Abstract: According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.

Abstract: A high frequency module is disclosed which comprises a high frequency device in a package, a circuit formed on a flexible substrate in the package, the circuit, the high frequency device and input/output terminals of the package being connected electrically.

Abstract: A flexible circuit member including a circuitized substrate of a dielectric material having a plurality of apertures therein. Located within and/or bridging selected ones of the apertures are electrical conductors, the conductors having a solder member secured thereto. A frame is also used, the circuitized substrate being secured thereto.

Abstract: An improved printed circuit card or second level electronics package (circuit board) including a laminate of lossy material and dielectric material between the voltage supply plane (Vcc) and the ground (GND) plane. The laminate suppresses common mode noise that is generated by active components on the card or circuit board.

Abstract: A conductive pattern layer structure includes an insulating member containing polyimide, a patterned thin film formed on the insulating member, and a patterned conductive layer formed on the thin film. The patterned conductive layer contains copper. Further, the layer structure includes a patterned barrier layer covering an upper surface and side surfaces of the patterned conductive layer to prevent copper from being diffused into another insulating layer formed around the patterned barrier layer.

Abstract: A touch sensitive switch pad. The switch pad includes a flexible film with a two conductive ink patterns on one side and an adhesive on the other. The adhesive backing can be of the peel off type such that a user simply peels off a protective backing to reveal the adhesive. The conductive ink patterns are disposed sufficiently close to each other such that there is a high probability that when a user touches the pad, a closed circuit occurs between the two patterns. Each conductive ink pattern is connected to an electrical contact which in turn can be connected to switching circuitry which is sensitive enough to sense the high resistance closed circuit. An extra adhesive-backed flap connected to the film and disposed in close proximity to the electrical contacts can be used to help protect the electrical contacts.

Abstract: A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as tungsten (W) on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the conductive material layers. Thick film conductor layers are formed on the copper-plated layers, to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.

Abstract: The invention provides a circuit board for an optical element which is disposed in an optical reading apparatus or an optical writing apparatus and is used to irradiate document reading light upon an document or irradiate image writing light upon a photosensitive material through a lighting window thereof.

Abstract: Proposed is a novel heat-sealable connector sheet, by which very reliable electric connection can be obtained with electrode terminals on an electronic device or a circuit board, consisting of a flexible insulating plastic substrate sheet and a patterned electroconductive layer formed thereon from an electroconductive paste with an overcoating layer of an insulating melt-flowable adhesive. Different from the electroconductive pastes used in conventional connector sheets, the electroconductive paste used here is compounded with an appropriate amount of relatively coarse particles of an insulating material having elasticity, e.g., plastic resins. The patterned electroconductive layer is formed from such a composite conductive paste in such a fashion that the insulating particles are fully embedded in the conductive paste but forming protrusions on the surface of the patterned electroconductive layer which accordingly exhibits a rugged appearance.

Abstract: An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad fellows to form an electrical connection with its corresponding solder bump.

Abstract: This multilayered wiring board having a multilayered wiring structure includes a first mesh wiring layer having a plurality of holes therein, and a second wiring layer having a plurality of wirings. The wirings of the second wiring layer undulate up and down so as to descend towards the holes formed in the first wiring layer. In another arrangement, the first wiring layer has a plurality of protrusions protruding toward the second wiring layer at locations between adjacent ones of the wirings of the second wiring layer. In these wiring boards, crosstalk between the wirings is suppressed.

Abstract: A printed circuit board capable of resilient deformation having two major surfaces and a contact edge. Electrically conductive traces are provided on each major surface of the board which lead to electrically conductive contact pads at the contact edge of the board. A gap is provided between the two major surfaces of the board along the contact edge. The gap permits resilient deformation of the board so that a force is created upon deformation which will bias the major surfaces toward their undeformed position. An elastomeric biasing member may be provided in the gap.

Abstract: A new circuit board and process for making the board are disclosed. The process comprises (a) forming a circuit pattern and terminal pads (on a substrate) with electrically conductive composition comprising conductive powder and a light curable resin binder; (b) shielding the terminal pads; (c) curing the circuit pattern by exposing it to light; and (d) applying conductive particles to the unexposed terminal pads and adhering the particles thereto by exposing the terminal pad to light; and then (e) coating the terminal pads with an insulating adhesive. A new method for attaching other circuit boards or electronic parts is also disclosed. The method comprises first aligning a circuit board or electronic part with the coated terminal pad of the new circuit board. Secondly, heat is applied to the terminal pad to cure the terminal pads, and thus bond the board or part to that terminal pad.

Abstract: Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

Abstract: A printed circuit board is provided with surface mount pads for soldering a surface mount pin grid array package. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.

Abstract: A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.

Abstract: A method of bending and soldering corners of a folding printed-circuit board in which holes are drilled on the printed-circuit board at points at where the circuits intersect the joints of segments of the folding printed-circuit board; V-shaped grooves are cut on the printed-circuit board along the joints of segments, permitting the printed-circuit board to be bent into a desired shape; and the drilled circuits are connected by soldering adequate amount of tin solder in the holes on the circuits.

Abstract: An article for tape-automated bonding of integrated circuit microchips comprises a carrier sheet (22) carrying conductive tracks (23) with a tubular metal formation (21) passing through the sheet at the end of each track for connection to a microchip (24). The tubular formations tend to accommodate irregularities in the chip and may contain solder or other metal having a lower melting point than the tubular formation to effect bonding.