With Discrete Structure Or Support Patents (Class 361/809)
  • Patent number: 5383096
    Abstract: An apparatus for increasing the number of electrical I/O ports on an existing computer system chassis, while maintaining the RF shield of the chassis and without changing the design of the existing chassis, by the use of an I/O expansion box. The I/O expansion box comprises a bottom and a cover. The bottom has a base plate with openings for cables from the computer chassis to pass therethrough and has lips at the openings. The lips extend outwardly away from the recess and are used to attach the base plate to the chassis at its I/O port openings. The cover has a top with openings therein for the attachment of electrical cable connectors that are attached to the cables from the computer chassis. The number of openings in the top of the cover are greater than the number of openings in the base plate of the bottom.
    Type: Grant
    Filed: May 3, 1993
    Date of Patent: January 17, 1995
    Assignee: Digital Equipment Corporation
    Inventors: Matthew C. Benson, Laurence M. Mazzone
  • Patent number: 5381308
    Abstract: A device and method for locking an electrical component, having a body and a flange portion, with a panel through a panel opening, in which the flange abuts a first face of the panel, which includes moving an actuator on the body of the component to displace a cam follower on the body from a first to a second position in which the cam follower projects beyond the contour of the body enough to abut another panel face.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: January 10, 1995
    Inventors: Richard W. Wolpert, Alan T. Wolpert, Richard A. Wolpert
  • Patent number: 5373478
    Abstract: A memory board includes a board, a RAM (random access memory), a back-up battery for supplying a back-up power to the RAM, and a switch to switch a power source from a main power to the back-up battery when the voltage of the main power drops below a predetermined value. The back-up battery is located at the same position where either the switch or the RAM is located and mounted to cover the switch or the RAM.
    Type: Grant
    Filed: May 17, 1993
    Date of Patent: December 13, 1994
    Assignee: Konica Corporation
    Inventors: Katsuaki Komatsu, Atsushi Takahashi, Kazuhiko Tsuboi, Shinichi Nishi
  • Patent number: 5373418
    Abstract: An electrical device for mounting electrical components includes an integrally die-cast aluminum base 20 having at an upper side thereof recesses 20a for receiving the electrical components and at the bottom side thereof radiator fins 20b for radiating heat generated by the electrical components. The terminals 31 of the electrical components accommodated in the recesses of the metal base 20 are substantially at the same height and electrical interconnection among them is secured via the conductors 21a carried on a printed circuit board 21. A high heat conductivity resin material 29 is interposed between the recesses and components 22, 23, and 27 that generate a large amount of heat. On the other hand, a heat insulating resin material 30 is interposed between the recess and the component 26 that generates a small or negligible amount of heat.
    Type: Grant
    Filed: March 26, 1991
    Date of Patent: December 13, 1994
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Satoru Hayasi
  • Patent number: 5365407
    Abstract: A DC power supply device for use with a video tape recorder with a built-in camera has a plurality of power supply blocks for supplying a plurality of voltages, each of the power supply blocks being composed of a switching circuit for being supplied with a DC voltage and a smoothing circuit connected to an output terminal of the switching circuit. The power supply blocks are mounted on a multilayer circuit board which includes a layer of a ground pattern with an electric conductor extending substantially fully thereover, the ground pattern being separated into a plurality of ground pattern portions by a plurality of recesses defined therein, the power supply blocks having respective ground terminals connected to the ground pattern portions, respectively.
    Type: Grant
    Filed: January 27, 1993
    Date of Patent: November 15, 1994
    Assignee: Sony Corporation
    Inventors: Toshiya Nakabayashi, Hirokazu Nakayoshi, Kazuo Hashimoto
  • Patent number: 5363278
    Abstract: A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, characterized in that the Vickers hardness of the copper sheet lies in the range from 40 kg/mm.sup.2 to 100 kg/mm.sup.2.
    Type: Grant
    Filed: May 28, 1992
    Date of Patent: November 8, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Komorita, Nobuyuki Mizunoya
  • Patent number: 5359496
    Abstract: A body is hermetically sealed by electroplating a hermetic layer over the exterior surface of the body. A hermetic high density interconnect structure is provided by forming a continuous metal layer over the outermost dielectric layer of the multilayer interconnect structure and by disposing that continuous metal layer in a hermetically sealing relation to the substrate of the high density interconnect structure. A variety of techniques may be used for providing electrical feedthroughs between the interior and exterior of the hermetic enclosure as may a pseudo-hermetic enclosure in those situations where true hermeticity is not required.
