Plural Patents (Class 361/784)
  • Patent number: 10973139
    Abstract: A flexible modularized system is configured to support graphics processing unit (GPU) cards of different dimensions. The system includes a riser bracket with attachment features for being coupled to a printed circuit board (PCB). The system further includes a fixing plate that is coupled to the riser bracket and which includes a plurality of adjustable holes. The system also includes a moving plate that is adjustably coupled to the fixing plate. The moving plate is movable between a plurality of positions. The moving plate has a first end that includes at least one latch, which engages the first adjustable hole in a first position and the second adjustable hole in a second position. The moving plate has a second end that is configured to secure in place one of the GPU cards relative to the PCB.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: April 6, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Chun Chang, Jun-Yu Chen, Ting-Kuang Pao
  • Patent number: 10963053
    Abstract: Implementations include a display assembly for a switch assembly, comprising a display assembly touch overlay plate, wherein at least a portion of the display assembly touch overlay plate is comprised of a transparent or translucent material; a display, wherein the display is disposed underneath the display assembly touch overlay plate and wherein at least a portion of the display is visible through the portion of the display assembly touch overlay plate; a display assembly first housing and a display assembly second housing, wherein the display assembly touch overlay plate is in communication with the display assembly first housing, wherein a force applied to the display assembly touch overlay plate is at least partially transmitted from the display assembly touch overlay plate to the display assembly first housing to a switch assembly through a central portion of the display assembly first housing.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: March 30, 2021
    Assignee: Joyson Safety Systems Acquisition LLC
    Inventors: Jason Lisseman, David Andrews, Daniel Alt, Nicholas Borgerding, Jason Peters, Erick Staszak, Filippo Leone
  • Patent number: 10944488
    Abstract: An optical interconnect computing module having free space optical interconnects that form communication links with other systems with like optical interconnects and with computer blades contained within the computing module. The computing module adapts to changes in the position and orientation and other factors of the optical interconnects. The optical interconnects utilize solid-state electronic and optoelectronic components and optical components. The ability to adapt is controlled by an algorithm implemented in software, firmware and logic circuits. Computing modules within an equipment rack and between equipment racks as well as blades contained within a computing module may experience changes in position and orientation due to installation misalignment, servicing of equipment, vibrations, floor sagging, thermal expansion and contraction, earthquakes, line-of-sight obstructions, manufacturing imperfections and other sources.
    Type: Grant
    Filed: August 10, 2019
    Date of Patent: March 9, 2021
    Inventor: Forrest Ivan Rose
  • Patent number: 10936087
    Abstract: A keyboard assembly is provided. The keyboard assembly includes an enclosure for protecting the keyboard and other components associated therewith. The enclosure is configured to engage with one or more bracket or bracket assembly, thereby providing a mounting system for supporting the enclosure. By engaging the enclosure with the bracket, the position of the keyboard can be controlled and maintained. By disengaging the enclosure from the bracket, the bracket can be moved and/or the enclosure can be engaged with a different bracket, thereby satisfying different requirements and/or preferences associated with the location of the keyboard.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: March 2, 2021
    Inventor: Kevin R. Stoops
  • Patent number: 10916871
    Abstract: A connection device connecting a plurality of PCB connectors with a printed circuit board includes a first positioning rib, a second positioning rib, and an elastic member between the first positioning rib and the second positioning rib. A distance between the first positioning rib and the second positioning rib is adjustable by deformation of the elastic member.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: February 9, 2021
    Assignees: TE Connectivity Italia Distribution S.r.l., TE Connectivity Italia S.r.l.
