Abstract: Mounting structures for facilitating fast and easy installation and/or removal of electronics components into or out of a computer system are disclosed. The mounting structures include a base and a stackable mounting structure. Each mounting structure generally includes generally parallel and opposing spacers, tapered supports extending from the spacers to engage holes defined on a surface of an electronics component, and a base portion extending between being generally orthogonal to the spacers. The spacers may define orifices to facilitate securing the mounting structure and the electronics component to an electronics base via, e.g., a hook and loop material. The stackable mounting structure may include sharp points and angled legs to also engage the electronics component below.

Abstract: A roll over audio visual control center (“roll over platform”) designed to be embedded for use within the top of a conference table to display, in an inverted position, a power or communications outlet for use on top of the conference table or to hide, in a regular position, the power or communications outlet under the conference table when not in use. The roll over platform consists of two main parts: a housing and a control center. The housing is rectangular in shape and forms a hollow center. The control center approximates the rectangular shape of the housing and is secured within the hollow center of the housing by a hinge. The hinge enables the rotation of the control center within the hollow center of the housing. The roll over platform further consists of a means to secure the control center to the housing to enable the regular and inverted positions of the control center with respect to the housing.

Abstract: A mobile communication device includes a printed circuit board (PCB); a radio frequency (RF) transceiver carried on the PCB; and an antenna coupled to the RF transceiver. A surface mountable antenna clip is mounted on the PCB for retaining the antenna. The clip is a metal structure having a plurality of planar sides generally formed into a U-shape. An opening formed by the structure is sized to receive and retain the antenna. One of the planar sides is used to support the structure and is mounted over a solder pad of the PCB. A hole formed through this planar side is configured to break a surface tension of molten solder over a solder pad of the PCB during a reflow soldering process, so that the clip is more stable and tends not to rotate out-of-position during the process. Legs extending from edges of this planar side also help to stabilize the clip during the process, and provide an increased surface area for the connection.

Abstract: The protective circuit module includes a substrate, electronic components mounted on the substrate for constituting a protective circuit, a molding formed on the substrate to enclose the electronic components, and terminal plates connected to appropriate portions of the substrate for connecting the protective circuit to a rechargeable battery. The molding includes a cover surface oriented opposite to the substrate and projections integrally formed on the cover surface to project therefrom.

Abstract: A chassis built in a panel is provided with a supporter for supporting a printed wiring board mounted with an electronic component, and the printed wiring board is provided with a board-opening portion in the proximity of this supporter. When a load F applied on a knob from a predetermined direction, the printed wiring board can be ruptured from the board-opening portion to get detached from the supporter, thereby lowering the height of the outward projection of the knob from the panel.

Abstract: An apparatus for permitting both base and flush mounting a device to a surface is disclosed. The apparatus comprises a case housing a device and a frame. The frame is configured to attach to the case in both a base mounting and flush mounting configuration.

Abstract: A foolproof polarity indication for poled electronics parts or devices to be mounted to a printed circuit board assures that the poled electronics parts and/or devices are correctly mounted with respect of their polarities to meet occasional requirements dependent on different specifications. Each pair of terminal holes is allotted to a given poled electronics part or device. Two symbols representative of such electronics part or device are arranged side by side on either side of a line drawn from one terminal hole to the other terminal hole. The poled electronics part or device symbols are of reversed polarities. This dual symbol arrangement is effective to draw a worker's attention in the mounting of electrode components in terms of their polarities. When extra components or dummy components are combined with such a poled component, they are encircled by a boundary line, thereby showing the correct polarity direction of the poled component with respect to whether it is enclosed or not.