    Type: Grant
    Filed: May 26, 1993
    Date of Patent: October 25, 1994
    Assignee: General Electric Company
    Inventors: William P. Kornrumpf, Robert J. Wojnarowski, Charles W. Eichelberger
  • Patent number: 5353199
    Abstract: A method of mounting fuse holding clips for a fuse holder on a circuit board by such an automatic part inserter as is used for inserting radial parts and including a pusher having a lower dead point set at 5 to 20 mm upwardly distant from an upper face of the circuit board and comprising a step of inserting a fuse holding clip while the pusher of the automatic inserter is engaging narrowed faces of a clip body which are to support a lower portion of a fuse until a bottom of the fuse holding clip is engaged with the upper face of the circuit board.
    Type: Grant
    Filed: March 18, 1993
    Date of Patent: October 4, 1994
    Assignee: Kyoshin Kogyo Co., Ltd.
    Inventor: Kozi Ohashi
  • Patent number: 5343366
    Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cuboid structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate and within which corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contain solder and form solder loaded pin-like structures.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: August 30, 1994
    Assignee: International Business Machines Corporation
    Inventors: Thomas M. Cipolla, Paul W. Coteus, Ioannis Damianakis, Glen W. Johnson, Peter G. Ledermann, Linda C. Matthew, Lawrence S. Mok
  • Patent number: 5343365
    Abstract: A PCB relay comprising a housing having a bottom side, a top side and a circumferential wall and terminal pins protruding from the bottom side for being contacted to a printed circuit board. For conducting heavy load currents from the relay contacts and away from the printed circuit board in a quick manner and via a short pathway, at least two conducting strips are fastened to the circumferential wall of the housing, extending from the bottom side to the top side. The strips form soldering pins at the bottom end thereof and quick-connect plugs or terminals at the top end thereof. An electrically conducting connection between the strips and the terminal pins of the relay may be formed on the PCB or, alternatively, the elements may be directly connected to one another.
    Type: Grant
    Filed: September 23, 1992
    Date of Patent: August 30, 1994
    Assignee: Potter & Brumfield, Inc.
    Inventor: Klaus Lueneburger
  • Patent number: 5333099
    Abstract: A simplified construction is suggested for an electrical construction assembly, or an assembled electrical component, having a circuit board, a liquid crystal display, a light conductor, and a sheet-metal screen. In this regard, a leg of the sheet-metal screen extends about one edge of the circuit board and effects, on the one hand, a secure contacting of the liquid crystal display and, on the other hand, in an uncomplicated manner, a releasable clamping together of the assembly.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: July 26, 1994
    Assignee: Preh-Werke GmbH & Co. KG
    Inventors: Karl-Heinz Bauer, Ulrich Bruggemann
  • Patent number: 5323297
    Abstract: Twist-in mounting structure comprises a barrel, and panel capture tabs extending oppositely away therefrom, each terminating in a free end spaced away from the barrel. Each tab has an interference surface sloping downwardly and inwardly toward the barrel, and an interference region bounded by the interference surface. An acute angle is included between the interference surfaces and a cooperative raised capture plateau lying below them. A spring locking arm, sprung out of the plane of the housing mounting surface, provides a distal locking element. The housing mounting surface provides structure for laterally capturing the locking arm.
    Type: Grant
    Filed: October 23, 1992
    Date of Patent: June 21, 1994
    Inventors: Nicholas R. Palumbo, Edward B. Mitchell
  • Patent number: 5319525
    Abstract: A circuit assembly comprises a plurality of electronic devices mounted on a circuit board, including a matched pair of devices intended for use together in the same circuit. In order to reduce the risk of using un-matched devices at the assembly stage the pair of matched devices are joined together prior to mounting them on the circuit board. For this purpose a simple bracket is disclosed into which the two devices can be inserted from opposite ends by push-fitting.
    Type: Grant
    Filed: May 6, 1992
    Date of Patent: June 7, 1994
    Assignee: Nokia Mobile Phones (U.K.) Ltd.
    Inventor: David Lightfoot
  • Patent number: 5315486
    Abstract: A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: May 24, 1994
    Assignee: General Electric Company
    Inventors: Raymond A. Fillion, William P. Kornrumpf, Edward S. Bernard
  • Patent number: 5310701
    Abstract: A method for mounting semiconductor bodies on a substrate includes bonding ires to a substrate being formed of metal at least in given locations. Semiconductor bodies are laterally fixed to the given locations of the substrate with the wires. The semiconductor bodies are subsequently materially joined to the substrate in the given locations.