    Inventor: Davide Chiarelli
  • Patent number: 10874366
    Abstract: A mammography installation includes a first compression device; a second compression device including an integrated X-ray detector; an X-ray emitter; a support device, arranged at the first compression device or at the second compression device, and including an integrated ultrasound transducer, the support device and the integrated ultrasound transducer being designed to be deformable so as to be adaptable to the breast of a patient, the integrated ultrasound transducer being arranged on an elastic substrate; and a breast locating region, provided between the support device and the first compression device or the second compression device that is situated opposite the first compression device or the second compression device at which the support device is arranged. The breast of the patient is positionable in the breast locating region. Further, the integrated ultrasound transducer is oriented in a direction of the breast locating region.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: December 29, 2020
    Assignee: SIEMENS HEALTHCARE GMBH
    Inventors: Peter Michael Dueppenbecker, Marcus Radicke, Oliver Schmidt
  • Patent number: 10849219
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 24, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Patent number: 10777769
    Abstract: A display module includes a display panel for displaying an image, and a protective film adhered to a back surface of the display panel. The protective film includes a compensation layer being in contact with the back surface of the display panel, a first release layer disposed under the compensation layer, a cushion layer disposed under the first release layer, and a second release layer disposed under the cushion layer. An adhesive strength of the first release layer is less than an adhesive strength of the second release layer.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: September 15, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dongwan Choi, Doyoub Kim
  • Patent number: 10772230
    Abstract: The present disclosure relates to an electronic device. A test board having improved reliability according to the present disclosure includes a main board, a storage device connector positioned at an upper section of the main board and configured to vertically combine the main board and a storage device with each other, an analysis signal output terminal positioned at the upper section of the main board and configured to output an analysis signal for testing the storage device or communication between the storage device and a host, a host connector connected to a first side section of the main board and configured to combine the main board and the host with each other; and a first sub board detachably connected to a second side section of the main board.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: September 8, 2020
    Assignee: SK hynix Inc.
    Inventor: Myung Seob Yoo
  • Patent number: 10757807
    Abstract: A printed wiring board includes a main substrate and a rising substrate. A support portion of the rising substrate is inserted into a slit in the main substrate. In a direction in which a plurality of first electrodes are aligned, a width of each of the plurality of first electrodes is larger than a width of each of a plurality of second electrodes, and the width of each of the plurality of second electrodes is arranged to fit within the width of each of the plurality of first electrodes.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: August 25, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shunsuke Sasaki, Kohei Sato, Yusuke Morimoto
  • Patent number: 10721831
    Abstract: Systems (100) and methods (1500) for using a pressure vessel. The methods comprise: obtaining the pressure vessel comprising a shell and an insert having an interference fit with the shell whereby the insert is locked in place within the shell via interfacial pressure; inserting at least one electronic component in a first hollow cavity formed in the insert; mechanically supporting the at least one electronic component using a structural feature of the insert; and transferring heat from the electronic component to an external environment via a heat transfer path that comprises a full surface area of the insert's outer surface abutting the shell's inner surface.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: July 21, 2020
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: G. Randall Straley, Brian C. Strom, James B. Loafman, Rebecca R. Coates
  • Patent number: 10707034
    Abstract: Various implementations include a switch assembly that includes a housing and at least two printed circuit boards (PCBs) that are disposed within the housing and are axially arranged relative to each other. One or more force sensors are disposed on one of the PCBs, and, in some implementations, the one or more force sensors receive force input received by a touch overlay plate. Signals from the force sensors are processed to determine a magnitude, acceleration, and/or location of the force input, and a haptic feedback response is received by the touch overlay plate. The haptic feedback response is based on the force magnitude, acceleration, and/or location of input, according to some implementations. Axially arranging the PCBs reduces the footprint of the switch assembly and allows for the inclusion of more electrical components in the switch assembly, according to some implementations.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: July 7, 2020
