Abstract: A memory cell has a data value storage circuit and a data address circuit that includes a first address transistor formed in a first address transistor well and a second address transistor formed in a second address transistor well. The first address transistor is coupled between a data node and the second address transistor, and the second address transistor is coupled between the first address transistor and the data value storage circuit. The first address transistor well is coupled to an intermediate node between the first address transistor and the second address transistor, and the second address transistor well is coupled to a ground terminal.

Abstract: In a semiconductor memory including word lines and bit lines arranged in a matrix and a plurality of memory cells provided at intersections of the word lines and the bit lines, a bit line precharge circuit is provided for controlling the potential of a low-data holding power supply coupled to memory cells provided on a corresponding one of the bit lines. In a write operation, the bit line precharge circuit controls the potential of a low-data holding power supply of a memory cell corresponding to a selected bit line to be higher than the potential of a low-data holding power supply of a memory cell corresponding to an unselected bit line.

Abstract: Dual port memory elements and memory array circuitry that utilizes elevated and non-elevated power supply voltages for performing reliable reading and writing operations are provided. The memory array circuitry may contain circuitry to switch a power supply line of a column of memory elements in the array to an appropriate power supply voltage during reading and writing operations. Each memory element may contain circuitry to select between power supply voltages during reading and writing operations. During reading operations, an elevated voltage may power cross-coupled inverters that store data in the memory elements while a non-elevated voltage may be used to turn on associated address transistors. During writing operations, the non-elevated voltage may power the cross-coupled inverters while the elevated voltage may be used to turn on the associated address transistors.

Abstract: There is provided a technique for ensuring both an SNM and a write margin simultaneously in a semiconductor device having static memory cells. A semiconductor device has a plurality of static memory cells. The semiconductor device includes a memory cell array having the static memory cells arranged in a matrix, a temperature sensor circuit for sensing a temperature in the semiconductor device, and a word driver for controlling a voltage supplied to a word line of the memory cell array based on an output of the temperature sensor circuit at the time of writing to or reading from a memory cell.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.

Abstract: A semiconductor device includes a SRAM having a pair of MCSFETs connected as access transistors (pass gates). A design structure embodied or stored in a machine readable medium includes a SRAM having two MCSFETs connected as access transistors.

Abstract: A multi-port SRAM cell includes cross-coupled inverters each including a pull-up transistor and at least a pair of pull down transistors. The SRAM cell includes first and second access ports coupled to first and second word line conductors, each access port including a first pass gate transistor coupled to the data storage node and a second pass gate transistor coupled to the data bar storage node, each pass gate transistor being coupled to a respective bit line conductor, wherein the pull down transistors of the first inverter are formed in a first active region, the pull down transistors of the second inverter are formed in a second active region, the pass gate transistors coupled to the data storage node are formed in a third active region and the pass gate transistors coupled to the data bar storage node are formed in a fourth active region.

Abstract: A SRAM architecture includes a read/write control signal, a read/write control transistor block, an equalize transistor block, a 6-T SRAM cell, a sense amplifier block, a column selection transistor block and a write driver. The 6-T SRAM cell can store and write data. The sense amplifier block is used to read out the data stored in the 6-T SRAM cell correctly when the SRAM architecture performs a read operation and makes bit lines BL (bit line) and BLB( bitline) produce a minimum voltage difference. The column selection transistor block is used to select a column that the data is written in and read out. The write driver is used to perform a write operation to the 6-T SRAM cell of the column. The SRAM architecture can effectively increase the read SNM and dramatically reduce the power consumption.

