Abstract: In one embodiment, an apparatus includes a cover configured for installation over a connector mounted on a printed circuit board and operable to couple a module to the printed circuit board, the cover comprises a lower surface for contact with the printed circuit board and a slot for receiving the module for attachment of the module to the connector. The cover encloses contacts at the connector for mating with the module and the printed circuit board to prevent corrosion of the contacts.

Abstract: In one embodiment, an apparatus includes a frame for attaching to a module with contacts of the module exposed for mating with a connector operable to couple the module to a printed circuit board, the frame comprising a seal for positioning on opposing faces of the module adjacent to the contacts to protect a module to connector interface from contaminants passing through a network device with the module installed in the network device.

Abstract: A module includes a physical form factor with one or more openings in a faceplate for receiving a corresponding sub-slot module; module high-speed connectors configured to mate with high-speed connectors in the corresponding sub-slot module; and one or more micro latches for each of the one or more openings to engage a compliant faceplate insert on the corresponding sub-slot module, wherein a single micro latch is utilized to engage a single sub-slot module to provide built-in physical compliancy with a biasing force sufficient to engage the high-speed connectors with the module high-speed connectors. Each of the one or more micro latches includes a latching pin which engages an integrated channel in the compliant faceplate insert on the corresponding sub-slot module and which engages an end of the integrated channel to apply a force to a spring on the compliant faceplate insert.

Abstract: Provided is an inverter-integrated electric compressor which uses the filter circuit as the substrate to eliminate a bulbar connection, improves assembly properties of the inverter device, optimizes the substrate structure, and makes the inverter device more compact and economical. In this inverter-integrated electric compressor, the inverter device is provided with multiple high-voltage electrical components which configure a noise removal filter circuit, a power substrate on which a power element is mounted, a control substrate on which a control circuit is mounted, and a filter circuit substrate which configures the filter circuit by the multiple high-voltage electrical components being connected in a pattern and mounted thereon, wherein the high-voltage electrical components, the power substrate, the control substrate and the filter circuit substrate are configured to be so as to be unitized together and housed and arranged in an inverter housing unit.

Abstract: An aspect of the present invention includes a module comprising a printed circuit board and a SSD case with at least one structural component that is removably coupled to the printed circuit board, whereby the at least one structural component is a power source. An aspect of the present invention includes a method of providing power to a module, comprising the steps of providing a printed circuit board and removably connecting a SSD case with at least one structural component to the printed circuit board, whereby the at least one structural component is a power source.

Abstract: A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

Abstract: An assembly for a computer system includes an insert housing with a housing floor; a power supply unit arranged on the housing floor and having a plug contact; a main circuit board arranged within the insert housing substantially parallel to the housing floor; and an angle plug having a mating plug contact and a connection region for connection of the power supply unit to the main circuit board, wherein the angle plug, when connected to the main circuit board via the connection region, connects to a top face of the main circuit board at a first installation height of the main circuit board and connects to a bottom face of the main circuit board at a second installation height of the main circuit board so that height compensation with respect to the plug contact of the power supply unit is established in each case.

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

Abstract: A platform comprises an array of slots for mounting electronic modules. Side rails are mounted on the platform. A side rail defines at least one outer edge of a slot. A central structure mechanically supports corresponding first electrical connectors for the slots. In a slot, a tray holds an electronic module. The tray comprises a second electrical connector supported at or near an interior end of the tray. The tray is secured laterally by at least one of the side rails. The tray is secured at or near the interior end by the second electrical connector that engages the first electrical connector. The tray is secured at or near an exterior end by an outer fastener associated with a floor of the platform.

Abstract: A connector housing apparatus includes a main body section that has a plurality of connectors confronting a plurality of external connectors of an external housing and a moving guide section that guides movement of the main body section toward the external housing. The moving guide section has a latching section that latches the moving guide section on the external housing. The main body section is connected to the moving guide section so as to be movable in a fitting direction of the plurality of connectors. The latching section latches the moving guide section on a position at which the plurality of connectors are fitted to the plurality of external connectors. The main body section moves along the moving guide section in the fitting direction of the plurality of connectors, and thereby the plurality of connectors are fitted to the plurality of external connectors.

