Abstract: A liquid crystal apparatus is constituted by a display device for data display, a drive circuit unit for driving the display device, a unit substrate for supplying electric signals to the drive circuit unit, and a tape-form film carrier comprising an insulating substrate and a conductor covered with the insulating substrate for connecting the display device, the drive circuit unit and the unit substrate. A part of the film carrier is provided with a blank portion where the insulating substrate is locally removed to absorb a stress applied to the film carrier. A unit substrate constituting the drive circuit unit is screwed to a supporting member so as to allow a movement thereof relative to the supporting member by use of a space regulating means surrounding the screw shank.

Abstract: A carrier system for an integrated circuit carrier assembly composed of a carrier member supporting an integrated circuit. The carrier system enables a number of carrier assemblies to be flexibly and sequentially interconnected, so as to form a flexible and continuous chain of carrier assemblies. The carrier system is characterized by interconnecting the carrier assemblies with a single tape that facilitates accurate alignment and placement of the carrier assemblies within the carrier system, and minimizes the risk of an adhesive buildup on the equipment used to handle the carrier system and separate the carrier assemblies from the carrier system.

Abstract: The supporting plate and the bulk removal, transport and storage fixture for small batch-fabricated devices (1) have openings (2) penetrating from the top side (3) to the bottom side (4) of the plate and raised retaining means (5) on the bottom side (4). The raised retaining means (5) are provided in sufficient number and are arranged according to the shape of the devices (1) for retaining the devices. Flange means (7) which are designed for providing vacuum or agents to the devices (1) on the supporting plate are connected to the supporting plate thus forming a fixture. By changing the arrangement of the raised retaining means (5) and/or the openings (2) the supporting plate and the fixture may easily be adapted to different sizes and kinds of devices.

Abstract: An electrical apparatus with a detachable power supply base, including a power supply base which holds a rechargeable battery and a control circuit on the inside and has two coupling channel bars at the top, and an electrical apparatus having a base and two outward coupling flanges raised from two opposite sides of the base and adapted for detachably coupling to the coupling channel bars of the power supply base to become electrically connected to the battery of the power supply base. The control circuit detects the power level of the battery and shows it through a display for example an indicator light on the outside of the power supply base.

Abstract: A multi-layer substrate structure and a method for fabricating the same are provided. Thin metal foils are laminated on the top and bottom sides of a non-conductive layer so as to form a laminated substrate. A plurality of plated-through holes are formed in the laminated substrate and are then filled with an epoxy. The laminated substrate is then patterned and etched. Epoxy layers are disposed on both sides of the laminated substrate. The laminated substrate is formed with a plurality of smaller plated-through holes extending through the epoxy layers and with a cavity to receive an integrated-circuit die. The through holes and the epoxy layers are metallized on both sides of the laminated substrate. The laminated substrate is patterned and etched again. A solder mask is applied on both sides of the laminated substrate so as to form selective wire bondable areas and selective solderable areas. The integrated circuit die is disposed in the center of the cavity and has a plurality of bonding pads.

Abstract: A combination axial and surface mounted cylindrically-shaped package containing at least one electronic component and being surface mountable to a printed circuit board with electrical lands by the use of conventional axial component through hole mounting machinery that includes a hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, at least one electronic component that is contained in the hollow, electrically-insulated, and generally circular-cylindrically-shaped housing, a pair of electrically-conductive axial leads that are in electrical communication with the at least one electronic component, and at least one circumferentially-disposed, laterally-oriented, and electrically-conductive ring also in electrical communication with the at least one electronic component.

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.

Abstract: A mounting structure of the vibration-generating-motor comprises a vibration-generating-motor and a holder for holding the vibration-generating-motor. A holding section of the holder contacts faced inner surfaces of a case and is held by the inner surfaces. Vibrations of the vibration-generating-motor are directly conveyed to the case through the holding section. For assembling, the holder holding the motor passes through a circuit board and is fixed by a hole formed on the circuit board. Then, the both ends of the holder are brought into contact with faced inner surfaces of the case so that the holder is held by the inner surfaces. The above structure enables vibrations of a vibration-generating-motor to be efficiently conveyed to the surface of the case and reduces undesirable sounds due to resonance of a circuit board.

