Ic Card Or Card Member Patents (Class 361/737)
  • Patent number: 10784634
    Abstract: The application is directed to various connector and sensor assemblies. In some embodiments, the connector and sensor assembly comprises a connector and a sensor assembly. The connector can have an opening that has a first surface and second surface that are opposite each other. The connector can have a plurality of retractable electrical connectors that extend from the first surface and a lock structure that is located on the second surface. The sensor assembly is comprised of a body portion and a proximal end. The proximal end has a top side and a bottom side. The top side includes a plurality of electrical contacts that is configured to interact with the plurality of retractable electrical connectors. The bottom side includes a key structure that is configured to interact with the lock structure in the connector.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: September 22, 2020
    Assignee: Masimo Corporation
    Inventors: Stephen Scruggs, Ammar Al-Ali, John Schmidt, Yassir Kamel Abdul-Hafiz, Benjamin C. Triman, William Jack MacNeish, III
  • Patent number: 10740670
    Abstract: The invention relates to a method for fabricating chip cards. According to this method, an antenna and a chip card module are provided. This chip card module includes a dielectric substrate and conducting tracks at least on a face of this substrate. A connection unit is used to establish a connection between the antenna and conducting tracks of the module. The invention also relates to a method for fabricating an antenna support including such a connection unit. The invention also relates to a chip card and an antenna support which are obtained by the aforementioned methods.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 11, 2020
    Assignee: Linxens Holding
    Inventors: Cyril Proye, Valerie Mousque, Christophe Paul
  • Patent number: 10726321
    Abstract: A method of manufacturing a smartcard may include providing a flexible smartcard circuit, forming conductive extension members on and extend away from the flexible circuit from a high melting point solder material, and laminating the flexible circuit to form a smartcard body. A cavity is then milled in the smartcard body to expose the ends of the extension members, and a contact pad is inserted into the cavity and electrically connected to extension members using a low melting temperature tin-bismuth solder using ultrasonically soldering, so as to avoid heat damage to the card body.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: July 28, 2020
    Assignee: Zwipe AS
    Inventors: Devin Snell, Jose Ignacio Wintergerst Lavin
  • Patent number: 10716233
    Abstract: According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: July 14, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Zheila N. Madanipour, Vincent W. Michna, Patrick Raymond, John Franz
  • Patent number: 10709029
    Abstract: A plug-in device may include a circuit board, a first connecting piece stacked on the circuit board and a card tray stacked on the first connecting piece. The card tray may include a first mounting face facing the first connecting piece and a second mounting face away from the first connecting piece. The first mounting face may be configured to place a first chip card electrically connected to the circuit board through the first connecting piece. The second mounting face may be configured to place a second chip card electrically connected to the circuit board. A projection of the first mounting face along a direction perpendicular to the first mounting face may overlap that of the second mounting face. A terminal may include the above mentioned plug-in device.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: July 7, 2020
    Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventor: Hanjie Huang
  • Patent number: 10582632
    Abstract: The present disclosure provides a board unit including: a circuit board; a connector portion that is mounted on the circuit board; and a case that houses the circuit board. The case includes: a lower case that has an upper opening; an upper cover that covers the upper opening of the lower case; and an opening portion that is formed in a side wall of the case so as to allow the connector portion to be fitted to a mating connector portion. The side wall includes: a step surface that extends outward from a lower region of the opening portion; and a plurality of vertical groove portions whose first ends are connected to the step surface and whose second ends are connected to a lower edge of the side wall.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: March 3, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Koki Uchida, Jun Ikeda
  • Patent number: 10564679
    Abstract: An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: February 18, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Youn Hong, Jong In Ryu, Seung Hyun Hong, Jang Hyun Kim
  • Patent number: 10561032
