Abstract: A method of manufacturing a small, thin card-type storage device is capable of easily manufacturing a frame for the storage device from a variety of resin materials without molding a very thin recessed bottom of the supporter. The method prepares a card-type support frame member from resin and a sheet material, cuts the sheet material into the size of the support frame member, to form a support sheet, bonds the support sheet to a bottom surface of the support frame member, to form a frame, and fits a memory module to be fixed in an opening of the support frame member in the frame, thereby completing the card-type storage device.

Abstract: An assembly that has an insert that fits onto a back plate. The back plate receives a circuit board that covers at least a portion of the insert. A components attaches to the circuit board and to the insert. The insert is made out of a material having a thermal expansion coefficient that is close to the thermal expansion coefficient of the bottom surface of the component, which allows the component to be securely soldered to the insert and therefore to the assembly. Preferably the insert is also made out of a good conductor to provide a good electrical conduction path between the component and the ground plane of the circuit board that contact the insert. The insert either fits into a recessed area in the back plate or attaches to the top of the back plate. In an alternative embodiment, the assembly has a circuit board with a contact opening and a back plate with a raised area that fits into the contact opening. The contact opening exposes a portion of ground plane on the circuit board.

Abstract: An integrated circuit package pin indicator that may include probe guides. The indicator includes a top marking plate with indicia for the multiple pins of the IC package. The top plate has individual indicia for each pin, and will have numerical or alpha labels for some or all of the pins, depending on the number of pins present. The top marking plate may include a securing means to attach the top marking plate to the top of the IC package and to hold the top marking plate in place. Each pin marker terminates in a hole or slot that is adapted to guide a probe to a selected pin. The pin indicator can be used with both through hole and surface mount IC boards.

Abstract: A light emitting device mounting bracket includes a body and mounting hooks for fixing the bracket to a computer enclosure. The body defines a hole for mounting a light emitting device, a turret with a snap being formed at one side of the hole and a battlement being formed around an opposite side of the hole. The light emitting device is inserted into the hole by pressing on a bottom thereof, a flange of the light emitting device abutting a stopping surface of the battlement when fully inserted, and the snap of the turret engaging the bottom of the light emitting device. The mounting hooks engage with corresponding holes in a front panel of the computer enclosure, thereby mounting the light emitting device bracket to the panel of the computer system.

Abstract: A retainer adapted to mount an electronic device to a circuit board, includes two spaced arms, each having an elongate body defining a channel for receiving an edge of the device thereby retaining the device between the two arms. Each retaining arm defines two cavities therein respectively proximate opposite ends of the body. Each cavity has a square configuration to snugly receive a square nut therein. The cavity has a bottom periphery to support the nut and a top periphery to retain the nut in the cavity. A through hole is defined in the bottom periphery to receive a bolt that extends from the circuit board and threadingly engages with the nut thereby securing the retaining arm to the circuit board. The top periphery of the cavity defines a circular recess and a cylindrical section of the nut is received and retained in the recess for further securing the nut in the cavity.

Abstract: According to the invention, a multilayered image sensor is backmounted to a plate, and the plate in turn, is installed in a holding pocket of a device. In that the scheme takes advantage of a high controllability of a mounting plate's thickness, the mounting scheme provides for tight control of holding forces with which an image sensor is secured in an imaging device. In that the scheme provides for back mounting of image sensor on a planar surface, the mounting system provides tight control of an imaging assembly's pixel plane to fixed point in space distance.

Abstract: GBIC frames are mounted with respect to one or another or with respect to the printed circuit board so as to facilitate space sufficiency, e.g. of a front or other panel. In one aspect two GBIC frames are mounted in back-to-back fashion on opposite surfaces of a mounting plate of preferably minimal thickness. Plate cut-outs are positioned to accommodate frame feet or other mounting structures in a fashion off-set, on opposite faces, to avoid interference between frame legs. In one aspect, portions of GBICs and frames are received in cut-out or other edges of a PCB so that GBICs in frames straddle a major surface of a PCB to reduce height for accommodating 1RU or other form factors while increasing space efficiency.

