Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: An object is to provide a semiconductor device having a novel structure. A first wiring; a second wiring; a third wiring, a fourth wiring; a first transistor including a first gate electrode, a first source electrode, and a first drain electrode; a second transistor including a second gate electrode, a second source electrode, and a second drain electrode are included. The first transistor is provided over a substrate including a semiconductor material and a second transistor includes an oxide semiconductor layer.

Abstract: An object is to provide a semiconductor memory device capable of copying memory data without using an external circuit. The semiconductor memory device includes a bit line to which first terminals of a plurality of memory cells are connected in common; a pre-charge circuit which is connected to the bit line and pre-charges the bit line with a specific potential in data reading; a data holding circuit comprising a capacitor which temporarily holds data read out from the memory cell or data which is written to the memory cell; and an inverted data output circuit which outputs inverted data of data held in the data holding circuit to the bit line. The inverted data output circuit includes a means for controlling output of inverted data of data held in the data holding circuit.

Abstract: A memory circuit including at least one memory cell connected to a bit line. The memory circuit further includes a means for providing a bit line reference voltage VBLref to the bit line. A VBLref/VDD ratio of the bit line reference voltage VBLref to a power voltage VDD is adjustable corresponding to a change of the power voltage VDD, and the VBLref/VDD ratio ranges from about 0.4 to about 0.53.

Abstract: A memory system and a refresh control method thereof are provided. The memory system includes a semiconductor memory device including a plurality of memory cells and a memory controller configured to generate a special command for searching for refresh information stored in the semiconductor memory device and to control a refresh operation of the semiconductor memory device. The semiconductor memory device is configured to output the refresh information to the memory controller in response to the special command generated by the memory controller.

Abstract: A semiconductor memory device or a semiconductor device which has high reading accuracy is provided. A bit line, a word line, a memory cell placed in an intersection portion of the bit line and the word line, and a reading circuit electrically connected to the bit line are provided. The memory cell includes a first transistor and an antifuse. The reading circuit includes a pre-charge circuit, a clocked inverter, and a switch. The pre-charge circuit includes a second transistor and a NAND circuit. The semiconductor memory device includes transistor in each of which an oxide semiconductor is used in a channel formation region, as the first transistor and the second transistor.

Abstract: A memcapacitor device (100) includes a first electrode (104) and a second electrode (106) and a memcapacitive matrix (102) interposed between the first electrode (104) and the second electrode (106). Mobile dopants (111) are contained within the memcapacitive matrix (102) and are repositioned within the memcapacitive matrix (102) by the application of a programming voltage (126) across the first electrode (104) and second electrode (106) to alter the capacitance of the memcapacitor (100). A method for utilizing a memcapacitive device (100) includes applying a programming voltage (126) across a memcapacitive matrix (102) such that mobile ions (111) contained within a memcapacitive matrix (102) are redistributed and alter a capacitance of the memcapacitive device (100), then removing the programming voltage (126) and applying a reading voltage to sense the capacitance of the memcapacitive device (100).

Abstract: An electronic device includes an integrated circuit with a FRAM memory and an integrated capacitor connected between a power supply for the FRAM memory and ground. The integrated capacitor has a capacitance sufficient to store the charge necessary for a complete read-and-write-back cycle of the FRAM memory. When granting read-access to the FRAM memory, the FRAM memory is supplied by the integrated capacitor which is then disconnected from the integrated circuit power supply. Upon receiving a request for a read-access to the FRAM memory, a charge detector detects whether the internal capacitor is sufficiently charged for a complete read-and-write-back cycle of the FRAM memory. Read-access to the FRAM memory is only granted if the internal capacitor is sufficiently charged and disconnected from the power supply. An alternative embodiment alternately charges and powers the FRAM from two integrated capacitors.

Abstract: Disclosed are methods and devices, among which is a device that includes a first semiconductor fin having a first gate, a second semiconductor fin adjacent the first semiconductor fin and having a second gate, and a third gate extending between the first semiconductor fin and the second semiconductor fin. In some embodiments, the third gate may not be electrically connected to the first gate or the second gate.

