Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

Abstract: According to an example aspect of the present invention, there is provided an audio amplifier for use with a limited power source, the audio amplifier having: a power input terminal, a signal input terminal, a first DC to DC converter having an input connected to the power input terminal, an electrical energy storage device connected to an output of the first DC to DC converter, a second DC to DC converter having an input connected to the electrical energy storage device, an amplifier conductively connected to the output of the second DC to DC converter so as to be powered by the output of the second DC to DC converter, the amplifier also being conductively connected to the signal input terminal so as to receive a signal for amplification, and an output of the amplifier configured to be connected to a transducer such that the transducer may be driven by the amplifier.

Abstract: A device includes a circuit carrier board and a conductor element that is configured to transfer an electric current from and/or to the circuit carrier board. The device includes an electrically conductive, elastically deformable, contoured, plate-like connection element that connects the circuit carrier board to the conductor element and is configured to create a local, dynamic resilience. As a result of this, a force transmission front the conductor element to the circuit carrier board may be reduced. A plate thickness of the connection element is at least 2 cm. A power converter and an aircraft having such a device are also provided.

Abstract: A display module includes a display panel for displaying an image, and a protective film adhered to a back surface of the display panel. The protective film includes a compensation layer being in contact with the back surface of the display panel, a first release layer disposed under the compensation layer, a cushion layer disposed under the first release layer, and a second release layer disposed under the cushion layer. An adhesive strength of the first release layer is less than an adhesive strength of the second release layer.

Abstract: A display device includes a base substrate in which a display area and a pad area disposed around the display area are defined, a plurality of panel pads disposed on the pad area of the base substrate, and a printed circuit board attached to the pad area of the base substrate. The printed circuit board includes a plurality of circuit pads, the plurality of circuit pads include a first lead align mark, and the first lead align mark includes a plurality of first patterns passing through the first lead align mark from a surface of the first lead align mark in a thickness direction.

Abstract: An image forming apparatus includes an image forming unit configured to form an image on a recording medium, side plates extending on one end and another end of the image forming unit in a vertical direction thereof and configured to support the image forming unit, a main board including an element on a first board and fixed to the side plate on the one end such that the first board vertically extends on an outer side of the side plate, a sub-board including an element on a second board and electrically connected to the main board, a top surface member arranged above the image forming unit and including a sheet discharge tray, and a holding member configured to support the sub-board below the top surface member such that the second board extends in a direction intersecting with a plane on which the first board of the main board extends.

Abstract: A power adapter includes a first output port, a second output port, a motherboard, a first flyback power module, a second flyback power module, a bus capacitor and an EMI module. The first flyback power module has a first circuit board and is electrically connected to the first output port. The second flyback power module has a second circuit board and is electrically connected to the second output port. The EMI module has a third circuit board and is arranged on the motherboard. The first circuit board and the second circuit board are arranged in parallel with each other, and are arranged substantially perpendicular to the motherboard on a first side of the motherboard.

Abstract: An electrical arrangement for performing radio frequency isolation for microelectromechanical relay switches. A microelectromechanical relay switch comprises a beam configured to switch from a first position connected to an upper voltage source to a second position connected to a lower voltage source. The microelectromechanical relay switch further comprises at least one frequency isolation circuit or resistor disposed adjacent to the beam. The at least one frequency isolation circuit or resistor biases a direct current potential to allow for electrostatic actuation and further provides a path for transient electrical currents during switching.

Abstract: A circuit board includes at least one circuit board unit sequentially stacked in a thickness direction of the circuit board, an insulating layer, an electromagnetic shielding layer, and a barrier layer. The circuit board unit includes a substrate layer, and two conductive layers respectively disposed on two opposite sides of the substrate layer in a thickness direction of the substrate layer, and each of the conductive layers includes a plurality of signal lines. The insulating layer is located on a side of an outermost conductive layer away from the substrate layer. The electromagnetic shielding layer is located on a side of the insulating layer away from the substrate layer. The barrier layer is located between the electromagnetic shielding layer and the outermost conductive layer. The barrier layer at least covers a plurality of signal lines in the outermost conductive layer.