Abstract: A Static Random Access Memory comprising a matrix arrangement of cells, each cell comprising:—a bistable loop of a first inverter and a second inverter, in which an input of the first inverter is coupled to an output of the second inverter at a first bistable node and an input of the second inverter is coupled to an output of the first inverter at a second bistable node;—a first access transistor connected between the first bistable node and a write bitline, the first access transistor having a control terminal connected to a write wordline, and—a second access transistor connected between the second bistable node and a line being the complement of the write bitline, the second access transistor having a control terminal connected to the write wordline wherein—a first separate read port is connected between a read bitline and a source potential, which first read port has at least two control terminals, one control terminal being connected to the second bistable node and one to a read wordline, and—a second se

Abstract: An improved memory design is described which removes the need to read firmware from ROM into RAM on start-up. A SRAM memory element comprises an influencing element which sets the state of the memory cells within the memory element on start-up to defined values. These defined values are set at the design stage such that on start-up the volatile memory contains firmware or other data. Dependent upon the implementation of the influencing element, the values of stored in the memory cells may be fixed or may subsequently be overwritten during operation of the device. In an example, the memory cell comprises two cross-coupled inverters and the influencing element comprises at least one transistor arranged to connect the input to one of the inverters to ground or a power supply rail when voltage is applied to a controlling node of the transistor.

Abstract: A power island for a system-on-a-chip (SoC) includes a first segment, a second segment, and a supply line. The first segment includes a hardware device and operates the hardware device at first power characteristics indicative of at least a first voltage. The second segment includes scalable logic and operates the scalable logic at second power characteristics indicative of at least a second voltage. The second power characteristics of the scalable logic are different from the first power characteristics of the hardware device. The supply line receives an external supply signal (VDD) and directs the external supply signal to both the first segment and the second segment. The second segment changes at least one power characteristic of the external supply signal to operate the scalable logic according to the second power characteristics.

Abstract: Disclosed herewith is a semiconductor device having an SRAM cell array capable of easily evaluating the performance of transistors and the systematic fluctuation of wiring capacity/resistance. In order to form an inversion circuit required to form a ring oscillator, a test cell is disposed at each of the four corners of the SRAM cell array and the ring oscillator is operated while charging/discharging the subject bit line. Concretely, the ring oscillator is formed on a memory cell array and the ring oscillator includes test cells disposed at least at the four corners of the memory cell array respectively. At this time, a wiring that is equivalent to a bit line is used to connect the test cells to each another.

Abstract: New and improved methods and circuit designs for asynchronous circuits that are tolerant to transient faults, for example of the type introduced through radiation or, more broadly, single-event effects. SEE-tolerant configurations are shown and described for combinational logic circuits, state-holding logic circuits and SRAM memory circuits.

Abstract: A semiconductor memory device includes a plurality of memory cells 205 provided corresponding to nodes of a plurality of word lines (WLBk, WLBk+1) and a plurality of bit line pairs (D1, DB1, D1+1, DB1+1). And column selection lines (S1, S1+1) are provided corresponding to each of the bit line pairs. Each of the memory cell includes an inverter (INV3) receiving power from the column selection line, and having its input connected to the word line and its output connected to gates of access transistors. Only the access transistors of a memory cell whose word line and column selection line are simultaneously selected are turned on.

Abstract: A circuit includes a first negative feed back loop coupled to a virtual Vvdd power rail and a true Vdd power rail. A second negative feed back loop is coupled to the virtual Vvss power rail and a true Vss power rail. The virtual rail to virtual rail voltage difference is regulated at the highest threshold voltage between pull-up and pull-down transistors of a memory cell.

Abstract: In a double edge triggered flip-flop circuit, a first latch circuit latches input data at either one of rising edge and falling edge of clock signal. A second latch circuit, which is provided in parallel with the first latch circuit, latches the input data at the other of the either one of rising edge and falling edge of the clock signal. At least one of the first latch circuit and the second latch circuit is configured by an SRAM (Static Random Access Memory) type.

Abstract: A semiconductor memory device comprises a word line; a bit line crossing the word line; a memory cell connected to intersection of the word line and the bit line; and a sense circuit connected to sense node coupled to the bit line. The sense circuit includes a first transistor of the first conduction type having a gate connected to the sense node, a second transistor of the second conduction type having a source connected to a first power supply, a drain connected to the sense node, and a gate connected to the drain of the first transistor, a third transistor having a source connected to the first power supply, a drain connected to the drain of the first transistor, and a gate connected to a control signal line, and a fourth transistor having a source connected to a second power supply, a drain connected to the source of the first transistor, and a gate connected to the control signal line. The sense circuit is activated with a control signal given to the control signal line.

