Abstract: An adaptor is shaped for allowing use of a micro SIM card in a mini SIM card implemented device. An adaptor body is shaped like a micro SIM card and may include a cutout region for receiving a micro SIM card therein.

Abstract: A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

Abstract: A multi-function dummy card inserted in an electronic card slot of an electronic device includes a lower cover, a main board fixed on the lower cover, an upper cover fixed on the main board, and a first button received into the upper cover. The lower cover includes a laser. The main board includes a chargeable battery for providing power for the laser. When the first button is pressed to contact the main board, the main board generates a first signal to turn on the laser.

Abstract: A subscriber identity module (SIM) card to be mounted to a terminal device that includes a SIM interface unit, the SIM card including: a first terminal to output a control signal indicating that the SIM card is mounted to the terminal device when the SIM card is mounted to the terminal device; and a second terminal to receive the control signal from the first terminal, and to transmit, to the SIM interface unit, the control signal when the SIM card is mounted to the terminal device.

Abstract: A mounting apparatus is configured for securing a PCI card and includes a securing member and a latch member. The securing member extends along a first direction. A protrusion is located on the securing member. The latch member is capable of securing the other end of the PCI card and defines a securing slot. The protrusion is inserted in the secured slot along a second direction perpendicular to the first direction.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.

Abstract: Various embodiments of the present invention are directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing that has first and second parallel elongated mounting frames extending along the respective side edges of the circuit board. Each mounting frame has an elongated body portion forming a channel extending the length of the body, the channel serving to nest one of the side edges of the circuit board. The body of each mounting frame has one or more sets of orthogonally disposed, intersecting mounting holes that permit use of mounting holes to accommodate screws for attaching the mounting frames in a rack frame of a host system so that the circuit board is optionally supported in a side attached mode or in a bottom attached mode.

Abstract: A method of making an electronic circuit device includes expelling air from a gap between a circuit board and an electronic element mounted on only a first side of the circuit board by filling the gap with a filling member, placing the circuit board in a mold cavity such that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board with a resin material by injecting the resin material into the cavity.

Abstract: A system relating to improved traffic-control hardware expansion and component testing. More particularly, this invention relates to providing systems for efficient expansion and portable testing of NEMA-standard TS-1 and TS-2 traffic-control devices used in traffic-control applications. The system is especially useful in extending the service life of “aging” fixed-size traffic-control cabinets, within existing traffic-control networks.

Abstract: A method for arranging a component on a circuit board, a circuit board, and a mobile device comprising a circuit board are described.

Abstract: A differential signal pair transmission structure adapted to a wiring board and including a first signal path and a second signal path is provided. The first signal path includes a first upper trace, a first lower trace and a first conductive through via. The second signal path includes a second upper trace, a second lower trace and a second conductive through via. A portion of the first signal path and a portion of the second signal path overlaps in the normal projection onto the upper or lower surface of the wiring board. Normal projections of the first and the second signal path projecting onto the upper surface of the wiring board are substantially symmetric with respect to a line which is perpendicular to a segment connecting normal projections of axes of the first and the second through via onto the upper surface and passes through the midpoint of the segment.

Abstract: Flexible substrates are drawn from two terminals provided on a TFT substrate, respectively, and IC chips are mounted on both flexible substrates. Both flexible substrates are placed so that positions of the IC chips provided on both flexible substrates overlap with each other.

Abstract: The invention relates to a mobile data storage device (1) with high storage density, comprising a flat support layer (3) with a first (10) and second (5) flat side, a communication connection (2) with a contact section (9) and at least one semiconductor storage device (4), which is designed as a non-volatile read-write memory. The support layer (3) is arranged with a section of the first flat side (10) on a mounting surface (11) of the contact section (9) and the mounting surface (11) is offset relative to the middle plane (22) of the communication connection (2) in a direction perpendicular to the middle plane (22). Furthermore, the invention relates to a pocket-size tool or tool card with a data storage device.

Abstract: A chip card holder for holding a chip card includes a fixing member and a sliding member. The fixing member defines a receiving space to receive the chip card. The fixing member includes two latching portions at two opposite sides thereof. Each latching portion includes a bent plate and a supporting plate. The bent plate defines a slot. The supporting plate is positioned above the receiving space. The sliding member includes a main plate and an operating portion at one end of the main plate. Two sliding blocks are formed on two sides of the main plate correspondingly. Each sliding block is slidably engaged in a corresponding slot. The supporting plates support the main plate.