Abstract: A cover for the upper end of an electrical capacitor having electrical leads on the upper end thereof. The cover includes a cup-shaped cylindrical section having a closed end and an open end. The open end being adapted to receive the upper end of the capacitor. The capacitor cover further includes a radially extending opening defining a passage for electrical leads from the exterior thereof into the interior of the cover. The cover is further provided with radially extending mounting means which are adapted to be received in mating vertically extending support structure which allows the cover to be supported through a range of vertical positions. The cover further includes a grounding screw support structure extending from the outer surface which is adapted to receive a grounding screw therethrough to engage the capacitor protected by the cover.

Abstract: Method for the removable sealing of a component housing, and apparatus to practice the method using an elastic or conformable sealing band. The present invention teaches a sealing band, preferably elastic, to apply a horizontal seal to the horizontal seam defined by vertically assembled component case elements. The seal is maintained in position over the seam by an alignment element disposed on at least one of the seal and the case. The sealing band is rendered electrically conductive by admixing therewith a conductive material, or by plating thereon a conductive coating. A retaining element may be further added to at least one of the sealing band and the case to minimize tampering with the sealing band once installed.

Abstract: An IC card, which can be mass-produced at low cost, is composed of a plane coil formed by means of punching or etching.

Abstract: The contact arrangement is a connector block for detachably fastening an electrical component, particularly an integrated circuit having a plurality of terminal contacts disposed in a ball grid array (BGA), in a column grid array (CGA), in a land grid array (LGA) or of the flip-chip type to a printed circuit board. In a support part, a number of contact pins are disposed in a grid in bores. The contact pins project from the bore on the side facing the printed circuit board and are surface-mounted together with contact areas of the printed circuit board. A free end region of each bore is intended for guiding the substantially dome-shaped terminal contacts. Between the end of a contact pin and a terminal contact there is a space bridged for establishing an electrical connection with a contact element, for example an axially compressible coil spring. By means of several holding-down elements disposed peripherally to the integrated circuit, the integrated circuit is pressed down upon the support part.

Abstract: A plurality of shields is provided for shielding selected electronic components and electronic sub-assemblies mounted on a printed wiring board assembly from electromagnetic interference (EMI) and/or from radio frequency interference (RFI). The shields include open-ended electrically conductive casings having lower ends fixedly attached on the printed wiring board so as to surround selected components. A compliant electrically conductive member is positioned in common over upper ends of the casings. An electrically conductive housing disposed over the compliant member provides compression of the compliant member such that electrical contact is maintained between the housing on the upper ends of the casings. A grounded base plate is spaced from the wiring board assembly. The housing is removably attached to the base plate to provide the plurality of shields.

Abstract: An apparatus for securing a component in a computer chassis. The apparatus provides a tray that may be made from a resilient material in which the computer component is encased. The computer component is thereby isolated from physical shock applied to the chassis, and sound from the component is dampened from escaping the confines of the apparatus. Embodiments of the tray are particularly constructed to be placed near the top of a tower configuration computer and encased by a cover that keeps the component secured. The cover is removable and therefore allows for ready access to the component.

Abstract: A structure for mounting a heat sink onto an integrated circuit package mounted on a printed circuit board is constructed such that a guide member having a frame portion and support post portions is fixed to the printed circuit board, and the heat sink is seated on an inner periphery of the guide member such that the heat sink may be closely contacted with the integrated circuit package, and then a cover is fixed to the guide member such that it covers over outer peripheral edge portions of an upper face of the heat sink. This structure is high in cooling efficiency and is easy to mount.

Abstract: Secondary circuit board which carries an acceleration sensor is mounted upon a primary circuit board in an anti-lock brake system control unit. The secondary circuit board is mounted at an angle to the primary circuit board and the acceleration sensor is mounted at an angle relative to the secondary circuit board to align a sensing element contained in the acceleration sensor perpendicular to a direction of vehicle travel.