    Assignee: JOYSON SAFETY SYSTEMS ACQUISITION LLC
    Inventors: Jason Lisseman, David Andrews, Daniel Alt, Nicholas Borgerding, Jason Peters, Erick Staszak, Prathap Chandra
  • Patent number: 10679978
    Abstract: A module is disclosed. In one example, the module includes a carrier, an at least partially thermally conductive and electrically insulating body mounted on only a part of a main surface of the carrier, an at least partially electrically conductive redistribution structure on the thermally conductive and electrically insulating body, an electronic chip mounted on the redistribution structure and above the thermally conductive and electrically insulating body, and an encapsulant encapsulating at least part of the carrier, at least part of the thermally conductive and electrically insulating body, at least part of the redistribution structure, and at least part of the electronic chip.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: June 9, 2020
    Assignee: Infineon Technologies AG
    Inventors: Alexander Roth, Juergen Hoegerl, Hans-Joachim Schulze, Hans-Joerg Timme
  • Patent number: 10642374
    Abstract: A keyboard/keyboard enclosure is provided. The keyboard/keyboard enclosure includes front and rear shells removably connected together and made of a durable metal material such as aluminum. The enclosure defines a cavity and various features for positioning and/or restraining a PCB within the cavity. A keypad is positioned on the front surface of the front shell. End caps extend into the cavity from opposed ends of the front and rear shells, thereby selectively securing the front and rear shells together and/or further positioning and/or restraining the PCB within the cavity.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: May 5, 2020
    Inventor: Kevin R. Stoops
  • Patent number: 10534410
    Abstract: A card assembly includes a card that includes a first edge and an opposing second edge, where the first edge includes an edge connector; and device sockets mounted to the card and operatively coupled to the edge connector, where each of the device sockets defines an end of a respective device bay, where each of the device bays is disposed at an angle of approximately 25 degrees to approximately 75 degrees with respect to the edge connector.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: January 14, 2020
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Omar Ali Ali, Rodrigo Samper, Marc Richard Pamley, Alan Ladd Painter
  • Patent number: 10528039
    Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: January 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: WeiFeng Zhang, Guo Wei, Lin Zhao, Zhipeng Wang, Qiuyi Yu, Zhongfeng Yang, YanLong Hou
  • Patent number: 10524380
    Abstract: Device (1) comprising a multitude of server modules (3). The server modules (3) are removable, are substantially plate shaped and extend parallel to each other. Each one of the server modules (3) is connected to cable passages (61a) of a first switch (4) by first data cables (6a) and to cable passages (61b) of a second switch (4) by second data cables (6b. The first switch (4) extends perpendicular to and adjacent an edge of the server modules (3) The cable passages (61a) of said first switch (4) extend in a first array and the cable passages (61b) of said second switch (4) extend in a second array. The second array of cable passages (61b) is mounted on a bracket (7) which is mounted on the second switch (4). The bracket (7) extends at a distance from the second switch (4) and from the first array.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: December 31, 2019
    Assignee: Aecorsis B.V.
    Inventor: Dirk Roelof Brink
  • Patent number: 10431548
    Abstract: A electronic device module includes a first substrate; electronic devices mounted on the first substrate; a second substrate coupled to a lower surface of the first substrate, the second substrate including a device accommodating portion; a sealing portion configured to seal an electronic device in the device accommodating portion; and an external connection terminal bonded to an electrode pad disposed in a lower surface of the second substrate. Bonding surfaces of the electrode pad and the external connection terminal are disposed on a same plane as a lower surface of the sealing portion.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: October 1, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Young Pyo Lee
  • Patent number: 10426050
    Abstract: The present disclosure provides a home security device assembly for mailing by direct mail package. The home security device assembly includes a first panel. The first panel is characterized by rectangular shape. The first panel includes a ledge extending from a first side of the first panel. The first panel includes a hollow circular tapered intrusion. The home security device assembly includes a second panel. The second panel is characterized by rectangular shape. Dimensions of rectangular shape of the second panel are identical to corresponding dimensions of rectangular shape of the first panel. The second panel includes a continuous ledge extending from three sides of the second panel. The home security device assembly includes an electrical components sub-assembly. The substantially cuboidal housing encapsulates a first section of the electrical component sub-assembly. The electrical component sub-assembly includes at least one sensor.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: September 24, 2019
    Assignee: Roo Inc.