Abstract: A memory comprises a two dimensional array of memory cells. Each memory cell comprises a first transistor, a second transistor and a capacitor. A multi-bit datum is stored as one of a plurality of voltage signal levels driven over a vertical input signal line and further across a source and a drain of the first transistor to be stored onto a gate of the second transistor. The first transistor is selected by a horizontal WR control line. The gate of the second transistor is connected to a first terminal of the capacitor. A second terminal of the capacitor is connected to a horizontal RD control line. The RD control line is driven to couple the second transistor to drive a signal onto a vertical output signal line during a read of the stored signal on the gate.

Abstract: A semiconductor memory device includes a bit line; two or more word lines; and a memory cell including two or more sub memory cells that each include a transistor and a capacitor. One of a source and a drain of the transistor is connected to the bit line, the other of the source and the drain of the transistor is connected to the capacitor, a gate of the transistor is connected to one of the word lines, and each of the sub memory cells has a different capacitance of the capacitor.

Abstract: In a semiconductor memory device, one electrode of a capacitor is connected to a bit line, and the other electrode of the capacitor is connected to a drain of a cell transistor. A source of the cell transistor is connected to a source line. When a stack capacitor, for example, is used in this structure, one electrode of the capacitor is used as part of the bit line. An impurity region formed on the semiconductor substrate or a wiring parallel to a word line can be used as the source line; thus, the structure of a DRAM is simplified.

Abstract: A memory device whose speed at the time of operation such as writing or reading is high and whose number of semiconductor elements per memory cell is small is provided. The memory device includes a control unit, an arithmetic unit, and a buffer memory device. The buffer memory device stores data sent from a main memory device and/or the arithmetic unit, in accordance with an instruction from the control unit. The buffer memory device includes a plurality of memory cells. The memory cells each include a transistor including a channel formation region including an oxide semiconductor, and a memory element to which charge with an amount in accordance with a value of the data is supplied through the transistor. Further, a data retention time of the memory cell corresponding to a valid bit is shorter than a data retention time of the memory cell corresponding to a data field.

Abstract: Methods and structures are described for reducing leakage currents in semiconductor memory storage cells. Vertically oriented nanorods may be used in the channel region of an access transistor. The nanorod diameter can be made small enough to cause an increase in the electronic band gap energy in the channel region of the access transistor, which may serve to limit channel leakage currents in its off-state. In various embodiments, the access transistor may be electrically coupled to a double-sided capacitor. Memory devices according to embodiments of the invention, and systems including such devices are also disclosed.

Abstract: The present invention provides a dynamic random access memory apparatus includes a first chip and a second chip. The first chip includes a plurality of memory cells and a plurality of through-silicon vias (TSVs). The plurality of memory cells are arranged in an array. First terminals of the TSVs are respectively coupled to the memory cells. The first chip and the second chip are overlapped, the second chip includes a plurality storage capacitors. Second terminals of the TSVs are respectively coupled to the storage capacitors storage capacitors.

Abstract: There is provided a semiconductor device including a word line, a bit line, a power supply node, a memory element, and a capacitor. The memory element includes at least first and second regions that form a PN junction between the bit line and the power supply node, and a third region that forms a PN junction with the second region. The capacitor includes a first electrode provided independently from the second region of the memory element and electrically connected to the second region of the memory element, and a second electrode connected to the word line.

Abstract: A memory device in which data can be retained for a long time is provided. The memory device includes a memory element and a transistor which functions as a switching element for controlling supply, storage, and release of electrical charge in the memory element. The transistor includes a second gate electrode for controlling the threshold voltage in addition to a normal gate electrode. Further, the off-state current of the transistor is extremely low because an active layer thereof includes an oxide semiconductor. In the memory device, data is stored not by injection of electrical charge to a floating gate surrounded by an insulating film at high voltage but by control of the amount of electrical charge of the memory element through the transistor whose off-state current is extremely low.

Abstract: In one embodiment of an improved memory array architecture and cell design, a memory array for an integrated circuit may comprise a plurality of memory cells. Each of the memory cells may comprise a material capable of holding a logic state and two access transistors coupled to the material. The two access transistors may be configured to access the logic state of the material, and may be independently selectable by two word lines of a plurality of word lines parallel to a first dimension.

