Abstract: Provided are a semiconductor package and a plasma display device including the same. The semiconductor package includes a film substrate that relays a signal between a circuit board and a display panel; a semiconductor chip that is electrically connected to the film substrate; a reinforcement plate to which the film substrate and the semiconductor chip are connected to via adhesive layers, and that provides a floating ground; and a connecting member that electrically connects the reinforcement plate and a ground of the semiconductor chip, and the electrically connects the reinforcement plate and a ground of the film substrate. Accordingly, the semiconductor package has excellent heat dissipation performance and ground stability.

Abstract: A mounting structure of a semiconductor package includes a semiconductor package, a chassis having a coupling boss protruding at a position corresponding to the coupling hole, a coupling member penetrating the coupling hole and coupled to the coupling boss, and an insulation member covering around the coupling hole of the reinforcing plate and making insulation contact with the coupling member and the coupling boss. The semiconductor package includes a film substrate for interfacing transmission of signals between a circuit board and a display panel, a semiconductor chip forming an electrical contact point with the film substrate, and a reinforcing plate to which the film substrate and the semiconductor chip are directly attached. The reinforcing plate has a coupling hole.

Abstract: An enclosure for electronic device includes a chassis, a power supply, and a cover. The chassis includes a bottom wall. A ring and a plurality of elastic pieces protrude from the bottom wall. The power supply includes a top side and bottom side. The bottom side defines a sliding groove. The top side defines a receiving groove. The power supply is located on the plurality of elastic pieces of the chassis with the ring positioned in the sliding groove. The cover includes a protrusion. The cover is mounted on the chassis. The protrusion is positioned in the receiving groove, and biases the power supply toward the plurality of elastic pieces.

Abstract: A flat panel display device having improved drop characteristics, that minimize a drop shock of the flat panel display device by controlling the size of a shock-absorbing tape, the flat panel display device including: a display panel having a display part to display an image and a pad part; a supporting member configured to support the display panel; and the shock-absorbing tape disposed between the display panel and the supporting member. The shock-absorbing tape is in contact with the display part of the display panel and ? to ? of the pad part of the display panel.

Abstract: According to the present invention, there is provided a holder having a pressure flange not to be easily disengaged from a small-sized electronic part in pressing and accommodating the holder having the small-sized electronic part in a mounting recess. A holder includes a projecting portion protruding from a pressing flange toward a cylinder axis of a holding portion, formed in a portion having a predetermined length of an inner edge of the pressing flange. With this construction, when the holder accommodating a small-sized electronic part is mounted to a casing of an apparatus, even if the pressing flange is rolled up and about to be disengaged from the small-sized electronic part, the projecting portion engages with the small-sized electronic part, thereby preventing the pressing flange from being rolled up.

Abstract: A spacer or retainer secures two circuit boards in a back-to-back configuration. The spacer has opposite first and second sides, each having a peripheral rim against which the circuit boards fit. Each side is recessed to a depth enabling any component terminals or connections from rear surfaces of the circuit boards to be received in the recesses. Pins on ends of the spacer are received in apertures in the circuit boards to guide the circuit boards into position on the spacer. Two clips are positioned next to each other on one wall forming the peripheral rim. Each clip extends beyond an opposite side, and the clips have resilient tabs biased to press the circuit boards against the rims. The circuit boards are connected by electrical wire extending around an opposite wall of the peripheral rim. The spacer and circuit boards form a subassembly, such as for a vehicle instrument cluster.

Abstract: An electrical apparatus that can be fixed to a supporting frame having a mounting window to receive the electrical apparatus includes a main body having a substantially box-like shape and first fixing elements provided on first and second opposite sides of the body to engage with corresponding second fixing elements the frame and facing the mounting window. The first fixing elements include guiding fixing elements to permit axial and guided sliding of electrical apparatus with respect to the frame in inserting the apparatus into the mounting window. The first fixing elements further include snap-in fixing elements to block axial sliding of the electrical apparatus with respect to the frame once a predetermined snap-in position has been reached.