    Type: Grant
    Filed: January 13, 1993
    Date of Patent: May 10, 1994
    Assignee: Eupec Europaeische Gesellschaft fur Leistungshalbleiter mbH&Co
    Inventors: Franz Kaussen, Martin Figura
  • Patent number: 5309328
    Abstract: The disclosure relates to a forearm support strap for supporting various types of portable electronic equipment or instruments. The forearm support strap includes three exposed pile areas which will receive various types of equipment that has been provided with a mating Velcro loop strip on its base. A plurality of quick-release buckles are included to provide secure attachment to the user's forearm. A battery compartment is also included to provide electrical current to the attached instrument. Significant advantages of the forearm support strap include its ease of attachment, comfortable anti-rotation features and its availability to right-handed as well as left-handed users. Through the use of the forearm strap the user has both hands free to perform other tasks.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: May 3, 1994
    Inventor: James C. P. Lum
  • Patent number: 5307240
    Abstract: An electronic package assembly which has a first electrical device mounted to a housing and a second electrical device attached to the lid of the package. The first and second devices are completely encapsulated by the lid and housing, and are typically coupled to a printed circuit board by pads on the bottom surface of the package. The electrical devices may be active or passive elements that are coupled together by conductive pads located on the top and bottom surfaces of the housing and lid, respectively. The conductive pads are typically soldered together when the lid is attached to the housing.
    Type: Grant
    Filed: December 2, 1992
    Date of Patent: April 26, 1994
    Assignee: Intel Corporation
    Inventor: John F. McMahon
  • Patent number: 5289347
    Abstract: A Faraday shield minimizes the leakage of electromagnetic interference (EMI) and radio frequency interference (RFI) of a maximum frequency and corresponding wavelength that emanates from electronic components contained within the shield. The top and bottom each contain apertures that are dimensioned to effectively block the escape of EMI and RFI from the shield and to permit the flow of air to dissipate heat without generating acoustic noise. The thickness of the top of the shield is at least one half of the diagonal length across the largest of the apertures located in the top. The length of the longest aperture side is less than one fourth of the wavelength of the maximum frequency of EMI and RFI contained by the shield. Corresponding relationships exist between the apertures located in the shield bottom and its thickness.
    Type: Grant
    Filed: June 4, 1992
    Date of Patent: February 22, 1994
    Assignee: Digital Equipment Corporation
    Inventors: William F. McCarthy, Colin E. Brench, Daniel M. Snow
  • Patent number: 5289348
    Abstract: A rack with platforms for mounting electronic equipment is suspended by elastic straps within a frame. The frame is resiliently supported on legs that are attached only by means of elastic cords, which are configured to absorb shock, particularly horizontal shock.
    Type: Grant
    Filed: November 19, 1992
    Date of Patent: February 22, 1994
    Assignee: Harold R. Miller
    Inventor: Harold R. Miller
  • Patent number: 5284254
    Abstract: A rack for electrical equipment includes a base having a bottom wall, and a back wall extending up from the bottom wall at the back of the rack. The bottom wall has a plurality of fastener openings therein through which fasteners may be driven into a surface supporting the rack for securing the rack to the surface. A pair of legs extend up from the bottom wall of the base at opposite sides of the base adjacent the back wall of the base. A cover may be removably fastened to the base of the rack in a position where the cover extends forward from the back wall of the base between the legs of the rack and is spaced above the bottom wall of the base to form, in combination with the back and bottom walls of the base, an enclosure for electrical wiring and the like. Removal of the cover from the base provides ready access to the electrical wiring and the like and also the fastener openings in the bottom wall of the base for facilitating securement of the rack to the surface.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: February 8, 1994
    Assignee: B-Line Systems, Inc.
    Inventor: Eric R. Rinderer
  • Patent number: 5278729
    Abstract: In a preferred embodiment, there is provided a compact rotatable electrical device for attachment to a mounting panel of an electrical apparatus. The mounting panel has inner and outer surfaces and defines an interior space of the apparatus, with the inner surface adjacent the interior space. The device includes: a control body having a control shaft extending upwardly from the distal end thereof, the proximal end of the control shaft being connected to operative elements within the control body; and apparatus for attachment of the proximal end of the control body to the mounting panel through an opening defined therethrough such that the control body, when so attached, will be disposed substantially outside the interior space.
    Type: Grant
    Filed: March 26, 1993
    Date of Patent: January 11, 1994
    Assignee: Magnavox Electronic Systems Company
    Inventor: Arden L. Hoffman
  • Patent number: 5274529
    Abstract: An electronic device has terminals and other elements such as piezoelectric elements enclosed inside a box-shaped molded case. One of the terminals which penetrates and fixed to a side wall of the case has one or more raised contact portions for making electrical contact with one of the enclosed elements. Tabs protruding higher than these raised contact portions are provided to this terminal for preventing resin from entering the interior of the case during its molding process. These tabs are fixed to the wall of the case. Externally protruding contacting portions of the terminals are bent toward a bottom wall of the case which is larger than the side wall such that the device can be stably mounted.