Abstract: A method of operating a memory circuit compatible with dynamic random access memories (DRAM) and static random access memories (SRAM) is disclosed. The method includes selecting a word line (708) connected to a row of memory cells in response to a plurality of row address signals and selecting a plurality of columns (706,710) of memory cells in response to a plurality of column address signals. A first part (714) of the plurality of columns is selected in response to a first voltage applied to the selected word line. A second part (716) of the plurality of columns is selected in response to a second voltage applied to the selected word line.

Abstract: A capacitor-less memory cell, memory device, system and process of forming the capacitor-less memory cell includes forming the capacitor-less memory cell in an active area of a substantially physically isolated portion of a bulk semiconductor substrate. A pass transistor is formed on the active area for coupling with a word line. The capacitor-less memory cell further includes a read/write enable transistor vertically configured along at least one vertical side of the active area and operable during a reading of a logic state with the logic state being stored as charge in a floating body area of the active area, causing different determinable threshold voltages for the pass transistor.

Abstract: Resistive-switching memory elements having improved switching characteristics are described, including a memory element having a first electrode and a second electrode, a switching layer between the first electrode and the second electrode comprising hafnium oxide and having a first thickness, and a coupling layer between the switching layer and the second electrode, the coupling layer comprising a material including metal titanium and having a second thickness that is less than 25 percent of the first thickness.

Abstract: A graphics memory device includes a memory array configured to store data for a display device comprising b*y rows by a*x columns of pixels, where b>a. The memory array is arranged in a*y rows by b*x columns of memory locations. Each memory location is adapted to store n-bit image data for one of the pixels of the display device. A memory location remapping circuit is adapted to map image data stored in the b*x columns of memory locations in the memory device to the a*x columns of the display device.

Abstract: A transistor circuit layout structure includes a transistor disposed on a substrate and including a source terminal, a drain terminal and a split gate including an independent first block and an independent second block, a bit line disposed on the source terminal and on the drain terminal or embedded in the substrate, a word line disposed on the first block, and a back line disposed on the second block. The horizontal level of the back line is different from that of the bit line and the word line.

Abstract: A memory circuit includes a transistor having a channel in an oxide semiconductor layer, a capacitor, a first arithmetic circuit, a second arithmetic circuit, a third arithmetic circuit, and a switch. An output terminal of the first arithmetic circuit is electrically connected to an input terminal of the second arithmetic circuit. The input terminal of the second arithmetic circuit is electrically connected to an output terminal of the third arithmetic circuit via the switch. An output terminal of the second arithmetic circuit is electrically connected to an input terminal of the first arithmetic circuit. An input terminal of the first arithmetic circuit is electrically connected to one of a source and a drain of the transistor. The other of the source and the drain of the transistor is electrically connected to one of a pair of electrodes of the capacitor and to an input terminal of the third arithmetic circuit.

Abstract: To provide a semiconductor device in which power consumption can be reduced and operation delay due to a stop and a restart of supply of power supply voltage can be suppressed and a driving method thereof. A potential corresponding to data held in a period during which power supply voltage is continuously supplied is saved to a node connected to a capacitor before the supply of power supply voltage is stopped. By utilizing change of channel resistance of a transistor whose gate is the node, data is loaded when the supply of power supply voltage is restarted.

Abstract: A semiconductor memory device includes a plurality of N external ports, each of which receives commands, and an internal circuit which performs at least N access operations during a minimum interval of the commands that are input into one of the external ports.

Abstract: A dynamic random access memory (DRAM) device has a hierarchical bitline structure with local bitlines and global bitlines formed on different metal layers. The local bitlines are separated into a plurality of local bitline sections, and bitline isolation switches are configured to connect or disconnect the local bitline sections to or from the global bitlines. As a result, the local bitlines with higher per-length capacitance can be made shorter, since the global bitline with lower per-length capacitance is used to route the signal from the cell capacitances of the memory cells to the remote sense amplifiers.