Abstract: An expansion card includes a mounting bracket with a full height I/O panel with a top mounting panel attached thereto extending orthogonally away. A low profile printed circuit board assembly (PCBA) is physically attached to at least one of the top mounting panel and the full height I/O panel, and the mounting bracket and low profile PCBA define a full height expansion card. The low profile PCBA has a card edge that is insertably connectable to an I/O connector of an information handling system (IHS) to communicate with other components of the IHS. A full height heat sink is attached to the low profile PCBA and extends across a portion of the top mounting panel, providing increased heat dissipation for functional components of the low profile PCBA during operation of the low profile PCBA. A battery compartment is mounted on the mounting panel and supplies power to the functional components.

Abstract: A power distribution unit includes a first solid state power module comprising a first plurality of solid state power controllers, where the first solid state power module comprises a first set of power characteristics. Also included is a second solid state power module comprising a second plurality of solid state power controllers. The second solid state power module comprises a second set of power characteristics. Also, the first solid state power module and the second solid state power module are interchangeably coupled to a first location of a common chassis.

Abstract: An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.

Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.

Abstract: A printed circuit board (PCB) for an Advanced Telecommunications Computing Architecture (ATCA) shelf. The ATCA shelf may include a backplane providing a payload power supply and a standby power supply. Additionally, the PCB may include a first shelf management controller (ShMC) and a multiport switch, the multiport switch electrically coupling the first ShMC with a second ShMC on a second PCB by way of the backplane, the first ShMC utilizing standby power provided by the backplane at least when payload power is not available.

Abstract: A chip card holder for holding at least two chip cards is disclosed. The chip card holder includes a base, a drawer slidably attached to the base. The drawer includes at least two receiving spaces, each receiving space for receiving a chip card. The drawer moves relative to the base to make the at least two receiving spaces be exposed out of the base or be received in the base.

Abstract: A chip card holder for holding at least one chip card is disclosed. The chip card holder includes a base, a drawer slidably attached to the base and a cover. The drawer defines at least one receiving space, each receiving space for receiving a chip card. The cover is detachably latched to the base to retain the drawer in the base or allow the drawer to be slid out of the base. After the cover is detached from the base, the drawer can automatically partially or completely slide out of the cabinet to expose it from the base, thereby facilitating grasping chip cards out of the receiving spaces or putting the chip cards in the receiving spaces.

Abstract: A device for mounting a riser card includes a base board forming two rods, a motherboard forming an expansion slot to connect the riser card, and a fixing member having two legs at opposite ends. The rods extend through the motherboard and are positioned at opposite ends of the expansion slot. Each rod contains a resilient member inside, and a ball mounted to the resilient member and partly extending out of the rod. The riser card is fixed to the fixing member. Each leg defines a cylindrical hole fitted about one of the rods. The balls partly extend out of the corresponding rods and block tops of the corresponding legs.

Abstract: A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N?1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements.

Abstract: A chip card holding mechanism includes a bracket, an unlock assembly and a tray. The bracket defines a receiving chamber. The unlock assembly is assembled adjacent to the opening of the bracket. The movable tray is assembled to and received within the receiving chamber of the bracket via the unlock assembly, for receiving a chip card. The unlock assembly includes an ejecting member and an unlock member, the ejecting member is slidably assembled to the opening of the bracket and pushes against the tray. The unlock member is an included accessory for driving the ejecting member to slide, thereby ejecting the tray. An electronic device using the chip card holding mechanism is also provided.

Abstract: A chip card holding mechanism includes a bracket, an unlock member and a tray. The bracket defines a receiving chamber. The unlock member is assembled adjacent to the opening of the bracket. The movable tray is assembled to and received within the receiving chamber of the bracket by the unlock member. The tray includes a supporting portion for receiving a chip card, a draw-off portion formed on a first end of the supporting portion, and a resisting block formed on the draw-off portion. The unlock member includes a main portion and an ejecting portion formed on the main portion, the ejecting portion slidably resists against the corresponding resisting block of the tray, for providing an ejecting force to eject the tray away from the bracket. An electronic device using the chip card holding mechanism is also provided.