    Type: Grant
    Filed: August 28, 1992
    Date of Patent: December 28, 1993
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hideo Mura, Koichi Nagano, Toshikazu Ishiguro
  • Patent number: 5274193
    Abstract: A load spring for heat sink assemblies has an elongated body with a plurality of fingers, spring arms and a positioning mechanism extending from the body. Also, a wedge bar tensions and maintains the spring in a heat sink housing. The fingers apply a force onto the electrical components to clamp the electrical components against the heat sink housing to provide heat dissipation from the electrical components to the housing.
    Type: Grant
    Filed: April 24, 1992
    Date of Patent: December 28, 1993
    Assignee: Chrysler Corporation
    Inventors: Terry G. Bailey, Bradley S. Chupp
  • Patent number: 5272595
    Abstract: A terminal structure for an electronic device, which can be affixed to a resin case while the latter is being molded, has planar base member having a raised portion at least on one of its surfaces. A protruding piece is provided on the same surface so as to protrude therefrom higher than the raised portion. This protruding piece may be a tab which is cut out from the base member and bent therefrom, or another planar plate which overlaps the base member.
    Type: Grant
    Filed: December 29, 1992
    Date of Patent: December 21, 1993
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hideo Mura, Koichi Nagano, Toshikazu Ishiguro
  • Patent number: 5264990
    Abstract: The invention relates to an integrated circuit card comprising a card support (130) which has a cavity (101) in which a vignette (200) is fixed, which vignette (200) comprises a circuit support (20, 40) and a circuit (10) arranged on a lower surface of the circuit support facing towards the interior of the cavity (101), the circuit (10) being positioned opposite a portion of a bottom (100) of the cavity (101). The bottom (100) has at least two weakenings (104) situated on either side of a bridge-portion (103) of the bottom.
    Type: Grant
    Filed: May 9, 1991
    Date of Patent: November 23, 1993
    Assignee: U.S. Philips Corporation
    Inventor: Jacques Venambre
  • Patent number: 5251103
    Abstract: A casing for holding electronic components and the like, is provided on each of its side walls facing away from one another with two fastening lugs which project laterally therefrom and are each provided with an opening for the passage of a screw, and which are associated with casing side edges corresponding to one another. The openings for the passage of a screw which are provided in fastening lugs lying opposite one another and associated with the same side wall of the casing are in each case free from overlap, in their projection, with the fastening lug lying opposite. The arrangement of the fastening lugs makes possible the installation of the casing in both right-hand and left-hand drive vehicles without being mounted with mirror inversion. This provides advantages, for example, when there is restricted space to accommodate the cable leading out of the casing.
    Type: Grant
    Filed: July 13, 1992
    Date of Patent: October 5, 1993
    Assignee: Mercedes-Benz A.G.
    Inventors: Rudolf Haberstroh, Wolfgang Rohde, Hans-Jurgen Meier
  • Patent number: 5237829
    Abstract: An ice-making machine has a thermal relay in which resilient mounting arms are formed at both sides of the thermal relay. A concave portion for receiving the thermal relay and grooves for receiving tip ends of the resilient mounting arms are formed on a surface of a case. The surface is brought into intimate contact with an ice-making tray. The thermal relay is urged toward the ice-making tray through the resilient mounting arms by bottom walls of the grooves.
    Type: Grant
    Filed: July 29, 1992
    Date of Patent: August 24, 1993
    Assignee: Japan Servo Co., Ltd.
    Inventors: Toshio Kobayashi, Eiji Kuroda
  • Patent number: 5233505
    Abstract: A security device for protecting electronically-stored data comprising a protected circuit board which has a memory device for storing data code and a battery, a plurality of protective circuit boards respectively overlaid on each side of the protected circuit board, and a plurality of connectors connected between the protected circuit board and the protective circuit boards, wherein the printed circuit on each protective circuit board is respectively connected to the printed circuit on the protected circuit board forming into a series electronic circuit. Detaching either protective circuit board from said protected circuit board or damaging either protective circuit board will break the series electronic circuit causing any code data stored in the memory device to be erased.
    Type: Grant
    Filed: December 30, 1991
    Date of Patent: August 3, 1993
    Assignee: Yeng-Ming Chang
    Inventors: Yeng-Ming Chang, Wing-Fai Chun