Abstract: A mounting system (10) and method for adjusting the position of a PCB (14) in a housing (22) therefor is provided. An annular, stepped mounting member (16) having axially and radially spaced surface portions (19) provides predetermined positions for the PCB (14) in the housing (22) based on the size of a mounting opening (20) of the PCB (14). The PCB (14) is placed onto the mounting member (16) with those surface portions (19) that are of smaller diameter than the opening (20) fitting therethrough until the first portion (19) having a larger diameter is encountered which will be engaged against the PCB (14). In this manner, the present system (10) allows for a relatively quick and easy change to the size of the PCB mounting hole opening (20) to be made to effect a change in the PCB vertical position in the housing (22) thereby avoiding expensive and time-consuming changes that are usually required when the position of the PCB (14) needs to be changed to accommodate component reconfigurations and the like.

Abstract: A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

Abstract: Method for the removable sealing of a component housing, and apparatus to practice the method using an elastic or conformable sealing band. The present invention teaches a sealing band, preferably elastic, to apply a horizontal seal to the horizontal seam defined by vertically assembled component case elements. The seal is maintained in position over the seam by an alignment element disposed on at least one of the seal and the case. The sealing band is rendered electrically conductive by admixing therewith a conductive material, or by plating thereon a conductive coating. A retaining element may be further added to at least one of the sealing band and the case to minimize tampering with the sealing band once installed.

Abstract: A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the pallet and a second portion that is bonded to the bottom surface of the printed wiring board so that the insert is movable, relative to the pallet, in a plane parallel to the PWB. In one embodiment, the pallet includes an opening having a first portion and a second portion that is larger than the first portion, and the first and second portions of the insert fit at least partially in the respective first and second portions of the pallet opening. In another embodiment, the insert has a thickness that is equal to or greater than the thickness of the pallet.

Abstract: In one embodiment of the present invention, an apparatus for retaining a printed circuit board includes a hollow shell structure having an aperture and an inner slot for receiving the printed circuit board and a mounting bracket including a frame portion for receiving the shell structure. A rim extends around the perimeter of the aperture and flexible flanges extend from at least a portion of the rim. The flexible flanges include a neck portion and a lower tab that provide means to retain the shell structure in the mounting bracket. The inner slot is sized to fit snugly around the perimeter of the printed circuit board when the printed circuit board is inserted in the shell structure. The shell structure is constructed of a dielectric material that substantially insulates the printed circuit board from electro-static discharge and/or other types of electrical damage or interference, as well as shock and vibrations.

Abstract: A coating insulator layer has plural rows of through holes disposed longitudinally in the coating insulator layer. A plurality of conductors are disposed in parallel with one another longitudinally in the coating insulator layer. Each conductor does not interfere with the through holes. Plural rows of locking projections are longitudinally formed on a face of the coating insulator layer. The locking projection has a construction to engage with the through hole. Thus, when a couple of the wiring substrates are layered, some of the locking projections formed on one of the wiring substrates are aligned to be engaged with some relative through holes of the other wiring substrate, allowing a sure lamination of the wiring substrates. The locking projections are disposed in regular intervals and the through holes are spaced in the same regular intervals. Another wiring substrate is enough flexible to be arranged along a structural wall for wiring.

Abstract: The present invention is a mounting platform for placement of a first device on a first plane in close proximity to a second device on a second plane. In the preferred embodiment, the first device is a voltage regulator circuit, the second device is a microprocessor, the first plane is the surface of the platform printed circuit board (PCB), and the second plane is the surface of the base printed circuit board. Typically the microprocessor is electrically coupled to the base printed circuit board and the voltage regulator circuit is electrically coupled to the platform printed circuit board. The mounting platform is mounted as a mezzanine over the base printed circuit board on the platform printed circuit board. Mounting the voltage regulator in this way allows the voltage regulator output to be placed adjacent to the microprocessor chip while at the same time minimizing the amount of valuable board space that is used.