Abstract: A semiconductor memory device is provided which includes a sense amplifier, a bit line connected to a plurality of memory cells of a first memory block, a complementary bit line connected to a plurality of memory cells of a second memory block, a first switch configured to connect the bit line to the sense amplifier, and a second switch configured to connect the complementary bit line to the sense amplifier. The first switch is configured to electrically separate the bit line from the sense amplifier when the second memory block performs a refresh operation.

Abstract: A dynamic random access memory (DRAM) can include at least one DRAM cell array, comprising a plurality of DRAM cells, each including a storage capacitor and access transistor; a body bias control circuit configured to generate body bias voltage from a bias supply voltage, the body bias voltage being different from power supply voltages of the DRAM; and peripheral circuits formed in the same substrate as the at least one DRAM array, the peripheral circuits comprising deeply depleted channel (DDC) transistors having bodies coupled to receive the body bias voltage, each DDC transistor having a screening region of a first conductivity type formed below a substantially undoped channel region.

Abstract: A circuit and method erase at power-up all data stored in a DRAM chip for increased data security. All the DRAM memory cells are erased by turning on the transistors for the DRAM storage cells simultaneously by increasing the body voltage of cells. In the example circuit, the body voltage is increased by a charge pump controlled by a power-on-reset (POR) signal applying a voltage to the p-well of the memory cells. The added voltage to the p-well lowers the threshold voltage of the cell, such that the NFET transistor of the memory cell will turn on. With all the devices turned on, the data stored in the memory cells is erased as the voltage of all the cells connected to a common bitline coalesce to a single value.

Abstract: A memory device is provided. The memory device includes a plurality of memory cells and a controller to write data to and read data from the memory cells. Each memory cell includes a first semiconductor material having a spontaneous polarization, a resistive ferroelectric material having a switchable spontaneous polarization, and a second semiconductor material having a spontaneous polarization, the resistive ferroelectric material being positioned between and in contact with the first and second semiconductor materials. The memory device can be configured to store energy that can be released by applying a voltage pulse to the memory device.

Abstract: A plurality of masters arbitrate for access to a shared memory device, such as a SDRAM (synchronous dynamic random access memory), amongst themselves using software and arbitration interfaces. The masters generate additional commands upon arbitration, such as MRS and PALL commands, for prevention of collision of commands, refresh starvation, and/or a missing pre-charge operation in the shared memory device.

Abstract: An integrated circuit which can be switched to a resting state and can be returned from the resting state rapidly is provided. An integrated circuit whose power consumption can be reduced without the decrease in operation speed is provided. A method for driving the integrated circuit is provided. The integrated circuit includes a first flip-flop and a second flip-flop including a nonvolatile memory circuit. In an operating state in which power is supplied, the first flip-flop retains data. In a resting state in which supply of power is stopped, the second flip-flop retains data. On transition from the operating state into the resting state, the data is transferred from the first flip-flop to the second flip-flop. On return from the resting state to the operating state, the data is transferred from the second flip-flop to the first flip-flop.

Abstract: A double data rate pseudo SRAM (DDR PSRAM) is provided. The DDR PSRAM includes a data receiver, a memory and an address decoder. The data receiver receives a first single data rate data from a controller via a common bus according to a clock. The address decoder decodes the first single data rate data to obtain an address of the memory. The data receiver stores the double data rate data into the address of the memory. The DDR PSRAM also includes a data transmitter and a data strobe generating unit. The data transmitter obtains data stored in the address of the memory and provides a double data rate data to the controller according to the obtained data, and the data strobe generating unit a data strobe signal to the controller and toggling the data strobe signal in response to the double data rate data.

Abstract: A semiconductor integrated circuit according to one aspect of the present invention may includes a plurality of driving circuits to drive a respective plurality of word lines with either a first voltage supplied from a first power supply or a second voltage supplied from a second power supply in accordance with a control signal, and a plurality of gate transistors in each of which a gate is connected to one of the plurality of word lines, and a connection state between a storage node and a bit line is changed based on the voltage provided to the word line connected to the gate. In the semiconductor integrated circuit, a gate oxide film of each of the plurality of gate transistors is thinner than a gate oxide film of each of transistors constituting the plurality of driving circuits.