Abstract: An apparatus (10) for maintaining an electrical component (22) in a substantially fixed position relative to a base (24) in an electrical assembly, the apparatus (10) being electrically isolated. The apparatus (10) includes a component retention portion (12) adapted for contact with the component (22), a base retention portion (14) adapted for attachment to the base (24), and a variable portion (16) between the component retention portion (12) and the base retention portion (14), the variable portion (16) being adjustable to the size of the component (22).

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract: An anchor for mounting a heat sink and an electronic device on a printed circuit board has a plastic body. An arcuate groove or protruberance is engaged by a spring. The anchor has a neck which is inserted into a hole in a printed circuit board. A pin in a hole in the body is pushed into the neck to spread it to secure the anchor to the printed circuit board. The assembly is formed by attaching a wire or clip spring to the anchor.

Abstract: A portable air cooling apparatus for electronic components is provided comprising a compact fan which is situated horizontally, and which is mounted to four one inch legs protruding vertically downward. Each leg has a rubber boot to provide vibration free contact with the upper surface of an electronic component. Attached to the side of the fan is a settable thermal switch that alternately engages and disengages the fan, and a knob to control the setting at which to begin the delivery of cooling air. A 110 volt plug and power cord are provided to supply the energy required to drive the fan.

Abstract: The hermetically sealed package for an electronic device of the present invention comprises a body containing an electronic device therein and a covering member, such as a cap or a lid, for covering the body. The package is characterized in that the covering member of the package comprises a metal foil, and the covering member and the body are sealed together with a resin adhesive.

Abstract: An adapter (1, FIG. 1) is provided for the connection of an optoelectronic component such as an LED (light emitting diode) (2) to a circuit board (8) that lies in a case (34), wherein the adaptor positions the LED close to a window (32) in the top wall (30) of the case. The adapter has a pair of passages (4, 5) for holding conductors (11, 12) that connect terminals of the LED to SMD (surface mount device) contacts (6) that connect to the circuit board. The adapter holds the LED high enough above the circuit board, for the upper face (36) of the LED to lie in or close to the level of the window, so light from the LED can be readily seen from outside the case.

Abstract: A structure for mounting a switch to a front panel of an electric apparatus. Supporting members are arranged on the front panel to support an elastic member which can hold the switch under the elastic deformation of the elastic member. One support member is arranged one side of the opening in the front panel and another support member is arranged on the opposite side of the opening. The elastic member includes a pair of longitudinal webs adapted to engage with the lateral flap portions of the switch and at least one transverse web connecting the longitudinal webs together. The elastic member has tongues for engaging with the support member.

Abstract: A space-saving circuit board mounting of a Surface Mounted Technology (SMT) device, such as a resistor, capacitor, ferrite or clock oscillator, is achieved using (1) a single through hole extending transversely through the board substrate, and (2) a cylindrical adapter having a first longitudinal portion coaxially received in the through hole and a second longitudinal portion projecting outwardly therefrom. The second longitudinal adapter portion has a radially inwardly extending notch that receives the SMT device and positions it with its electrically conductive opposite end sections spaced apart in a direction parallel to the axis of the through hole. Spaced apart external metal plating sections on the adapter connect the SMT device end portions to circumferentially separated metal plating segments on the surface of the through hole which, in turn, are representatively connected to ground and signal plane structures within the interior of the board substrate.

Abstract: The present invention relates to an improved apparatus and screwless method for rack mounting an independent rail to a peripheral electronic component or primary rail. First, a spring-urged elongated arch having a convex surface and a concave surface is engaged by depressing the convex surface, the arch further having an engaged state and disengaged state, two legs, each of the legs being placed at an opposite end of the concave surface and angled inward of the arch. Second, the two legs are individually directed through two apertures in the independent rail. Third, the two legs are subsequently directed into two apertures in the peripheral electronic component. Finally, when the convex surface is released, the two legs retract and clamp the peripheral electronic component within the apertures of the peripheral electronic component.

Abstract: There is disclosed a cover for protecting the leads extending between a silicon chip device and an associated printed circuit board and their electrical connections with the board. The cover is formed out of clear plastic allowing inspection of the chip device and has several legs for securing and maintaining the cover on the board and has openings that allow for cooling of the chip device.

