Abstract: A converged infrastructure manager comprises a circuit board, a processor connected to a first side of the circuit board, a solid state drive connected to the circuit board, a first connector extending from the first side of the circuit board, a second connector extending from a second side of the circuit board, a first dual in-line memory module connected to the first connector and a second dual in-line memory module connected to the second connector.

Abstract: Provided is an electronic equipment cabinet capable of detecting a storage state of a circuit board unit by using a smaller number of switches than circuit board units. The electronic equipment cabinet, which stores a plurality of circuit board units inserted and extracted in the same direction, includes a plurality of slots for storing the circuit board units, a plurality of cover members for covering the slots, and a switch for detecting closing of all the slots. The cover members, which are provided by a plurality of types having an installation order restricting mechanism for preventing closing of the slots, except for when the cover members are installed according to a preset installation order, includes a driving member located in a final-installation cover member that is installed last and configured to drive the switch.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: An electronic system includes a first circuit board having a first connection interface, and a second circuit board having a second connection interface and a guide pin device. The guide pin device includes a convex connector and a concave connector. The convex connector includes a guide member and a connection portion. The connection portion connects the guide member to the first circuit board and has two first inclined surfaces formed on two opposite sides of the guide member. The concave connector is secured on the second circuit board and includes a guide sliding slot and two second inclined surfaces formed on two opposite sides of the guide sliding slot. When the guide member is aligned with and is inserted into the guide sliding slot, the two first inclined surfaces mat with the two second inclined surfaces, and the first connection interface is engaged with the second connection interface.

Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.

Abstract: An electronic system includes a first circuit board having a first connection interface, and a second circuit board having a second connection interface and a guide pin device. The guide pin device includes a convex connector and a concave connector. The convex connector includes a guide member and a connection portion. The connection portion connects the guide member to the first circuit board and has two first inclined surfaces formed on two opposite sides of the guide member. The concave connector is secured on the second circuit board and includes a guide sliding slot and two second inclined surfaces formed on two opposite sides of the guide sliding slot. When the guide member is aligned with and is inserted into the guide sliding slot, the two first inclined surfaces mat with the two second inclined surfaces, and the first connection interface is engaged with the second connection interface.

Abstract: A motherboard assembly includes a motherboard having an expansion slot and a storage device interface, and a serial advanced technology attachment dual in-line memory module (SATA DIMM) with a circuit board. A control chip and a storage chip are arranged on the circuit board. Two voids are defined in a top side of the circuit board. A first extending board is formed on the top side of the circuit board between the voids. An edge connector is arranged on the first extending board and connected to a power supply. The edge connector includes power pins connected to the control chip and the storage chip. A second extending board is extended from an end edge of the circuit board and includes a connector connected to the storage device interface of the motherboard. A bottom side of the second extending board is in alignment with a bottom side of the circuit board.

Abstract: A key assembly comprises a base plate, two elastic elements and a key body. The elastic elements are both mounted to the base plate, and the elastic elements are spaced from and opposite to each other. The key body is slidably mounted to the base plate between the two elastic elements. The key body includes a first key section and a second key section connected with the first key section. The first key section has an arcuate first contacting portion formed thereon. The second key section has an arcuate second contacting portion formed thereon. The first key section resists one of the two elastic elements, the second key section resisting another elastic element. When the first key section slides toward and compresses the elastic element that resists the first key section, the second key section slide away from the elastic element that resists the second key section.

Abstract: There is provided a communication device that includes a first circuit board which includes a first ground pattern (GND) and a first signal line formed on a substrate, a ground pin electrically coupled with the first GND, where the ground pin protrudes from an end of the substrate, and a signal pin formed in the substrate and electrically coupled with the first signal line, where the signal pin protrudes from the end. The communication device further includes a send circuit board which includes a second GND and a second signal line, wherein when an end of the circuit board is inserted into a space between the ground pin and the signal pin, the first signal line and the second signal line are electrically coupled with each other via the signal pin and the first GND and the second GND are electrically coupled with each other via the ground pin.