Abstract: In a method of erasing data, a wordline of the DRAM array is set active, and signals develop on bitlines according to flows of charge between memory cells coupled to the wordline and the respective bitlines. Sense amplifiers connected to the respective bitlines can remain off such that the sense amplifiers do not amplify the signals to storable signal levels. Thereafter, when the wordline is set inactive again, insufficient charge remains in the memory cells coupled to the wordline to represent data such that the data stored in memory cells coupled to the wordline are erased. These steps can be performed using each of the wordlines of a selected range of the DRAM array or all of the DRAM array so as to erase the data stored in the selected range or in all of the DRAM array.

Abstract: Adverse effects of a parasitic resistance and a parasitic capacitance of a driver circuit to a memory cell causes problems of thermal disturbance to a not-selected cell, unevenness of application voltage, degradation of a memory element in reading. A capacitor (C) is provided above or beneath a memory cell (MC) that includes a memory element to which a current write memory information and a selection element connected to the memory element. A charge stored in this capacitor writes to the memory element.

Abstract: A re-writable resistance-switching memory cell includes first and second capacitors in series. The first and second capacitors may have balanced electrical characteristics to allow nearly concurrent, same-direction switching. The first capacitor has a first bipolar resistance switching layer between first and second conductive layers, and the second capacitor has a second bipolar resistance switching layer between third and fourth conductive layers. The first and third conductive layers are made of a common material, and the second and fourth conductive layers are made of a common material. In one approach, the first and second bipolar resistance switching layers are made of a common material and have common thickness. In another approach, the first and second bipolar resistance switching layers are made of materials having different dielectric constants, but their thickness differs in proportion to the difference in the dielectric constants, to provide a common capacitance per unit area.

Abstract: An electronic circuit includes a floating gate transistor with a floating gate capacitor. The floating gate transistor can be programmed to be in an ON or an OFF state by charging the floating gate capacitor. The circuit further includes a deactivation capacitor adapted to store a charge sufficient for deactivating the floating gate transistor temporarily. The deactivation capacitor is connectable in series to the floating gate capacitor. A method for deactivating a floating gate transistor temporarily is provided, wherein the floating gate transistor includes a floating gate capacitor. A deactivation capacitor is charged with a charge sufficient for changing the state of the floating gate transistor temporarily. The deactivation capacitor is connected in series to the floating gate capacitor for deactivating the floating gate transistor.

Abstract: To provide a memory device which can perform verification operation for detecting a memory cell whose data holding time is shorter than a predetermined length, accurately in a short time. Each memory cell includes at least a first capacitor, a second capacitor, and a transistor which functions as a switching element for controlling supply, storage, and release of charge in the first capacitor and the second capacitor. The capacitance of the first capacitor is thousand or more times the capacitance of the second capacitor, preferably ten thousand or more times the capacitance of the second capacitor. In normal operation, charge is stored using the first capacitor and the second capacitor. In performing verification operation for detecting a memory cell whose data holding time is shorter than a predetermined length, charge is stored using the second capacitor.

Abstract: An object is to provide a semiconductor memory device capable of shortening writing operation by concurrently determining potentials of memory cells on one word line. A plurality of transistors having switching characteristics are connected to one potential control circuit, whereby writing potentials are determined concurrently. A potential continues to be changed (raised or decreased) stepwise, a desired potential is determined while changing the potential, and whether data resulted from reading with respect to written data is correct or not is continuously checked, so that high-precision writing operation and high-precision reading operation can be achieved. In addition, favorable switching characteristics and holding characteristics of a transistor including an oxide semiconductor are utilized.

Abstract: A one-bit memory cell for a nonvolatile memory includes a bit line and a plurality of serially-connected storage units. The bit line is connected to the serially-connected storage units. Each storage unit includes a first doped region, a second doped region and a third doped region, which are formed in a surface of a substrate. A first gate structure is disposed over a first channel region between the first doped region and the second doped region. The first gate structure is connected to a control signal line. A second gate structure is disposed over a second channel region between the second doped region and the third doped region. The second gate structure is connected to an anti-fuse signal line.

