The input terminal table is located near the second end of the capacitor. This structure permits the power converter to be reduced in size and produced at a decreased cost.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: July 29, 2014
    Assignee: Denso Corporation
    Inventor: Wataru Funatsu
  • Patent number: 8791558
    Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.
    Type: Grant
    Filed: December 29, 2010
    Date of Patent: July 29, 2014
    Assignee: SK Hynix Inc.
    Inventors: Jin Ho Bae, Ki Young Kim, Jong Hyun Nam
  • Publication number: 20140168908
    Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: HTC CORPORATION
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Chih-Hung Li, Cheng-Te Chen
  • Patent number: 8749990
    Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: June 10, 2014
    Inventors: Sun-Wen Cyrus Cheng, Carl Milton Wildrick, Jeffrey John Boylan
  • Patent number: 8742576
    Abstract: An MCM includes a two-dimensional array of facing chips, including island chips and bridge chips that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures are in cavities in a substrate, which house the bridge chips, provide a compressive force on back surfaces of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: June 3, 2014
    Assignee: Oracle International Corporation
    Inventors: Hiren D. Thacker, Hyung Suk Yang, Ivan Shubin, John E. Cunningham
  • Patent number: 8729691
    Abstract: Some embodiments include a device having a number of memory cells and associated circuitry for accessing the memory cells. The memory cells of the device may be formed in one or more memory cell dice. The associated circuitry of the device may also be formed in one or more dice, optionally separated from the memory cell dice.
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: May 20, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Paul D. Farrar, Hussein I Hanafi
  • Patent number: 8717773
    Abstract: A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.
    Type: Grant
    Filed: March 4, 2011
    Date of Patent: May 6, 2014
    Assignee: General Electric Company
    Inventor: Daniel Z. Abawi
  • Patent number: 8686572
    Abstract: A multi-chip stack module provides increased circuit density for a given surface chip footprint. Support structures are alternated with standard surface mount type chips to form a stack wherein the support structures electrically interconnect the chips. One aspect is a structure and method for interconnecting a plurality of generally planar chips in a vertical stack such that signals, which are common to the chips, are connected in the stack and signals, which are accessed individually, are separated within the stack.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: April 1, 2014
    Assignee: STEC, Inc.
    Inventor: Mark Moshayedi
  • Publication number: 20140078686
    Abstract: A stackable communications apparatus comprises modules to be powered on in a sequence. Each of the modules comprises components that perform an individual function or group of functions of the apparatus, each module in the plurality of modules comprising an individual chassis stackable with at least another individual chassis of at least another module in the plurality of modules. The modules comprise at least two modules establishing surface contacts by stacking. The surface contacts maintain, without physical cabling, power connection between the at least two modules. A preceding module in the sequence determines, via a power controller in communication with a power controller of a next module, a power requirement of the next module. The power controller of the preceding module in the sequence enables power to the next module if a remaining power from the preceding module is greater than the power requirements of the next module.
    Type: Application
    Filed: November 19, 2013
    Publication date: March 20, 2014
    Applicant: TiVo Inc.
    Inventors: David A. Lockett, Kurtis G. Heaton
  • Patent number: 8665599
    Abstract: A portable external power-supplying device is disclosed. The portable external power-supplying device implements a unique mechanism to detachably assemble battery units whose number can be adjusted according to user needs, which means the overall aggregate capacity of the portable external power-supplying device is adjustable. The portable external power-supplying device is adaptive to connect and charge a portable electronic device.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: March 4, 2014
    Assignee: Hugee Technology Co., Ltd.
    Inventors: Hung-Pin Shen, Lung-Hua Wu, Yen-Ling Chen
  • Publication number: 20140036454
    Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.
    Type: Application
    Filed: March 12, 2013
    Publication date: February 6, 2014
    Applicant: INVENSAS CORPORATION
    Inventors: Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi, Reynaldo Co, Ellis Chau, Belgacem Haba
  • Patent number: 8643175
    Abstract: A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n?2) and controls the at least one multi-channel package.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: February 4, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kil-Soo Kim, Sun-Pil Youn
  • Publication number: 20140009894
    Abstract: A communication device having multi-module assembly is provided. The communication device includes a body, a first communication module and a second communication module. The body has a front side, a rear side and a plurality of lateral sides. The front side and the rear side both have a length dimension and a width dimension, and the lateral sides have a thickness dimension. The body is a combination of a plurality of housings with the same length dimension and the same width dimension, and the rear side of a housing ahead is connected with the front side of another housing behind. The first communication module is disposed in a first housing of the body. The second communication module is disposed in a second housing of the body.