    Inventors: Jingren Xu, David Sutton, Dhruv Garg, Maximus Yaney
  • Patent number: 10412822
    Abstract: An electrical contact-making arrangement for electrical power components, having a printed circuit board for mounting the electrical power components, and a line element which is fixed to the printed circuit board. The line element has a metal main body and the main body has an electrical connection contact in order to electrically contact-connect the line element to the printed circuit board or one of the electrical components. The main body has a fastening section in order to fix the line element to the printed circuit board. The line element is produced separately from the printed circuit board, and the electrical connection contact and the fastening section are formed separately from one another.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: September 10, 2019
    Assignee: Dr. Ing. h.c. F. Porsche Aktiengesellschaft
    Inventors: Stefan Götz, Pascal Scherz
  • Patent number: 10389266
    Abstract: A rectification module includes a transformer, a connecting unit and a rectification unit. The transformer includes a first lateral region, a second lateral region and at least one secondary winding assembly. The second lateral region is located beside the first lateral region. The secondary winding assembly includes plural outlet ends. The plural outlet ends are arranged near the first lateral region. The connecting unit is located at the first lateral region, and includes plural conducting plates. Each of the conducting plates includes at least one opening and at least one connecting structure. The conducting plates are partially or completely stacked on each other. The outlet ends are accommodated within the corresponding openings. The conducting plates are fixed on the first lateral region. The connecting structures face the second lateral region. The rectification unit includes a circuit board and plural rectifier components.
    Type: Grant
    Filed: June 30, 2018
    Date of Patent: August 20, 2019
    Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
    Inventors: Hao Lu, Tianding Hong, Bofeng Xu, Jie Ruan, Jinfa Zhang
  • Patent number: 10345920
    Abstract: A keyboard/keyboard enclosure is provided. The keyboard/keyboard enclosure includes front and rear shells removably connected together and made of a durable metal material such as aluminum. The enclosure defines a cavity and various features for positioning and/or restraining a PCB within the cavity. A keypad is positioned on the front surface of the front shell. End caps extend into the cavity from opposed ends of the front and rear shells, thereby selectively securing the front and rear shells together and/or further positioning and/or restraining the PCB within the cavity.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: July 9, 2019
    Inventor: Kevin R. Stoops
  • Patent number: 10297553
    Abstract: An electronic component package includes first and second wiring parts including insulating layers, conductive patterns formed in the insulating layers, and conductive vias penetrating through the insulating layers, to be connected to the conductive patterns, respectively; a frame disposed between the first and second wiring parts and having conductive connection parts electrically connecting one or more through-holes with the first and second wiring parts and an electronic component disposed to be surrounded by the through-hole, to thereby be connected to the first wiring part, wherein the conductive patterns formed to be adjacent to the electronic component among the conductive patterns of the first wiring part are embedded in the insulating layer of the first wiring part.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: May 21, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Ho Baek, Sang Kun Kim, Ye Jeong Kim, Jae Ean Lee, Jae Hoon Choi
  • Patent number: 10296481
    Abstract: A board adapter system includes a first adapter board. A secondary first processor coupling is located on the first adapter board, and the first adapter board passes signals between a primary first processor coupling on a first board and a first processor coupled to the secondary first processor coupling when the first adapter board engages the primary first processor coupling. A first/third processor communication bus extends between the secondary first processor coupling and the second board connector on the first adapter board, and passes signals between the first processor and a third processor that is coupled to the second board connector. A first/fourth processor communication bus extends between the secondary first processor coupling and the second board connector, and passes signals between the first processor and a fourth processor that is coupled to the second board connector on the first adapter board.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: May 21, 2019
    Assignee: Dell Products L.P.
    Inventors: Kevin Warren Mundt, Sandor Farkas, Bhyrav Mutnury
  • Patent number: 10276467
    Abstract: A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a reinforcing layer disposed on the encapsulant. The first interconnection member and the second interconnection member respectively include redistribution layers electrically connected to the connection pads of the semiconductor chip.