Abstract: A smoke detector or alarm includes on its lower side a cylindrical cup which may be lined with ribbed foam rubber. The inside diameter formed by the liner is designed to mate with the end of a broom or mop handle so that the cup forms a reasonably firm fitting socket for the handle end. A wedge shape triangular adapter plate is mounted on top of the smoke detector and slightly spaced from the top by a round vertical stud. Secured either directly to the ceiling or to the usual smoke detector mounting fasteners is a receiver into which the adapter plate fits. The receiver is in the form of a horizontal wedge shape triangular slot, the bottom of which has a blind slot to accommodate the stud of the adaptor. The bottom of the entrance to the receiver is provided with a lip over which the adapter plate must move. The smoke alarm may accordingly be readily removed and replaced for battery changing, servicing, and testing without the use of a step ladder or step stool.

Abstract: A quartet of parallel coupled planar triodes is removably mounted in a quadrahedron shaped PCB structure. Releasable brackets and flexible means attached to each triode socket make triode cathode and grid contact with respective conductive coatings on the PCB and a detachable cylindrical conductive element enclosing and contacting the triode anodes jointly permit quick and easy replacement of faulty triodes. By such orientation, the quad pulser can convert a relatively low and broad pulse into a very high and narrow pulse.

Abstract: A device and method for insulating a dry film capacitor includes a pair of electrically non-conductive discs having knurled protrusions extending therefrom. The dry film capacitor includes a core for receivingly engaging the protrusions to thereby secure the discs to the capacitor. The discs are dimensioned such that the discs when placed on the interior surface of a ballast can serve as supports for the capacitor by raising the capacitor away from contact with the ballast can. In connecting the discs to the capacitor, the protrusions are twistingly pushed into the core of the capacitor.

Abstract: An electrical module (125) is for mounting upon a circuit board (104). During circuit assembly, the electrical module (125) is placed upon a breakaway portion (117) of the circuit board (104) and a bracket assembly (103) is mounted to the circuit board (104) so as to position the electrical module (125). At the conclusion of circuit assembly, final assembly is initiated and the breakaway portion (117) is removed and the circuit board (104) is mounted into a housing (105). Preferably, the electrical module (125) is in direct contact with the housing (105) so as to maximize heat transfer.

Abstract: An implantable medical device including a hermetic housing containing an electronic circuit, such as a cardiac pacemaker. The electronic circuit may be coupled to a medical lead by means of a connector module which is formed as part of a molded, resilient shroud, extending around the circumference of the hermetic container.

Abstract: A device and method for interconnection packages in a stack. Each package encapsulates, for example a semiconductor chip containing an integrated circuit, which for example may be a memory. The packages (2) which have connecting pins (21) are mounted on support grid (4) which preferably act as a heat shunt, and are stacked and linked to each other with a resin coating (5). A stack (3) is cut out so that the pins on the packages and one edge of the grids are flush with faces (31, 32) of the stack (3). Connections between the packages themselves, and between the packages and stack connecting pads, are made on the faces of the stack. The connecting pads are where necessary fitted with connecting pins.

Abstract: A connector module (10,100,200) having at least one electrical terminal (24,116,206) therein, adapted to be sealingly mounted to a mounting surface upon being placed thereagainst at a connection site (30,112,204), and simultaneously form electrical connections of each terminal with a circuit (38,152,214) thereat, with the terminal adapted to be thereafter terminated to a discrete conductor wire (60,138,210,212) to interconnect the circuit with the wire. Upstanding lead members (40,160,216) are electrically connected to the circuits and are received into pin-receiving holes (50,172) along the module's bottom surface and become engaged with respective terminals. Each terminal is terminated to such a wire upon actuation of an actuator (26,118). A base section (14,104) of the module forms a seal with the mounting surface around the connection site (30,112,204). Such module can easily be mounted to a solar panel (32,110) or circuit board (202).

Abstract: In an electrical system consisting of individual subassemblies, particularly in a control system composed of modules, the individual subassemblies (1, 2) comprise housings, which are adapted to be arranged in a row and for making electric line connections are provided with plug terminals for counterplug terminals on a subassembly carrier. The housings (1, 2) are secured to the subassembly carrier (4) by detachable retaining elements (27, 30, 34), particularly by swivel holders Which permit the housings to be swung up, and by snap holders (27, 28) for locking the housings when they have been swung into the row.