Abstract: In a box-shaped electric part-mounting construction, a block (10) is fixedly mounted on a mounting portion such as a vehicle body, and a box-shaped electric part (30a) is mounted on the block through an attachment (20). An upwardly-open notch (14) is formed in a rib (13) formed in an upstanding manner on the block (10). The attachment (20) is reversibly fitted and held in the notch (14). Engagement portions (24) and (25) of different shapes for respectively holding two different box-shaped electric parts (30a) and (30b) are formed respectively on opposite sides of the attachment (20), and the different box-shaped electric parts (30a) and (30b) can be mounted on the block (10) through the attachment (20).

Abstract: A fan duct for dissipating heat generated by a central processing unit of a computer is disclosed. The fan duct has a main body defining an air inlet and an air outlet. An electrical fan is mounted to the main body below the air outlet. A knob is attached to a top wall of the main body and located above the fan. An enclosure of the computer includes a back panel and a top cover. The top cover is attached with a hook. The fan duct is firstly assembled to the back panel by extending screws through the back panel to threadedly engage with the fan duct. The top cover is then mounted to the back panel to reach a finally assembled position in which the hook engages with the knob, whereby a portion of a weight of the fan is supported by the hook.

Abstract: A changeable display element is edgewise mounted on an insulating board and carries to rotate through about 180.degree. to show one color face or the other to a viewer. The board provides a similarly colored face for each face to form a pixel. The element carries a permanent magnet and is driven by a switchable magnetic field provided from the board. Soft iron pads on the board cooperate with the magnet on each position to retain the element against incidental displacement between application of the field. The board may support arrays of such elements.

Abstract: A shield panel includes a substantially flat plate adapted to be snugly fit into an opening defined in a casing of an electronic device for shielding a circuit board inside the casing. Two board support arms extend from the flat plate. Each board support arm defines an elongate slot extending in a direction substantially normal to the flat plate having a distal end, a proximal end, and two edges extending between the ends for receiving and guiding an edge of the circuit board from the distal end to the proximal end. One of the edges of the slot is declined with respect to the other edge for accommodating a variation of an angle formed between the flat plate and the circuit board.

Abstract: Computer apparatus 10 includes mother board 10M, bracket 12 mounted on the mother board, a circuit board assembly 10A installed in the bracket, and a pair of assembly latches 13L and 13R. The mother board has connector slot 12E for electrically engaging corresponding contacts 10E on the circuit board assembly. The bracket has an elongated base member 12M positioned proximate the connector slot, and a pair of spaced retaining posts 12L and 12R extending generally away from the mother board, one at each end of the base member. The bracket receives the circuit board assembly into the space between the retaining posts. The circuit board assembly has heat conductive thermal plate 14 between circuit board 10C and heat sink 14H. The thermal plate has two end edges 14L and 14R, one proximate each retaining post, which are engaged by the retaining posts during and after installation. Each retaining post has a latch port 12P extending therethrough.

Abstract: A printed circuit board is provided with at least one component having one or more leads which are secured to contact faces of the printed circuit board. The leads of the component are secured to the printed circuit board via wire clamps soldered onto the surface of the contact faces. The formation of through-holes in the printed circuit board is rendered superfluous by the wire clamps. For the leaded components use can be made of resistors and capacitors, but also of a single electroconductive wire. Also described is a method of manufacturing the invented printed circuit board.

Abstract: A battery assembly is provided for holding a battery and for supplying power to an integrated circuit. When the battery is removed from the battery assembly, the battery assembly provides a LOW level signal to either the high voltage input (Vdd) of the integrated circuit or the reset port of the integrated circuit. The battery assembly includes a battery holder, a negative electrode attached to the battery holder and electrically connected to the a negative power line related to the integrated circuit, and a positive electrode also attached to the battery holder and connected to a positive power line to provide power to the integrated circuit. The positive and negative electrodes are disposed such that the battery may be held between the positive and negative electrodes, with positive and negative terminals of the battery in electrical contact with the positive and negative electrodes. The negative electrode includes an electrically conductive extension.