Abstract: According to one embodiment, an electronic apparatus includes a case, a main circuit board in the case, a connector on the main circuit board, an auxiliary circuit board includes one end portion connected to the connector and an extending portion extending outside the main circuit board, and a spring supporting mechanism between the case and the extending portion of the auxiliary circuit board. The spring supporting mechanism includes a spring portion configured to support the extending portion elastically deformable in a direction across a surface of the auxiliary circuit board, and is fixed to the extending portion to prevent the auxiliary circuit board from moving along the surface thereof.

Abstract: A display apparatus and a driving chip mounting film in the display apparatus, capable of simplifying a manufacturing process and reducing a process time. The display apparatus includes an insulating substrate; a display device formed on the insulating substrate and for defining an image display unit; pads formed on the insulating substrate and electrically connected to the display device; a first circuit substrate disposed at and separate from a first side of the insulating substrate; and a number of driving chip mounting films including one-side ends electrically connected to the first circuit substrate, and other-side ends electrically connected to the pads. A number of driving chips are mounted on each of the number of driving chip mounting films.

Abstract: An improved MEMS transducer apparatus and method is provided. The apparatus includes a movable base structure having a base surface region. An anchor structure is disposed within a substantially circular portion of the surface region typically at or near the center of the surface region. A spring structure is coupled to the anchor structure and at least one portion of the base surface region. A capacitor, having a fixed capacitor element and a movable capacitor element, are disposed near the base surface region. The fixed capacitor element can be coupled to the anchor structure and the movable capacitor element can be spatially disposed on a portion of the base surface region near the anchor structure.

Abstract: An improved MEMS transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region. At least one intermediate anchor structure is disposed within the inner surface region. The apparatus includes an intermediate spring structure operably coupled to the central anchor structure, and at least one portion of the inner surface region. A capacitor element is disposed within the inner surface region.

Abstract: A mezzanine board alignment and mounting device includes a multi-stage pin connected to a main board near a mezzanine board connector disposed on the main board. The multistage pin includes a base adapted to connect to the main board, a point distal to the base adapted to pass through an opening on a mezzanine board, and a support disposed between the base and the point. A diameter of the point widens towards the support. A diameter of the support is wider than a diameter of the opening. When the point is fully inserted through the opening in the mezzanine board, the mezzanine board is aligned properly to connect with the mezzanine board connector on the main board.

Abstract: A wiring board is formed with a substrate designating either the upper surface or the lower surface as a first surface and the other as a second surface; an electronic component arranged inside the substrate; and a first conductive layer formed on the first-surface side of the substrate by means of a first insulation layer made up of a first lower insulation layer and a first upper insulation layer. In such a wiring board, the first lower insulation layer and the first upper insulation layer are made of different materials from each other. Moreover, the first lower insulation layer is positioned on the first surface of the substrate and the electronic component, and the material that forms the first lower insulation layer fills a clearance between the substrate and the electronic component.

Abstract: A pad layout structure of a driver IC chip of a liquid crystal display device includes dummy power pads and dummy ground pads, which are disposed in corners of the driver IC chip and are connected to main power pads and main ground pads by metal lines in a chip-on-film (COF) package. Accordingly, it is possible to reduce the resistance of power supply lines and ground lines, to minimize a power dip of a block located far away from the main power pads and main ground pads, and to prevent a failure in power application, which may occur due to a decrease of adhesive strength at a specific position, by dispersing the adhesion positions of the power pads and ground pads.