Abstract: The present disclosure refers to an apparatus for aligning at least two visual display monitors. A symmetrical pair of pads are joined by a linkage that allows for angular and lateral adjustment and are configured to be affixed to the surfaces of monitors for adjusting and bracing the monitors in a chosen orientation relative to each other.

Abstract: Systems and methods of securing an integrated circuit assembly includes: arranging a plurality of securing elements within a plurality of orifices fabricated within one or more layer components of a plurality of layer components of an integrated circuit assembly; applying a mechanical compression load against the integrated circuit assembly that uniformly compresses together the plurality of layer components of the integrated circuit assembly; after applying the mechanical compression load to the integrated circuit assembly, fastening the plurality of securing elements while the integrated circuit assembly is in a compressed state based on the mechanical compression load; and terminating the application of the mechanical compression load against the integrated circuit assembly based on the fastening of the plurality of securing elements.

Abstract: The present invention provides an epoxy resin composition that is provided with flexibility to combine impact resistance and mechanical strength, while maintaining epoxy resin-specific high elastic modulus, that reduces an increase in viscosity due to mixing, and that is excellent in heat resistance, storage stability, and solvent resistance. Provided is an epoxy resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; a reactive diluent; and an epoxy resin, the epoxy resin composition having a sea-island phase separated structure after being cured.

Abstract: A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.

Abstract: A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 ?m or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in3.

Abstract: An embodiment of the present disclosure provides a substrate structure applied to a power module. In the substrate structure applied to a power module, the substrate includes an upper substrate and a lower substrate, a plurality of semiconductor devices disposed on the lower substrate, a source signal electrode transmitting a source signal to the semiconductor devices, and a gate signal electrode transmitting a gate signal to the semiconductor devices, one of the source signal electrode or the gate signal electrode is connected to the upper substrate through a conductive column, and a signal transmitted by one of the source signal electrode or the gate signal electrode is transmitted to the semiconductor devices through the upper substrate.

Abstract: A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 ?m or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in3.

Abstract: A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.

Abstract: Methods of making a top-plane connection in an electro-optic device and devices including such connections. A through hole is created through a rear substrate to provide a connection between a conductor coupled to the rear substrate and a light-transmissive conductive layer coupled to a top transparent substrate. The hole is subsequently filled with a top-plane connection material that provides an electrical connection between the conductor and the light-transmissive conductive layer, but does not provide an electrical connection between a separate rear conductive layer and the light-transmissive conductor.

Abstract: Disclosed is a circuit board assembly, a display device, and a method for manufacturing the same. The display device includes a main board, a logic board, a X-coordinate circuit board and a display panel. The main board and the logic board forms a circuit board assembly with a stacked structure, and the logic board is connected to the X-coordinate circuit board by a flexible flat cable line.

Abstract: A display module includes a display panel for displaying an image, and a protective film adhered to a back surface of the display panel. The protective film includes a compensation layer being in contact with the back surface of the display panel, a first release layer disposed under the compensation layer, a cushion layer disposed under the first release layer, and a second release layer disposed under the cushion layer. An adhesive strength of the first release layer is less than an adhesive strength of the second release layer.

Abstract: An electronic assembly includes a plurality of circuit boards each comprising engagement grooves spaced around an outer wall. The assembly includes a plurality of spacers with alignment elements. The alignment elements comprise a first tab and a first tab receiver extending in a first axial direction. The alignment elements further comprising a second tab extending in a second axial direction opposite the first and a second tab receiver extending in the second axial direction. A first spacer is disposed between a first circuit board and a second circuit board. The first tab of the first spacer is disposed within a first engagement groove of the first circuit board. The second circuit board is disposed between the first spacer and a second spacer. A second tab of the first spacer is received in a second engagement groove of the second circuit board and a first tab receiver of the second spacer.

