Abstract: An instrument cluster having a housing, a system support (21) to receive indicating instruments, and a circuit board (6) which is connected by fastening elements (35) to the system support (21) and mounted in floating fashion.

Abstract: First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.

Abstract: A power connector for coupling a power supply to an integrated circuit (IC) whose current requirements may vary abruptly over time to a power supply is disclosed. The male connector comprises parallel conductive plates separated by a thin sheet of insulation. A mounting structure positions the power supply a predefined distance above the surface of a PC board upon which is disposed the IC. The male connector is electrically coupled to the IC and mates with a female connector attached to the power supply. The parallel plate male connector improves the ability of the power supply to accomodate abrupt changes in the current requirements of the IC by several different mechanisms. First, voltage oscillations associated with abrupt changes in the current requirements of the IC are reduced by selecting the inductance of the male connector to be low, which corresponds to a comparatively wide width of the conductive plates and a comparatively thin insulation thickness separating the plates.

Abstract: A primary printed wiring board includes: secondary printed wiring boards arranged in plural lines; main plated leads formed between the plural lines of secondary printed wiring boards; and auxiliary plated leads which connect patterns forming the secondary printed wiring boards to the main plated leads. In the primary printed wiring board, each main plated lead is zig-zagged to provide forward lines and backward lines which are laid respectively on both sides of a cutting line with respect to the pattern, and the auxiliary plated leads are connected to the backward lines.With the primary printed wiring board thus designed, the auxiliary plated leads can be isolated from one another without being processed by blanking. That is, by cutting the board along a predetermined cutting line or lines, the auxiliary plated leads can be separated from the main plated leads and isolated from one another.

Abstract: Chip-support arrangement (23) with a chip support (23) for the manufacture of a chip casing, said chip support being provided on a support foil (20) with conducting paths (21) which are connected on the front side of the support foil facing a chip (39) to contact-surface metallizations (40) of the chip and which with their free ends form a connection-surface arrangement (42) distributed in planar manner for the purpose of connection to an electronic component or a substrate, whereby the conducting paths (21) are arranged on the reverse side of the support foil (20), recesses (28) in the support foil (20) are provided in the region of the contact-surface metallizations (40), the conducting paths for forming the connection-surface arrangement (42) are covered with a perforated mask (36) and the thickness (s) of the support foil is smaller than or substantially equal to the height (h) of the contact-surface metallizations (40) on the surface of the chip.

Abstract: A mountable circuit breaker assembly and a method for mounting a circuit breaker on a base. A body portion of the circuit breaker is provided with rail insertion grooves on opposite sides thereof. The rail insertion grooves receive stepped portions of a corresponding pair of mounting rails mounted on a base. The circuit breaker body is retained relative to the mounting rails by engaging a protruding portion provided on one of the stepped portion of the mounting rails and the rail insertion grooves with a recessed portion provided on the other of the stepped portion of the mounting rails and the rail insertion grooves. The circuit breaker may be mounted onto a base on which the pair of mounting rails is provided by sliding the circuit breaker body between the mounting rails so that the respective stepped portions of the mounting rails are received in the respective rail insertion grooves provided on the circuit breaker body.

Abstract: The structure of the present invention includes a flexible printed circuit board (10) having a mounting portion 13 and a motor connecting member (11); a vibration motor (1) connected to the motor connecting member (11) and capable of generating vibrations; a motor cushion (25) for elastically holding the vibration motor (1); and a rectangular frame (52) for holding the motor cushion (25), wherein a second bent portion (60) and a third bent portion (61) for preventing transmission of vibrations generated by the vibration motor (1) are provided between the mounting portion (13) of the flexible printed circuit board (10) and the motor connecting member (11) of the same.

Abstract: A board usually resembling a PCB or a PWB mounts a display element, whose appearance in a viewing direction is controlled by the sense of magnetization of a core which extends through a bore in the board. A conducting coil formed on the surface of said board is located so that current in said coil will magnetize the core.

Abstract: An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.

