Abstract: An integrated circuit includes a plurality of tiles. One tile is a master tile. Other tiles contain writable registers of memory structures. Information for configuring circuitry of the tile is stored in the register in the tile. An individual one of the registers can be written via the master tile. Each memory structure of a register includes a non-volatile floating gate cell (that stores the configuration information) as well as a volatile cell. All transistors have the same gate insulator thickness. Although a programming pulse signal is applied to all memory structures, the state of the non-volatile cell of a memory structure is only changed if the state stored by the associated non-volatile cell differs from the state stored by the volatile cell. Floating gates are automatically refreshed by the programming pulse signal. By storing configuration information in each tile, inefficiencies associated with using blocks of non-volatile memory are avoided.

Abstract: Disclosed is a method and device for providing fast-response One-Time-Programmable (OTP) memory based on SRAM memory technology and the inherent breakdown characteristics of a MOS transistor. Each memory cell of an SRAM memory cell circuit is connected to a programming circuit. The programming circuit is comprised of two groups of MOS transistors connected to the storage nodes (SN and SNB, where SNB is the complementary value of SN) of the two cross-coupled inverters of the SRAM memory circuit. A desired data set is loaded into the circuit and then is burned-in by applying and repeatedly cycling a “burn-in” voltage across the source and drain of the MOS transistors of the programming circuit that approaches the ON STATE trigger voltage of the characteristic bipolar junction transistor contained within the MOS transistors.

Abstract: A layout structure of bit line sense amplifiers for use in a semiconductor memory device includes first and second bit line sense amplifiers arranged to share and be electrically controlled by a first column selection line signal, and each including a plurality of transistors. In this layout structure, each of the plurality of transistors forming the first bit line sense amplifier is arranged so as not to share an active region with any transistors forming the second bit line sense amplifier.

Abstract: An SRAM device includes a first inverter; a second inverter cross-coupled with the first inverter; a first pass gate transistor connecting the first inverter to a bit line; and a second pass gate transistor connecting the second inverter to a complementary bit line, wherein the first or second pass gate transistor has a layout structure where a first distance between its gate conductive layer and its source contact is purposefully designed to be substantially different from a second distance between its gate conductive layer and its drain contact for reducing leakage current induced by misalignment of the gate conductive layer with respect to the source contact.

Abstract: An elastic power header device and methods of operation are provided to improve the read margin of static random access memory (SRAM) cells by increasing read stability, reducing read disturbance and improving the Signal to Noise Margin (SNM) figure of merit. For example, various implementations of an elastic power header device are utilized as programmable resistances to permit the power supply lines to reach a maximum voltage. Allowing the power supply lines to reach the reference voltage allows more flexibility in read margin and read stability. Furthermore, this additional flexibility can be controlled by means for adjusting a voltage. This adjustment voltage can fine-tune the programmable resistances so that the read margin can be more conveniently controlled.

Abstract: A semiconductor memory maintains securely the stored contents in the memory cells, and it is written with data reliably even in a case where a relatively low supply voltage is applied. A memory cell M00 comprises a pair of inverters cross-coupled with each other, a first switching unit provided between bit line BL and the output terminal of one of the inverters, and a second switching unit provided between bit line XBL and the output terminal of the other inverter. The first switching unit and the second switching unit are controlled to be conductive such that the conductance of the switches be larger for the writing operation than for the reading operation.

Abstract: Embodiments disclosed herein generally relate to switches that utilize micro-electromechanical systems (MEMS). By replacing transistors in many devices with switches such as MEMS switches, the devices may be used for logic applications. MEMS switches may be used in devices such as FPGAs, NAND devices, nvSRAM devices, AMS chips and general memory logic devices. The benefit of utilizing MEMS devices in place of transistors is that the transistors utilize more space on the chip. Additionally, the MEMS devices can be formed in the BEOL without having any negative impacts on the FEOL or necessitating the use of additional layers within the chip.

Abstract: A semiconductor memory device with an improved protection against soft errors includes a bi-stable flip-flop cell having a data storage node and a data bar storage node. A first capacitor electrically couples the data storage node to a predefined voltage and a second capacitor electrically couples the data bar storage node to the predefined voltage. Each one of the first and second capacitors includes a top conductive electrode overlying a bottom contact electrode with a dielectric layer disposed in-between. The bottom contact electrode overlays at least two different active regions forming the data and data bar storage nodes.