    Abstract: A printed circuit board accommodation casing includes: a support surface that abuts on a first planar portion of a printed circuit board; a side wall portion located outside in a planar direction of the printed circuit board, the first planar portion of which is abutted by the support surface; and an engagement protrusion formed on the side wall portion, in which a crushing margin, which is crushed against the first planar portion of the printed circuit board, is set on the engagement protrusion at a location where the support surface does not abut on the first planar portion of the printed circuit board.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: February 11, 2020
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Akitsugu Funahashi, Takeshi Tsuriki, Takahiro Suga
  • Patent number: 10504821
    Abstract: A TSV structure includes a substrate comprising at least a TSV opening formed therein, a conductive layer disposed in the TSV opening, and a bi-layered liner disposed in between the substrate and the conductive layer. More important, the bi-layered liner includes a first liner and a second liner, and a Young's modulus of the first liner is different from a Young's modulus of the second liner.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: December 10, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chu-Fu Lin, Ming-Tse Lin, Kuei-Sheng Wu
  • Patent number: 10497673
    Abstract: Systems and methods of interconnecting electrical devices are provided. In one exemplary embodiment, an arrangement of interconnected electrical devices may include one or more first electrical devices with a first data flow and one or more second electrical devices with a second data flow. Further, the first electrical devices may be mirrored versions of the second electrical devices. Also, the first data flow may be substantially opposite to the second data flow.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: December 3, 2019
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventor: Mikael Lostedt
  • Patent number: 10474192
    Abstract: A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: November 12, 2019
    Inventors: Young Hee Song, Hyouk Lee, Ki Hong Song, Jun Hee Jeong
  • Patent number: 10461485
    Abstract: An electronic device lacking an internal power supply comprises electronic circuitry, an external power adapter having an input connector for receiving AC power from a conventional AC power outlet and for providing a low-voltage output signal to an output connector, and a first port electronically coupled to the electronic circuitry for receiving the low-voltage output signal from the output connector of the power adapter and for providing the low-voltage output signal to the electronic circuitry.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: October 29, 2019
    Assignee: Ecolink Intelligent Technology, Inc.
    Inventors: Michael Lamb, Michael Bailey, Carlos Q. Petrucci
  • Patent number: 10275699
    Abstract: A method for manufacturing a smart card includes: planting a solder ball on the secure chip solder pad of the main circuit board; according to the position of the secure chip solder pad on the main circuit board, milling out a groove on the substrate on which the main circuit board is packed, such that the solder ball on the secure chip solder pad is visible at the bottom of the groove; packing the secure chip module into the groove, and by use of the solder ball on the secure chip solder pad, mounting the secure chip module onto the main circuit board. The method is capable of improving the quality of the wiring of the main circuit board; and increasing the scalability of the smart card.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 30, 2019
    Assignee: Feitian Technologies Co., Ltd.
    Inventors: Zhou Lu, Huazhang Yu
  • Patent number: 10249422
    Abstract: The present invention relates to a front-maintained multilayer magnetic-attaching LED display screen with small pitch. The structure of the present invention includes a planar array driving board containing light emitting diodes, pads having fixed interval are arranged around the planar array driving board, and the planar array driving board is fixedly connected to a first mounting board of a central fixed iron board to form a module. The module and the second mounting board are magnetically attached to form an outer layer magnetic-attaching structure, and the second mounting board are magnetically attached to the box or mounting member to form an inner layer magnetic-attaching structure; the magnetic force of the outer layer magnetic-attaching is smaller than that of the inner layer magnetic-attaching structure; a module assembly including at least two modules is magnetically attached by the box body or the mounting member.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: April 2, 2019
    Assignee: NANJING LUOPU TECHNOLOGY CO., LTD
    Inventors: Bin Zhu, Jorge Perez Bravo
  • Patent number: 10218138
    Abstract: An electronic device lacking an internal power supply comprises electronic circuitry, an external power adapter having an input connector for receiving AC power from a conventional AC power outlet and for providing a low-voltage output signal to an output connector, and a first port electronically coupled to the electronic circuitry for receiving the low-voltage output signal from the output connector of the power adapter and for providing the low-voltage output signal to the electronic circuitry.
    Type: Grant
    Filed: November 14, 2012
    Date of Patent: February 26, 2019
    Assignee: Ecolink Intelligent Technology, Inc.