Abstract: A modular control assembly for controlling a plurality of electromechanical components in a printing machine for producing prints on a substrate is provided. The assembly includes a body, a plurality of electrical components mounted onto the body. The assembly further includes a plurality of electrical conduits. Each of the conduits is electrically connected to at least one of the electrical components. The assembly further includes a plurality of electrical connectors. Each of the connectors is electrically connected to at least one of the electrical conduits. The electromechanical components are quickly electrically connectable and disconnectable to the assembly at the connectors.

Abstract: A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.

Abstract: The present invention is a mounting structure for a power supply. The mounting structure of the present invention allows power to be coupled from a power supply to a predetermined area on a motherboard adjacent one or more high power demand components, such as an IC microprocessor chip. The mounting structure includes a frame; a plurality of legs attached to the frame for supporting the frame on the motherboard; the ends of the legs opposite the frame being attached to the motherboard; a fastener coupled to the frame for releasably fastening the power supply to the mounting structure such that the power supply is positioned a predefined distance above the upper surface of the motherboard; and a plurality of power buses interconnecting the power supply and the motherboard at predetermined area on the motherboard adjacent a high power demand IC chip.

Abstract: A thin dielectric substrate bearing a plurality of conductive leads has a hole circumscribed by the substrate in which is positioned a die having pads that are bonded to ends of leads carried by the substrate and projecting into the hole for contact with the die pads. The leads include free outer ends that project laterally outwardly and downwardly away from the plane of the substrate for connection to contact pads on a circuit board. The free leads are isolated from pressure applied to the chip on tape assembly after it has been connected to a circuit board by means of a thin self-supporting thermally conductive heat spreader that contacts the side of the die opposite its pads and includes fixed standoff and/or alignment pins that extend through alignment holes in the thin substrate and are in physical contact with a surf ace of the printed circuit board.

Abstract: A support fixture for supporting a face plate and CCA board as they are secured together has a base plate and a pair of end supports or blocks projecting upwardly from opposite ends of the base plate to support opposite ends of the face plate. A center support also projects upwardly from the base plate at a location spaced centrally between the two end supports for supporting a central region of the face plate. The end supports have rectangular recesses at the same height as the center support for receiving the opposite ends of the face plate. The height of the recesses and center support is selected to be greater than the height of any LED projecting from the CCA board through openings in the face plate, such that any such LED is spaced above the base plate.

Abstract: A surface mount carrier device which permits an electrical component having wire leads to be converted for surface mounting on a printed circuit board is disclosed. The carrier device comprises a body member fabricated from an electrical insulating material which includes a pair of upwardly extending, U-shaped lead supports. The lead supports define a pair of vertically opposed, symmetrical notches wherein the wire leads of the component are attached to the carrier device. In one embodiment the carrier device includes a pair of electrically conductive tabs which are secured within the notches and bent around the end faces of the carrier device and extend to a bottom surface thereof so as to provide an electrical pathway from the component to the printed circuit board whereon it will be fused. The wire leads are soldered to the conductive tabs and cut off at the end faces of the carrier device.

Abstract: A portable electronic device (100) includes a housing cover (110) having a faceplate location (145), an electronic circuit (115), and a first faceplate (140). The location comprises a generic controls cutout (135) and a generic display cutout (130). The electronic circuit includes a specific set of controls (125) fitting within the generic controls cutout and a specific display (120) fitting within the generic display cutout. The first faceplate (140) is mounted in the faceplate and has a specific controls cutout (155) that is conformal to the set of specific controls (125) and a specific display lens (150) that is conformal to the specific display (120) and is one of a set of faceplates, wherein the first faceplate (140) is incompatible with another faceplate in the set of faceplates.

Abstract: The present invention relates to an improved socket for use with a printed circuit board. The socket removably secures an integrated circuit package and a separate electronic item to a printed circuit board. The socket includes a non-moveable member and a moveable member. The non-moveable member has a first plurality of pin-contacting sections for receiving pins that extend from the integrated circuit package. At least one of these pin-contacting sections is electrically connected to the printed circuit board. The moveable member has a second plurality of pin-contacting sections for securing the pins that extend from the integrated circuit package when the moveable member is in a locked position. The moveable member also includes a retaining projection to at least partially secure the separate electronic item when the moveable member is in the locked position. The socket may also include a lever that is rotatably connected within the non-moveable member.