Abstract: A tray keying mechanism is mounted on a backplane inside a modular chassis and has a protrusion that stands out like a post for each of several equipment bays. A modular tray can be inserted into each of the equipment bays, but it will not be allowed to be fully inserted and to engage the electrical connectors on the backplane if the corresponding post meets an obstruction on the rear apron of the tray. If the particular tray is the correct type, and is not upside down, the post will encounter no obstructions during the insertion of the tray, and the electrical connectors will be allowed to engage. In one embodiment, the keying mechanism comprises a bracket of molded plastic that fits all around the several connectors on the backplane, and could be patterned to fit an already existing and in-service backplane and chassis.

Abstract: A key mechanism includes a key body, a circuit board, and a elastic metal frame. The elastic metal frame comprising a main body, a first latching portion, and a second latching portion. The first latching portion and the second latching portion protrude from the main body. The main body is positioned between the key body and the circuit board. The elastic metal frame supporting the circuit board by the first latching portion and the second latching portion.

Abstract: The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12 and to the substrate 13. The electrode has grooves as an air discharging device discharging the air 15a in air voids 15 generated within the solder 14 between joint surfaces 11a, 11b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13.

Abstract: An information handling system includes a printed circuit board and an extension card. The printed circuit board includes a first expansion terminal. The extension card includes a first coupling interface, a retention mechanism, and an access terminal. The first coupling interface is operable to engage the first expansion terminal. The retention mechanism is operable to be coupled to at least a first exterior portion of the first expansion terminal to secure the first coupling interface to the first expansion terminal. The access terminal is operably coupled to the first coupling interface, and the access terminal is electrically coupled the first expansion terminal to access terminal.

Abstract: In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.

Abstract: A guide module is provided for connecting a primary circuit board and a secondary circuit board to a common backplane circuit board. The primary and secondary boards are in a tiered arrangement with both the primary and secondary circuit boards having interface connections on the backplane circuit board. The guide module includes a body having a height between opposite top and bottom surfaces. The height of the body establishes a stack height between the primary and secondary boards. Locating elements are formed on the top and bottom surfaces to locate and align the primary and secondary boards with respect to one another.

Abstract: A modular protection housing with a first housing module and a second housing module is provided. The first housing module comprises a first volume and a first potential rail, while the second housing module comprises a second volume and a second potential rail. In this arrangement the first housing module and the second housing module are coupleable to an operating state in such a way that the first volume and the second volume form a shared volume. In this arrangement the first potential rail and the second potential rail are coupleable such that in the coupled operating state the first potential rail and the second potential rail form a shared potential rail for the overall volume.

Abstract: An electronic component contained substrate in which an electronic component is mounted between a pair of wiring substrates, wherein the wiring substrates are connected electrically via solder balls, an opening portion opened larger than a planar shape of the electronic component is formed in the other wiring substrate, which faces to one wiring substrate on which the electronic component is mounted, in a position that opposes the electronic component, and a space between a pair of wiring substrates is sealed with a sealing resin.

Abstract: The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.

Abstract: A device and system are disclosed. In one embodiment the device comprises a primary display unit, a base unit coupled to the primary display unit, and a touch-sensitive secondary display unit, coupled to the base unit, operable to receive input from a user and display information for the user.

Abstract: Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed circuit board, which can have deleterious effects on electrical components thereon. Slots are provided on the PCB to enable the portion of the PCB surrounding the edge connector to bend relative to the remainder of the PCB, thereby confine the bending to a localized area between the ends of the slots, and isolate the electrical components from any stresses caused thereby.