Abstract: The invention discloses a card socket comprising a base, a first resilient member, a holder, a second resilient member and a driving rod. The base comprises a bottom surface and a side wall with a block portion. The first resilient member is disposed on the bottom surface. The holder is pivotally connected to the base and compresses the first resilient member. The holder comprises an accommodating space, and a card member is removably accommodated in the accommodating space. The second resilient member and the driving rod are also disposed in the accommodating space. The driving rod comprises a hook and a recess. The hook is against the second resilient member and is capable of driving the card member to move. The block portion restrains the driving rod on the base. Furthermore, the restriction between the driving rod and the block portion can be removed through the recess.

Abstract: An electronic circuit module and a method of manufacturing the electronic circuit module are disclosed. In one embodiment, the electronic circuit module includes i) a substrate on which a circuit is formed, ii) a plurality of electrical devices electrically connected to the circuit and iii) a first molding unit coated on the substrate to cover at least the electrical devices. The module further includes i) a test terminal unit comprising a plurality of test wires and configured to inspect the circuit, wherein each of the test wires comprises a first end electrically connected to the circuit and a second end exposed from the first molding unit, and wherein the second ends of the test wires form an inspection unit and are adjacent to each other on the substrate and ii) a second molding unit coated on the substrate to cover the second ends of the test wires.

Abstract: An apparatus for retaining an expansion card within an information handling system provides a first bracket including a first elongated body defining a first groove for receiving a first edge of an expansion card and wherein the first groove extends in a direction substantially parallel to a motherboard of the information handling system. The apparatus also includes a first base member extending from the first elongated body, wherein the first base member is attachable to the motherboard and a first pivot portion extending from the first elongated body, wherein the first pivot portion is angled upward toward an interior side of the first bracket.

Abstract: A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern (3) including mounting pads (8, 10), on which an electronic device (5) is mounted, a second wiring pattern (21) having lower impedance than the first wiring pattern (3), ICT wirings (13, 15) extending from the mounting pads (8, 10) of the first wiring pattern (3), and ICT pads (17, 19) formed at distal ends of the ICT wirings (13, 15). The ICT wirings (13, 15) extend towards the second wiring pattern (21) so that the ICT pads (13, 15) are in the vicinity of the second wiring pattern (21), and discharge gaps (G) are formed between the ICT pads (13, 15) and the second wiring pattern (21).

Abstract: An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.

Abstract: A chip card holder is secured to a circuit board. The chip card holder comprises a hollow frame including an opening, a first board, a second board opposite to the first board, two opposite sidewalls and an end board opposite to the opening. The frame has two securing blocks protruding from the first board toward the second board and two latching blocks protruding from the end board; the securing blocks and the latching blocks are for latching the chip card holder to the circuit board.

Abstract: Disclosed herein is a card device including a semiconductor package section having memory functions and a substrate section joined to the semiconductor package section by superposition and mounted by a variety of electronic components. The semiconductor package section includes a card-side connector section having card-side terminals for inputting and outputting information signals, and package-side terminals at a location at which the semiconductor package section is joined to the substrate section by superposition. The substrate section includes substrate-side terminals at a location at which the substrate section is connected to the semiconductor package section by superposition. The substrate section is electrically joined to the semiconductor package section by making use of the package-side terminals and the substrate-side terminals.

Abstract: A Secure Digital device including a PCBA having passive components mounted on a PCB using surface mount technology (SMT) techniques, and active components (e.g., controller and flash memory) mounted using chip-on-board (COB) techniques. The components are mounted only on one side of the PCB, and then a molded plastic casing is formed over both sides of the PCB such that the components are encased in the plastic, and a thin plastic layer is formed over the PCB surface opposite to the components. The molded plastic casing is formed to include openings that expose metal contacts provided on the PCB, and ribs that separate the openings. The molded plastic casing defines a pre-molded switch slot that facilitates an insert-in switch assembly process for mounting a write protect switch. The write protect switch includes a movable switch button engaged in the switch slot, and a switch cap secured over the switch slot.

Abstract: A holder for a surface contact card includes a first housing, a second housing, and a tray. The first housing defines a receiving hole. The second housing includes a cover portion. A tray is configured for carrying a surface contact card therein. The cover portion covers one part of the tray. The tray slidably engages in the receiving hole allowing insertion and removal of the surface contact card from inside the first housing and the second housing.

Abstract: The disclosure discloses a remote radio unit, which comprises: a common slot, an antenna and a plurality of function modules; wherein the common slot is connected with the antenna and comprises a plurality of slots, and each function module is inserted in a different slot of the common slot respectively. The disclosure can solve the problem that a remote radio unit is extended inconveniently while adding frequency bands and the whole remote radio unit will be greatly affected in most cases when a fault occurs in the module supporting one frequency band.