    Type: Grant
    Filed: February 23, 2017
    Date of Patent: April 30, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Sil Kim, Doo Hwan Lee, Dae Jung Byun, Tae Ho Ko, Yeong A Kim
  • Patent number: 10201077
    Abstract: A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: February 5, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuu Sugimoto, Hiroyuki Tanabe, Naohiro Terada
  • Patent number: 10064260
    Abstract: A high voltage valve arrangement includes a high voltage valve unit; an external electric shield structure arranged at least partially around the high voltage modular valve unit and a grounding system. The grounding system includes a grounding system configured to be remotely extended from a retracted position to an extended position, whereby the extendable grounding device establishes electric connection with the external shield structure when it is extended from the retracted position.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: August 28, 2018
    Assignee: ABB SCHWEIZ AG
    Inventors: Björn Sandin, Christer Sjöberg, Erik Doré, Johannes Gran Hirvioja
  • Patent number: 10061309
    Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: August 28, 2018
    Assignee: International Business Machines Corporation
    Inventors: WeiFeng Zhang, Guo Wei, Lin Zhao, Zhipeng Wang, Qiuyi Yu, Zhongfeng Yang, YanLong Hou
  • Patent number: 10006787
    Abstract: A high density sensor module includes a first substrate, a plurality of first sensors positioned on the first substrate, a plurality of first conductive rods positioned on the corresponding first sensors, a first package resin member covering the first sensors and one end of each of the first conductive rods, a second substrate positioned on the first package resin member, a plurality of second sensors positioned on the second substrate, and a second package resin member covering the second sensors and another end of each of the first conductive rods. The first conductive rods pass through the first package resin member and the second substrate. The high density sensor module has a two-layer structure to increase the number of the sensors such that the sensing density and resolution of the high-density sensor module are increased.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: June 26, 2018
    Assignee: ScienBiziP Consulting(Shenzhen)Co., Ltd.
    Inventors: Tsung-Ju Wu, Jen-Tsorng Chang, Hsin-Pei Hsieh, Yi-Cheng Lin
  • Patent number: 10004140
    Abstract: A three-dimensional circuit substrate according to the present disclosure includes a base body and a wiring pattern formed on an outer surface of the base body. Also, the outer surface of the base body includes a mounting surface which faces the substrate when the three-dimensional circuit substrate is mounted onto the substrate, and an installation surface which is different from the mounting surface and is a surface where an electronic component is installable. Further, a recess is formed on a side where the mounting surface is provided in the base body.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: June 19, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Mitsuru Kobayashi
  • Patent number: 9963627
    Abstract: Nanostructured phase change materials (PCMs) which are heterogeneous materials having at least two phases, at least one of the phases having at least one of its dimensions in the nanoscale, and comprising a first agent that undergoes an endothermic phase transition at a desired temperature and a second agent that assists in maintaining a nanostructure, are provided. There are also provided methods for manufacturing such PCMs, and applications thereof for providing thermoregulatory coatings and articles containing such coatings for use in a wide range of applications, such as cooling textiles, wipes, packaging, films, walls and building materials.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: May 8, 2018
    Inventors: Sumitra Rajagopalan, Giovanni Alexander Fabra Prieto
  • Patent number: 9887183
    Abstract: The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: February 6, 2018
    Assignee: Delta Electronics, Inc.