    Inventors: Michael Lamb, Michael Bailey, Carlos Q. Petrucci
  • Patent number: 10197755
    Abstract: A fiber optic transceiver FPGA mezzanine card (FMC) is capable of operating in radiation environments. The fiber optic transceiver FMC may be used with radiation-hardened and non-hardened FPGAs. The FMC may enable high speed serial communications, such as gigabit Ethernet, PCI express, serial rapid IO, and/or other high speed serial protocols over the fiber.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: February 5, 2019
    Assignee: Triad National Security, LLC
    Inventors: Robert Merl, Paul Graham, Nikolai Mondragon
  • Patent number: 10103501
    Abstract: An electrical connector includes an insulative housing, a plurality of conductive terminals retained in the insulative housing and two grounding members. The insulative housing defines an upper sidewall, a lower sidewall and two end walls connected to both ends of the upper and lower sidewalls to form a mating cavity. Each grounding member defines a body portion fixed to the insulative housing and a plurality of contacting arms extending forward from the body portion. Each contacting arm defines a pair of wing portions located on both sides thereof, and the upper and lower sidewalls define a plurality of channels and a plurality of receiving slots. The wing portions are abutted against the bottom surfaces of the receiving slots to form a pre-pressure to the contacting arms.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: October 16, 2018
    Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jun Lin, Jian-Kuang Zhu, Zhi-Jian Chen
  • Patent number: 10003679
    Abstract: A mobile phone is provided, which includes a metal bezel having a left bezel portion and a right bezel portion and covering at least one part of an outer circumferential edge of a main body of the mobile phone, wherein upper and lower corner bezel portions of the left and right bezel portion are formed to be thicker outwardly in comparison with a middle portion of the left and right bezel portions.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: June 19, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Yong-Seok Lee, Jin-A Mock, Soon-Woong Yang, Seung-Hoon Lee, Min-Su Jung, Hong-Moon Chun, Kun-Chan Seo
  • Patent number: 9990577
    Abstract: Provided is a card with a built-in electronic component, which has a superior button click sensation. A card of the present invention into which is built-in a module substrate upon which an electronic component has been disposed is provided with: a front cover sheet stacked upon a side above the module substrate; an adhesion layer adhering between the module substrate and the front cover sheet; and a dome switch which is disposed upon the module substrate, and by way of the card upper surface being pressed, the switch's movable portion deforms to the module substrate side so that the electrical contact comes into tactile contact with the module substrate in order to operate the card; wherein the switch's movable portion is such that the upper surface does not adhere to the adhesion layer and the deformation to the module substrate side is unrestrained with respect to the adhesion layer.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: June 5, 2018
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Jintaro Tatsu
  • Patent number: 9927846
    Abstract: A flash drive structure includes an insulated base including an upper end, a first slot formed near the upper end, a lower end, two inclined guiding surfaces, a receiving space connected to the inclined guiding surfaces, a limiting tab disposed in the receiving space and two latches disposed on the two guiding inclined surfaces respectively; a circuit board including a surface, on which circuits and modules are mounted, and an extending portion, on which a plurality of interface elements are disposed, wherein the extending portion corresponds to the receiving space, the circuit board is mounted on a lateral surface of the insulated base through the extending portion positioned in the receiving space by the limiting tab; and a case having a hollow structure, housing the assembled insulated base and circuit board, wherein the case includes two notches configured to engage the latches.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: March 27, 2018
    Assignee: HOEY CO., LTD.
    Inventor: Joseph Huang
  • Patent number: 9812808
    Abstract: Described herein is a molded printed circuit board. The printed circuit board may be placed inside of a mold and a material is injected therein. The material hardens in the mold around the printed circuit board thereby forming an overmolded printed circuit board. The overmolded material may have apertures in it to allow access to the leads on the printed circuit board so that components to be connected to it. The overmolded printed circuit boards may allow a plurality of electrical components to selectively and removably attach to it. Further, the printed circuit board may be attached in a housing which may itself removably and selectively connect to components.
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: November 7, 2017
    Assignee: Psion, Inc.
    Inventors: Bo Xu, Yanmin Mao
  • Patent number: 9799598
    Abstract: Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face, covered with a first layer of electrically conductive material and intended to be linked to a radio antenna, and a core made from an electrically insulating material separating the first face from the second face. This method includes steps of drilling at least one through hole through the plate, depositing a layer of electrically conductive material on the first face and chemically etching a first electric circuit and a second electric circuit on the first face and the second face respectively. Prior to the chemical etching step, a step of depositing a third layer of electrically conductive material in the hole or holes, which covers the electrically insulating material in the corresponding hole or holes.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: October 24, 2017
    Assignee: Linxens Holding
    Inventor: Eric Eymard
  • Patent number: 9768569
    Abstract: This document describes a bracket assembly for reinforcing connectors on printed circuit boards. In some aspects, an apparatus is described that includes a device chassis with a stopper feature, a printed circuit board (PCB) attached to the device chassis, and an extended connector assembly mounted to the PCB. The extended connector assembly includes a connector and a connector reinforcing bracket. The connector reinforcing bracket increases a length of the connector to reduce the magnitude of a bending moment induced in the PCB by a connector insertion force. The connector reinforcing bracket also limits deformation of the PCB caused by the connector insertion force.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: September 19, 2017
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Le Chang
  • Patent number: 9721402
    Abstract: Apparatuses are provided for performing physical access control using various types of encoding technologies by removably incorporating modular encoder subassemblies. An access control apparatus includes access control electronics and at least one docking bay or slot for removably housing at least one modular encoder unit. The encoder unit can be removably house in the docking bay or slot of the access control apparatus and be removably linked, communicatively and/or physically, to the access control electronics when housed in the access control apparatus, and can interface with and write or read information to or from a credential. When removably housed in the docking bay or slot, the encoder unit can receive identity data from the access control electronics and bind the identity data to the credential.