Abstract: A mounted printed wiring board is disclosed that will allow sensors to be installed in optimal positions thereon with the same time and effort needed for one board, and allow the same to be inexpensively manufactured with a simple process. A single board unit includes first and second board portions having a break line interposed therebetween. Sensors and mounted components that are shorter than the sensors are mounted on the first board portion, connectors and mounted components that are taller than the sensors are mounted on the second board portion, and jumper wires are mounted across the first and second board portions. The board unit is then folded in two with the break line so that the mounting surfaces face outward, and the first and second board portions are fixed with spacers.

Abstract: A first circuit board connectable to a second circuit board is disclosed. The first circuit board includes at least one set of contacts, a detection circuit, and a voltage generator. Each set of contacts is configured to receive an electrically conductive keypin for bridging a set of the contacts. The detection circuit is in signal communication with the contacts and produces a logic signal in response to a set of the contacts being bridged. The voltage generator is responsive to the logic signal and produces a voltage signal at a connector connectable to the second circuit board. The voltage signal at the connector has a first voltage in response to the keypin being disposed at a first location, and a second different voltage in response to the keypin being disposed at a second location, wherein at least one of the pin locations results in a set of the contacts being bridged.

Abstract: In one embodiment, a removable storage module includes a bezel, and opposed first and second rails that extend from the bezel, the first rail including a key system component that is adapted to prevent full insertion of the module into a bay of a module cage so as to protect a connector of at least one of the module and the cage. In another embodiment, a removable storage module for use in a module cage includes a latch mechanism including: a latch arm that is used to rotate the mechanism about an axis, and a top portion that includes at least one latch tooth and a paddle member, the latch tooth comprising a first surface that is adapted to abut a rear side of a first flange of the cage during insertion of the module and a second surface that is adapted to abut a second flange of the cage during removal of the module, the paddle member being adapted to abut a front side of the first flange during removal of the module.

Abstract: A power supply keying method for use with an electrical apparatus includes defining a plurality of power supply classes; associating with the plurality of power supply classes a plurality of power supplies, each of the plurality of power supplies including a power supply housing having a unique keying arrangement corresponding to one power supply class of the plurality of power supply classes; and providing in the electrical apparatus a power supply receptacle for receiving at least one power supply of the plurality of power supplies, the unique keying arrangement of the power supply housing in conjunction with the power supply receptacle permitting reception of a particular power supply of the plurality of power supplies into the power supply receptacle only if the power supply class associated with the particular power supply has power supply electrical characteristics that satisfy electrical power requirements of the electrical apparatus.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. Edge metallization of the subassembly board can provide enhanced thermal or electrical connection to the underlying portions of one or more lugs.

Abstract: A motion detector is provided that enables power to a computer module to be disconnected prior to removal of the module from the connector. Actuation of a sensor causes a shutter assembly to move vertically. The shutter assembly is in communication with a switch. Movement of the shutter assembly causes actuation of the switch to send a signal to a control circuit of an associated controller. Power to the controller is provided when the shutter assembly is in communication with the switch, and power is removed from the connector when the shutter assembly is not in communication with the switch.

Abstract: An electronic equipment module includes a symmetrical casting with two chassis units. Each unit includes a mounting recess to receive a circuit assembly, separated by a cover applied to either unit, or both. The module is normally mounted to a unit rack, and typically has a removably attachable, re-orientable keyed surface which mates with another keyed surface on the rack. A mounting system includes a unit rack coupled to at least one electronic equipment module and a mounting frame. A method of mounting an electronic equipment module includes inserting the module into an open end of a unit rack, electrically coupling connectors attached to the module and the rack, securing the module to the rack, and attaching the rack to a mounting frame. The module can be secured to the rack by engaging a cam lever attached to the module.

Abstract: The invention provides a subassembly to facilitate co-planar vertical surface mounting of subassembly boards. By “vertically mounting” is meant that a subassembly circuit board with a major surface is mounted perpendicular to the major surface of a circuit motherboard. In accordance with the invention, a subassembly for co-planar vertical surface mounting comprises a subassembly board coupled between a pair of base headers. Advantageously one base header comprises a plurality of mounting lugs secured to a transverse element in a co-planar configuration. The other base header conveniently comprises a plurality of connector pins secured to an elongated header element in co-planar configuration. The two headers interlock with the board to provide connection and co-planar support. A pickup cap attached at the board edge opposite the base permits pick-and-place positioning of the subassembly by conventional equipment without the need for special grippers.