Abstract: An ultrasonic weld is provided in a cover component, is formed protruding from the cover component, and is provided so that it can join the cover component and the body component together by being fixed to the body component with ultrasonic welding. A locking mechanism is provided so that it can join the cover component and the body component together via engaging portions that engage with each other. The locking mechanism includes a first engaging portion provided in the cover component, and a second engaging portion that is provided in another component fixed to the body component, and that can engage with the first engaging portion. Thus, it is possible to decrease the number of components, and also reduce equipment costs and production control costs.

Abstract: Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention is that the integrated circuit products are produced a batch at a time, and that singulation of the batch into individualized integrated circuit products uses a non-linear (e.g., non-rectangular or curvilinear) sawing or cutting action so that the resulting individualized integrated circuit packages no longer need to be completely rectangular. Another aspect of the invention is that the integrated circuit products can be produced with semiconductor assembly processing such that the need to provide an external package or container becomes optional.

Abstract: A secure circuit board assembly is provided. The secure circuit board assembly comprises: a control board including a cryptographic processor; a spacer portion mounted on the control board; and a lid mounted on the spacer portion. The control board, the spacer portion, and the lid collectively provide a secure enclosed chamber in which the cryptographic processor is mounted. The spacer portion provides protection against side-on attacks against the cryptographic processor.

Abstract: An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or “shot”.

Abstract: A small form factor USB Bluetooth dongle includes a printed circuit board (PCB), a USB contact area, and a radio frequency (RF) transceiver die. The PCB includes a first primary surface and a second primary surface. The USB contact area is fabricated on the first primary surface. The RF transceiver die is mounted on the second primary surface, wherein the RF transceiver is in accordance with Bluetooth.

Abstract: A memory card includes a circuit board, semiconductor chips mounted on different areas on the circuit board, a semiconductor chip with a semiconductor electrode on its top face and being fixed such that at least a part of its bottom face faces at least a part of a top face of the semiconductor chip, a wire for connecting the semiconductor electrode and a board electrode on the circuit board to achieve a mounting state of the semiconductor chip, and a cover for covering a circuit formation area from an upper side of the circuit board. The circuit formation area includes three semiconductor chips and the wire. At least a part of each of three semiconductor chips, at least a part of the circuit board, and the wire are covered with secondary sealing resin and primary sealing resin.

Abstract: A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion.

Abstract: The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: Embodiments are described including a device comprising a carrier frame. The device includes a first connector on a first side of the carrier frame, and the first connector connects to a host system when the carrier frame is inserted into the host system. The device includes a second connector on a second side of the carrier frame, where the second side of the carrier frame is perpendicular to the first side. The second connector electrically couples to the first connector and connects to an input/output (I/O) adapter card inserted into a third side of the carrier frame, where the third side perpendicular to the first side. Consequently, the device has a flat structure that receives an adapter card and reorients the electrical connection of the adapter card. The device includes external visual status indicators and a switch for hot-swapping of the adapter card carrier in a running host system.

Abstract: A memory card connector, which is mounted on a printed circuit board, includes a radio-communication module, and a card slot arranged with input/output terminals that are connected to the printed circuit board. In the memory card connector, input/output terminals of the radio-communication module are arranged to join the input/output terminals of the card slot, such that the radio-communication module enables the printed circuit board to access an external device via radio communication in a manner equivalent to a manner when the printed circuit board accesses a memory card attached to the card slot.

Abstract: An electronic device having a USB connector is provided comprising a partial outer sleeve reaching short of the USB connector and securely holding thereof and a shorter inner sleeve extending little over the USB connector and partially housed in the outer sleeve in a sliding relationship. The USB connector is connected to functional circuit on at least one printed circuit board. A short piece of adaptor bracket permits the selected printed circuit board fastened in a uniform profile to the containing space of the outer sleeve so that a determined size of outer sleeve may hold a variety of printed circuit boards in a constantly acceptable tolerance.

Abstract: A flash memory device includes a cover, an electrical module, a slider and a rotatable member for driving the slider. The cover defines a receiving chamber and an opening communicating with the receiving chamber. The electrical module is slideably received in the receiving chamber and includes a circuit board and a connector port electrically connected with the circuit board. The rotatable member has a fixed axis around which the rotatable member revolves. The rotatable member includes a protrusion slideably received in a slot defined in the slider. The connector port is driven to telescopically extend through the opening by the slider which is further driven by the protrusion.

Abstract: Embodiments are described including a device comprising a carrier frame. The device includes a first connector on a first side of the carrier frame, and the first connector connects to a host system when the carrier frame is inserted into the host system. The device includes a second connector on a second side of the carrier frame, where the second side of the carrier frame is perpendicular to the first side. The second connector electrically couples to the first connector and connects to an input/output (I/O) adapter card inserted into a third side of the carrier frame, where the third side perpendicular to the first side. Consequently, the device has a flat structure that receives an adapter card and reorients the electrical connection of the adapter card. The device includes external visual status indicators and a switch for hot-swapping of the adapter card carrier in a running host system.