    Type: Grant
    Filed: August 14, 2013
    Date of Patent: August 1, 2017
    Assignees: UTC FIRE & SECURITY CORPORATION, ONITY, INC.
    Inventors: Levent Gosterisli, Craig Bonnett, Alberto Vecchiotti, Dennis Bailey
  • Patent number: 9699913
    Abstract: Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device having at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method includes the following steps: creating the interconnecting wire by depositing individual wires on the substrate in a predefined interconnecting pattern, the wire comprising at least one terminal connection portion which is exposed on the substrate, bringing at least one contact of a component to face the terminal portion and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: July 4, 2017
    Assignee: GEMALTO SA
    Inventors: Frederick Seban, Jean-Christophe Fidalgo
  • Patent number: 9699279
    Abstract: A mobile phone is provided, which includes a metal bezel having a left bezel portion and a right bezel portion and covering at least one part of an outer circumferential edge of a main body of the mobile phone, wherein upper and lower corner bezel portions of the left and right bezel portion are formed to be thicker outwardly in comparison with a middle portion of the left and right bezel portions.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: July 4, 2017
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Yong-Seok Lee, Jin-A Mock, Soon-Woong Yang, Seung-Hoon Lee, Min-Su Jung, Hong-Moon Chun, Kun-Chan Seo
  • Patent number: 9653370
    Abstract: Embodiments relate to active devices embedded within printed circuit boards (PCBs). In embodiments, the active devices can comprise at least one die, such as a semiconductor die, and coupling elements for mechanically and electrically coupling the active device with one or more layers of the PCB in which the device is embedded. Embodiments thereby provide easy embedding of active devices in PCBs and inexpensive integration with existing PCB technologies and processes.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: May 16, 2017
    Assignee: Infineon Technologies Austria AG
    Inventors: Martin Standing, Andrew Roberts
  • Patent number: 9647359
    Abstract: An electronic device that accommodates a plurality of cards is provided. The electronic device includes a first contact area connected to a first card among the plurality of cards and a second contact area selectively connected to one of a second card or a third card among the plurality of cards.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: May 9, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung Cho, Yong Sang Yun, John Gy Lee, Beom Ju Kim
  • Patent number: 9569702
    Abstract: A card reader may include a card insertion part which is formed with an insertion port for the card; and a conveying passage for the card which is connected with the insertion port. The card insertion part may include a shutter member disposed on a rear side with respect to the insertion port is movable between a closed position an open position; and a protruding member which is attached to the shutter member and is protruded from the shutter member to an insertion port side. An insertion port side of the protruding member may be formed with a card abutting face. A distance between the insertion port and the card abutting face in a conveying direction of the card may be set to be shorter than a width in the short widthwise direction of the card.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: February 14, 2017
    Assignee: NIDEC SANKYO CORPORATION
    Inventors: Kazutoshi Ishikawa, Kazunori Takahashi, Jo Tanaka
  • Patent number: 9520663
    Abstract: A connector for fixing and electrically connecting a flat cable includes a base body and a first inspection window. The base body includes a bottom part and a top part which are opposite to each other. The bottom part and the top part together form a flat-cable slot and an inserting opening. The flat-cable slot and the inserting opening are communicated with each other. The first inspection window extends through two surfaces of the top part which are opposite to each other. The first inspection window communicated with the flat-cable slot. A portion of the flat-cable slot away from the inserting opening is exposed in the first inspection window, and a position of the flat cable in the flat-cable slot is inspectable through the first inspection window.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: December 13, 2016
    Assignee: WISTRON CORP.