Abstract: A memory cell 36 within an integrated circuit memory is provided with an access controller 32 coupled to a first pass gate 38 and a second pass gate 40. During a write access to the memory cell 38 both the first pass gate 38 and the second pass gate 40 are opened. During a read access, the first pass gate 38 is opened and the second pass gate 40 is closed. This asymmetry in the read and write operations permits an asymmetry in the gates forming the memory cell 36 thereby permitting changes to increase both read robustness and write robustness. The asymmetry in the design parameters of different gates can take the form of varying the gate length, the gate width and the threshold voltage so as to vary the conductance of different gates to suit their individual role within the memory cell 36 which is operating in the asymmetric manner provided by the separate word line signals driving read operations and write operations.

Abstract: Partial reconfiguration techniques and reconfiguration circuitry are provided that allow portions of a memory cell array to be reconfigured with new reconfiguration data without disturbing other portions of the memory cell array. The memory cells may be loaded with configuration data on an integrated circuit such as a programmable logic device. Memory cell outputs may configure programmable logic. To avoid disturbing programmable logic operations for programmable logic that is unaffected by the reconfigured cells during reconfiguration, unaffected memory cells are not unnecessarily cleared. Only those memory cells that need to be cleared to conform to the new configuration data that is being loaded into the array need to be loaded with logic zero values during reconfiguration operations. After these clearing operations are complete, set operations may be performed to convert appropriate memory cells to logic one values to match the new configuration data.

Abstract: A memory to which a bit line potential step-down technique is applied is provided. The memory includes an IO block including first transistors which control potentials of first bit lines provided with respect to columns of memory cells, and first logic gates which control the first transistors. The drain or source of each first transistor is connected to an input of the corresponding first logic gate, and the gate of each first transistor is connected to an output of the corresponding first logic gate. The first transistors are driven by pulses.

Abstract: A data store and method of storing data is disclosed that comprises: an input for receiving a data value; at least one storage cell comprising: a feedback loop for storing the data value; an output for outputting the stored data value; the feedback loop receiving a higher voltage and a lower voltage as power supply, the data store further comprising: a voltage supply for powering the data store, the voltage supply outputting a high voltage level and a low voltage level; write assist circuitry arranged between the voltage supply and the at least one storage cell, the write assist circuitry being responsive to a pulse signal to provide a discharge path between the high voltage level and a lower voltage level and thereby generate a reduced internal voltage level from the high voltage level for a period dependent on a width of the pulse signal, the reduced internal voltage level being lower than the high voltage level, such that when powered the feedback loop receives the reduced internal voltage level as the hig

Abstract: A programmable latch circuit (200) can include a volatile latch (206) that may regenerate a value determined by programmable section (202). In a test operation, a variable current source (216?) can generate a current (IBASE) that can be mirrored in test sections (252-0 and 252-1) and compared to a current drawn by either programmable element (210-0) or (210-1) by a latching operation of volatile latch (206). Variable current source (216?) can enable characterization of programmable elements (210-0 or 210-1) as well as adjustable test threshold limits. A program voltage (Vprog) applied to programmable elements (210-0 or 210-1) can be also be variable to allow for characterization of programmable elements (210-0 and 210-1) over a range of voltages.

Abstract: A method and apparatus involving a circuit is disclosed. The circuit has separate first and second portions, where the first portion includes a first memory device such as a flip-flop, and the second portion includes a second memory device such as a latch. The first portion is selectively operated in first and second operational modes, the first portion consuming less power in the second operational mode than in the first operational mode. During the first operational mode a logical value is maintained in the flip-flop and can vary dynamically. During the second operational mode, the state that the logical value had at a point in time just before the first portion entered the second operational mode is maintained in the latch. Then, after the first portion switches from the second operational mode back to the first operational mode, the state of the logical value in the latch is restored to the flip-flop.