Abstract: The present invention discloses an improved computer casing that allows a circuit board to be inserted from either the front side or the rear side of the computer casing. The improved computer casing comprises: a main frame, being a frame and comprising a frame hole on its front end, a bottom plate at its bottom, and a bottom groove, a protrusion disposed on the frame hole; a midway board, comprising a snap hole disposed at its upper edge and an extended plate being vertically disposed at a position proximate to each of both ends, a protruded plate disposed thereon, and a rectangular latch plate disposed in the middle section and having a protruded latch; a base plate disposed on both sides of the bottom; a cover frame, having a latch hole at its upper edge and a side hole on its lateral sides, such that the side hole is latched with the protruded plate, the latch hole with the protrusion, and the bottom plate with the bottom groove of the main frame.

Abstract: In a module frame for electronic components, having a conductor structure having a metallic conductor, at least one contact segment of a metallic conductor, the at least one contact segment of the metallic conductor uncovered by the insulation sheathing and conductively connected to a segment of the metallic conductor, the thermal conduction cross section of the at least one connecting web being designed to be so small that when the contact segment is intensely heated, the connecting web has a throttling effect on the heat flow to the segment of the conductor.

Abstract: An arrangement which has a panel-like electrical/electronic module, such as a solar power module, and a connection unit which are electrically connected to one another. The module and the connection unit each have an essentially flat printed conductor structure with connecting sections. The printed conductor structures are situated in parallel planes. The connecting sections are rigid electrical conductor sections and are bent out from the planes of the printed conductor structures of the connection unit and the module. The connecting sections of the connection unit are situated corresponding to the arrangement of the connecting sections of the module so that for the connection unit connected to the module each connecting section of the module is electrically connected to a respective connecting section of the connection unit and these adjoin one another in one section situated in a different spatial position than that of the planes of the printed conductor structures.

Abstract: A method for providing electrical signal transmission and a secure mechanical attachment in a flexible circuit assembly. The inventive mechanism combines the electrical features of discrete wiring with the mechanical features of etched pads connected to plated vias on flex circuits in order to achieve robustness in both the mechanical and electrical properties. A discrete wire is preferably securely bonded to a conductive pad which pad is then securely attached to a plated via. In this manner, the sequence of connections is made mechanically secure by either ultrasonically bonding or welding the discrete wire to the pad and employing the traditionally robust connection between the pad and the via. The arrangement achieves high quality electrical signal transmission by employing discrete wiring for signal transmission along any path of significant length.

Abstract: A mounting apparatus for mounting a motherboard (10) having several first mounting holes (13) includes a chassis (80), a fixing member (40), and a supporting member (20). The chassis comprised two posts (13) protruding from a bottom wall (81) thereof, and a number of standoffs (82) received in first the mounting hole. The fixing member is horizontally slidably mounted to the posts, and includes a first engaging portion (42) and a first locating portion (54). The supporting member is attached to the motherboard, and includes a second engaging portion (26) and a second locating portion (29). When the circuit board together with the supporting member is mounted to the chassis, the first locating portion engages with the second locating portion. When the circuit board together with the supporting member is disassembled from the chassis, the first engaging portion exerts force on the second engaging portion.

Abstract: A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The penetration hole is formed in a region along a periphery of the land.

Abstract: A printed circuit board (PCB) assembly includes a stiffener member that eliminates the need for a separate PCB housing. The stiffener member is attached to the PCB at a first mount interface without the use of fasteners and is attached to a vehicle structure at a second mount interface. The first mount interface comprises a plurality of mounting feet that extend out transversely relative to a stiffener main body portion, and which are soldered directly to the PCB. The second mount interface comprises a plurality of radially extending tabs formed about the circumference of the stiffener member. The tabs each include an aperture for receiving a fastener. The stiffener member also includes gripping elements that resiliently engage electrical components mounted to the PCB to securely hold the electrical component in place and to reduce vibrations.

Abstract: A modular electronic equipment enclosure (10) for housing telecommunications, signaling, or other electronic equipment. The enclosure (10) separates into modules for easier module-by-module installation. The preferred enclosure (10) broadly comprises three separable modules, including a housing module (12); a mounting structure (14); and a cable interface module (16). The housing module (12) receives, retains, and protectively encloses the electronic equipment. The mounting structure (14) is operable to secure to a mounting surface and to provide the housing module (12) with an operating orientation which is either perpendicular or parallel to the mounting surface. The interface block (16) is coupled with the housing module (12) in any of two or more possible orientations. The interface block (16) including a first wire connector half (94) operable to couple with a corresponding second wire connector half (38) connected to the electronic equipment.