    Inventor: Hung-Sheng Chen
  • Patent number: 9507973
    Abstract: An apparatus with the middle structure being layered between the first outer structure and the second outer structure. The operational circuitry includes a plurality of pockets for subscriber identity module cards, the pockets being arranged in two parallel rows in a planar fashion. The pockets of each row are placed next to each other and include open sides capable of receiving the subscriber identity module cards. The open sides of the pockets of different rows face in opposite directions. The middle structure includes a plurality of holes in rows for transferring subscriber identity module cards therethrough to the pockets or from the pockets, the holes of the middle structure of different rows facing in opposite directions, and the holes being on the open sides of the pockets.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: November 29, 2016
    Assignee: UROS TECHNOLOGY S.À R.L.
    Inventors: Marko Nousiainen, Ilkka Rahikainen
  • Patent number: 9496635
    Abstract: A memory card identification device, a host device using the memory card, and a memory card are provided. The memory card identification device includes: a card socket comprising a single card slot through which at least two kinds of memory cards can be inserted and a target port disposed to be in contact with any one kind of a target memory card based on an external characteristic difference between different kinds of memory cards; and a card type detector configured to determine a type of a memory card inserted in the card socket by using a contact state signal of the target port.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: November 15, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-bum Lee, Seok-heon Lee, Sung-hoon Lee
  • Patent number: 9467186
    Abstract: A card holder for holding a card includes a card holder body for providing a support plane for supporting the card; and a plurality of inlaid pieces, wherein each of the plurality of inlaid pieces is pivotally mounted on the card holder body, and is structured to be rotated to a first position perpendicular to the support plane or a second position not higher than the support plane.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: October 11, 2016
    Assignee: Xiaomi Inc.
    Inventors: Fenghui Wu, Kesheng Yan, Shasha Shi, Shaojie Wang
  • Patent number: 9468116
    Abstract: An apparatus and associated methodology contemplating an enclosure configured to securely contain a circuit board. The enclosure has a cover defining a flange operably extending substantially parallel to the circuit board in direct contact with the circuit board. The enclosure also has a body extending from the flange that is operably separated from the circuit board. A connecting member has opposing planar sides operably pressing to contain the flange against the circuit board in supporting the circuit board within the enclosure.
    Type: Grant
    Filed: April 11, 2014
    Date of Patent: October 11, 2016
    Assignee: Seagate Technology LLC
    Inventor: William G. Voss
  • Patent number: 9418036
    Abstract: The present invention provides a data terminal with a connection structure of a universal serial bus (USB) interface. The structure includes: a USB interface, a guide rail element, an elastic element, and a limit element; a protrusion is disposed on at least one side of the USB interface; the guide rail element includes two vertical faces disposed opposite each other; the USB interface is located in an accommodating space formed by the two vertical faces; a guide rail is disposed on each vertical face in a hollow manner; the protrusion on the USB interface extends out of the accommodating space from the guide rail; and in the two vertical faces, a connection terminal is disposed on an outer side of at least a first vertical face.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: August 16, 2016
    Assignee: Huawei Device Co., Ltd.
    Inventors: Jian Xiao, Bin Zeng
  • Patent number: 9414510
    Abstract: An electronic card connector includes a tray, at least one latching member, a push rod and an ejection assembly. The tray defines a defined space for accommodating an electronic card and at least one notch. Each latching member comprises at least one fixing portion fixed to a housing and a bulge. Each bulge receives in one of the at least one notch to detachably engage the tray with the housing. The push rod includes a first hook. The ejection assembly includes a connecting rod having a second hook and an expansion bracket rotatably coupled to the connecting rod and resisting the tray. When the second hook is engaged with the first hook, the tray is engaged with the housing. When the first hook is disengaged from the second hook, the tray is driven to disengage from the housing by an elastic restoring force of the expansion bracket.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: August 9, 2016
    Assignee: ShenZhen Goldsun Network Intelligence Technology Co., Ltd.
    Inventor: Qian Lei
  • Patent number: 9367712
    Abstract: A memory card comprising a flexible substrate (a “flex”) which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: June 14, 2016
    Assignee: Amkor Technology, Inc.