Abstract: A method of testing integrated circuit chips. The method includes: attaching integrated circuit chips to an interposer of a temporary carrier, the carrier comprising: a substrate, a first interconnects on a bottom surface and a second array of interconnects on a top surface of the substrate, corresponding first and second interconnects electrically connected by wires in the substrate; the interposer, first pads on a top surface and a second pads on a bottom surface of the interposer, corresponding first and second pads electrically connected by wires in the interposer, and the second pads in physical and electrical contact with corresponding second interconnects; and the interposer including an interposer substrate comprising a same material as a substrate of the integrated circuit chip; connecting interconnects of the first array of interconnects to a tester; and testing the one or more integrated circuit chips.

Abstract: A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end part to be connected to a first object of connection to be placed opposite the first surface of the board body; and a projection part provided on the first end part so as to project toward the first conductor.

Abstract: The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.

Abstract: An electronic module has at least one first and one second connecting terminal and power semiconductors which are connected by way of connecting conductors, diodes which are each connected in parallel with the power semiconductors and at least one capacitor, likewise connected to the power semiconductors by connecting conductors, which is used, in the event of a fault, to ensure a high degree of availability and operational reliability of a converter; the connecting conductors of the novel device have at least two sections which run parallel to one another and at least one of which can be deformed. The sections are used to guide the current flowing in the electronic module in the opposite direction and are dimensioned such that, when a threshold current is exceeded, they form a conductive connection between the connecting terminals and bridge the power semiconductors and each capacitor.

Abstract: An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means interconnecting pairs of adjacent islands, and a second resilient suspension means connecting the islands adjacent to the receiving zone with the receiving zone.

Abstract: A portable electronic device (20) includes a circuit board (21) and at least one conducting pole (22). The conducting pole is mounted on the circuit board and includes a breakable portion (2224), the breakable portion is configured to be the part that breaks when the conducting pole is crumpled.

Abstract: In a burn-in test configuration wherein a chip board having a plurality of semiconductor chips engages a heat sink board having a plurality of heat sinks. When the boards are operationally engaged, the each semiconductor chip has a heat sink has heat sink spring-loaded against the semiconductor chips. Posts coupled to one board engage posts located on the second board. The engagement of the posts orients and secures the relative positions of the two boards. A clip is provided that secures the relative position of the two boards when the two sets of posts are engaged. To uncouple the two boards, a pressure on the side of the clip permits the two boards to separate.

Abstract: A patch panel system including a chassis and a plurality of modules. The chassis includes elongated structures configured to interconnect top, bottom and side portions of the chassis. The elongated structures are also configured to receive and secure a printed circuit board and the plurality of modules to the chassis. The modules include a housing and a module card. The card can include a variety of connections that provide communication to connections located on a back plane of the chassis. The system can include a combination of passive and active modules that are interchangeable to provide a variety of interface configurations. A spring clip electrically links at least one module to the chassis.

Abstract: Clip for attaching two outer panels to an intermediate panel, the clip comprising two arm portions each arm portion being configured to apply pressure to one of the outer panels in order to force the panel against a surface of the intermediate panel, and a bridge portion connecting the two arm portions, the bridge portion comprising a central section configured to provide mechanical coupling to the intermediate panel.

Abstract: A method and apparatus is provided for attaching a cooling structure to the surface of an integrated circuit (IC). The attachment of the cooling structure, for example a heat sink, to the IC requires that certain pressure is applied, usually by connecting the cooling structure to a Printed Circuit Board (PCB). However, excess pressure may damage the ball grid array (BGA) that connects the IC to the PCB. Attachment of a cooling structure to the IC package substrate is provided without support from the PCB. In one embodiment, shock absorbers are also attached to the cooling structure and the PCB to prevent undesirable vibration of the heat sink mass from affecting the IC.

Abstract: An integrated circuit (IC) carrier assembly includes a printed circuit board (PCB). A carrier is soldered to the PCB. The carrier includes a grid of electrical contact islands surrounding a receiving zone for receiving an IC. Pairs of adjacent islands are interconnected by respective resilient suspension means. The IC is received in the receiving zone and is electrically coupled to a number of the plurality of islands adjacent to the receiving zone. The IC is fast to a retainer, and the retainer is fast with the number of the plurality of islands and the IC.