Abstract: The invention relates to a data carrier comprising a card body and an integrated circuit connected electroconductively via contact elements with at least one coil serving the purpose of power supply and/or data exchange of the integrated circuit with external devices. The invention is characterized in that the integrated circuit and the contact elements form a separate module known in the art and the coil is disposed on a card body constructed from one or more layers in known fashion. The coil is preferably formed as a flat coil.

Abstract: A remote control holder having a mounting face to which several remote control units are attached using releasable fastening strips. The mounting face terminates in a curved frontal section enabling the holder to be hung on a television or other piece of furniture when not in use. A label containing information, such as a channel guide, is attached to the mounting section undersurface. A clear acrylic window fits over the label and attaches flush onto the undersurface providing protection for the label.

Abstract: An assembly of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier. Tabs on the carrier engage slots in each substrate to align the substrates with respect to the carrier. At least one pair of male projections on each substrate frictionally engage female retaining members in the carrier to lock each substrate with respect to the carrier. The assembly is thus adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier. The carrier can be of metal or recyclable plastic material.

Abstract: A transport pallet is provided for automating pre-shipment testing or "burn-in" of personal computers. The transport pallet is adapted to receive and transport the computer from an assembly line to a test storage location or bin. The pallet also provides on-board connections by which both operating power and computer signals are furnished to the personal computer at the test storage location. The pallet is adapted to engage external power supply terminals and external computer signal inputs at the test location. The pallet furnishes both power and test signals to the personal computer and return responses of the computer through the on-board connections, permitting "burn-in" testing of the computer while it is located in the test storage bin.

Abstract: In order to make contact from heavy-current connecting elements of a component, in particular a relay, to connecting conductors of an insulating mount (1), the blade terminals of the component, in the form of connecting tongues (10) are welded to bent connecting tabs (12) of the connecting conductors (13), which are embedded in a mount, for example a printed circuit board. In order to protect the plastic located in the vicinity against damage from the welding energy, the end sections of the connecting tabs (12) and of the connecting tongues (10) are provided with a tooth contour, such that the individual teeth (16, 17) are welded successively. Having a reduced area with which to conduct the current, the teeth reach a high thermal load. In consequence, the teeth rapidly reach the melted phase, without the adjacent plastic being caused to melt via the heat conduction in the short welding time.

Abstract: A printed wiring board and an electronic device using the same with which the formation of cracks in base portions of projecting external electrodes formed on lands on the printed wiring,board is certainly prevented. With respect to a printed wiring board 11 having lands 16 formed in a wiring pattern where external electrodes 13 are to be formed and a pattern-protecting film 17 having openings 17a where the external electrodes 13 are to be formed, the opening diameter D1 of the openings 17a in the pattern-protecting film 17 is set greater by a predetermined dimension than the external diameter D2 of the lands 16 and a gap is thereby provided between each of the external electrodes 13 and the pattern-protecting film 17 so that the external electrodes 13 and the pattern-protecting film 17 do not make contact with each other and as a result there is no cracking of the external electrodes 13 caused by differential thermal expansion of the external electrodes 13 and the pattern-protecting film 17.

Abstract: In order to provide a secure housing assembly for an electronic lock, while also providing protection against electrostatic discharge, a conductive plate-based housing assembly is configured to be installed within either a door mortise, or as an escutcheon housing mountable to the exterior of the door. For either installation, the same metallic plate sub-assembly is employed as both a support structure for a circuit board of the lock's electronic circuitry and as a wall of the protective housing. Since the circuit board's ground conductor layer is electrically connected to the metallic plate via conductive mounting standoffs, the lock circuitry is protected against damage due to electrostatic discharge when a key is inserted into a keyway of the lock.

Abstract: A tape ball grid array (TBGA) package, and a method of making a TBGA package, includes the use of a metal or other stiffener affixed to a flexible tape on which conductive traces connect contact points on an integrated circuit (IC) chip with an array of solder balls. The stiffener is perforated with a pattern of small vent holes. The TBGA package materials are hygroscopic. When the TBGA package is heated during 2nd level packaging, e.g., during solder reflow, moisture absorbed within the hygroscopic materials evaporates and the resulting water vapor is able to escape through the vent holes, rather than becoming trapped within the IC package and introducing various 2nd level packing failure modes.