Abstract: An energy cell package includes an energy cell, a first metal substrate, a second metal substrate, at least one first jointing component, at least one second jointing component, and an insulating structure. The energy cell has at least one positive contact and at least one negative contact. The first metal substrate has an end functioning as an external positive contact. The second metal substrate has an end functioning as an external negative contact. The at least one first jointing component joints the at least one positive contact and the first metal substrate, and the at least one second jointing component joints the at least one negative contact and the second metal substrate. Except the external positive contact and external negative contact, the insulating structure coats the energy cell, first metal substrate, second metal substrate, at least one first jointing component, and at least one second jointing component.

Abstract: A battery cover includes an outer panel, an inner panel, a resilient member and a chassis. The inner panel is disposed on the outer panel. The resilient member is located on the inner panel and includes two elongated arms. Each elongated arm includes a contact at the distal end thereof. The chassis is disposed on the resilient member and the inner panel, and is fastened to the outer panel. The chassis defines two openings configured for the two contacts to extend out correspondingly.

Abstract: A bracket is provided for supporting a current transformer on a printed circuit board including a first aperture and a second aperture. The bracket includes a base portion including first and second ends, the base portion extending therebetween; a first mounting portion extending laterally from the first end of the base portion to an end of the first mounting portion, the first mounting portion being structured to be coupled with the first aperture in the printed circuit board; and a second mounting portion extending laterally from the second end of the base portion to an end of the second mounting portion, the second mounting portion being structured to be coupled with the second aperture in the printed circuit board. The end of the first mounting portion forms a first tab and the end of the second mounting portion forms a second tab, which are structured to extend through and be coupled with the first and second apertures, respectively.

Abstract: The disclosure describes a printed circuit board (PCB) for use in an electronic device. The PCB comprises: a top side; a bottom side; an edge between the top side and the bottom side; a cavity from the top side to the bottom side; a region on the top side for mounting an electronic device; and a connector for receiving connections from the electronic device. In the PCB, the connector is located on either the bottom side or the edge of the side of the PCB. The electronic device can be a display module.

Abstract: Embodiments of a storage cabinet and methods for making and using such cabinet are disclosed. In one embodiment of an apparatus. a tubular sealed chamber for storing telecommunications equipment is coupled to a sealed chamber to support the sealed chamber. The tubular sealed chamber comprises at least one mount configured to attach and remove the telecommunications equipment, a tube and at least one door to enclose one end of the tube. The support structure partially surrounds the sealed chamber and an area between the sealed chamber and the support structure defines an inter-tube space that functions as a thermal barrier.

Abstract: A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.

Abstract: A component and card coupling alignment and support apparatus includes a card. A primary component connector is mounted to the card. A primary component including a connection edge engages the primary component connector. A secondary component extends from the primary component. An alignment and support member is included on the secondary component, whereby the card engages the alignment and support member on the secondary component. The engagement of the alignment and support member with the card aligns the primary component with the primary component connector during their coupling and supports the primary component in the primary component connector after their coupling. The card may then be coupled to an information handling system connector in an information handling system.

Abstract: The present invention relates to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. One such arrangement involves a foil carrier structure, which includes a foil adhered to a carrier having cavities. Some methods of the present invention involve attaching dice to the foil and encapsulating the foil carrier structure in a molding material. In one embodiment, the molding material presses against the foil, which causes portions of the foil to distend into the cavities of the carrier. As a result, recessed and raised areas are formed in the foil. Afterwards, the carrier is removed and portions of the raised areas in the foil are removed through one of a variety of techniques, such as grinding. This process helps define and electrical isolate contact pads in the foil. The resulting molded foil structure may then be singulated into multiple semiconductor packages.

Abstract: A composite-metal-composite sandwich structure is employed as a housing of a mobile electronic device. A metal sheet is preformed as a desired shape with nuts deposed thereon. A composite sheet is attached to each side of the metal sheet, exposing the nuts such that other components of the mobile electronic device can be screwed on the sandwich structure.