Abstract: A mounted printed wiring board is disclosed that will allow sensors to be installed in optimal positions thereon with the same time and effort needed for one board, and allow the same to be inexpensively manufactured with a simple process. A single board unit includes first and second board portions having a break line interposed therebetween. Sensors and mounted components that are shorter than the sensors are mounted on the first board portion, connectors and mounted components that are taller than the sensors are mounted on the second board portion, and jumper wires are mounted across the first and second board portions. The board unit is then folded in two with the break line so that the mounting surfaces face outward, and the first and second board portions are fixed with spacers.

Abstract: A printed circuit board (PCB) assembly includes a PCB. An integrated circuit (IC) carrier defines a receiving zone to receive an IC. The carrier has a plurality of island portions about the receiving zone. Each island portion includes a solder member for contacting the PCB. A plurality of resilient serpentine members interconnect neighboring island portions so that at least some relative displacement of the PCB and the carrier is accommodated by the serpentine member, thereby alleviating strain imparted to the solder member.

Abstract: A structure is disclosed for preventing stacking connectors on a first and a second boards from coming apart that are fitted to each other. The first and second boards connected by said stacking connectors being fitted to each other are clamped by a clamping member. The clamping member is connected to surfaces on the first and second boards that connect to ground.

Abstract: An integrated circuit carrier is claimed comprising at least one receiving zone for an integrated circuit. A plurality of island-defining portions, having electrical terminals, is arranged about each of the receiving zones. Rigidity-reducing arrangements are disposed between neighbouring island-defining portions.

Abstract: An apparatus, such as a reader, adapter, or other device, is described that is capable of receiving at least four different types of memory cards using a single slot. The slot includes a central region having a width to receive a memory card of a first type, first outer regions that extend the width of the central region to a second width to receive a memory card selected from a second type of memory card or a third type of memory card, and second outer regions that extend the width of the central region to a third width to receive a memory card of a fourth type. A plurality of electrically conductive contact areas are disposed within the slot. The apparatus may receive, for example, any of a Smart Media flash memory card, Memory Stick flash memory card, Secure Digital flash memory card, or MultiMedia flash memory card.

Abstract: A clip is used to clamp a LED in place in a LED module. The clip has pliable conducting cover and can be latched to the upper lead metal of the LED module. The clip can be lifted for replacing a defective or color LED. A plurality of replaceable LEDs can be mounted a common metal substrate to form a display panel, and each LED can be clamped in position with clips straddling between parallel upper lead metal for electrical coupling to the top electrodes of the LED.

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract: A motion detector is provided that enables power to a computer module to be disconnected prior to removal of the module from the connector. Actuation of a sensor causes a shutter assembly to move vertically. The shutter assembly is in communication with a switch. Movement of the shutter assembly causes actuation of the switch to send a signal to a control circuit of an associated controller. Power to the controller is provided when the shutter assembly is in communication with the switch, and power is removed from the connector when the shutter assembly is not in communication with the switch.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the flexible substrate; (c) an adhesive layer comprised of a compliant adhesive material having vias aligned with the pads on the second side of the flexible substrate; the adhesive layer being affixed to the flexible substrate and the rigid substrate; (d) a card; (e) electrical connectors that are retained in the vias of the rigid substrate and the adhesive layer, which electrical connectors have first and second retractable ends, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (f) a clamp that is adapted to fit over the substrate and the adhesive layer, the clamp having an opening to provide access to the contactors, wherein the clamp is connected to the card.

Abstract: A semiconductor device wafer-on-support wafer package comprising a plurality of segmentable chip-scale packages and method of constructing, burning-in, and testing same are disclosed. The wafer-on-wafer package can be burned-in and tested at the wafer level prior to segmenting, or singulating, the wafer-on-wafer package into a plurality of individual chip-scale packages. The device wafer includes a plurality of unsingulated semiconductor dice having a plurality of die bond pads being respectively bonded to a plurality of electrically conductive die bond pad connect elements provided on a first surface of the support wafer.