Abstract: A non-volatile memory device includes a first metal-oxide-semiconductor (CMOS) device coupled to a bit line and a word line and a second CMOS device coupled to the first CMOS device. The second CMOS device is also coupled to a complementary bit line and a complementary word line. The first and second CMOS devices are complementary to one another. An output node is coupled between the first CMOS device and the second CMOS device. A method of programming a non-volatile field programmable gate array (NV-FPGA) includes coupling an information handling system to the FPGA, performing a block erase of a plurality of memory cells in the FPGA, verifying that the block erase is successful, programming an upper page of the FPGA, verifying that the upper page programming is successful, programming a lower page of the FPGA and verifying that the lower page programming is successful.

Abstract: Integrated circuits are provided that have volatile memory elements. The memory elements produce output signals. The integrated circuits may be programmable logic device integrated circuits containing programmable core logic including transistors with gates. The core logic is powered using a core logic power supply level defined by a core logic positive power supply voltage and a core logic ground voltage. When loaded with configuration data, the memory elements produce output signals that are applied to the gates of the transistors in the core logic to customize the programmable logic device. The memory elements are powered with a memory element power supply level defined by a memory element positive power supply voltage and a memory element ground power supply voltage. The memory element power supply level is elevated with respect to the core logic power supply level.

Abstract: An object of the present invention is to provide a technique of reducing the power consumption of an entire low power consumption SRAM LSI circuit employing scaled-down transistors and of increasing the stability of read and write operations on the memory cells by reducing the subthreshold leakage current and the leakage current flowing from the drain electrode to the substrate electrode. Another object of the present invention is to provide a technique of preventing an increase in the number of transistors in a memory cell and thereby preventing an increase in the cell area. Still another object of the present invention is to provide a technique of ensuring stable operation of an SRAM memory cell made up of SOI or FD-SOI transistors having a BOX layer by controlling the potentials of the wells under the BOX layers of the drive transistors.

Abstract: A system for terminating a homogenous cell array is disclosed. A preferred embodiment comprises a plurality of homogenous cells arranged in rows and columns to form the homogenous cell array, wherein a first homogenous cell of each column is electrically differently connected than a rest of the homogenous cells of the column.

Abstract: A semiconductor storage device includes a plurality of integrated memory cells. Each cell includes a first inverter having a first driver transistor and a first load transistor which are formed on a semiconductor substrate in order to form a first storage node, a second inverter having a second driver transistor and a second load transistor which are formed on the semiconductor substrate in order to form a second storage node, a first transfer transistor connected between the first storage node and a bit line to serve as a transistor connecting the memory cell to the bit line, and a second transfer transistor connected between the second storage node and a complementary-bit line to serve as a transistor connecting the memory cell to the complementary-bit line.

Abstract: A memory device is a provided that includes memory cells situated at the intersection of lines and columns, and a dummy path including a first dummy column having two bit lines to which there are connected dummy memory cells, and a circuit adapted to select at least one of the dummy memory cells to discharge one of the dummy bit lines. The dummy path also includes at least one second dummy column adapted to generate a dummy leakage current (representing a leakage current of a column of the memory device selected in read mode), and a circuit adapted to copy the dummy leakage current to the one dummy bit line, so that the discharge of the one dummy bit line also depends on the dummy leakage current.

Abstract: The semiconductor memory device includes an initialization memory cell having a first inverter circuit including a first transistor and a second transistor, and a second inverter circuit whose input portion is connected to an output portion of the first inverter circuit and output portion is connected to an input portion of the first inverter circuit, and including a third transistor and a fourth transistor. An absolute value of a threshold voltage of the third transistor is smaller than that of the first transistor.