Abstract: An electrical connector (1) for receiving a circuit board (2) includes an elongated insulative housing (10) defining a longitudinal slot (11) for receiving the circuit board. A multiplicity of evenly-spaced passageways (12) is defined in two sidewalls (13) of the housing that are at opposite sides of the slot respectively. A multiplicity of conductive terminals (14) is received in the passageways, for electrically connecting the circuit board. A pair of guiding arms (130) extends upwardly from opposite ends of the housing respectively. Each arm defines a central guiding channel (131), for guiding the circuit board into the slot. The central guiding channel has a width narrower than that of the slot, thereby the circuit board can securely be received in the slot.

Abstract: A keypad of a portable wireless terminal includes a sheet having a plurality of holes, a plurality of keys inserted into respective ones of the holes, and a silicon adhesive layer on a lower surface of the sheet to fix the keys to the sheet. A protrusion at a lower surface thereof contacts a dome switch. The keys are firmly mounted at a precise position, and more beautiful design can be realized since a decoration line or a decoration shape can be easily formed to set an appearance of the keys.

Abstract: An apparatus for protecting an electronic card is described. The apparatus has a protective contact. The protective contact has a contact face that, when the apparatus is in a locked protruding state, makes contact with a first incorrect card slot backplane feature. In the locked protruding state, the contact face extends outward a first distance from a feature of the card that can receive resultant damage if the card is fully inserted into the incorrect card slot. The first distance is greater than a second distance between a second incorrect card slot backplane feature that can cause the resultant damage and the first incorrect card slot backplane feature. The apparatus includes a guide along which the protective contact slides in order to transition between the locked protruding state and a collapsed state. The protective contact extends less outward from the card in the collapsed state as compared to the locked protruding state so as to allow the card to be fully inserted into a correct card slot.

Abstract: In some embodiments, the invention includes a system having first and second modules; and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector and to the second module, and wherein the first path in the first module couples to stubs for first and second chips of the first module and the first path in the second module couples to stubs for first and second chips of the first module; and each of the first and second chips include selectable on die terminations.

Abstract: A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.

Abstract: In some embodiments, the invention includes a termination card having a substrate having groups of fingers on a first side of the substrate and groups of fingers on a second side of the substrate and wherein some of the groups of fingers on the first side and some of the groups of fingers on the second side are connected through module connectors, and others of the groups of fingers on the first side are coupled to on module terminations on the first side.

Abstract: In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system includes a first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector, to the second module, and to on module terminations of the second module; and a second path of conductors extending from the circuit board to the second module connector, to the second module, back to the second module connector, to the circuit board, to the first module connector, to the first module, and to on module terminations of the first module.

Abstract: A printed circuit assembly for use in an implantable medical device comprises a plurality of panels having active and passive circuit components on one major surface thereof, the plurality of panels being interconnected with flexible flat cable segments allowing the assembly to be folded so as to place the individual panels carrying the circuit components in a stacked relationship. By providing conductive layers on predetermined surfaces of the panels, shielding is provided to inhibit noise generating circuitry from contaminating wanted signals passing between the components and the plural panels.

Abstract: In some embodiments, the invention includes a system having first and second modules; and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector and to the second module, and wherein the first path in the first module couples to stubs for first and second chips of the first module and the first path in the second module couples to stubs for first and second chips of the first module; and each of the first and second chips include selectable on die terminations.

Abstract: In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system includes a first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector, to the second module, and to on module terminations of the second module; and a second path of conductors extending from the circuit board to the second module connector, to the second module, back to the second module connector, to the circuit board, to the first module connector, to the first module, and to on module terminations of the first module.