    Inventors: Tao Wang, Zhenqing Zhao, Zeng Li, Kai Lu
  • Patent number: 9706025
    Abstract: There is provided a transportable electronic device in which a configuration related to a protective cover can be simplified. A transportable digital photo frame includes a cylindrical main unit that is divided into four areas along the circumferential direction, and a tubular cover that houses at least a part of the main unit to protect the circumferential surface of the main unit, the tubular cover having an opening formed in its circumferential surface for exposing one area to the outside. The tubular cover is rotatable relative to the main unit so that the areas protected by the tubular cover can be switched.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: July 11, 2017
    Assignee: TEAC Corporation
    Inventors: Tomohiro Ikeda, Eiji Ueda
  • Patent number: 9706658
    Abstract: Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: July 11, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Gi Suk Kim, Yang Je Lee, Hee Ju Park, Jong Hyung Kim, Chang Hyun Kim, Kyeong Seon Chae
  • Patent number: 9603288
    Abstract: A housing for electronic/electrical components includes an inner panel and an outer panel, a strip of metal plate, and a strip of shape memory material. The inner panel and the outer panel are disposed parallel to each other to define an internal space. The strip of metal plate extends from an inner surface of the outer panel. The strip of shape memory material extends from an inner surface of the inner panel and is attached to or detached from the metal plate on the outer panel while changing into an original straight shape or a bent shape according to a temperature variation. When the temperature increases beyond a first transition temperature, the shape memory material straightens to form a heat transfer path. When the temperature falls below a second transition temperature, the shape memory material bends and is separated from the metal plate to interrupt the heat transfer path.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: March 21, 2017
    Assignee: Hyundai Motor Company
    Inventors: Jin Woo Kwak, Kyong Hwa Song, Byung Sam Choi, Han Saem Lee
  • Patent number: 9549464
    Abstract: The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: January 17, 2017
    Assignee: Apple Inc.
    Inventors: Shayan Malek, John B. Ardisana, II, Dhaval N. Shah
  • Patent number: 9516756
    Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: December 6, 2016
    Assignee: EZEK LAB COMPANY LIMITED
    Inventors: Sheng-Che Huang, Yu-Tse Liu, Wei-Han Hu, Chien-Hung Lee
  • Patent number: 9507236
    Abstract: An optical module includes: an optical modulator that performs an optical modulation process by using electrical signals input from a plurality of terminals; and a flexible substrate that has flexibility and electrically connects the optical modulator and a predetermined connector to each other via a plurality of wiring patterns formed on first and second surfaces thereof. The flexible substrate includes: a first pad including a first conductor pattern connected, on the first surface, to a wiring pattern, a second conductor pattern formed on the second surface, and a through hole that connects the first conductor pattern and the second conductor pattern to each other; and a second pad including a third conductor pattern connected, on the second surface, to a wiring pattern, a fourth conductor pattern formed on the first surface, and a through hole that connects the third conductor pattern and the fourth conductor pattern to each other.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: November 29, 2016
    Assignee: FUJITSU OPTICAL COMPONENTS LIMITED
    Inventor: Masaki Sugiyama
  • Patent number: 9480190
    Abstract: A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB.
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: October 25, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Hae-Kwan Seo
  • Patent number: 9462720
    Abstract: An aligning apparatus for mounting cards into a housing space is provided. The aligning apparatus includes a first line card having a mating portion and a card guide assembly coupled to the first line card. The mating portion is configured to mate with a backplane of the housing space. The card guide assembly varies from a first height at a first portion to a second height at a second portion. The varying heights correspond to an arrangement of components on a neighboring card. The first and second portions are configured to guide directional movement of the first line card in relation to one or more components on the neighboring card during insertion of the first line card into the housing space. In this regard, the first line card is guided past the one or more components on the neighboring card as the mating portion of the first line card is moved toward the backplane.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: October 4, 2016
    Assignee: Google Inc.