Abstract: An attachment device for attachment of an electrical or electronic device to a top-hat rail, including an attachable or integrated carrier plate, and a lockable fastener. The carrier plate has a holding device. The fastener is axially movable relative to the carrier plate and has an elongated base region, metal catch hooks, and a spring tongue punched out of the base region. The carrier plate has a projection protruding in a direction of the fastener, and arranged corresponding to the spring tongue.

Abstract: A supporting structure for a circuit board includes a main body, a first post, and a second post. One end of the first post is connected to the main body, and the cross-sectional diameter of the first post is less than that of the main body. The second post is connected to the other end of the first post, and the cross-sectional diameter of the second post is less than that of the first post. The supporting structure is correspondingly inserted into a corresponding hole on the circuit board.

Abstract: An integrated circuit package system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation.

Abstract: Provided is a system-in-package module including a system circuit board; a first element that is disposed on the system circuit board; a second element that is disposed on the first element so as to be shifted to one side from the center of the first element, while partially exposing the first element; a third element that is electrically connected to the system circuit board and is disposed on the second element; and a plurality of bump pads that are disposed on the bottom surface of the system circuit board.

Abstract: An enclosure (10) that contains a switch (40, 42) and that is surrounded by an explosive or flammable environment that could be ignited by a spark from the switch, includes a body (52) that guides a flat cable (16) through a body bore (56) to the inside of the vessel. A tight and strong seal is formed around the flat cable by a tubular seal (60) that lies in the body bore, that is formed of Teflon, and that has a tapered seal section (84) that lies in a tapered section (74) of the bore. A nut (62) at the rear of the body can be turned to push the tubular seal forward within the body bore and thereby compress it against the outside of the flat cable to form an explosion-proof seal.

Abstract: The invention relates to a method for production of packaged electronic, in particular optoelectronic, components in a composite wafer, in which the packaging is carried out by fitting microframe structures of a cover substrate composed of glass, and the composite wafer is broken up along trenches which are produced in the cover substrate, and to packaged electronic components which can be produced using this method, comprising a composite of a mount substrate and a cover substrate, with at least one functional element and at least one bonding element, which makes contact with the functional element, being arranged on the mount substrate, with the cover substrate being a microstructured glass which is arranged on the mount substrate, and forms a cavity above the functional element, and with the bonding elements being located outside the cavity.

Abstract: An apparatus and method used for connecting surfaces to one another is provided. In one embodiment, the apparatus comprises of a mounting body with a front and a back portion. The front portion includes an opening that is aligned with another opening of a block, fixably attached to this front portion. The openings of the block and/or front section can include internal threading. A threaded insert is then placed inside the block such that the insert can move from a first position to a second position using threading movement.

Abstract: A back plate assembly is compatible with mainboards having different specification. The back plate assembly includes a back plate and a plurality of fasteners engaging with the back plate. The back plate defines a plurality of sets of mounting holes. Each set of mounting holes is used to align with through holes in mainboard with a corresponding specification. The mounting holes are spaced from each other and each includes a first receiving hole and a second receiving hole located at a lower portion of the first receiving hole. The fasteners are interferentially fitted in a corresponding set of the mounting holes of the back plate. Each fastener includes a baffling portion received in the first receiving hole of the mounting hole, and a connecting portion extending downwardly from the baffling portion of the fastener and received in the second receiving hole of the mounting hole.

Abstract: An enclosure is provided for an electronic device, including a single-sheet metal enclosure, which has a frame-like board arranged at a central portion thereof. The frame-like board forms a central opening. The frame-like board has opposite edges, which are bent downward and further extend outward to form parallel side wings, in which fastening holes are defined. The side wings and the frame-like board together form an accommodation space on an underside of the frame-like board. A plurality of fastening elements is respectively fit through the side wings of the enclosure and is secured to a circuit board to have the enclosure securely fit on an electronic device.