Abstract: A computer chassis having tabs extending from the inside of its side panels and springs extending from the bottom panel, for spring-mounting a circuit board, such as a motherboard or other circuit board oriented parallel to the bottom surface of the chassis. The tabs and springs may also be used to ground the circuit board.

Abstract: A circuit board assembly includes a circuit board which defines circuit board pads, a set of surface mount electronic components soldered to a first set of the circuit board pads using a surface mount soldering process, and a set of surface mount coupling devices soldered to a second set of the circuit board pads using the surface mount soldering process. Each surface mount coupling device is configured to couple at least a portion of an object to the circuit board. Each surface mount coupling device includes a set of surface mount pads connected to the second set of the circuit board pads by solder joints resulting from the surface mount soldering process, a set of legs extending from the set of surface mount pads, and a body portion connected to the set of legs, the body portion providing a fixed structure relative to the circuit board for securing the object.

Abstract: A device for fastening an electrical component to a mounting board includes a sleeve that at least partially surrounds the electrical component, and a tensioning device that is separate from the sleeve and that holds the electrical component in the sleeve. The tensioning device is positioned around a circumference of the sleeve.

Abstract: A built-in unit (10) for a transmission control of a motor vehicle has a substrate plate (11), on which stamped grids (21, 22) are secured. The stamped grids electrically connect sensors and regulating elements with a control apparatus, which likewise is secured to the substrate plate (11). The individual conductor tracks (23, 24) of the stamped grids (21, 22) are fixed to one another by means of reinforcing elements, or injection-molded parts (25 through 28). Additional expanding mandrels (30) and expanding dowels (36) are provided on the reinforcing elements (25 through 28), whereby the expanding dowels project into openings (42) in the substrate plate (11). By means of the inventive construction of the reinforcing elements (25 through 28), a secure attachment of the stamped grids (21, 22) to the substrate plate (11) is made possible.

Abstract: A universal snap-fit system for interconnecting multiple circuit boards in a stacked relationship is provided. The system allows circuit boards to be stacked with a minimum of assembly time. In addition, the system allows circuit boards of varying thicknesses to be stacked, without requiring the provision of system components in a multitude of sizes. The provided system also allows more than two circuit boards to be interconnected to one another in a stacked relationship without requiring multiple sets of attachment holes in interior circuit boards. In addition, more than two circuit boards can be stacked quickly and easily.

Abstract: A printed circuit board stiffener is provided comprising a generally U-shaped elongated horizontal assembly having a substantially horizontal surface, an elongated vertical member extending downward from and rigidly coupled to one of the elongated horizontal assembly members opposite the assembly's curved edge and having a plurality of legs extending from the elongated vertical member, each such leg further comprising a flange extending substantially perpendicular to its respective plurality of legs in a direction toward the elongated horizontal assembly's curved edge. Each of said flanges are suitable for attachment to a surface of a circuit board. Further, such stiffener is capable of being moved, oriented, placed and mechanically bonded to the printed circuit board using existing SMT robotic assemblies.

Abstract: A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the device module. The device module may be secured to a carrier substrate in a substantially perpendicular orientation relative to the former. Solder reflow or a module-securing device can secure the device module to the carrier substrate. An embodiment of a module-securing device comprises an alignment device having one or more receptacles formed therein and intermediate conductive elements that are disposed within the receptacles to establish an electrical connection between the semiconductor devices and the carrier substrate. Another module-securing device comprises a clip-on lead, where one end resiliently biases against a lead of at least one of the semiconductor devices, while the other end connects electrically to a carrier substrate terminal.