Abstract: Provided are a method of manufacturing a display apparatus and the display apparatus. A method of manufacturing a display apparatus includes preparing a first substrate including a display; adhering a second substrate to the first substrate by using a sealing element; exposing the sealing element by using a blocking member including a plurality of blocking patterns arranged apart from one another; and cutting the first substrate and the second substrate along portions thereof inside the blocking member.

Abstract: The present disclosure relates to an electronic circuit having a three-dimensional design by comprising a set of two-dimensional electronic circuits, wherein the two-dimensional electronic circuits are coupled with each other by radiation. The disclosure further relates to a radar antenna system.

Abstract: An electronic device according to various embodiments comprises: a case for accommodating at least one electronic part; an upper cover for covering at least one part of an upper end of the case; and a connector, which is arranged on the upper cover, for electrically connecting an external module and the at least one electronic part, wherein the upper cover can guide heat generated from the at least one electronic part such that the heat is discharged to the outside along a side part of the upper cover. Additional other embodiments are possible.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: A flexible modularized system is configured to support graphics processing unit (GPU) cards of different dimensions. The system includes a riser bracket with attachment features for being coupled to a printed circuit board (PCB). The system further includes a fixing plate that is coupled to the riser bracket and which includes a plurality of adjustable holes. The system also includes a moving plate that is adjustably coupled to the fixing plate. The moving plate is movable between a plurality of positions. The moving plate has a first end that includes at least one latch, which engages the first adjustable hole in a first position and the second adjustable hole in a second position. The moving plate has a second end that is configured to secure in place one of the GPU cards relative to the PCB.

Abstract: Implementations include a display assembly for a switch assembly, comprising a display assembly touch overlay plate, wherein at least a portion of the display assembly touch overlay plate is comprised of a transparent or translucent material; a display, wherein the display is disposed underneath the display assembly touch overlay plate and wherein at least a portion of the display is visible through the portion of the display assembly touch overlay plate; a display assembly first housing and a display assembly second housing, wherein the display assembly touch overlay plate is in communication with the display assembly first housing, wherein a force applied to the display assembly touch overlay plate is at least partially transmitted from the display assembly touch overlay plate to the display assembly first housing to a switch assembly through a central portion of the display assembly first housing.

Abstract: An optical interconnect computing module having free space optical interconnects that form communication links with other systems with like optical interconnects and with computer blades contained within the computing module. The computing module adapts to changes in the position and orientation and other factors of the optical interconnects. The optical interconnects utilize solid-state electronic and optoelectronic components and optical components. The ability to adapt is controlled by an algorithm implemented in software, firmware and logic circuits. Computing modules within an equipment rack and between equipment racks as well as blades contained within a computing module may experience changes in position and orientation due to installation misalignment, servicing of equipment, vibrations, floor sagging, thermal expansion and contraction, earthquakes, line-of-sight obstructions, manufacturing imperfections and other sources.

Abstract: A keyboard assembly is provided. The keyboard assembly includes an enclosure for protecting the keyboard and other components associated therewith. The enclosure is configured to engage with one or more bracket or bracket assembly, thereby providing a mounting system for supporting the enclosure. By engaging the enclosure with the bracket, the position of the keyboard can be controlled and maintained. By disengaging the enclosure from the bracket, the bracket can be moved and/or the enclosure can be engaged with a different bracket, thereby satisfying different requirements and/or preferences associated with the location of the keyboard.

Abstract: A connection device connecting a plurality of PCB connectors with a printed circuit board includes a first positioning rib, a second positioning rib, and an elastic member between the first positioning rib and the second positioning rib. A distance between the first positioning rib and the second positioning rib is adjustable by deformation of the elastic member.