Abstract: In an arrangement in which the earphone cord 16 of earphones 15 is connected to a remote control unit 11 and the remote control cord 12 of this remote control unit 11 is detachably connected to a portable audio unit 10 by means of a plug 14, a battery 19 that drives the elements inside the remote control unit 11 is embodied in a plug unit 13 having the plug 14. Specifically, a battery accommodation recess 23 is formed in the plug unit 13, and a battery holder 26 into which the battery 19 is fitted is detachably attached to this battery accommodation recess 23. As a result, with the plug 14 inserted into the portable audio unit 10, the portable audio unit 10 and the plug unit 13 are an integral unit and do not have the weight of the remote control unit 11 if the portable audio unit 10 is kept in a pocket or handbag. The remote control unit 11 becomes lighter and smaller to the extent of the battery 19.

Abstract: Trays having the same size are piled up by fitting a downward extending edge frame formed on the whole periphery of the undersurface of each tray on the outer wall of the upward extending outer peripheral frame formed on the outer wall of the lower tray. The tray has multiple rectangular pockets defined by longitudinal and crosswise partition portions formed in a space defined by the inner wall of the outer peripheral frame. An upward projecting base is formed in the central portion of each pocket, for supporting the undersurface of a semiconductor device. Downward extending ribs are formed on the undersurface of each tray. Each rib surrounds upper side portions of the semiconductor device housed in the corresponding pocket of the lower tray and fitted on the inner wall of the inner wall of the lower tray. A first horizontal space D.sub.1 is defined between the outer peripheral frame and the edge frame, and a second horizontal space D.sub.

Abstract: A method is provided for hermetically sealing a surface-mounted thick film electronic module within a cover soldered to a ceramic substrate, under the circumstances in which the input/output terminals of the electronic module are electrically interconnected with their corresponding external conductors on the exterior of the cover with a number of conductors. The integrity of the hermetic seal is promoted by routing the conductors beneath the ceramic substrate, as opposed to printing the conductors directly on the surface of the ceramic substrate, which necessitates that a dielectric material be placed intermediate the conductors and the bond material so as to electrically isolate the conductors from the bond material and cover. Consequently, an advantage of the present invention is the avoidance of a material mismatch between the dielectric material and the bonding material and the cover.

Abstract: Disclosed is a method of connecting the terminals of at least one heat-sinked, plastic-encapsulated power transistor to circuits of a printed-circuit board. In the method, a main flat surface of the plastic-encapsulated power transistor is adhered to a first side of a heat sink. The transistor has a plurality of terminals projecting from one end of a transistor body in an orientation generally parallel to the main flat surface of the transistor. On a printed-circuit board, a mechanical coupling device is mounted that has respective conductors with respective, terminal-receiving apertures, for receiving the terminals of the transistor. The conductors are connected to respective circuits of the printed-circuit board. The printed-circuit board is adapted to be located on the mentioned one side of the heat sink in an assembled position. The heat sink, with the transistor mounted thereon, is positioned such that the terminals are respectively inserted into respective apertures in the mechanical coupling device.

Abstract: An enclosure for protectively housing a printed circuit board in an electronic circuit module includes a base having an internal surface and an external surface. The base includes a pair of raised mounting pads formed on the internal surface which define respective mounting surfaces. A pair of channels are also formed on the internal surface of the base. The enclosure further includes a cover having a panel portion and a pair of end wall portions. Respective projections are formed on each of the end wall portions which define grooves therein. The cover is assembled to the base by inserting the edges of the end wall portions provided on the cover into the channels provided on the base. A plurality of spring clips is disposed within each of the grooves provided on the cover. The spring clips can be positioned at any desired location along each of the grooves.

Abstract: An electrical module (125) is for mounting upon a circuit board (104). During circuit assembly, the electrical module (125) is placed upon a breakaway portion (117) of the circuit board (104) and a bracket assembly (103) is mounted to the circuit board (104) so as to position the electrical module (125). At the conclusion of circuit assembly, final assembly is initiated and the breakaway portion (117) is removed and the circuit board (104) is mounted into a housing (105). Preferably, the electrical module (125) is in direct contact with the housing (105) so as to maximize heat transfer.