Abstract: A mechanism for measuring the variability of the read current of SRAM cells on an integrated circuit includes the integrated circuit having an SRAM array including a plurality of SRAM cells. The integrated circuit may also include a selection circuit configured to select a particular SRAM cell in response to a selection input. An oscillator circuit such as a ring oscillator, for example, on the integrated circuit may be configured to oscillate at a frequency that is dependent upon a read current of a selected SRAM cell during operation in a first mode. A frequency determining circuit that is coupled to the oscillator circuit may be configured to output a value corresponding to the frequency of oscillation of the oscillator circuit.

Abstract: An integrated circuit structure includes a first static random access memory (SRAM) cell including a first read-port and a first write-port; and a second SRAM cell including a second read-port and a second write-port. The first SRAM cell and the second SRAM cell are in a same row and arranged along a row direction. A first word-line is coupled to the first SRAM cell. A second word-line is coupled to the second SRAM cell. A read bit-line is coupled to the first SRAM cell and the second SRAM cell, wherein the read bit-line extends in a column direction perpendicular to the row direction. A write bit-line is coupled to the first SRAM cell and the second SRAM cell.

Abstract: A random access memory cell including: two double-gate access transistors respectively arranged between a first bit line and a first storage node and between a second bit line and a second storage node, a word line, a first double-gate load transistor and a second double-gate load transistor, a first double-gate driver transistor and a second double-gate driver transistor, a mechanism to apply a given potential to at least one electrode of each of the load or driver transistors, and a mechanism to cause the given potential to vary.

Abstract: An integrated circuit has a matrix of rows and columns of cells (10, 18, 19), each cell (10, 18, 19) comprising a first inverter (100) and a second inverter (102). First columns have a bit-line (12a,b), the first inverter (100) and the second inverter (102) in each cell of the first columns being cross-coupled to each other and coupled to bit-line (12a,b) of the associated first column. A further column is provided in the matrix with bit line fragments (16) that are mutually disconnected. Delays are monitored by coupling at least the first inverters (100) of cells in respective pairs of rows in series via the bit-line fragments and measuring a delay during signal propagation through the series connection, for example by in corporating the series of inverters in a ring oscillator.

Abstract: A novel and useful mechanism for reducing current leakage in a static random access memory array which significantly reduces the power requirements of the memory array. The method enables the steady state of all local and global bit lines in an SRAM array to be discharged during both active and inactive modes. The memory array includes memory cells having an N channel field effect transistor read stack. A mechanism is provided to evaluate data from memory cells where the steady state of local and global read bit lines is discharged.

Abstract: A memory device includes a power supply line, a memory cell, a memory cell power supply node provided between the memory cell and the power supply line, a first voltage generating circuit coupled to the memory cell power supply node for supplying the memory cell power supply node with a first potential lower than a potential of the power supply line for a first period corresponding to at least a part of a writing operation period, and a second voltage generating circuit that is coupled to the memory cell power supply node for supplying the memory cell power supply node with a second potential lower than the potential of the power supply line for a second period corresponding to at least a part of the writing operation period.

Abstract: An integrated circuit structure includes a word-line; a column select line; and a latch. The latch includes a first storage node and a second storage node complementary to each other; and an operation voltage node. A control circuit is coupled between the operation voltage node and the latch. The control circuit includes a first input coupled to the word-line; and a second input coupled to the column selection line. The control circuit is configured to interconnect the operation voltage node and the latch when both the word-line and the column select line are selected, and disconnect the operation voltage node and the latch when at least one of the word-line and the column select line is not selected.

Abstract: A memory includes an SRAM bitcell including a pair of cross-coupled inverters, wherein a first inverter of the pair includes a first device having a body and a second inverter of the pair includes a second device having a body. A first selection circuit has a first input coupled to a first supply voltage terminal, a second input coupled to a second supply voltage terminal, and an output coupled to a first current electrode of the first device and to a first current electrode of the second device. A second selection circuit has a first input coupled to the first supply voltage terminal, a second input coupled to the second supply voltage terminal, and an output coupled to the body of each of the first and second devices. A word line coupled to the SRAM bitcell is driven by a word line driver coupled to the first supply voltage terminal.