    Inventors: Lee J. Smith, Jeffrey Alan Miks, Curtis Michael Zwenger, Barry Michael Miles
  • Patent number: 9351418
    Abstract: According to one embodiment, semiconductor memory device is capable of operating at a first mode and a second mode which is higher in speed than the first mode. The semiconductor memory device comprising: a semiconductor memory; a controller which controls the semiconductor memory; a connector which is provided with terminals for sending and receiving data to and from an external device; and a substrate on which the semiconductor memory, the controller, and the connector are mounted, the substrate comprising a plurality of wiring layers. The controller and the connector are mounted on an identical surface of the substrate. The substrate comprises a wiring which connects a mounting pad for the terminal for data transfer at the second mode of the connector and a mounting pad for a pin for data transfer at the second mode of the controller to each other on the wiring layer on a mounting surface for the connector and the controller.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: May 24, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takeshi Mitsuhashi, Hirofumi Katami
  • Patent number: 9320163
    Abstract: Disclosed is a portable downloader comprising a pen-shaped housing and a circuit board provided inside of the pen-shaped housing. Provided at one end of the circuit board is a micro-universal serial bus (MUSB) port. Connected to the circuit board are a ground wire and two data wires. Each data wire is connected to a probe at the other end. Provided at the end of the pen-shaped housing corresponding to the MUSB port is a socket. Provided at the other end are two position-fixing holes. The two probes penetrate the position-fixing holes. The MUSB port connects to a computer universal serial bus (USB) port through a USB-MUSB computer extension wire. The portable downloader uses USB power supply with no need for an external power supply, and supports hot plug. The downloader uses the two probes as the C2 port, and is convenient to transmit data to C2 slave devices. The downloader is of a pen-shaped packaging, and is therefore easy to carry.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: April 19, 2016
    Assignee: WUHAN TELECOMMUNICATION DEVICES CO., LTD.
    Inventors: Liuyu Zhang, Beili Song, Tao Yuan
  • Patent number: 9274569
    Abstract: The instant disclosure relates to a memory module comprising a PCB and a detachable assembly. The PCB has a terminal portion and a free portion away from the terminal portion. The detachable assembly includes a plurality of metal members disposed on the free portion of the PCB. Thereby, user can averagely force the metal members to install or detach the memory module from a memory slot of a computer system to prevent the interference of outer ESD to affect the normal function of PCB.
    Type: Grant
    Filed: April 13, 2013
    Date of Patent: March 1, 2016
    Assignee: ADATA TECHNOLOGY CO., LTD.
    Inventor: Yujen Yang
  • Patent number: 9259936
    Abstract: A circuit board holder holding a circuit board which is not fixed to a liquid container containing an ink and stores information relating to the ink includes a support portion configured to have an inclined surface supporting the circuit board. The circuit board supported by the support portion is inclined to a horizontal direction.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 16, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Takeshi Iwamuro, Hidetoshi Kodama
  • Patent number: 9257377
    Abstract: A semiconductor device includes: an oscillator including external terminals disposed on a first face with a specific distance along a first direction; an integrated circuit including a first region formed with first electrode pads along one side, and a second region formed with second electrode pads on two opposing sides of the first region; a lead frame that includes terminals at a peripheral portion, and on which the oscillator and the integrated circuit are mounted such that the external terminals, the first and second electrode pads face in a substantially same direction and such that one side of the integrated circuit is substantially parallel to the first direction; a first bonding wire that connects one external terminal to one first electrode pad; a second bonding wire that connects one terminal of one lead frame to one second electrode pad; and a sealing member that seals all of the components.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: February 9, 2016
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventors: Toshihisa Sone, Kazuya Yamada, Akihiro Takei, Yuichi Yoshida, Kengo Takemasa
  • Patent number: 9218953
    Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: December 22, 2015
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Robert C. Miller, Hem Takiar, Steven Sprouse, Ka Ian Yung
  • Patent number: 9198314
    Abstract: A USB memory stick includes housing having a frame hole, a tray providing a fastening structure, and a memory attached to the tray and mounted with the tray in the housing. The memory includes a mating fastening structure fastened to the fastening structure of the tray, a stepped bottom wall formed of a plurality of steps rising one behind another, a plurality of vertical clearance compensation spring leaves respectively disposed corresponding to the steps, and a mating locating block forced into engagement with the frame hole of the housing.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: November 24, 2015
    Assignee: HO E SCREW & HARDWARE CO., LTD.