Abstract: A structure for mounting a VIB motor and a button pedestal in a compact portable electronic equipment wherein a rear panel has a plurality of fitting pawls formed by partly bending the rear panel, and a button pedestal has recessed portions to fit with some fitting pawls of a plurality of fitting pawls, and wherein some fitting pawls so fit as to engage with the recessed portions formed in the button pedestal to mount the button pedestal, and the VIB motor is positioned and fixed between all or some other fitting pawls, of some fitting pawls that fix the button pedestal, of the plurality of fitting pawls formed on the rear panel, and fitting pawls, other than some fitting pawls that fix the button pedestal, of the plurality of fitting pawls, thereby mounting the VIB motor.

Abstract: A module houses electronic circuitry that comprises a first electrically conductive surface area and a second electrically conductive surface. The first and second electrically conductive surfaces combine to form a substantially token-shaped body. The body has a groove positioned around its perimeter. A probe that has a first end and a second end. A conductive, approximately pointed tip that extends from the first end of the probe and a conductive sleeve extends outward from pointed tip from a location proximate to said first end to a second distance. A first electrical connection contacts the tip and extends from the first end through the probe out the second end. A second electrical connection contacts the sleeve and extends from the first end through the probe out from the second end. A housing that holds an electronic module. The electronic module has a first surface and a second surface.

Abstract: A device with an electric circuit configuration includes electrical components and a pressed grid stamped from a metal strip for electrically conductively connecting the electrical components to one another. The pressed grid has bent-over large-area peripheral regions and a plug part with connection pins stamped out of the metal strip.

Abstract: An enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material.

Abstract: The present invention is to provide an electronic part mounting device including: a lamination body composed of a circuit board and a structural member; an electronic part attached in an opening formed in the lamination body; and an encapsulant layer to encapsulate the electronic part, wherein an outer circumferential line of the opening is arranged inside an outer circumferential line of the encapsulant layer. Due to the foregoing arrangement, in the electronic part mounting device of the present invention, even if the device is bent, the encapsulant layer to encapsulate the electronic part is engaged with the circuit board or the structural member arranged inside the outer circumferential line of the encapsulant layer, so that electronic parts are prevented from coming off. Further, the manufacturing process is simple. Therefore, the cost of the electronic part mounting device can be greatly reduced.

Abstract: The present invention relates generally to an apparatus for securely retaining a small battery or electric cell on a printed circuit board, and for providing electrical contacts which engage the battery for use in an electronic circuit. The present invention provides an improved mechanical attachment of the battery retention apparatus to the circuit board by means of a plurality of tabs which extend through and engage the printed circuit board. These tabs are separate and apart from the electrical connections to the circuit board.The apparatus of the present invention provides a lightweight, low-profile, rugged battery retention mechanism capable of withstanding impulse forces. The apparatus is low-cost, easily manufactured, and facilitates easy installation, and is particularly well suited for remote control devices and other hand-held or portable units.

Abstract: A miniature motor includes a frame which has been solder treated on its surface and which has a closed end and is generally cylindrical-shaped or generally oval-shaped in cross section. The frame includes a projected portion of an outer periphery thereof for insertion into a hole of a printed circuit board. The projecting portion has a notch for holding the printed circuit board therein, wherein the printed circuit board and the projected portion extending through the hole of the printed circuit board are soldered to each other with solder while the printed circuit board is held in the notch of the projected portion.

Abstract: A surface mount package to encapsulate one or more semiconductor devices has a standoff that maintains the thickness of solder columns bonding the package to an external circuit. The standoff either extends over or circumscribes a central portion of the package base. To enhance the thermal performance of the standoff, a solderable layer enhances soldering of the standoff to the external circuit.In alternative embodiments, the standoff contains a flange having a plurality of apertures useful for either mechanically locking an adhesive or for enabling irradiation of an adhesive by a light source. The standoff may contain protrusions for alignment, strength or circuit routing.