Abstract: A signal processing circuit using a nonvolatile memory circuit with a novel structure is provided. The nonvolatile memory circuit is formed using a transistor including an oxide semiconductor and a capacitor connected to one of a source electrode and a drain electrode of the transistor. A high-level potential is written to the memory circuit in advance, and this state is kept in the case where data to be saved has a high-level potential, whereas a low-level potential is written to the memory circuit in the case where data to be saved has a low-level potential. Thus, a signal processing circuit with improved writing speed can be provided.

Abstract: Embodiments of the present disclosure describe methods, apparatus, and system configurations for tile-level snapback detection through a coupling capacitor in a phase-change memory array. Other embodiments may be described and claimed.

Abstract: Apparatus and methods level shift a direct current (DC) component of a voltage rail signal from a first DC level to a second DC level such that voltage rail noise can be determined. The actual voltage rail noise can be compared to an expected amount of noise for analysis and validation of simulation models. Such assessment can be used to validate simulation models used to refine a design of an integrated circuit or as part of built-in self test.

Abstract: It is an object to provide a memory device for which a complex manufacturing process is not necessary and whose power consumption can be suppressed and a signal processing circuit including the memory device. In a memory element including a phase-inversion element by which the phase of an input signal is inverted and the signal is output such as an inverter or a clocked inverter, a capacitor which holds data and a switching element which controls storing and releasing of electric charge in the capacitor are provided. For the switching element, a transistor including an oxide semiconductor in a channel formation region is used. The memory element is applied to a memory device such as a register or a cache memory included in a signal processing circuit.

Abstract: A circuit compatible with dynamic random access memories (DRAM) and static random access memories (SRAM) is disclosed. The circuit includes a substrate having a first conductivity type. A trench isolation region (850,852) is formed in the substrate. The trench isolation region has sides and a bottom formed below a face of the substrate. A first semiconductor region having a second conductivity type (868) is formed at the bottom of the trench isolation region. A second semiconductor region having the second conductivity type (870) is formed separately from the first semiconductor region adjacent a first side of trench isolation region and in conductive contact with the first semiconductor region.

Abstract: An object is to provide a semiconductor device which can hold stored data even when not powered and which achieves high integration by reduction of the number of wirings. The semiconductor device is formed using a material which can sufficiently reduce the off-state current of a transistor, e.g., an oxide semiconductor material which is a wide bandgap semiconductor. When a semiconductor material which allows a sufficient reduction in the off-state current of a transistor is used, data can be held for a long period. One line serves as the word line for writing and the word line for reading and one line serves as the bit line for writing and the bit line for reading, whereby the number of wirings is reduced. Further, by reducing the number of source lines, the storage capacity per unit area is increased.

Abstract: A storage device stores data in groups of memory cells using vectors corresponding to voltage code codewords, each codeword having k entries. Entries have values selected from a set of at least three entry values and 2n distinct inputs can be encoded into k-entry codewords for some n>k. A vector storage element comprising k cells can store an k electrical quantities (voltage, current, etc.) corresponding to a codeword. The voltage code is such that, for at least one position of a vector, there are at least three vectors having distinct entry values at that position and, for at least a subset of the possible codewords, the sum of the entry values over the positions of the each vector is constant from vector to vector in that subset. The storage device might be an integrated circuit device, a discrete memory device, or a device having embedded memory.

Abstract: Disclosed is a semiconductor device functioning as a multivalued memory device including: memory cells connected in series; a driver circuit selecting a memory cell and driving a second signal line and a word line; a driver circuit selecting any of writing potentials and outputting it to a first signal line; a reading circuit comparing a potential of a bit line and a reference potential; and a potential generating circuit generating the writing potential and the reference potential. One of the memory cells includes: a first transistor connected to the bit line and a source line; a second transistor connected to the first and second signal line; and a third transistor connected to the word line, bit line, and source line. The second transistor includes an oxide semiconductor layer. A gate electrode of the first transistor is connected to one of source and drain electrodes of the second transistor.