Abstract: A memory cell includes an access transistor, first and second pull-up transistors, first and second pull-down transistors, and a first search transistor. The access transistor is connected to a first word line and connected between a first bit line and a first data node. The first pull-up transistor is connected to a first power supply point and the first data node, and the second pull-up transistor is connected to the first power supply point and the second data node. The first pull-down transistor is connected to a second power supply point and the first data node, and the second pull-down transistor is connected to the second power supply point and the second data node. The first search transistor is connected to the second data node and includes a source terminal connected to a third power supply point comprising a voltage less than the voltage at the second power supply point.

Abstract: A content addressable memory (CAM) device includes an array of memory cells arranged in rows in a word line direction and columns arranged in a bit line direction, and compare circuitry configured to compare data presented to the array with data stored in each row and column of the array, and simultaneously indicate match results on each row and column of the array, thereby resulting in a two-dimensional, matrix-based data comparison operation.

Abstract: A memory has a first bit line, a second bit line, and a word line. A memory cell is coupled to the word line and the first and second bit lines. A sense amplifier has a first input, a second input, a first output, and a second output. A pair of coupling transistors includes a first transistor and a second transistor. In one embodiment, the first transistor is coupled between the first bit line and the first input of the sense amplifier and the second transistor is coupled between the second bit line and the second input of the sense amplifier. A write back circuit is coupled to an output of the sense amplifier. The write back circuit writes back to the memory cell a value read from the memory cell during a read cycle.

Abstract: In a RAM control device, an arbiter circuit is means for generating BUSY1 and BUSY2 of exclusive logic with CLK1 and CLK2 so as to give a right to access RAM3 to a host which has transmitted the first access clock and requesting a one-shot circuit to generate RAMCLK for deciding the timing to access the RAM3. The one-shot circuit is means for generating one pulse of RAMCLK with CLKRQ from the arbiter circuit and transmitting it to the RAM3. This configuration suppresses increase of the device size and cost and enables appropriate control of access to the RAM according to the access clocks of two systems inputted asynchronously.

Abstract: A first integrated circuit containing a single sided write SRAM cell array, each SRAM cell having a bit passgate and an auxiliary bit-bar driver transistor. A process of operating the first integrated circuit including a single sided read operation in which source nodes of the auxiliary drivers in both addressed cells and half-addressed cells are floated. A second integrated circuit containing an SRAM cell array, in which each SRAM cell includes a bit-side write passgate, a bit-bar-side read passgate and a bit-bar auxiliary driver transistor. A process of operating the second integrated circuit including a single sided read operation in which source nodes of the auxiliary drivers in both addressed cells and half-addressed cells are biased to a low bias voltage.

Abstract: An integrated circuit with SRAM cells containing dual passgate transistors and a read buffer, all connected to one word line is disclosed. The read buffer and one passgate transistor may be variously configured to a separate read data line and write data line, or a combined data line, in different embodiments. The read buffer in addressed SRAM cells may be biased during read operations. The read buffer in half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line. The read buffer in addressed and half-addressed SRAM cells may be biased or floated, depending on the configuration of the read data line and the write data line.

Abstract: A semiconductor memory device comprises a plurality of memory cells each including a holding circuit for holding memory data, and a read-only output circuit for outputting a signal corresponding to the data held by the holding circuit. The read-only output circuit has a read drive transistor controlled in accordance with a signal held by the holding circuit. A gate length of the read drive transistor is longer than a gate length of a transistor included in the holding circuit. Alternatively, the read-only output circuit has a read access transistor controlled in accordance with a read word select signal, and a gate length of the read access transistor is longer than a gate length of a transistor included in the holding circuit.

Abstract: A nonvolatile semiconductor memory according to an aspect of the invention includes memory cell arrays including plural cell units, a power supply pad disposed on one end in a first direction of the memory cell arrays, and page buffers disposed in the first direction of the memory cell arrays. The nonvolatile semiconductor memory also includes plural bit lines which are disposed on the memory cell arrays while extending in the first direction and a first power supply line which is disposed on the plural bit lines on the memory cell arrays to connect the power supply pad and the page buffers.

Abstract: A chalcogenide material is proposed for programming the cross-connect transistor coupling interconnect lines of an electrically programmable matrix array. Leakage may be reduced by optionally placing a thin insulating breakdown layer in series with the select device or a phase change material. The matrix array may be used in a programmable logic device.