Abstract: A high-insulated stud comprises a first columnar conductive terminal of a first height, a second columnar conductive terminal of a second height lower than the height of the first conductive terminal that is placed in a row with and at a distance from the first conductive terminal, an insulating pedestal, and a first groove open at the top and a second groove intersecting the first groove and shallower than the first groove at the top of the first conductive terminal and a third groove open at the top, which is parallel with the first groove and whose bottom face is almost the same height as the bottom face of the first groove, at the top of the second conductive terminal.

Abstract: A printed board apparatus is assembled by superposing two printed boards spaced by a gap. A connector is disposed on a lower printed board. A through hole is formed across the connector in an upper printed board. A harness is passed through the through hole and connected to the connector.

Abstract: A guide device receives and engages a cutout in a distal pin-bearing edge of a printed circuit board for aligning pins with pin sockets. The alignment device includes a web, sized and shaped to be received in a circuit board cutout and a shelf surface for engaging a part of a major surface of the circuit board, to provide for biaxial guidance during board insertion. By positioning guide devices and circuit board cutouts in different locations, for different circuit boards, insertion of circuit boards in an incorrect slot or location is avoided.

Abstract: A printed circuit board assembly comprises a circuit membrane, a printed circuit board, a cover plate and two screws. The cover plate has an arch-shaped bump formed thereon such that the ribbon cable has firm contact with the printed circuit board. Therefore, the electric contacts of the printed circuit board are in firm contact with the electric contacts of the circuit membrane. The cost and assembling time is saved.

Abstract: A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).

Abstract: A circuit board retainer includes a U-shaped body portion having a base plate and two side plates extending from the base plate. A panel connecting portion includes two retaining tabs perpendicularly extending from the base plate and each defines a notch. A resilient tab is formed on the base plate and extending between the retaining tabs. The retaining tabs are received in corresponding slits defined in a support panel. The circuit board retainer is moved with respect to the support panel for rendering the notches of the retaining tabs to engage with edges of the corresponding slits. The resilient tab is biased by the resiliency thereof to engage with an opening defined in the support panel thereby securely mounting the circuit board retainer to the support panel. A board connecting portion includes two resilient L-shaped members respectively extending from the side plates.

Abstract: An improved motherboard layout uses DIMM sockets in complementary pairs where the sockets have keys are in opposite locations. In essence, the first and second sockets in a pair are mirror images of each other. The sockets can be configured for single DIMMs (single-decker) or can be configured in a double-decker configuration. In circuit board layouts where both sockets are mounted on the same side of the motherboard, the sockets are disposed with their module-receiving recesses facing toward or away from each other, rather than in the same direction as in the prior art configuration. The complementary sockets can be disposed on opposite sides of the motherboard. In this type of layout, the respective keys are immediately opposite each other.

Abstract: An advanced zero-insertion force (ZIF) socket for coupling an electronic package having a plurality of electrical pins and a heat sink having a heat sink alignment and retention means onto a printed circuit board (PCB) of a computer system.

Abstract: A body of an electronic apparatus includes an upper case and a lower case fitted to the upper case. A display is rotatably mounted on an outer surface of the upper case. A keyboard is attached to an inner surface of the upper case, and a shield plate is fixed to an inner surface of the keyboard. On the shield plate are mounted a memory device and circuit boards with electronic parts. A supporting unit attached to the inner surface of the upper case and arranged to the side of the keyboard has a storing portion for storing a battery pack.

Abstract: A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit to a printed circuit board. The integrated circuit package includes a base having a bottom and a side. A flex circuit having traces therein is coupled to the base. The traces in the flex circuit are designed to couple to the leads of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.

Abstract: A flexible printed circuit board assembly comprising a first flexible printed circuit board and a second flexible printed circuit board, wherein each of the first and second flexible printed circuit boards is provided with a position fixing coupling to determine the position of the second flexible printed circuit board relative to the first flexible printed circuit board.