Abstract: A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Abstract: An aluminum heat sink bridge (1), mounted overlying a transistor unit (5) on a circuit board (12), has affixed to its underside, along two lateral edges, a pair of resilient plastic or rubber members (4), which, when the bridge is screwed down into place, exert continuous vertical pressure on the collector tab (8) and the base tab (7) keeping them in electrical contact with their underlying electrical contact points on the circuit board (12) while permitting horizontal movement of the tabs due to variations in temperature. One embodiment of the invention has resilient members extending the entire length of the bridge to exert vertical pressure on grounding tabs (9) extending laterally from the ends of the transistor unit.

Abstract: A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system. In one embodiment of the system of the present invention, a plurality of carriers corresponds to a plurality of ICs, and a board has a plurality of board regions for receiving the plurality of ICs and are arranged so as to be attached to a backplane forming a vertical stack of boards.

Abstract: The HT power supply unit modular support according to the invention comprises functional housings intended to accommodate the functional elements of the power supply unit, the insulating walls of which are formed by two protruding walls (2, 3) having overlapping complementary inclined surfaces (5, 6). Application to HT power supply units for X-ray sources.

Abstract: A display array including a board resembling a printed circuit board or printed wiring board to which are pivotally mounted a plurality of display elements whose appearance in a viewing direction is controlled by a sense of magnetization of a core which extends through a bore in the board. A conducting coil formed on the surface of the board is located so that current in the coil will magnetize the core.

Abstract: In a product including a printed circuit board which comprises a printed-circuit part and a terminal part and including a rechargeable battery having two terminals, and including retaining device for mechanically retaining the battery, the retaining device and the printed circuit board are arranged and constructed so as to be mechanically separate from one another, in such a manner that the printed circuit board does not form part of the retaining device, and each of the two terminals of the battery is connected to a terminal zone on the terminal part of the printed circuit board in an electrically conductive manner via a mechanically flexible and electrically conductive connecting device.

Abstract: In a modern computer, heat is removed from the internal power supply unit by means of a fan and ducting for channeling the airflow created by the fan through the circuitry of the power supply unit. The fan draws part of its air supply from the ambient air inside the computer casing and this helps to cool other components of the computer such as the microprocessor. As the power of microprocessors increases, the cooling requirement for this component has increased and heat sinks have been utilised to increase heat transfer to the surrounding air. Whilst further augmentation of heat removal could be achieved by increasing the power of the cooling fan, this would also increase noise levels. The present arrangement provides for increased heat removal without increasing fan power by arranging for the microprocessor heat sink to project into the ducting used to channel cooling air over the circuitry of the power supply unit.

Abstract: Overhead storage device adapted to be easily and inexpensively flush mounted on a variety of ceilings with little or no modification to the ceiling. The device is hingedly connected to a pan portion suspended from a ceiling and is selectively moveable from a first closed position against the ceiling to a second open position away from the ceiling.

Abstract: A pin-less retainer for mounting a press-pack device, which includes circumscribing fins for preventing arc formation between terminal faces thereof, onto the rods of a clamping mechanism used to stack a plurality of such devices and heat sinks together. The retainer is constructed out of a semi-flexible sheet having two mirrored sections, each section having a void therein and at least two extending tabs. The voids are sized such that the retainer may be press-fitted into interstices between the fins, and the tabs are shaped and sized to suspend the press-pack device from the rods and axially align the press-pack device with other elements of the stack. The retainer, being a pin-less mount, facilitates the easy and rapid removal of a press-pack device from a stack without having to completely disassemble it.