Abstract: A multi-layer feedthrough structure for use in optoelectronic equipment. The feedthrough structure is composed of multiple stacked ceramic layers that together form a multi-layer platform. The multi-layer platform bisects the base portion of a header assembly that is located within the transmitter optical subassembly such that an interior portion of the multi-layer platform is located within the header assembly and an exterior portion is disposed outside. Each layer contains at least a portion of a plurality of conductive pathways that extend from the exterior to the interior portion of the multi-layer platform. A top insulating layer enables the conductive pathways to pass from the exterior to the interior portion of the platform without electrically contacting the header assembly base. The conductive pathways serve as electrical interconnects between components located within the header assembly and structures outside thereof.

Abstract: A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.

Abstract: A mounting clip that attaches a circuit component to an electrical device attenuates vibration of the circuit component as the electrical device is operated. The mounting clip is designed for a thermo-protector of an electric motor and removably attaches the thermo-protector to a switch housing of the electric motor. The thermo-protector is connected in the circuit of the electric motor and wiring of the electric motor that communicates with the thermo-protector is attached to the mounting clip. The mounting clip is provided with a spring mechanism that engages an abutment provided on the switch housing and biases the mounting clip and the attached thermo-protector and thermo-protector wiring away from the switch housing and thereby attenuates vibration of the thermo-protector and its wiring.

Abstract: A device arrangement includes a number of series installation devices which can be snapped onto a mounting rail by way of a snap-action slide interacting with a slide actuator. It further includes the synchronous actuation of a plurality of snap-action slides, a comb-like coupling part which is connected in captive fashion to the slide actuator. Such parts are to be coupled and include a coupling web which runs transversely to a number of joining arms and connects the latter.

Abstract: An optical module comprises (1) an optical device assembly having an optical device for converting one of optical and electric signals into the other; (2) a circuit board for mounting an electronic device to electrically connect with the optical device; (3) a lead frame having a lead pin, a board mounting part for mounting the circuit board, and a support part which are provided on a reference surface; (4) a holding member having a holding part for grasping and holding the optical device assembly, and a grasping part for grasping the support part of the lead frame; and (5) a resin member for encapsulating the optical device assembly, the circuit board, the holding member, and the lead frame.

Abstract: A chassis built in a panel is provided with a supporter for supporting a printed wiring board mounted with an electronic component, and the printed wiring board is provided with a board-opening portion in the proximity of this supporter. When a load F applied on a knob from a predetermined direction, the printed wiring board can be ruptured from the board-opening portion to get detached from the supporter, thereby lowering the height of the outward projection of the knob from the panel.

Abstract: An adjustable circuit sled module for a mass storage device has a housing, a mass storage device, a circuit board, a cover and spacers. The spacers position the mass storage device to align the power and data interface ports of the mass storage device with corresponding power and data interface connectors of the circuit board. The resulting sled module can be adjusted to accommodate a variety of brands and sizes of mass storage devices.

Abstract: An electrical component has a housing received in a receiving groove, which is confined by opposite lateral walls connected to a groove bottom, formed in a support. A retaining device includes a base extending from one end of the housing and disposed on the groove bottom of the receiving groove, an engaging block confined non-rotatably in the receiving groove and disposed between the base and opposite stop protrusions that are formed respectively on the lateral walls and that cooperate to form a restricted access into the receiving groove, and a fastener extending rotatably through a through hole in the engaging block and coupled rotatably to the base. Operation of the fastener can drive the engaging block to move to an engaging position, where the engaging block abuts against the stop protrusions and where the fastener urges the base toward the groove bottom.

Abstract: An electronic apparatus of the present invention comprises an electronic circuit board; an electrically conductive casing for encasing the electronic circuit board; a semiconductor element module electrically connected to the electronic circuit board; and a resin fixture intervening between the electrically conductive casing and the semiconductor element module, the resin fixture mounted with the semiconductor element module and fitted to the electrically conductive casing. As a result, the resin fixture can suppress a transfer of heat generated in the electronic circuit board to the semiconductor element module.