    Inventors: Jonathan David Beck, Kenneth Dale Shaul, Soheil Farshchian, Roy Michael Bannon
  • Patent number: 9351403
    Abstract: Disclosed herein is a portable terminal, including: a case; a first substrate disposed at one side of the case; a second substrate spaced from the first substrate to form a battery installing space; and a connection substrate electrically connecting between the first substrate and the second substrate and disposed in parallel with a side of the case.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: May 24, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gi Suk Kim, Yang Je Lee, Hee Ju Park, Jong Hyung Kim, Chang Hyun Kim, Kyeong Seon Chae
  • Patent number: 9348377
    Abstract: Various embodiments described herein include systems, methods and/or devices used to dissipate heat generated by electronic components in an electronic system (e.g., a memory system that includes closely spaced memory modules). In one aspect, an electronic assembly includes a first circuit board with one or more heat generating components coupled thereto. The electronic assembly further includes a second circuit board with one or more heat sensitive components coupled thereto. The electronic assembly also includes a thermal barrier interconnect. The thermal barrier interconnect electrically couples the first circuit board to the second circuit board. In some embodiments, thermal barrier interconnect is a flexible interconnect with a lower thermal conductivity than the first circuit board and the second circuit board. The thermal barrier interconnect forms a thermal barrier between the first and second circuit boards which protects the heat sensitive components from the heat generating components.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: May 24, 2016
    Assignee: SANDISK ENTERPRISE IP LLC
    Inventors: David Dean, Robert W. Ellis
  • Patent number: 9345126
    Abstract: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: May 17, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Sou Hoshi, Nobuaki Yamashita, Yusuke Murai
  • Patent number: 9265182
    Abstract: A flat panel display (FPD) including a display panel for displaying an image; a film substrate electrically connected to the display panel, the film substrate including driving circuits; a printed circuit board (PCB) electrically connected to the film substrate, the printed circuit board providing a signal for displaying the image; and a heat radiating unit attached to one surface of the film substrate, the heat radiating unit contacting at least one of the display panel and the PCB.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: February 16, 2016
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Hae-Kwan Seo
  • Patent number: 9256026
    Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each other on the same side of a substrate in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. In addition, an input/output (I/O) integrated circuit is coupled to the optical integrated circuit between the substrate and the optical integrated circuit. This I/O integrated circuit includes high-speed I/O circuits and energy-efficient driver and receiver circuits and communicates with optical devices on the optical integrated circuit. By integrating the optical integrated circuit, the integrated circuit and the I/O integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: February 9, 2016
    Assignee: ORACLE INTERNATIONAL CORPORATION
    Inventors: Hiren D. Thacker, Ashok V. Krishnamoorthy, Robert David Hopkins, II, Jon Lexau, Ronald Ho, John E. Cunningham
  • Patent number: 9252077
    Abstract: Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: February 2, 2016
    Assignee: Intel Corporation
    Inventors: Wolfgang Molzer, Edmund Goetz, Reinhard Mahnkopf, Bernd Memmler
  • Patent number: 9182784
    Abstract: A double-sided emission type display device includes a first substrate having a first connection and a first protruded portion extending in a first direction; a first display unit at the first substrate; a second substrate coupled to the first substrate, comprising a second connection and a second protruded portion extending in the first direction; a second display unit at the second substrate; and a first flexible printed circuit board (FPCB) including a first connecting portion coupled to the first connection and a second connecting portion coupled to the second connection.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: November 10, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyo-Sang Yang, Jin-Oh Park, Dong-Wan Choi
  • Patent number: 9042117
    Abstract: A semiconductor device effectively suppress the problem of mutual interaction occurring between an inductor element and wires positioned above the inductor element formed over the same chip. A semiconductor device includes a semiconductor substrate and a multi-wiring layer formed overlying that semiconductor substrate, and in which the multi-wiring layer includes: the inductor element and three successive wires and a fourth wire formed above the inductor element; and two shielded conductors at a fixed voltage potential and covering the inductor element as seen from a flat view, and formed between the inductor element and three successive wires and a fourth wire formed above the inductor element.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: May 26, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Kenichiro Hijioka, Akira Tanabe, Yoshihiro Hayashi
  • Patent number: 9042115
    Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heung-Kyu Kwon, Min-Ok Na, Sung-Woo Park, Ji-Hyun Park, Su-Min Park
  • Patent number: 9030838
    Abstract: Provided is a package substrate and a semiconductor package. The package substrate includes a main body having an upper surface and a lower surface opposite to the upper surface, a plurality of external terminals attached to the lower surface, and a plurality of grooves formed in regions of the lower surface to which the plurality of external terminals is not attached. The semiconductor package includes a package substrate, a semiconductor chip mounted on the upper surface of the semiconductor substrate, and a board providing a region mounted with the package substrate and being mounted with a plurality of mounting elements which are vertically aligned with the plurality of grooves and are inserted into the plurality of grooves.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: May 12, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-Ho You, Heeseok Lee, Chiyoung Lee, Yun-Hee Lee