Abstract: An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element mounted in the cavity and having a plurality of leads, a plurality of the leads extending via the through holes from the element to the second surface, and a plurality of lead terminal recesses formed at the second surface for for receiving and forming terminal ends and connections of the leads to the circuit on the second surface.

Abstract: The innovation pertains to a device for fastening the housing of a data sensing element which encloses electronic circuits and connecting elements. Data sensing elements of this type are fastened in the wall which encloses the medium to be measured by means of a screw insert. Depending on their function, these data sensing elements may assume a position in which the connection of the connecting lines leading to a control room which is situated at a distance from the measuring point is only possible with great difficulties. This is the reason why the housing should be adjustable axially symmetrically relative to the screw insert. According to the solution suggested, the separable connection between the housing and the screw insert is formed by only one easily accessible screw which penetrates through a clamping disk and by projections which penetrate into a groove of the screw insert.

Abstract: An interconnector includes a first connecting portion connected to a front surface electrode of a solar cell, a second connecting portion connected to a rear surface electrode of another solar cell connected in serial direction, and a stress relief portion formed between the first connecting portion and the second connecting portion for absorbing displacement. The width of the first connecting portion in the parallel direction is made smaller than the width of the stress relief portion in the parallel direction. By this structure, the width of the front surface electrode of the solar cell can be reduced, the effective light receiving area of the solar cell can be increased, and therefore the efficiency in generating power can be improved.

Abstract: A stand-off device to mount an electrical component, in stand-off relation to a horizontally extending circuit board, the component having elongated lead structure, comprising a longitudinally vertically elongated body having a supporting end portion to support the component remotely from the board, the body having slot structure extending from the end portion to receive the lead structure; and deflectable retention structure carried by the body in proximity to the slot structure to be engaged and deflected by the lead structure, whereby the retention structure frictionally retains the lead structure in position in the slot structure prior to attachment of the lead structure to the circuit board.

Abstract: A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.

Abstract: A tray for semiconductor devices is used by piling up another tray or other trays on this tray. Rectangular pockets are formed on the upper surface of the trays and each of the pockets houses a semiconductor device. A base projects upward from each pocket to support each semiconductor device. The base has a similar shape to and is larger than the undersurface of the semiconductor device. Parallel guide ribs are formed on the undersurface of each tray and each is provided with an tapered inner face inclined downward outward of the base. The roots of the adjacent guide ribs define a portion of the undersurface of the trays which has a similar shape to and is smaller than the upper surface of the semiconductor device. The guide ribs are arranged to provide a horizontal play between the outer edge portions on the upper surface of the semiconductor device and the tapered inner face. An upwardly projecting holding mechanism extends along the outer edge portions.

Abstract: A mounting structure for an EMI prevention filter which facilitates mounting and dismounting of the EMI prevention filter onto and from an electric wire having a connector to be releasably connected to an electronic apparatus, and which allows reliable mounting of the EMI prevention filter even where the EMI prevention filter and an object electric wire do not conform fully to each other in configuration. An outer holder in which the EMI prevent filter is accommodated is disposed such that the electric wire extends through the inside thereof, and the, the outer holder is resiliently deformed and locked in this condition, where after a second threaded portion is screwed with a first threaded portion to mount the EMI prevention filter onto the electric wire.

Abstract: A wall-mounted enclosure for mounting electrical and electronic equipment and the like, in modular form. The enclosure body takes the form of a mounting assembly, including mounting modules, with each module including a backbone element and a cover element. The backbone element has a horizontally extending backplane bordered by two upstanding side portions, with an interassembly connecting mechanism for joining one backbone element to an adjacent backbone element. The backplane includes a flat mounting surface, with a pattern of preformed pilot holes, and two recessed wiring channels. Interconnection is provided by interlocks and screw anchor points. The cover element includes a horizontally extending cover plate with coverwalls and a cover assembly connecting mechanism for joining one cover element to another cover element. Adjacent cover elements are joined by mutual engagement of a mating tab and slot, and by screw anchor points.

Abstract: In a flyback transformer device wherein the leads of diodes or like electronic components are connected between pairs of terminal pieces provided upright at opposite ends of a coil bobbin, the lead ends of the components are fixedly connected to the respective terminal pieces by electric welding. A coil conductor wound around the bobbin has an end twined around the terminal piece, and the twined portion is soldered by dipping.