Abstract: A microelectronic package includes a flexible substrate and is adapted to be installed onto a support structure, which is preferably a nonplanar support structure. The package includes a frame that is affixed to a perimeter of a first portion of the flexible substrate and forms the substrate into a shape corresponding to the support structure. The package is installed so that the obverse surface of the flexible substrate is intimately against the support structure, so that the support structure not only reinforces the package to prevent damage, but also extracts heat generated during operation of the electronics.

Abstract: Methods and apparatuses for removably securing one or more computer circuit boards to a computer chassis. In one embodiment, the apparatuses include a bracket having attached sites that can be selectively aligned with corresponding fastening sites of one or more types of printed circuit boards. The circuit boards can be attached to the bracket without tools and without threaded fasteners, and the bracket can be attached to the chassis also without tools and with out threaded fasteners. The circuit boards can be grounded to the chassis solely through a compressible conductive gasket that extends between the chassis and input/output connectors of the printed circuit boards.

Abstract: A sliding lid with an anchoring structure for covering a signal transmission port of an electronic device includes a housing of the electronic device, a first lid and a second lid. The housing has a first opening and a second opening corresponding respectively to the upper side and a lateral side of the signal transmission port. The first lid and the second lid correspond to the first opening and the second opening. The second lid is pivotally engaged with the first lid. The second lid may be slid in the second opening and spare a slot opening to allow a flat cable to pass through. The first lid is pivotally turned to cover the first opening. The invention improves the convenience of assembly and detachment of the lids, and also can prevent dusts or external objects from entering into the exposed signal transmission port of the electronic device.

Abstract: A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.

Abstract: An electronic component base for an electronic component is disclosed to have a top wall adapted to accommodate an electronic component core, diagonally extended wire grooves in the top wall for guiding out lead wires of the loaded electronic component core, a bottom wall, a plurality of electrically conducting zones in the bottom wall, four peripheral walls, four chamfered angles alternatively connected between the peripheral walls, and four conducting side grooves respectively extended from the wire grooves to the electrically conducting zones for receiving the lead wires of the electronic component core from the wire grooves.

Abstract: A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electronic component relative to the circuit board.

Abstract: A retaining device (20) for mounting a switch (10) to a computer enclosure (30) includes a main wall (22) and left and right side walls (24) cooperatively defining a space therebetween for accommodating the switch therein. A pair of pins (28) is stamped perpendicularly from the main wall. An extension tab (23) extends from the left side wall and defines a through aperture (25) therein. A bent tab (27) extends from the right side wall. In assembly, the switch is received in the retaining device with the pins being received in through holes of the switch. The combined retaining device and switch is then attached to a panel (32) of the enclosure (30). The bent tab is engagingly received in a locking aperture of the panel. A screw (40) is extended through the through aperture (25) to engage with the panel in a screw aperture (38) thereof.

Abstract: A rack-mount apparatus for mounting printed circuit boards and other types of electronic components is provided. A five-sided enclosure is provided for mounting one of several different types of electronic components. The enclosure includes a bottom panel having countersunk holes for mounting electronic component. The countersunk holes are arranged according to two or more mounting patterns. Mounting hardware is also provided for mounting the printed circuit board or other type of electronic component to the bottom panel without protruding from the bottom surface of the bottom panel and also providing a gap between the printed circuit board and the bottom panel as specified by the type of printed circuit board or other electronic component. The rack-mount apparatus allows many different types of printed circuit boards or electronic components to be mounted in a standard rack-mount chassis.

Abstract: An assembly that mounts components to a module box is disclosed. Large components, such as capacitors, can take up appreciable amounts space on a circuit board. If these components are mounted to the module box, there will be more surfaces on the circuit for other components. In an illustrated embodiment, three capacitors are mounted to a module box using three separate plastic cradles. The module can be made of plastic or metal as necessary. The component cradles are preferably secured to the box by an interference fit between the hole and posts. Alternate methods to secure the component cradles include snap fit, heat staking or epoxy. The component cradles also provide alignment of the pins that extend through the circuit that will eventually be mounted on the box. The pins are electrically fixed to the circuit board by either solder or press fit means.