    Inventor: Joseph Huang
  • Patent number: 9196509
    Abstract: An adaptive patterning method and system for fabricating panel based package structures is described. A plurality of semiconductor die comprising a copper column disposed over the active surface of each semiconductor die is provided. An embedded die panel is formed by disposing an encapsulant around each of the plurality of semiconductor die. A true position and rotation of each semiconductor die within the embedded die panel is measured. A unit-specific pattern is formed to align with the true position of each semiconductor die in the embedded die panel. The unit-specific pattern as a fan-out structure disposed over the semiconductor die, over the encapsulant, and coupled to the copper columns. A fan-in redistribution layer (RDL) can extend over the active surface of each semiconductor die such that the copper columns formed over the fan-in RDLs. The unit-specific pattern can be directly coupled to the copper columns.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: November 24, 2015
    Assignee: DECA Technologies Inc
    Inventors: Christopher M. Scanlan, Timothy L. Olson
  • Patent number: 9148255
    Abstract: A detection signal output device includes connector terminals adapted to be connected by a cable to an external device. Fixed contacts are spaced apart from the connector terminals and output information indicating detector states. An integrated circuit includes a box-shaped package having different first and second side surfaces. First IC terminals are arranged on the first side surface and electrically connected to the fixed contacts. Second IC terminals are arranged on the second side surface and electrically connected to the connector terminals. The integrated circuit generates an information signal, in accordance with information indicating the detector states obtained through the first IC terminals, and outputs the information signal from one of the second IC terminals. The fixed contacts are arranged in correspondence with the first side surface, and the connector terminals are arranged in correspondence with the second side surface.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: September 29, 2015
    Assignee: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
    Inventors: Osamu Inagaki, Shinichi Yoshida, Eijiro Hirose
  • Patent number: 9141902
    Abstract: A smart card module for a smart card, comprising a chip having electrical contacts at a front side; a first laminate layer, wherein a rear side of the chip is connected to the first laminate layer, the rear side of the chip opposite the front side; a second laminate layer; a first conductive layer, wherein the electrical contacts of the chip are connected to the first conductive layer and the first conductive layer is arranged between the chip and the second laminate layer; and an adhesive material arranged between the chip and the conductive layer and/or the second laminate layer.
    Type: Grant
    Filed: September 29, 2012
    Date of Patent: September 22, 2015
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Kristof Bothe, Juergen Hoegerl, Andreas Karl, Andreas Mueller-Hipper, Peter Scherl, Peter Stampka, Uwe Wagner
  • Patent number: 9136661
    Abstract: A storage device including a storage module and a sheath member is provided. The storage module has a substrate, a first terminal set and a second terminal set, and the first and the second terminal sets are disposed on opposite sides of the substrate. The sheath member has an opening and a third terminal set. A portion of the third terminal set is exposed out of the sheath member. At least a portion of the storage module is sheathed into the sheath member, and the first terminal set is exposed out of the sheath member through the opening. The second terminal set is electrically connected to the third terminal set, and an connection interface is formed by the first terminal set exposed out of the sheath member and the portion of the third terminal set exposed out of the sheath member.
    Type: Grant
    Filed: May 5, 2014
    Date of Patent: September 15, 2015
    Assignee: PHISON ELECTRONICS CORP.
    Inventor: Wei-Hung Lin
  • Patent number: 9101066
    Abstract: An outer circumferential groove filled with a seal material and an opposing surface portion are provided to a fit portion of a case. A tray portion opposing the opposing surface portion and an outer circumferential protruding portion entering the outer circumferential groove are provided to the fit portion of a cover. Master dimensions are set so that an outer clearance A0 between the outer circumferential groove and the outer circumferential protruding portion is always larger than an inner clearance C0 between the former and the latter when center positions of the cover and the case coincide with each other.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: August 4, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Isao Azumi, Koji Hashimoto
  • Patent number: 9073149
    Abstract: A method of fixing a functional component (2) in a housing (4). During a first step, a first housing portion (1) is prepared in which a functional component (2), to be fixed, is arranged in a provisional fixing position. During a second step, a second housing portion (3) is brought into contact with the first housing portion (1) so that the functional component (2) is arranged in a joining direction (X) between the housing portions (1, 3). During a third step, material from at least one of the housing portions (1, 3) is melted in such manner that the functional component (2), located between the housing portions (1, 3), is gripped in position when a material-integral bond is formed between the housing portions (1, 3).
    Type: Grant
    Filed: August 2, 2013
    Date of Patent: July 7, 2015
    Assignee: ZF Friedrichshafen AG
    Inventor: Dirk Raschke