Abstract: The frame (1) comprises an intermediate layer (5) sandwiched between a first layer (3) with a first pattern and a second layer (4) with a second pattern. Adhesion layers (2,12) are present on the first and second layer (3,4) respectively. The patterns are defined such that bumping portions (31) and a cap (21) are defined. The intermediate layer (5) is continuous and extends over spaces (25) between bumping portions (31) and the cap (21), so as to prevent disintegration. The frame is assembled to a device (50) with an electronic element (52), such as a MEMS element. The cap (21) then encapsulates a cavity (60) over the element (52).

Abstract: A folding electronic device includes a fixed casing, a movable casing, and a hinge device connecting the fixed casing and the movable casing to allow rotational movement of the movable casing. The movable casing is openable with respect to the fixed casing. The hinge device has an axis extending over a land portion of the fixed casing and a land portion of the movable casing. A projection is provided in any of the following: at least one of end faces of the land portion of the fixed casing and an end face, opposed to one of the end faces, of the land portion of the movable casing. As the movable casing changes from a closed state to an open state, a gap between the projection and an end face opposed to the projection is increased.

Abstract: A structure for clamping the harnesses, enabling the harnesses attached to the substrate or the harnesses around the substrate to be clamped by using parts that have been usually used. An assembly having the structure for clamping the harnesses comprises a circuit board on which parts are mounted on one side thereof; a shielding plate arranged on the other surface side thereof; and an insulating sheet arranged between the other surface of the circuit board and the shielding plate; wherein the harnesses are extending around the circuit board. The insulating sheet forms a clamp protruding outward beyond the circuit board, and the harnesses are engaged with a protruding piece.

Abstract: The present disclosure describes an apparatus for enclosing electrical equipment. A shutter panel with at least one shutter aperture, at least one guide piece configured to align the shutter panel with a stab-on bore of a unit area, an operator member and a mounting member interconnected with a bus bar assembly is presented. A method for accessing electrical equipment in a motor control unit is also presented.

Abstract: Support frame (1) for wall mounting at least one electrical apparatus (20, 21, 22, 23), the frame (1) comprising: a surround casing (4) for wall fixing, enclosing an opening (5) that defines a assembly housing adapted to accepting and retaining said at least one electrical apparatus (20, 21, 22 and 23), the opening (5) being defined by a facing pair of fixing panels (6 and 7) and a facing pair of connecting panels (9 and 10) with ends attached to said fixing panels (6 and 7) and the fixing panels (6 and 7) comprising attachment elements (8) for mounting said at least one electrical apparatus (20, 21, 22 and 23). The connecting panels (9 and 10) include coupling components (11), adapted to engaging with respective complementary coupling components (12) substantially located on end sections of a divider (13) that can be removably coupled to said frame (1) to subdivide said opening.

Abstract: A standing apparatus for mounting electrical components to a base plate (10), the standing apparatus includes the base plate, a standing member (20), and a clamping member (30). The base plate defines a recess (12) in a first face, and a hole (14) extends through the recess to a second face opposite to the first face. The standing member includes a positioning collar (22) and a standing pillar (24). The standing pillar has a groove (242). The clamping member includes a base portion (32) and a domelike portion (34), the domelike portion has a plurality of spring clips (36), the spring clips encircling the standing pillar and received in the groove of the standing member for retaining the standing member to the base plate.

Abstract: A high projection is provided outside the bottom surface of a cap and a low and small protrusion is provided inside the projection. The projection is resistance-welded to a stem by allowing the projection to abut the stem so as to supply an electric current thereto. Even if melt particles flow inwardly, they are blocked by the small protrusion arranged inside so as not to enter the internal space, thereby eliminating a tapping test of an optical device and an optical module.