Abstract: Many circuit boards include conventional sockets for receiving optional ICs. Such sockets are soldered to the circuit board during the manufacturing process. However, many of such sockets are wasted because they are never used. Such waste can be eliminated by using a clip-on IC retaining apparatus. It includes a housing, a retaining clip, and four registration holes arranged at the comers of a trace pad on a circuit board. The housing includes a shallow, open cavity on a bottom side for receiving a SMD. Four registration fingers projecting from the bottom of the housing mate with the registration holes on the circuit board to align the pins of the SMD with the trace pad. Ribs on the walls of the cavity slide between the pins to separate and straighten any bent pins. The retaining clip includes four downwardly bent flat springs connected in a rectangular pattern. Four slots in the housing extend vertically between the top thereof and the bottom of the fingers.

Abstract: A sealable housing for electrical components comprises an extruded main body having a first end and a second end, the extruded main body defining a longitudinal axis and having an outer wall and a substantially cylindrical bore. Two end caps are removably sealably attached to a respective one of the first and second ends of the extruded main body to define, together with the substantially cylindrical bore, an electrical component chamber. Thickened longitudinal outer wall segments extend radially outwardly from the cylindrical bore. The electrical components are mounted within the electrical component chamber by being conventionally attached to a trolley, which trolley is longitudinally interfitted to a mounting track contiguous with the extruded main body. The extruded main body is preferably constructed from aluminum.

Abstract: A method is provided for producing a capacitor to be embedded in an electronic circuit package comprising the steps of selecting a first conductor foil, selecting a dielectric material, coating the dielectric material on at least one side of the first conductor foil, and layering the coated foil with a second conductor foil on top of the coating of dielectric material. Also claimed is an electronic circuit package incorporating at least one embedded capacitor manufactured in accordance with the present invention.

Abstract: A technique for applying uniform force to an IC chip module, urging the module into electrical contact with one face of a circuit board, is provided. One face of the board has contact pads, and the module has contact members on one surface corresponding to the contact pads. A first clamping member is provided having a pressure applying section and a reaction section mounted for movement toward and away from each other. A second clamping member having a pressure applying section is provided. The module is interposed between the pressure applying element of one of the clamping members and the substrate with the contact members on the module in electrical contact with the pads on the board. Several pins interconnect the reaction section of the first clamping member and the second clamping member to restrain movement of the reaction section of the first clamping member away from the second clamping member.

Abstract: An interface device having a printed circuit board connected to a processor unit and an electronic base with grooves to receive the board with active or passive interface devices connected by terminal blocks. The interface devices are housed in separate modules having lengths which are equal to or integer multiples of a modulus wherein each module includes a strip of indicator openings or terminal operating openings disposed lengthwise at a particular pitch. The modules have complementary grooves and tongues on their side faces in order to permit assembly perpendicular to the plane of the board thereby forming a rigid assembly.

Abstract: A layered circuit-board designing method and layered circuit-board where circuit-boards to be overlaid are connected at the center or an arbitrary position of each circuit-board. The layered circuit-board includes an upper-layer first circuit-board, a lower-layer third circuit-board, and an intermediate-layer second circuit-board between the first and third circuit-boards. A first connector is mounted on the first circuit-board, a second connector is mounted on the third circuit-board, a third connector is mounted on the top surface of the second circuit-board, while maintaining the positional relation between the third connector and the first connector, and a fourth connector is mounted on the bottom surface of the second circuit-board, while maintaining the positional relation between the fourth connector and the second connector. In addition, through holes are provided at pins of the third and fourth connectors for passing through the front and bottom surfaces of the second circuit-board.

Abstract: A CPU heat dissipating device including a CPU mount having a center opening and a plurality of raised portions spaced around the center opening at the top, a CPU mounted on the CPU mount and spaced from the top side of the CPU mount by the raised portions thereof, a heat sink attached to the CPU at the top, and a fan controlled to draw outside air into the center opening of the CPU mount, permitting it to be forced horizontally outwards through the gap between the CPU mount and the CPU in all directions.

Abstract: An electronics assembly is described which allows three-dimensional movement of a printed wiring board (PWB) relative to an attached electronics subassembly. The subassembly is attached to the PWB by a coupling device which is capable of resilient deflection responsive to mechanical agitation while maintaining effective electrical and thermal communication between the subassembly and the PWB. The coupling device includes contact surfaces which enhance the reliability of the overall electronics assembly by minimizing the potential for detachment of the subassembly from the PWB.