    Type: Application
    Filed: April 25, 2013
    Publication date: January 9, 2014
    Applicant: Sercomm Corporation
    Inventor: Sercomm Corporation
  • Patent number: 8597032
    Abstract: A system to mate electronic assemblies includes a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system also includes a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time.
    Type: Grant
    Filed: February 26, 2011
    Date of Patent: December 3, 2013
    Assignee: International Business Machines Corporation
    Inventors: William L. Brodsky, Eric J. McKeever, John G. Torok
  • Patent number: 8599568
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: December 3, 2013
    Assignee: Delphi Technologies, Inc.
    Inventors: Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Jeffrey T. Bell, Robert L. Vadas, Donald G. Moeschberger, Rick L. Hatcher, Quan N. Nguyen
  • Publication number: 20130314865
    Abstract: A power supply apparatus includes a first electronic device, a second electronic device, and plural power modules. The first electronic device includes a first compartment. The first compartment has a first width. The second electronic device includes a second compartment. The second compartment has a second width. Each of the power modules has a third width. The third width is determined according to the first width and the second width, so that a specified number of power modules are selectively accommodated within the first compartment or the second compartment.
    Type: Application
    Filed: June 14, 2012
    Publication date: November 28, 2013
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Shih-Chang Chuang, Yu-Hung Huang, Hsin-Chung Niu, Wang-Lung Lin
  • Patent number: 8582313
    Abstract: A motherboard assembly includes a motherboard with a memory slot, an adapter board, and a serial advanced technology attachment dual-in-line memory module (SATA DIMM) with a circuit board and a connector. An edge connector is set on a bottom edge of the circuit board. The adapter board includes a SATA interface, a hard disk drive (HDD) signal multiplier, a power interface, and an expansion SATA interface. The edge connector is connected to the memory slot and the connector is connected to the expansion SATA interface, to enable the motherboard communication with SATA DIMM modules, which are connected to the memory slots.
    Type: Grant
    Filed: August 25, 2011
    Date of Patent: November 12, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Kang Wu, Bo Tian
  • Patent number: 8576570
    Abstract: The adaptive computing system described herein may generally include a modular control, switching, and power supply architecture. In particular, the adaptive computing system may provide a platform supporting multiple independent desktop computer modules that occupy less physical space than a standalone commercial computer, provide performance density comparable to current server solutions, and address concerns relating to stability, safety, productivity, performance, assembly, service, and other factors important to diverse desktop computer user communities. Moreover, mechanical, electrical, and functional components associated with the adaptive computing system may have various certifications or otherwise be relied upon to demonstrate compliance with criteria in regulatory, environmental, consumer safety, and other contexts.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: November 5, 2013
    Assignee: NCS Technologies, Inc.
    Inventors: An Van Nguyen, M. Dewayne Adams, Nesdon Alexandre′ Harris, Dinh Van Nguyen, Binh Kien Thai
  • Patent number: 8549737
    Abstract: The present invention relates to a compliant leaded interposer for resiliently attaching and electrically connecting a ball grid array package to a circuit board. The interposer may include a substrate, a plurality of pads, and a plurality of pins. The plurality of pads may be positioned substantially on the top surface of the substrate and arranged in a predetermined pattern substantially corresponding to the solder ball pattern on the ball grid array package. The plurality of pins may be positioned substantially perpendicular to the substrate and may extend through the substrate and the plurality of pads. The interposer may be configured to attach the ball grid array package to the circuit board such that each of the solder balls on the ball grid array package contacts at least a portion the plurality of pins and at least a portion of the plurality of pads and such that the each of the plurality of pins also connects to a contact on the circuit board.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: October 8, 2013
    Assignee: General Dynamics Advanced Information Systems, Inc.
    Inventor: Deepak K. Pai