Abstract: A memory circuit having a global signal driving circuit, which, when a first read signal is inputted from a first bit signal line with a column signal inputted from a column signal line, outputs the first read signal as a global signal from a global signal line, and, when a first driving write signal is inputted from the first bit signal line, inhibits the first driving write signal from being outputted to the global signal line on the basis of a first write signal inputted from a first write signal line.

Abstract: Included are a memory cell, a first metal interconnection, a variable capacitance circuit and a connection switch. The memory cell includes cross-coupled first and second inverters which are connected to a power supply node. The first metal interconnection is connected to the power supply node. The variable capacitance circuit includes: second and third metal interconnections electrically connected to a connection node; and a controller capable of controlling electrical connection between the third metal interconnection and the connection node. The connection switch is connected between the first metal interconnection and the connection node of the variable capacitance circuit. The connection switch is configured to electrically connect the first metal interconnection and the connection node in a write operation of the memory cell.

Abstract: A method and circuit for implementing an enhanced dual-mode static random access memory (SRAM) performance screen ring oscillator (PSRO), and a design structure on which the subject circuit resides are provided. The dual-mode SRAM PSRO includes a plurality of SRAM base blocks connected together in a chain. Each of the plurality of SRAM base blocks includes an eight-transistor (8T) SRAM cell, a local evaluation circuit and a logic function coupled to the SRAM cell. The eight-transistor (8T) static random access memory (SRAM) cell is an unmodified 8T SRAM cell. The dual-mode SRAM PSRO includes one mode of operation, where the output frequency is determined by write-through performance of the 8T SRAM cell; and another mode of operation, where the output frequency is determined by read performance of the 8T SRAM cell.

Abstract: Described herein are methods and apparatuses for write-assist voltage generation and power-down voltage scaling for static random access memory (SRAM) cells. According to various embodiments, an SRAM cell may include a local power supply voltage node for receiving a power supply voltage generated by a power supply voltage generator circuit, the generated power supply voltage being substantially equal to or less than a global power supply voltage provided to one or more transistors of the SRAM cell during a write-enable or power-down mode.

Abstract: A semiconductor memory, such as an SRAM, is described that accommodates smaller read/write accesses in one mode of operation and larger read/write accesses in a second mode of operation, wherein power is conserved during the smaller accesses. Methods of using such a semiconductor memory are also described.

Abstract: A static random access memory device capable of preventing stability issues during a write operation is provided, in which a memory cell is coupled to a read word line, a write word line, a read bit line, a write bit line and a complementary write bit line, and a multiplexing unit is coupled to the read bit line, the write bit line and the complementary write bit line. The multiplexing unit applies first and second logic voltages representing a logic state stored in the memory cell to the write bit line and the complementary write bit line, respectively, when the memory cell is not selected to be written by an input signal from a data driver and the read word line is activated, in which the first and second logic voltages are opposite to each other.

Abstract: Embodiments of the present invention provide a system for transferring data between a receiver chip and a transmitter chip. The system includes a set of data path circuits in the transmitter chip and a set of data path circuits in the receiver chip coupled to a shared data channel. In addition, the system includes a set of asynchronous control circuits for controlling corresponding data path circuits in the transmitter chip and receiver chip. Upon detecting the transition of a control signal for an asynchronous control circuit in the transmitter chip, the asynchronous control circuit is configured to enable a transfer of data from the corresponding data path circuit in the transmitter chip across the data channel to a corresponding data path circuit in the receiver chip, and generate a control signal to cause a next asynchronous control circuit to commence the transfer of a data signal.

Abstract: A semiconductor device having SRAM cell units each comprising a pair of a first driving transistor and a second driving transistor, a pair of a first load transistor and a second load transistor, and a pair of a first access transistor and a second access transistor, wherein each of the transistors comprises a semiconductor layer projecting upward from a substrate plane, a gate electrode extending on opposite sides of the semiconductor layer so as to stride over a top of the semiconductor layer, a gate insulating film interposed between the gate electrode and the semiconductor layer, and a pair of source/drain areas formed in the semiconductor layer; and the first and second driving transistors each have a channel width larger than that of at least either each of the load transistors or each of the access transistors.