Abstract: A vehicle entertainment system and method to prevent a mechanical connection between certain components of an entertainment system for a vehicle can include an entertainment system housing containing a plurality of entertainment components and a remote control module. The remote control module can include a user interface on a surface of the remote control module. In addition, the remote control module can be configured to prevent secure mounting of the remote control module to the entertainment system housing when the remote control module is not the appropriate remote control module for the particular vehicle entertainment system.

Abstract: An electronic part-connecting structure is used in an electrical equipment including a housing, and bus bars which are mounted on the housing and have a plurality of pairs of opposed press-contacting blades to which electronic parts for circuit-protecting purposes are electrically connected by pressing. Positioning ribs are formed in proximity respectively to the press-contacting blades so as to position lead portions of the electronic parts at the respective press-contacting blades.

Abstract: A mounting device includes a base plate for supporting an electrical coil and includes two or more legs that are substantially L-shaped. Each leg has a first end and a second end and the first end is secured to the base plate and the second end is in a direction away from the base plate. A contact pin extends through the second end of each leg and the legs are capable of resilient movement relative to the base plate.

Abstract: A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.

Abstract: Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

Abstract: The present invention discloses an improved expansion card slot structure including a slot base with a plurality of rear-end fixing pins, and a shield bracket installed at the slot base for shielding a rear-end port of the slot base and allowing a plurality of contact portions of the shield bracket to be in contact respectively with an upper end of each rear-end fixing pin, and a plurality of elastic arms to be in contact respectively with a main body portion of each rear-end fixing pin and disposed proximate to a lower end of each rear-end fixing pin. With this structure, the invention increases the number of electromagnetic interference (EMI) contact points and provides a shorter path for grounding and eliminating noises to improve the electromagnetic interference (EMI) effect.

Abstract: An exemplary printed circuit board assembly includes a printed circuit board, four supporting members, four shock-absorption members, and four fixing members. The printed circuit board defines a plurality of cutouts therein. Each supporting member defines a positioning hole therein. The shock-absorption members are snapped in the cutouts, and each has a first surface contacting the corresponding supporting member, a second surface parallel to the first surface, and a through hole extending through the first and second surfaces. The first and second surfaces are disposed at opposite sides of the printed circuit board. Each fixing member comprises a first portion pressed on the second surface of the corresponding shock-absorption member, and a second portion extending through the through hole and engaging in the positioning hole.

Abstract: A module is inserted from an aperture of a parts support apparatus into a part support hole, and further pushed into a cavity innermost the part support hole until a insertion side end portion is engaged in the cavity. After the module is engaged into the part support hole, an effect of force of dropping off upward the module from contact points inside on upper and lower surfaces is suppressed by the cavity, and the module can be supported by the parts support apparatus only. After the attachment of the module, a projection unit provided on the lower surface of a housing of a body device lowers with the housing, touches an end surface opposite the insertion side of the module to protect the module from dropping off the cavity in the horizontal direction.

Abstract: Coupling reliability of a passive component is improved to increase the reliability of a semiconductor device. A first through hole is formed in a first electrode part of a first plate-like lead, and a second through hole is formed in a second electrode part of a second plate-like lead. As a result, at the first electrode part of the first plate-like lead, one external terminal of the passive component can be coupled to the first electrode parts on both sides of the first through hole while being laid across the first through hole. Also, at the second electrode part of the second plate-like lead, the other external terminal of the passive component can be coupled to the second electrode parts on both sides of the second through hole while being laid across the second through hole. Accordingly, at central portions both in the longitudinal and width directions of the passive component, the passive component is surrounded by sealing members.

Abstract: An apparatus for mounting a motherboard includes a mounting boss and a boss backing. The mounting boss is alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard. The boss backing is adapted to connect with the mounting boss in the first orientation through the motherboard having the first hole spacing, and adapted to connect with the mounting boss in the second orientation through the motherboard having the second hole spacing.