Abstract: A mammography installation includes a first compression device; a second compression device including an integrated X-ray detector; an X-ray emitter; a support device, arranged at the first compression device or at the second compression device, and including an integrated ultrasound transducer, the support device and the integrated ultrasound transducer being designed to be deformable so as to be adaptable to the breast of a patient, the integrated ultrasound transducer being arranged on an elastic substrate; and a breast locating region, provided between the support device and the first compression device or the second compression device that is situated opposite the first compression device or the second compression device at which the support device is arranged. The breast of the patient is positionable in the breast locating region. Further, the integrated ultrasound transducer is oriented in a direction of the breast locating region.

Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

Abstract: A display module includes a display panel for displaying an image, and a protective film adhered to a back surface of the display panel. The protective film includes a compensation layer being in contact with the back surface of the display panel, a first release layer disposed under the compensation layer, a cushion layer disposed under the first release layer, and a second release layer disposed under the cushion layer. An adhesive strength of the first release layer is less than an adhesive strength of the second release layer.

Abstract: The present disclosure relates to an electronic device. A test board having improved reliability according to the present disclosure includes a main board, a storage device connector positioned at an upper section of the main board and configured to vertically combine the main board and a storage device with each other, an analysis signal output terminal positioned at the upper section of the main board and configured to output an analysis signal for testing the storage device or communication between the storage device and a host, a host connector connected to a first side section of the main board and configured to combine the main board and the host with each other; and a first sub board detachably connected to a second side section of the main board.

Abstract: A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.

Abstract: Systems (100) and methods (1500) for using a pressure vessel. The methods comprise: obtaining the pressure vessel comprising a shell and an insert having an interference fit with the shell whereby the insert is locked in place within the shell via interfacial pressure; inserting at least one electronic component in a first hollow cavity formed in the insert; mechanically supporting the at least one electronic component using a structural feature of the insert; and transferring heat from the electronic component to an external environment via a heat transfer path that comprises a full surface area of the insert's outer surface abutting the shell's inner surface.

Abstract: Various implementations include a switch assembly that includes a housing and at least two printed circuit boards (PCBs) that are disposed within the housing and are axially arranged relative to each other. One or more force sensors are disposed on one of the PCBs, and, in some implementations, the one or more force sensors receive force input received by a touch overlay plate. Signals from the force sensors are processed to determine a magnitude, acceleration, and/or location of the force input, and a haptic feedback response is received by the touch overlay plate. The haptic feedback response is based on the force magnitude, acceleration, and/or location of input, according to some implementations. Axially arranging the PCBs reduces the footprint of the switch assembly and allows for the inclusion of more electrical components in the switch assembly, according to some implementations.

Abstract: A module is disclosed. In one example, the module includes a carrier, an at least partially thermally conductive and electrically insulating body mounted on only a part of a main surface of the carrier, an at least partially electrically conductive redistribution structure on the thermally conductive and electrically insulating body, an electronic chip mounted on the redistribution structure and above the thermally conductive and electrically insulating body, and an encapsulant encapsulating at least part of the carrier, at least part of the thermally conductive and electrically insulating body, at least part of the redistribution structure, and at least part of the electronic chip.

Abstract: A keyboard/keyboard enclosure is provided. The keyboard/keyboard enclosure includes front and rear shells removably connected together and made of a durable metal material such as aluminum. The enclosure defines a cavity and various features for positioning and/or restraining a PCB within the cavity. A keypad is positioned on the front surface of the front shell. End caps extend into the cavity from opposed ends of the front and rear shells, thereby selectively securing the front and rear shells together and/or further positioning and/or restraining the PCB within the cavity.

Abstract: A card assembly includes a card that includes a first edge and an opposing second edge, where the first edge includes an edge connector; and device sockets mounted to the card and operatively coupled to the edge connector, where each of the device sockets defines an end of a respective device bay, where each of the device bays is disposed at an angle of approximately 25 degrees to approximately 75 degrees with respect to the edge connector.

Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.