Abstract: A semiconductor memory, such as an SRAM, is described that accommodates smaller read/write accesses in one mode of operation and larger read/write accesses in a second mode of operation, wherein power is conserved during the smaller accesses. Methods of using such a semiconductor memory are also described.

Abstract: Disclosed herein is a semiconductor memory device including a plurality of memory cells including first and second inverters each having first and second driver transistors and first and second load transistors and including first and second memory node, and first and second transfer transistors. The of the first and second transfer transistors is connected to each of the first and memory nodes respectively. The memory cell is connected to a bit line and complementary bit line via the first and second transfer transistors respectively wherein a supply voltage applied to the bit line and the complementary bit line is lower than a supply voltage applied to the load transistors, and at least a memory-node-side end of a gate insulating film of the first driver transistor, second driver transistor, first load transistor, and the second load transistor have a thickness larger than a thickness of a gate insulating film of the other part.

Abstract: A memory cell includes double-gate first and second access devices configured to selectively interconnect cross-coupled inverters with true and complementary bit lines. Each access device has a first gate connected to a READ word line and a second gate connected to a WRITE word line. During a READ operation, the first and second access devices are configured to operate in a single-gate mode with the READ word line “ON” and the WRITE word line “OFF” while the double-gate pull-down devices are configured to operate in a double gate mode. During a WRITE operation, the first and second access devices are configured to operate in a double-gate mode with the READ word line “ON” and the WRITE word line also “ON.

Abstract: The memory cell comprises first and second inverter circuits, connected in a loop. First and second decoupling transistors, normally turned off outside the write phases, are respectively connected between an output of the second inverter circuit and first and second inputs of the first inverter circuit. The memory cell is thereby protected against transient disturbances due to ionizing particles. The gates of the decoupling transistors are preferably respectively connected to a supply voltage for the P-type decoupling transistors and grounded for the N-type decoupling transistors.

Abstract: An integrated circuit including an array of SRAM cells containing a write port with a write word line and two read buffers with read word lines. The write port includes passgate transistors connected to each data node of the SRAM cell. A process of operating the integrated circuit in which source nodes of read buffer driver transistors are biased during a read operation. A process of operating the integrated circuit in which source nodes of read buffer driver transistors are floated during a read operation. A process of operating the integrated circuit in which the write port and the read ports share data lines and the source nodes of read buffer driver transistors are floated during a write operation.

Abstract: The present invention relates to a multi-port register file memory or SRAM including a plurality of storage elements and other circuitry that operate synchronously or asynchronously. The storage elements are arranged in rows and columns and store data. Two read port pairs are coupled to each of the storage elements and a differential sensing device or circuit. The read port is coupled to the storage elements in an isolated manner, enabling a plurality of cells to be arranged in such rows and columns. The sensing device is adapted to sense a small voltage swing. A column mux circuit is coupled to each column and the sensing device. Performance is not degraded unusually as the power supply voltage is reduced due to bus drop or inductive effects.

Abstract: An integrated circuit includes an array of memory cells, each including a core storage element with first and second complementary storage nodes and first and second cell pass transistors coupled to the first and second storage nodes, respectively. In the cell, a first bitline (BL) is coupled to a first BL node in a source drain path of the first cell pass transistor, and a second BL is coupled to a second BL node in a source drain path of the second cell pass transistor. Each of the memory cells also includes a first buffer circuit comprising a first buffer pass transistor and a first driver transistor coupled to the source drain path of the first cell pass transistor, where the first buffer pass transistor is between the first BL node and the first driver transistor.

Abstract: In one aspect of the present invention, a semiconductor device A semiconductor device may include a SRAM cell having a first inverter, a second inverter, a first transfer transistor and a second transistor, the first inverter having a first load transistor and a first driver transistor connected to the first load transistor, the second inverter having a second load transistor and a second driver transistor connected to the second load transistor, a voltage supplying circuit configured to supply a voltage to one of the terminals of the first driver transistor and one of the terminals of the second driver transistor, the voltage which is one of more than a GND voltage and less than a GND voltage.