Abstract: A housing for an electrical component which protects the electrical component sealed therein and reduces mechanical stress on the electrical component includes two housing sections which are connected to each other, a support for the electrical component located within the housing, and attachment connections for mounting the housing on a mounting point, e.g., of a motor vehicle chassis. To reduce the mechanical stress imposed upon the electrical component, and to obtain a good seal of the housing interior against dirt, etc., the two housing sections are connected to each other directly or via an intermediate piece. The housing interior is sealed by one or two seals, made from elastically or plastically deformable material, which are located between the faces of the support and the housing sections associated with them. The attachment connections are located on one of the two housing sections.

Abstract: A heat sink may be shared among a plurality of electronic devices attached to a printed circuit board by attaching the heat sink to the printed circuit board using a plurality of standoff/spring combinations. In this way, the level of compression imposed by the springs on the heat sink allows the heat sink to make the appropriate level of thermal contact with the electronic devices.

Abstract: A part holder comprises a groove into which one terminal of a part is inserted, and in a cross section of the groove, there are at least two projecting peaks in one side, one projecting peak in the other side of the holder which is positioned at center between the two projecting peaks. The distance between a line linking vertexes of the two projecting peaks in the one side of the groove and a vertex of the one projecting peak in the other side of the groove is shorter than the diameter or width of the terminal of the part.

Abstract: A method and apparatus for reducing warpage of an assembly substrate and providing registration between a surface mount technology (SMT) component and the assembly substrate. The SMT component includes mounting pins extending from the component and capable of engaging corresponding apertures in the assembly substrate. Each mounting pin is registrable with a corresponding aperture in the assembly substrate. The mounting pins are capable of providing an interference fit between the SMT component and the assembly substrate.

Abstract: An adapter is provided for electrically connecting a printed circuit board to an airbag accelerometer. The adapter includes a leadframe housing to which is joined a leadframe, as, for example, by embedding the leadframe within the leadframe housing during insert molding thereof. The leadframe includes connector tails which extend in a first direction for connection to a printed circuit board and facing segments which face in a second direction for connection to an airbag accelerometer. The first and second directions are angularly disposed relative to each other. An adjuster assembly which includes such an adjuster is also provided.

Abstract: Latches are pivotally provided on opposite sides of an IC device stored in the pocked of an IC carrier. Connecting arms of the latches are engaged in engagement holes formed in actuator members which are biased upwardly by springs. The top surface of the IC carrier, except the IC pocket, is covered by an actuating plate. The positioning pins of an IC set/removal mechanism are inserted into holes of the IC carrier so as to cause the mounting plate to which the pins are secured to press the actuating plate down against the top face of the IC carrier causing the actuator members to pivot the latches, whereby the hold-down lugs of the latches are retracted from the top of the IC. The IC is now ready to be picked up by a suction pad.

Abstract: A semiconductor chip mount structure includes a substrate having a base surface on which base side connectors are formed; a semiconductor chip mounted on the base surface, the semiconductor chip having chip side connectors on a first surface thereof facing the base surface, the chip side connectors being electrically connected to the base side connectors; an insulating resin layer covering the chip side connectors and the base side connectors; a metal layer, made of a metal having a melting point lower than a temperature at which the electrical components of the semiconductor chip may be thermally destroyed, for covering the semiconductor chip and the insulating resin layer; and a wetting characteristic improving layer such as a metal powder or foil layer, formed along a contact surface between the metal layer and the insulation resin layer.

Abstract: A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

Abstract: For use with a printed circuit board (PCB), a socket removably retains a CPU integrated circuit package and a separate voltage regulator module with only one manually-engaged latch. The socket includes a non-moveable member and a moveable member. The non-moveable member interfaces with the PCB and with the voltage regulator module. The non-moveable and moveable members receive the CPU integrated circuit package and the moveable member includes a retaining arm for locking into the voltage regulator module. The moveable member is moved from an unlocked position into a locked position for fixedly securing the CPU integrated circuit package, with the arm securing the voltage regulator module. Other optional features include power plane connectors and decoupling capacitors within the socket.