Abstract: A heat dissipation module and its fixed member. The fixed member is disposed on a main board and is provided with a base. The base is provided with a plurality of protrusions. Each of the protrusions is provided with a flange. By means of the flange, the protrusion is engaged with a fixed hole disposed on the main board. Alternatively, the base is provided with a plurality of engaging portions. By means of the engaging portions, the protrusion is engaged with the fixed hole disposed on the main board so that the fixed member is fixed on the main board.

Abstract: A butt joined electronic module has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined carrier and housing. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors. The carrier and housing are bonded together as a single module.

Abstract: A protective cover mounting apparatus for a hermetic compressor for removably mounting a protective cover to protect electrical parts disposed on a terminal portion of a hermetic compressor casing comprises a pair of first protrusions respectively formed on two facing sides of the protective cover for protecting electrical parts disposed on a terminal portion of a hermetic compressor casing, a second protrusion formed on a side that is removed from the casing when the protective cover is mounted on the casing, a clamp pivotably disposed on the casing and including a pressing portion and a holding portion formed to correspond to the first and second protrusions.

Abstract: The invention relates to a capacitor module for a converter. The capacitor module contains a capacitor which can be fastened to a base frame or to a cooling body by means of lateral, mechanical holding devices. In addition, the capacitor comprises at least one additional mechanical holding device for fastening at least one electronic terminal of the converter and of at least one measuring sensor, especially of a current transformer and/or of a voltage transformer. The inventive capacitor module makes it possible to realize a construction of a converter which is compact and has a reduced weight.

Abstract: A switch cabinet (1) comprises a case (2), several modules (3) and a supporting rail (4), the modules (3) being secured on the supporting rail (4). The disclosed switch cabinet (1) is characterised in that it is designed in functional blocks and modules, so that all modules (3) required by a machine and only those modules are mounted in the switch cabinet case (2).

Abstract: A reliable capacitor module is provided which can solve the following problem: when a plurality of capacitors is mounted on a wiring board, the wiring board is distorted and deformed by the weight and cracks appear on mounting holes and the main body of the wiring board. The bottoms of metallic cases of the capacitors are fit in recesses formed on a mounting plate. In this state, lead wires drawn from the upper surfaces of the capacitors are electrically connected via the wiring board. With this configuration, a weight load of the plurality of capacitors is not applied at all, thereby preventing distortion and deformation of the wiring board and vibration causing cracks on the main body of the wiring board.

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract: A mounting clip that attaches a circuit component to an electrical device attenuates vibration of the circuit component as the electrical device is operated. The mounting clip is designed for a thermo-protector of an electric motor and removably attaches the thermo-protector to a switch housing of the electric motor. The thermo-protector is connected in the circuit of the electric motor and wiring of the electric motor that communicates with the thermo-protector is attached to the mounting clip. The mounting clip is provided with a spring mechanism that engages an abutment provided on the switch housing and biases the mounting clip and the attached thermo-protector and thermo-protector wiring away from the switch housing and thereby attenuates vibration of the thermo-protector and its wiring.

Abstract: An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.

Abstract: Upper casing and lower casing of a portable telephone body enclose a body inner cavity in which a printed circuit board is disposed. The printed circuit board has an upper surface thereof on which a speaker body is fixedly mounted by means of soldering. A head portion of the speaker body is fitted with a cap in which a net is secured. An elastic rib formed in the upper portion of the cap and having a triangular cross section is pressed against the upper casing to thereby block entrance of any moisture and dust through a sound aperture without necessity of any adhesive and double-faced adhesive tape. The blocking of entrance of moisture and dust by the utilization of deformation of an elastic material may be applied to electronic parts other than the acoustic parts.