Abstract: A three-dimensional array especially adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.

Abstract: A static memory cell, composed of cross-coupled MOS transistors having a relatively high threshold voltage, is equipped with MOS transistors for controlling the power supply line voltage of the memory cell. To permit the voltage difference between two data storage nodes in the inactivated memory cell to exceed the voltage difference between the two nodes when write data is applied from a data line pair DL and /DL to the two nodes in the activated memory cell, the power supply line voltage control transistors are turned on to apply a high voltage VCH to the power supply lines after the word line voltage is turned off. The data holding voltage in the memory cell can be activated to a high voltage independent of the data line voltage, and the data holding voltage can be dynamically set so that read and write operations can be performed at high speed with low power consumption.

Abstract: A semiconductor memory device includes a plurality of word lines, a plurality of pairs of bit lines and complementary bit lines that cross the word lines, and a plurality of memory cells, each memory cell being disposed at a region where a respective word line and a pair of a bit line and a complementary bit line cross each other. A voltage control unit includes a plurality of elements connected in series between a power voltage source and the memory cells and are switched on/off in response to a control signal that controls an operation of the plurality of memory cells. The voltage control unit controls the voltage of the power voltage source to a predetermined level, thereby obtaining a controlled voltage to be supplied to the memory cells.

Abstract: A dummy memory cell for detection of write completion timing is provided as a replica of a memory cell. When assisting a write operation by power supply control and substrate potential control of the memory cell, the timing of ending the write assist operation is determined by a voltage control circuit based on information about the dummy memory cell. For example, the voltage control circuit performs, in a data write operation in the memory cell, the write assist operation of decreasing the voltage of a source power supply allocated to P-channel MOS load transistors using a pull-down transistor. Thereafter, at the time when completion of the data write operation in the dummy memory cell is detected, the voltage control circuit ends the write assist operation and restores the voltage of the source power supply to the original level using a pull-up transistor.

Abstract: A system and are described as to adjusting voltages in a memory device, while the device is in sleep mode, to prevent or minimize voltage or current leakage of the device.

Abstract: A semiconductor memory device includes: static memory cells arranged in a matrix; a read bit line for transmitting data read from one of the memory cells; a write bit line for transmitting data to be written to one of the memory cells; an input data line for transmitting data which is received from outside and is to be written in one of the memory cells; and a selector for selectively transmitting data of the read line or the input data line to the write bit line.

Abstract: An object of this invention is to provide a rewritable nonvolatile memory cell that can have a wide reading margin, and can control both a word line and a bit line by changing the level of Vcc. As a solution, a flip-flop is formed by cross (loop) connect of inverters including memory transistors that can control a threshold voltage by charge injection into the side spacer of the transistors. In the case of writing data to one memory transistor, a high voltage is supplied to a source of the memory transistor through a source line and a high voltage is supplied to a gate of the memory transistor through a load transistor of the other side inverter. In the case of erasing the written data, a high voltage is supplied to the source of the memory transistor through the source line.

Abstract: A detector circuit for detecting an external manipulation of an electrical circuit. The detector circuit includes a digital circuit which is sensitive to at least one of the effects of ionizing radiation or fluctuations of a supply voltage, and the output state of the digital circuit is indicative of an attack.

Abstract: A memory cell includes a first access transistor, first and second pull-up transistors, a depletion transistor, and first and second pull-down transistors. The first access transistor is connected to a word line and connected between a first bit line and a first data node. The first pull-up transistor is connected to a first power supply point and the second pull-up transistor is connected to the first power supply point and the second data node. The first pull-down transistor is connected to a second power supply point and to the first data node and the second pull-down transistor is connected to the depletion transistor and to the second data node. The depletion transistor is connected to the word line and to the second power supply point.