Abstract: A data card includes a casing provided with a circuit board therein. One end of the casing is provided with a plug electrically connected with the circuit board. The data card further includes a connecting part and a cap part. One end of the connecting part is connected with the casing, while the other end is connected with the cap part. The cap part can cover the plug. An antenna which is electrically connected with the circuit board is provided on the connecting part and/or the cap part. The invention mainly use in wireless data signal receiving or transmitting device.

Abstract: An electronic housing, which includes at least two housing parts, has at least one housing base, a housing cover, and at least one electronic connection in the form of a printed circuit board between electronic substrates disposed in the housing interior and components positioned outside the housing, with the electronic connection being fixed on the housing base. The housing cover has a filling port for a casting compound, and the filling port is closed by a label. A method for the production of such an electronic housing and the use thereof for transmission control of a motor vehicle, are also provided.

Abstract: A combination terminal includes a first logic circuit that is configured to interface with a first device using a first protocol. The combination terminal also includes a second logic circuit configured to interface with a second device using a second protocol. The combination terminal includes a retractable portion that includes a first plurality of contacts and retracts based upon an insertion of the second device; connects a first portion of the first device with the first logic circuit; and selects an active logic circuit. The combination terminal includes a static portion comprising a second plurality of contacts and connects the second device with the second logic circuit; and connects a second portion of the first device with the first logic circuit using the second plurality of contacts. The first device is connected to the first logic circuit using the first plurality of contacts and the second plurality of contacts.

Abstract: A memory device is disclosed including at least one surface pre-treated to roughen the surface for better adhesion of ink on the surface. The surface of the memory device may be pre-treated by scoring lines in the surface with a laser or by forming discrete deformations with a particle blaster. The surface may also be roughened by providing a roughened pattern on a mold plate during an encapsulation process. In further examples, the surface may be chemically pre-treated to roughen the surface and/or increase the adhesion energy of the surface.

Abstract: On a multilayer wiring board which has a plurality of wiring pattern stacked in sequence separately from one another, insulating members each positioned between the plurality of wiring patterns, and interlayer connection bodies electrically connecting the plurality of wiring patterns and in which a voltage conversion is built in, a first capacitor, a second capacitor, and an inductor are mounted, the other of electrode portions in the first capacitor or one of electrode portions in the second capacitor is positioned between an input section of the first capacitor and the inductor, and the other of the electrode portions or the one of the electrode portions is electrically set to ground.

Abstract: According to one embodiment, an electronic apparatus includes a first board, a second board facing the first board, a cover facing the second board from a side opposite to the first board, a first fixing portion attached to the first board and the cover, and a second fixing portion attached to the first board and the second board.

Abstract: A wireless signal receiver includes a housing, and a receiving module. The housing has a front portion, a rear portion and two side portions, and the housing has an installing space having an opening. The opening is located at the front portion. The receiving module is located in the installing space of the housing, and includes a circuit board, a receiving chip electrically coupled with the circuit board, and electric-conducting contacting portions electrically coupled with the circuit board. The electric-conducting contacting portions exposes to outside of the opening. Thereby, the total dimension is reduced.

Abstract: A memory card includes a substrate, at least one semiconductor chip attached to the substrate, a writing permitting/prohibiting setting element attached to the substrate, and a molding member formed on the substrate to cover the semiconductor chip.

Abstract: A plurality of separately powered data interface circuits, a controller circuit, and power switch circuits that collectively enable a supply of power to only one of the data interface circuits and disable the supply of power to the other data interface circuits. Alternatively, the separately powered circuits need not be data interface circuits.

Abstract: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.

Abstract: The method is for using a foldable card as a USB contact. A foldable flat card has a folding line and a foldable front flap section and foldable rear flap section. The card has contact segments. The front flap section is upwardly folded until the front flap section bears against a top surface of the card. The rear flap section is also upwardly folded until the rear flap section bears against the top surface of the card. A front segment is downwardly folded along the folding line until an underside of a rear segment bears against an underside of the front segment and the contact segment comes into contact with the contact segment to form a USB contact. The USB contact is then inserted into a computer.

Abstract: A USB flash disk with a none-joint metallic housing, the main point is that the USB flash disk is formed by inserting an internal structure composed of a printed circuit board, a metallic tray and an insulation upper seat in the metallic housing which is a none-joint rectangular pipe formed by drawing shaping.