Abstract: An active integrated circuit socket includes plural pin sockets receiving corresponding pins of an integrated circuit and plural socket pins making electrical contact with a printed circuit board. At least one active electronic component requiring electrical power for operation connects a pin sockets to a corresponding socket pin. The active electronic component may be a single ended input to differential output driver, a differential input to single ended output driver, a single ended to differential input/output transceiver or a voltage level shifter. These active components may include passive termination resistors. The single ended to differential transceiver may further include an enable input determining the direction of data transmission. This invention may be employed as an electronic system upgrade product including at least two active integrated circuit sockets connected via a flexible sheet including a plurality of electrical conductors connecting differential signal lines.

Abstract: A unitized discrete electronic component array being surface mountable as a unit on a printed circuit board comprising a plurality of discrete electronic components physically secured to one another by an adhesive. The adhesive is a non-conducting high temperature resistant epoxy, polyimide or glass. The electronic components are capacitors, resistors or inductors, or combinations thereof.

Abstract: An electronic component operating at high voltage is mounted to the top side of an insulating platform, which in turn is supported from a chassis by a pedestal. The insulating platform provides a long surface path conduction distance of the electronic component to the chassis and to other components mounted to the chassis. The platform-mounted electronic component is thereby insulated against arcing and damaging the other components.

Abstract: Coin-shaped one-wire communication modules with a flange for mounting convenience may be attached to contact extensions on items such as work totes for ease of communication. A host computer can keep track and locate multiple items which have mounted communication modules with use of a single data line and a single ground line for all of the modules.

Abstract: A changeable display element is edgewise mounted on an insulating board and carries to rotate through about 180.degree. to show one color face or the other to a viewer. The board provides a similarly colored face for each face to form a pixel. The element carries a permanent magnet and is driven by a switchable magnetic field provided from the board. Soft iron pads on the board cooperates with the magnet on each position to retain the element against incidental displacement between application of the field. The board may support arrays of such elements.

Abstract: A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes.

Abstract: A housing of an electronic apparatus such as an information processing apparatus has a first board has arranged in a casing and has a first connector, and a second board with a second connector adapted to be fitted to the first connector. The second connector forms at least a part of the casing and is fixed to a conductive cover that is detachable from the casing. A heat generating member is detachably attached to the second board. The cover can be made of a metal in contact with the heat generating member through a heat conduction elastomer.

Abstract: A circuit configuration includes a planar carrier which has at least two contact lugs. A semiconductor chip which is disposed on the carrier is electrically conductively connected to the insulated contact lugs of the carrier. At least two of the contact lugs are used to connect the semiconductor chip to two ends of a coil. The two contact lugs have different lengths, so that none of the coil ends has to cross the coil winding.

Abstract: A support arrangement for mechanically securing and electrically contacting electronic components has a support member consisting of an electrically conducting material and having a contacting side. The support member has perpendicularly projecting hollow pins at the contacting side. The hollow pins are stamped into the support member. The electronic components have connecting tabs including an opening. The tabs are placed onto the hollow pins. The hollow pins project through the openings and the tabs. The heads of the hollow pins are then mechanically deformed and engage radially outwardly the circumferential edge of the openings of the tabs.

Abstract: An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are an apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are an apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are an apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Abstract: A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17.

Abstract: A method for manufacturing a chip card comprising a multi-layer plastic card body; an integrated circuit arranged within a chip module; at least one coil which serves for the energy supply and/or the data exchange between the integrated circuit with external devices, with the chip module having at least two metallic contacts for an electrically conducting connection of the integrated circuit with the terminals of the coil arranged on a coil carrier layer, comprising the steps of: providing the coil carrier layer with the coil and the coil terminals being arranged on same; providing a cover layer to be applied onto the coil carrier layer on the side of the coil terminals, with the cover layer comprising recesses which correspond to the coil terminals; providing at least one thickness compensation layer to be applied onto the cover layer; stacking of the card layers in registered relationship, with the cover layer being positioned in such a manner that each of the recesses in the cover layer comes to lie in the