Abstract: In a multiport SRAM memory cell of the present invention, an access transistor of a first port is disposed in a p-type well, and an access transistor of a second port is disposed in a p-type well. The gates of all of transistors disposed in a memory cell extend in the same direction. With the configuration, a semiconductor memory device having a low-power consumption type SRAM memory cell with an increased margin of variations in manufacturing, by which a bit line can be shortened in a multiport SRAM memory cell or an associative memory, can be obtained.

Abstract: A non-volatile single-event upset (SEU) tolerant latch is disclosed. The non-volatile SEU tolerant latch includes a first and second inverters connected to each other in a cross-coupled manner. The gates of transistors within the first inverter are connected to the drains of transistors within the second inverter via a first feedback resistor. Similarly, the gates of transistors within the second inverter are connected to the drains of transistors within the first inverter via a second feedback resistor. The non-volatile SEU tolerant latch also includes a pair of chalcogenide memory elements connected to the inverters for storing information.

Abstract: The invention comprises a design structure for a dynamic voltage state-saving latch electrical circuit comprising a charge device adapted as a storage element, an integrated recovery mechanism, a supply voltage rail connected to the charge device, a hold signal allocated to the integrated recovery mechanism, a data signal input allocated to said charge device, a data signal output distributed from the charge device, and a clock signal allotted to the charge device, wherein said integrated recovery mechanism maintains a state of the charge device independent of the charge device.

Abstract: There is provided a technique for ensuring both an SNM and a write margin simultaneously in a semiconductor device having static memory cells. A semiconductor device has a plurality of static memory cells. The semiconductor device includes a memory cell array having the static memory cells arranged in a matrix, a temperature sensor circuit for sensing a temperature in the semiconductor device, and a word driver for controlling a voltage supplied to a word line of the memory cell array based on an output of the temperature sensor circuit at the time of writing to or reading from a memory cell.

Abstract: A memory cell includes a storage element, a write circuit coupled to the storage element and a read circuit coupled to the storage element. At least a portion of the storage element and at least a portion of the write circuit are fabricated using a thicker functional gate oxide and at least a portion of the read circuit is fabricated using a thinner functional gate oxide.

Abstract: The present invention provides a Single-Event-Upset (SEU) and Single-Event-Gate-Rupture (SEGR) protection against incident radiation for any bi-stable circuit either in one state, having a 2 transistor, 1 capacitor integrated circuit coupled to a bi-stable circuit's outputs, or in both states, having a 4 transistor, 2 capacitor integrated circuit coupled to the bi-stable circuit's outputs. The protection against SEU and SEGR is achieved by the 2T1C or the 4T2C circuits, by providing the opposite drive to the SEU or SEGR event through capacitive coupling, and shunting electron-hole pair current, created by an ion tracking through the bi-stable circuit, into the power supplies. The 2T1C integrated circuit architecture, which only protects bi-stable circuits in one state, is to allow the bi-stable circuit to be a Single-Event-Upset (SEU) detector by capturing the effect of an incident ion and store that state.

Abstract: A mask ROM is provided with a plurality of memory cells each including first and second nodes, and a transistor having a source and drain connected to the first and second nodes, respectively. A first memory cell out of the plurality of memory cells further includes a first resistive interconnection which provides an electrical connection between the first and second nodes. The resistance of the first resistive interconnection is adjusted depending on data stored onto the first memory cell.

Abstract: An integrated circuit includes common gate FinFET and split gate FinFET devices formed from different height fins at a semiconductor surface of a substrate. A patterned layer of gate electrode material formed over sides and unconnected over the tops of the taller fins defines respective gate electrodes for first and second paired transistors. The patterned layer of gate electrode material formed over the sides and connected over tops of the shorter fins defines common gate electrodes for transistors. In one embodiment, the common gate devices are used for cross-coupled inverters of a memory cell core storage element and the split gate devices are used for pass gates, with the gate electrodes coupled to wordlines and common source/drains coupled to bitline/complementary bitline and core element storage/complementary storage nodes.