Abstract: An electronic component holder includes a holder body and a wire retaining portion. The holder body includes a plurality of first grooves formed in a top face of the holder body and a plurality of second grooves formed in a back face of the holder body. The first grooves and the second grooves are configured to receive a lead wire of an electronic component. The lead wire is configured to be bent to be disposed in one of the second grooves. The back face intersects with the top face. The wire retaining portion is provided to the holder body. The wire retaining portion is configured to engage the lead wire to retain the lead wire in the second grooves.

Abstract: A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The mounting structure is a pin receptacle constructed to receive a pin of the light emitting diode device. An electrically conductive portion is carried by the resin base and positioned for electric connection to conductors of the device. Another flexible circuit carries discrete integrated circuit chips and a field of fastener elements extending from a surface of a resin strip carrying conductive traces interconnecting the chips.

Abstract: CMUT elements are formed on a substrate. Electrical conductors are formed to interconnect between different portions of the substrate. The substrate is then separated into pieces while maintaining the electrical connections across the separation. Since the conductors are flexible, the separated substrate slabs may be positioned on a curved surface while maintaining the electrical interconnection between the slabs. Large curvatures may be provided, such as associated with forming a multidimensional transducer array for use in a catheter. The electrical interconnections between the different slabs and elements may allow for a walking aperture arrangement for three dimensional imaging.

Abstract: An exemplary printed circuit board assembly includes a printed circuit board, four supporting members, four shock-absorption members, and four fixing members. The printed circuit board defines a plurality of cutouts therein. Each supporting member defines a positioning hole therein. The shock-absorption members are snapped in the cutouts, and each has a first surface contacting the corresponding supporting member, a second surface parallel to the first surface, and a through hole extending through the first and second surfaces. The first and second surfaces are disposed at opposite sides of the printed circuit board. Each fixing member comprises a first portion pressed on the second surface of the corresponding shock-absorption member, and a second portion extending through the through hole and engaging in the positioning hole.

Abstract: An electronic device includes a housing having a side surface formed with a receiving groove, a driving electrode layer mounted fixedly in the receiving groove and including a plurality of electrodes, a control module disposed in the housing, connected electrically to the driving electrode layer, and operable so as to apply respectively a plurality of driving voltages corresponding to digital image information to the electrodes of the driving electrode layer, and a sheet of electronic paper disposed removably in the receiving groove in the housing and over the driving electrode layer for displaying the digital image information thereon in response to application of the driving voltages by the control module.

Abstract: A mounting mechanism for mounting an electronic device to a chassis, the electronic device defining a first securing hole, and the chassis defining a second securing hole, includes a securing member having a base. A plurality of elastic hooks extends from a bottom of the base. At least one blocking portion protrudes laterally from the base. The elastic hooks extend through the first securing hole and the second securing hole and are engaged with a bottom side of one of the chassis and the electronic device. The at least one blocking portion abuts on the other one of the chassis and the electronic device, for sandwiching the electronic device and the chassis between the hooks and the at least one blocking portion.

Abstract: In plasma displays in different inch sizes, there is a disadvantage in that because each of the plasma displays in different inch sizes has an output semiconductor device with a different outer shape, a pitch of the external lead and the number of the output semiconductor devices vary, so that printed circuit boards need be designed differently for the different inch sizes. A hybrid integrated circuit includes mounting portions which are composed of a conductive path on an insulated metal substrate, and into which at least an output semiconductor device of a discharge maintaining circuit is incorporated, and includes external terminals arranged at a constant pitch. When the inch size of the plasma display is changed, the mounting portions are designed to have a size enough to accommodate the output semiconductor device for the greatest inch size. Thus, the same hybrid integrated circuit is commonly used.

Abstract: An electronic device includes a housing with electrical circuitry that is sealed against penetration by dust, moisture, water, and the like, and permits convenient mounting and reconfiguration during operation. The electronic device can be reconfigured to add or delete a connecting plug and cable without compromising the seal. Mounting brackets are provided for mounting to both horizontal and vertical support structures, depending on orientation of the brackets.