Abstract: A first transfer transistor includes a first diffusion layer connected to a first bit line, and a second diffusion layer connected to a first storage node, the first diffusion layer is provided in a substrate, the second diffusion layer is provided in a bottom part of a recess provided in the substrate, a channel region of the first transfer transistor is offset with respect to the second diffusion layer toward the first storage node, and the offset part functions as a resistor.

Abstract: Some embodiments regard a method comprising: during a leakage sampling phase, recognizing a voltage level dropped due to a leakage current associated with a signal linestoring the voltage level; and during a reading phase, using the voltage level to provide an amount of compensation current to the signal line.

Abstract: An initialization method of the present invention is a method for initializing a material (variable-resistance material) (2) whose resistance value increases/decreases according to the polarity of an applied electric pulse. An electric pulse having a first polarity is applied at least once between first and second electrodes (1, 3) connected to the variable-resistance material (2) such that the potential of the first electrode is higher than that of the second electrode.

Abstract: In an SRAM according to the present invention, an internal power supply voltage for a memory cell is applied to a back gate of each of P-channel MOS transistors included in an equalizer, a write driver, and a column select gate. Therefore, even if an internal power supply voltage for a peripheral circuit is shut off to reduce current consumption during standby, a threshold voltage of each of the P-channel MOS transistors is maintained at a high level, and hence a leakage current is small.

Abstract: In a method for reducing and/or eliminating mismatch in one or more devices that require a balanced state (e.g., in cross-coupled transistors in each memory cell and/or sense amp in a memory array), the bias (i.e., the preferred state) of each of the devices is determined. Then, a burn-in process is initiated, during which an individually selected state is applied to each of the devices. This fatigues the devices away from their preferred states and towards a balanced state. The bias is periodically reassessed during the burn-in process to avoid over-correction. By using this method both memory cell and sense-amplifier mismatch can be reduced in memory arrays, resulting in smaller timing uncertainty and therefore faster memories.

Abstract: A Random Access Memory (RAM) and method of using the same are disclosed. The RAM includes a plurality of memory cells arranged in columns and in rows with each memory cell coupled to at least one word line and at least one bit line. The RAM includes a plurality of switches with at least one of the switches coupled between two of the memory cells to allow data to be copied from one of the two memory cells to the other of the two memory cells. In another aspect, the two memory cells can be considered a dual bit cell that contains a copying mechanism. There are two interleaved memory planes, assembled from bit cells that contain two bits of information. One bit is the primary bit that corresponds to the normal RAM bit. The second bit is able to receive a copy and hold the primary value. When the copying mechanism is over, the two memory planes may act as two completely independent structures.

Abstract: A method for operating a static random access memory (SRAM) cell includes providing the SRAM cell having a static read margin and a static write margin, wherein the static read margin is greater than the static write margin; applying a dynamic power to perform a write operation on the SRAM cell; and applying a static power to perform a read operation on the SRAM cell.

Abstract: A static random access memory cell includes a metal hi-k layer; a poly-SiON gate stack over the metal hi-k layer; a plurality of inverters disposed within the poly-SiON gate stack; and a plurality of field effect transistors placed in the metal hi-k layer.

Abstract: Mechanisms for improving static noise margin and/or reducing misread current in multi-port devices are disclosed. In some embodiments related to dual port SRAM a suppress device (e.g., transistor) is provided at each word line port. When both ports are activated, both suppress devices are on and lower the voltage level of these ports, which in turn lower the voltage level at the node storing the data for the memory. As the voltage level at the data node is lowered, noise margin is improved and read disturb can be avoided.

Abstract: Conventional semiconductor memory devices have a problem of a data read failure caused by a leak current. To address this problem, a semiconductor memory device of the present invention including memory cells each formed of a transfer transistor, a load transistor and a drive transistor. Each of the memory cells includes: a first transfer transistor connected to a connection point of the drive transistor and the load transistor; a second transfer transistor connected between the first transfer transistor and a bit line DB; and a compensation transistor connected between a constant voltage node and a connection point of the first transfer transistor and the second transfer transistor. The compensation transistor is switched to a conductive state exclusively from at least one of the first transfer transistor and the second transfer transistor.

Abstract: A method of preparing Shmoo plots where both the number of failures and also the failure type is specified at each test voltage measurement point. A method that uses the operational SRAM array circuitry to determine the type of failure that may have occurred at each test voltage measurement point.