Abstract: A mounting bracket is disclosed, a pair of which are affixed at opposite sides of a conventional computer memory device (e.g. a hard disk drive system). The mounting brackets detachably connect the memory device to a removable computer circuit card by way of slots formed through the card. The brackets have legs which are received through the slots to engage the circuit card and thereby prevent the detachment of the memory device. Blocking arms of the mounting brackets are received through respective slots to prevent the disengagement of the legs of the brackets from the circuit card. A blocking arm and a leg are engaged in a single slot. The blocking arms may be rotated out of the slots to then permit the disengagement of the bracket legs from the circuit card so that the memory device may be disconnected from the card.

Abstract: The present invention provides a mechanism for kinetic energy dissipation which allows the bulk of the mass (e.g., a portable terminal) to be decelerated over some working distance such that the deceleration force is below the damage point. The present invention provides a molded "rubberlike" structure that serves as a carrier or cushion for internal structure (e.g., internal components of a portable terminal). The carrier structure has molded features including an outer frame that serves as a gasket, bumper and support and an inner structure which is molded to conform to the shape of the fragile electronic components that make up, for example, the terminal.

Abstract: An electrical installation device for fastening in an attachment position on a carrier rail includes an instrument housing made of insulating plastic and having an instrument housing wall and a bottom facing the carrier rail in an attachment position. A sliding latch is shaped in one piece to the instrument housing wall and is movable in a locking direction outside of the housing bottom transversely to the attachment direction and to the carrier rail direction. A flexible web, spring elastic in the locking direction, is connected between the sliding latch and the instrument housing wall. A detent lug is attached to the sliding latch and, in the locking direction, grips behind the carrier rail. An actuating end is connected to the flexible web and faces away from the detent lug, whereby the sliding latch is returnable against the spring elasticity of the flexible web from a locked position into a release position by actuation of the actuating end.

Abstract: A transistor mounting device (102) includes a recess area (112) for allowing a transistor (114)to be secured to the transistor mounting device (102) by turning the transistor a certain amount. Once the transistor (114) is secured into position to the transistor mounting device (102), a set of transistor pads (402) provide support and alignment to the transistor fins (116).

Abstract: A switch mechanism having a set of movable conductive contacts adapted to selectively conductively engage a set of conductive paths formed on a printed circuit board in order to open and close circuit paths created thereby. A contact carrier retains the movable contacts in a predefined spaced relationship and slidingly engages a guide member adapted to predeterminately guide the movement of the carrier with respect to the circuit board, the guide member being fixedly secured to a surface of the printed circuit board substrate.

Abstract: An integrated circuit device package of this invention includes a flexible substrate having an upper patterned insulative layer, and a lower patterned conductive layer including a plurality of package leads. An integrated circuit die is fixed within a void of the upper surface of the flexible substrate, and is provided with electrical connections to the package leads. A rigid upper protective layer is provided to substantially enclose the integrated circuit die, and at least partially cover the top surface of the upper insulative layer. The integrated circuit device package further comprises a rigid or semi-rigid lower protective layer opposite the upper protective layer. The rigid lower protective layer is prefomed, and preferably is made from a material selected from the group consisting of rigid ceramic, glass, plastic, and combinations thereof.

Abstract: Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.

Abstract: A device for attaching a heat sink to an electronic package comprises a pin having a compressible point, the point being adapted to pass through aligned holes in a heat sink and a printed circuit board so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package therebetween.

Abstract: A socket for mounting an external integrated circuit on a printed circuit board is described. The socket includes a base having a bottom that can be mounted on the printed circuit board and a top that can receive the external integrated circuit. A plurality of connectors are located on the top of the base for coupling to the external integrated circuit. An in-socket embedded integrated circuit is embedded inside the base for providing a predetermined electronic function. The external integrated circuit and the in-socket embedded integrated circuit occupy substantially minimized space on the printed circuit board. The external integrated circuit can be a microprocessor and the in-socket integrated circuit can also include a microprocessor. The socket can be used for a computer system that allows the embedded microprocessor functioning when the external microprocessor is not coupled to the plurality of connectors of the base.