Abstract: Device (1) comprising a multitude of server modules (3). The server modules (3) are removable, are substantially plate shaped and extend parallel to each other. Each one of the server modules (3) is connected to cable passages (61a) of a first switch (4) by first data cables (6a) and to cable passages (61b) of a second switch (4) by second data cables (6b. The first switch (4) extends perpendicular to and adjacent an edge of the server modules (3) The cable passages (61a) of said first switch (4) extend in a first array and the cable passages (61b) of said second switch (4) extend in a second array. The second array of cable passages (61b) is mounted on a bracket (7) which is mounted on the second switch (4). The bracket (7) extends at a distance from the second switch (4) and from the first array.

Abstract: A electronic device module includes a first substrate; electronic devices mounted on the first substrate; a second substrate coupled to a lower surface of the first substrate, the second substrate including a device accommodating portion; a sealing portion configured to seal an electronic device in the device accommodating portion; and an external connection terminal bonded to an electrode pad disposed in a lower surface of the second substrate. Bonding surfaces of the electrode pad and the external connection terminal are disposed on a same plane as a lower surface of the sealing portion.

Abstract: The present disclosure provides a home security device assembly for mailing by direct mail package. The home security device assembly includes a first panel. The first panel is characterized by rectangular shape. The first panel includes a ledge extending from a first side of the first panel. The first panel includes a hollow circular tapered intrusion. The home security device assembly includes a second panel. The second panel is characterized by rectangular shape. Dimensions of rectangular shape of the second panel are identical to corresponding dimensions of rectangular shape of the first panel. The second panel includes a continuous ledge extending from three sides of the second panel. The home security device assembly includes an electrical components sub-assembly. The substantially cuboidal housing encapsulates a first section of the electrical component sub-assembly. The electrical component sub-assembly includes at least one sensor.

Abstract: An electrical contact-making arrangement for electrical power components, having a printed circuit board for mounting the electrical power components, and a line element which is fixed to the printed circuit board. The line element has a metal main body and the main body has an electrical connection contact in order to electrically contact-connect the line element to the printed circuit board or one of the electrical components. The main body has a fastening section in order to fix the line element to the printed circuit board. The line element is produced separately from the printed circuit board, and the electrical connection contact and the fastening section are formed separately from one another.

Abstract: A rectification module includes a transformer, a connecting unit and a rectification unit. The transformer includes a first lateral region, a second lateral region and at least one secondary winding assembly. The second lateral region is located beside the first lateral region. The secondary winding assembly includes plural outlet ends. The plural outlet ends are arranged near the first lateral region. The connecting unit is located at the first lateral region, and includes plural conducting plates. Each of the conducting plates includes at least one opening and at least one connecting structure. The conducting plates are partially or completely stacked on each other. The outlet ends are accommodated within the corresponding openings. The conducting plates are fixed on the first lateral region. The connecting structures face the second lateral region. The rectification unit includes a circuit board and plural rectifier components.

Abstract: A keyboard/keyboard enclosure is provided. The keyboard/keyboard enclosure includes front and rear shells removably connected together and made of a durable metal material such as aluminum. The enclosure defines a cavity and various features for positioning and/or restraining a PCB within the cavity. A keypad is positioned on the front surface of the front shell. End caps extend into the cavity from opposed ends of the front and rear shells, thereby selectively securing the front and rear shells together and/or further positioning and/or restraining the PCB within the cavity.

Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.

Abstract: A board adapter system includes a first adapter board. A secondary first processor coupling is located on the first adapter board, and the first adapter board passes signals between a primary first processor coupling on a first board and a first processor coupled to the secondary first processor coupling when the first adapter board engages the primary first processor coupling. A first/third processor communication bus extends between the secondary first processor coupling and the second board connector on the first adapter board, and passes signals between the first processor and a third processor that is coupled to the second board connector. A first/fourth processor communication bus extends between the secondary first processor coupling and the second board connector, and passes signals between the first processor and a fourth processor that is coupled to the second board connector on the first adapter board.

Abstract: A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip.