Abstract: A memory device that includes at least one memory cell is introduced. Each of the at least one memory cell is coupled to a bit line and a word line. Each of the at least one memory cell includes a memory element and a selector element, in which the memory element is configured to store data of the at least one memory cell. The selector element is coupled to the memory element in series and is configured to select the memory element for a read operation and amplify the data stored in the memory element in the read operation.

Abstract: The output voltage of an MRAM is increased by means of an Fe(001)/MgO(001)/Fe(001) MTJ device, which is formed by microfabrication of a sample prepared as follows: A single-crystalline MgO (001) substrate is prepared. An epitaxial Fe(001) lower electrode (a first electrode) is grown on a MgO(001) seed layer at room temperature, followed by annealing under ultrahigh vacuum. A MgO(001) barrier layer is epitaxially formed on the Fe(001) lower electrode (the first electrode) at room temperature, using a MgO electron-beam evaporation. A Fe(001) upper electrode (a second electrode) is then formed on the MgO(001) barrier layer at room temperature. This is successively followed by the deposition of a Co layer on the Fe(001) upper electrode (the second electrode). The Co layer is provided so as to increase the coercive force of the upper electrode in order to realize an antiparallel magnetization alignment.

Abstract: An embodiment of an integrated circuit chip includes a combination processing core and magnetoresistive random access memory (MRAM) circuitry integrated into the chip. The MRAM circuitry includes a plurality of MRAM cells. The MRAM cells are organized into a number of memories, including a cache memory, a main or working memory and an optional secondary storage memory. The cache memory includes multiple cache levels.

Abstract: A system and method for a memory device is disclosed. A substrate is provided. A nucleation pad is disposed over the substrate. A nanowire is disposed substantially perpendicular, about a center of the nucleation pad. A charge current is selectively passed through the substrate to nucleate a magnetic vortex in the nucleation pad, the magnetic vortex indicative of a magnetic domain and a direction of the magnetic vortex indicative of a polarity of the magnetic domain. A shift current is applied through the nanowire to shift the magnetic domain into the nanowire.

Abstract: A controller for managing at least one MLC non-volatile memory space including at least one MLC non-volatile memory element and at least one SLC non-volatile memory space including at least one SLC non-volatile memory element. The controller is adapted to determine if a range of addresses listed by an entry and mapped to the at least one MLC non-volatile memory element fails a data integrity test performed at the controller based upon received data retained at the controller and which received data is stored in the at least one MLC memory element as stored data. In the event of such a failure, the controller remaps said entry to an the at least one SLC non-volatile memory element.

Abstract: A memory device has a magnetic tunnel junction (MTJ) element that includes a free layer structure, a free/pinned layer structure, and a tunnel barrier structure between the free layer structure and the free/pinned layer structure. A first electrode is coupled to the free layer structure, and a second electrode is coupled to the free/pinned layer structure. Processing circuitry is operatively coupled to the MTJ element. The processing circuitry is configured to apply a voltage to the MTJ element to modulate magnetic anisotropy using an electric field, to enable writing with reduced write currents; issue a charge current to the MTJ element to induce spin-dependent writing and magnetic spin accumulation in the free layer structure to set a bit state of the MTJ element, using spin-transfer torque into the free layer structure; and remove the voltage from the MTJ element that modulates the magnetic anisotropy, to perform a write operation.

Abstract: Various embodiments of the present disclosure are directed towards a memory device. The memory device has a first transistor having a first source/drain and a second source/drain, where the first source/drain and the second source/drain are disposed in a semiconductor substrate. A dielectric structure is disposed over the semiconductor substrate. A first memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the first memory cell has a first electrode and a second electrode, where the first electrode of the first memory cell is electrically coupled to the first source/drain of the first transistor. A second memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the second memory cell has a first electrode and a second electrode, where the first electrode of the second memory cell is electrically coupled to the second source/drain of the first transistor.

Abstract: Embodiments of present invention provide a method of improving yield of making MRAM arrays. More specifically, the method includes receiving an MRAM array; identifying a weak MRAM cell from the MRAM array wherein the weak MRAM cell includes an access transistor; and modifying the access transistor. In one embodiment, modifying the access transistor includes performing a hot carrier injection into a gate dielectric layer of the access transistor.

Abstract: Magnetic random access memory (MRAM) cells are provided. MRAM cell includes a plurality of stacked magnetic tunnel junction (MTJ) devices coupled in serial, and a transistor. The transistor has a gate coupled to a word line, a first terminal coupled to a bit line through the stacked MTJ devices, and a second terminal coupled to a source line. The stacked MTJ devices have different sizes. Each of the stacked MTJ devices includes a free layer, a pinned layer and a barrier layer between the free layer and the pinned layer. The free layers of two adjacent stacked MTJ devices are in direct contact with each other.

Abstract: A semiconductor device includes a transistor and a ferroelectric tunnel junction. The ferroelectric tunnel junction is connected to a drain contact of the transistor. The ferroelectric tunnel junction includes a first electrode, a second electrode, a crystalline oxide layer, and a ferroelectric layer. The second electrode is disposed over the first electrode. The crystalline oxide layer and the ferroelectric layer are disposed in direct contact with each other in between the first electrode and the second electrode. The crystalline oxide layer comprises a crystalline oxide material. The ferroelectric layer comprises a ferroelectric material.

Abstract: A magnetoresistive element comprises a nonmagnetic nano-current-channel (NCC) structure provided on a surface of the magnetic recording layer, which is opposite to a surface of the magnetic recording layer where the tunnel barrier layer is provided, and comprising a spatial distribution of perpendicular conducting channels throughout the NCC structure thickness and surrounded by an insulating medium, making the magnetic recording layer a magnetically soft-hard composite structure. Correspondingly, the critical write current and write power are reduced with reversal modes of exchange-spring magnets of the magnetically soft-hard composite structure.

Abstract: The present disclosure relates to a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a substrate; a transistor, including a control terminal, a first terminal, and a second terminal; a first magnetic memory structure, a bottom electrode of which is electrically connected to the first terminal of the transistor; a second magnetic memory structure, a top electrode of which is electrically connected to the first terminal of the transistor, the bottom electrode of the first magnetic memory structure is located in a same layer with a bottom electrode of the second magnetic memory structure; a first bit line, electrically connected to a top electrode of the first magnetic memory structure; a second bit line, electrically connected to the bottom electrode of the second magnetic memory structure; and a selection line, electrically connected to a second terminal of the transistor.

Abstract: Disclosed is a magnetic memory device including a pinned magnetic pattern and a free magnetic pattern that are sequentially stacked on a substrate, a tunnel barrier pattern between the pinned magnetic pattern and the free magnetic pattern, a top electrode on the free magnetic pattern, and a capping pattern between the free magnetic pattern and the top electrode. The capping pattern includes a lower capping pattern, an upper capping pattern between the lower capping pattern and the top electrode, a first non-magnetic pattern between the lower capping pattern and the upper capping pattern, and a second non-magnetic pattern between the first non-magnetic pattern and the upper capping pattern. Each of the lower capping pattern and the upper capping pattern includes a non-magnetic metal. The first non-magnetic pattern and the second non-magnetic pattern include different metals from each other.

Abstract: A magnetic tunnel junction is provided. The magnetic tunnel junction comprises an insulating tunnel barrier and a fixed ferromagnet layer adjacent the tunnel barrier. The fixed ferromagnet comprises a fixed magnetization along an easy axis approximately normal to an interface between the fixed ferromagnet and the tunnel barrier. A free ferromagnet layer is adjacent the tunnel barrier on the side opposite the fixed ferromagnet. The free ferromagnet layer comprises a bistable magnetization along the easy axis that can switch between a parallel state and an anti-parallel state with the fixed ferromagnet. A heavy metal layer is adjacent the free ferromagnet on the side opposite the tunnel barrier. A unidirectional electric current pulse through the heavy metal layer switches the bistable magnetization of the free ferromagnet, thereby switching an electrical resistance state of the magnetic tunnel junction.

Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.

Abstract: Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a semiconductor structure. The semiconductor structure may include an embedded magnetic random access memory (MRAM) array electrically connected between a bottom metal level and a top metal level. The MRAM array may include a first tier with first MRAM cells and first vias above the first MRAM cells, and a second tier with second MRAM cells and second vias below the second MRAM cells.

Abstract: A circuit includes an operational amplifier including an inverting input terminal capacitively coupled to each of an OTP cell array and an NVM cell array and first and second output terminals, an ADC coupled to the first and second output terminals, thereby configured to receive a differential output voltage from the operational amplifier, and a comparator coupled to the ADC and configured to output a data bit responsive to a digital output signal received from the ADC. The circuit is configured to cause the operational amplifier to generate the differential output voltage based on each of a current received from an OTP cell of the OTP cell array and a voltage received from an NVM cell of the NVM cell array.

Abstract: A first memory cell includes a first variable resistance element and a first switching element. A control circuit is configured to execute first detection of detecting a first value of a first physical quantity related to the first memory cell, execute first write for storing first data in the first memory cell, execute second detection of detecting a second value of the first physical quantity related to the first memory cell following the first write, and read second data related to the first memory cell based on the first value and the second value. At least one of the first value and the second value is a value during a change in the first physical quantity related to the first memory cell.

Abstract: Magnetic memory devices are provided. The devices comprise a first ferromagnetic layer, a second ferromagnetic layer, and a tunnel barrier layer composed of a doped semiconductor (instead of an insulator or a dielectric) between the first and second ferromagnetic layers and forming at least one ferromagnetic-doped semiconductor interface.

Abstract: The present disclosure provides a storage unit, a data writing method and a data reading method thereof, a memory and an electronic device. The storage unit includes a semiconductor substrate, a first insulating medium layer, a ferroelectric thin film layer, a bottom electrode, a tunnel junction, a first metal interconnection portion, a second metal interconnection portion, a third metal interconnection portion and a fourth metal interconnection portion. The first insulating medium layer is formed on the semiconductor substrate, the ferroelectric thin film layer is disposed on the first insulating medium layer, the bottom electrode is formed on the ferroelectric thin film layer, and the tunnel junction is formed on the bottom electrode. The first metal interconnection portion is connected to a first end of the bottom electrode, and the third metal interconnection portion is connected to a second end of the bottom electrode.

Abstract: A MLU-based magnetic device including a plurality of MLU-based magnetic cells, each MLU cell including a first ferromagnetic layer having a first magnetization, a second ferromagnetic layer having a second magnetization, and a spacing layer between the first and second ferromagnetic layers. An input device is configured for generating an input signal adapted for changing the orientation of the first magnetization relative to the second magnetization and vary a resistance of the MLU device. A bit line is configured for passing a sense signal adapted for measuring the resistance. A processing unit is configured for computing an electrical variation from the sense signal and outputting an electrical variation signature. The present disclosure further pertains to an authentication method for reading the MLU device.

Abstract: The present invention relates to a kind of magnetic heterojunction structure and the method of controlling and achieving spin logic and multiple-state storage functions. The said single magnetic heterojunction structure comprises the substrate, in-plane anti-ferromagnetic layer, in-plane ferromagnetic layer, nonmagnetic layer, vertical ferromagnetic layer, and vertical anti-ferromagnetic layer respectively from the bottom up; the said in-plane ferromagnetic layer and the said vertical ferromagnetic layer are coupled together through the said nonmagnetic layer in the middle; in-plane exchange biases, namely exchange biases in the plane, exist between the said in-plane ferromagnetic layer and the said in-plane anti-ferromagnetic layer, and out-of-plane exchange biases, namely exchange biases out of the plane, exist between the said vertical ferromagnetic layer and the said vertical anti-ferromagnetic layer.

Abstract: A memory cell array includes a first and a second column of memory cells, a first and a second bit line, a source line and a first set of vias. The first or second bit line includes a first conductive line located on a first metal layer, and a second conductive line located on a second metal layer. The first and second conductive lines overlap a source of a transistor of a memory cell of the first column or second column of memory cells. The source line is coupled to the first and second column of memory cells. The first set of vias is electrically coupled to the first and second conductive line. A pair of vias of the first set of vias is located above where the first conductive line overlaps each memory cell of the first or second column of memory cells.

Abstract: Provided are a laser diode driver for a multilevel optical signal and a multilevel optical signal transmission device including the same, wherein the laser diode driver includes: a clock generator configured to generate and output a clock signal; a first latch configured to delay output of data corresponding to a first timing of the clock signal from among data sequentially input at each data input period; a second latch configured to delay output of data corresponding to a second timing of the clock signal from among data sequentially input at each data input period; a first synchronization processor configured to output a signal corresponding to the data input by the first latch according to the clock signal; and a second synchronization processor configured to output a signal corresponding to the data input by the second latch according to the clock signal.

Abstract: A novel storage device is provided. The storage device includes a first wiring, a second wiring, and a first memory cell. The first memory cell includes a first transistor and a first magnetic tunnel junction device. One of a source or a drain of the first transistor is electrically connected to a first wiring. The other of the source or the drain of the first transistor is electrically connected to one terminal of the first magnetic tunnel junction device. Another terminal of the first magnetic tunnel junction device is electrically connected to the second wiring. The first transistor includes an oxide semiconductor in its channel formation region.

Abstract: Methods, systems, and devices for thin film transistor deck selection in a memory device are described. A memory device may include memory arrays arranged in a stack of decks formed over a substrate, and deck selection components distributed among the layers to leverage common substrate-based circuitry. For example, each memory array of the stack may include a set of digit lines of a corresponding deck, and deck selection circuitry operable to couple the set of digit lines with a column decoder that is shared among multiple decks. To access memory cells of a selected memory array on one deck, the deck selection circuitry corresponding to the memory array may each be activated, while the deck selection circuitry corresponding to a non-selected memory array on another deck may be deactivated. The deck selection circuitry, such as transistors, may leverage thin-film manufacturing techniques, such as various techniques for forming vertical transistors.

Abstract: A storage device includes a first interconnection, a second interconnection, a memory cell connected between the first and second interconnections and including a variable resistance element and a switching element that is connected in series to the variable resistance element, and a control circuit configured to exercise control of a read operation to read data stored in the memory cell. The control circuit exercises control in such a manner as to set the first interconnection which has been charged with a first voltage and the second interconnection which has been charged with a second voltage into floating states, to set the switching element into an on-state by discharging the second interconnection set into the floating state to thereby increase a voltage applied to the memory cell, and to read the data stored in the memory cell in a state in which the switching element is set into the on-state.

Abstract: Described apparatuses and methods provide automated error correction with memory refresh. Memory devices can include error correction code (ECC) technology to detect or correct one or more bit-errors in data. Dynamic random-access memory (DRAM), including low-power double data rate (LPPDR) synchronous DRAM (SDRAM), performs refresh operations to maintain data stored in a memory array. A refresh operation can be a self-refresh operation or an auto-refresh operation. Described implementations can combine ECC technology with refresh operations to determine a data error with data that is being refreshed or to correct erroneous data that is being refreshed. In an example, data for a read operation is checked for errors. If an error is detected, a corresponding address can be stored. Responsive to the corresponding address being refreshed, corrected data is stored at the corresponding address in conjunction with the refresh operation. Alternatively, data being refreshed can be checked for an error.

Abstract: Provided are a device comprising a bit cell tile including at least two memory cells, each of the at least two memory cells including a resistive memory element, and methods of operating an array of the memory cells, each memory cell including a resistive memory element electrically coupled in series to a corresponding first transistor and to a corresponding second transistor, the first transistor including a first gate coupled to a corresponding one of a plurality of first word lines and the second transistor including a second gate coupled to a corresponding one of a plurality of second word lines, each memory cell coupled between a corresponding one of a plurality of bit lines and a corresponding one of a plurality of source lines. The methods may include applying voltages to the first word line, second word line, source line, and bit line of a memory cell selected for an operation, and resetting the resistive memory element of the memory cell in response to setting the selected bit line to ground.

Abstract: This spin element includes: a current-carrying part that extends in a first direction; and an element part that is laminated on one surface of the current-carrying part, wherein the current-carrying part includes a first wiring and a second wiring in order from a side of the element part, and wherein both of the first wiring and the second wiring are metals and temperature dependence of resistivity of the first wiring is larger than temperature dependence of resistivity of the second wiring in at least a temperature range of ?40° C. to 100° C.

Abstract: In some embodiments, the present disclosure relates to a memory device that includes a spin orbit torque (SOT) layer arranged over a substrate. A magnetic tunnel junction (MTJ) structure may be arranged over the SOT layer. The MTJ structure includes a free layer, a reference layer, and a diffusion barrier layer disposed between the free layer and the reference layer. A first conductive wire is arranged below the SOT layer and coupled to the SOT layer. A second conductive wire is arranged below the SOT layer and coupled to the SOT layer. A third conductive wire is arranged over the MTJ structure. The memory device further includes a first selector structure arranged between the first conductive wire and the SOT layer.

Abstract: A sense amplifier includes an amplification module and a control module electrically connected to the amplification module. Herein, in a case of reading a data in a memory cell on a first bit line, at an offset compensation stage of the sense amplifier, the control module is arranged to configure the amplification module to include a first diode structure, a first current mirror structure, and a first inverter with an input terminal and an output terminal connected to each other. In a case of reading a data in a memory cell on a second bit line, at the offset compensation stage of the sense amplifier, the control module is arranged to configure the amplification module to include a second diode structure, a second current mirror structure, and a second inverter with an input terminal and an output terminal connected to each other.

Abstract: A neuromorphic device including an electrode including a first terminal connected to a bit line through a write drive transistor and a second terminal connected to a source line, a plurality of unit weighting elements having different resistance values, each of the unit weighting elements including a free layer arranged on the top of the electrode, a tunnel barrier layer arranged on the top of the free layer, and a fixed layer arranged on the top of the tunnel barrier layer, and corresponding to each bit of a synapse weight, and a plurality of control electrodes connected to the bit line through a plurality of read drive transistors, respectively, a control voltage being applied between the free layer and the fixed layer of each of the plurality of unit weighting elements through each of the plurality of control electrodes.

Abstract: A memory and a read and write method of memory can prevent the magnetic random-access memory (MRAM) from being easily damaged or degraded by excessive write current during use, and increase memory integration density. The memory includes: a storage unit, comprising a storage element; a source line, electrically connected to a first end of the storage element; the memory is configured to change a storage state of the storage element by a first current and a second current, the first current flowing through the storage element and the second current flowing through the source line without flowing through the storage element.

Abstract: A semiconductor device includes a sense amplifier, a first magnetic tunneling junction (MTJ) connected to the sense amplifier at a first distance, a second MTJ connected to the sense amplifier at a second distance, and a third MTJ connected to the sense amplifier at a third distance. Preferably, the first distance is less than the second distance, the second distance is less than the third distance, a critical dimension of the first MTJ is less than a critical dimension of the second MTJ, and the critical dimension of the second MTJ is less than a critical dimension of the third MTJ.

Abstract: A data storage system can employ a read destructive memory configured with multiple levels. A non-volatile memory unit can be programmed with a first logical state in response to a first write voltage of a first hysteresis loop by a write controller prior to being programmed to a second logical state in response to a second write voltage of the first hysteresis loop, as directed by the write controller. The first and second logical states may be present concurrently in the non-volatile memory unit and subsequently read concurrently as the first logical state and the second logical state.

Abstract: According to one embodiment, a magnetic head includes first and second magnetic poles, a stacked body, and first to third terminals. The stacked body is provided between the first and second magnetic poles. The stacked body includes a first magnetic layer, a second magnetic layer between the first magnetic layer and the second magnetic pole, a third magnetic layer between the second magnetic layer and the second magnetic pole, a fourth magnetic layer between the third magnetic layer and the second magnetic pole, a first nonmagnetic layer between the first magnetic pole and the first magnetic layer, a second nonmagnetic layer between the first and second magnetic layers, a third nonmagnetic layer between the second and third magnetic layers, a fourth nonmagnetic layer between the third and fourth magnetic layers and a fifth nonmagnetic layer between the fourth magnetic layer and the second magnetic pole.

Abstract: A magnetic memory of the present embodiment includes an electrode extending along a plane including a first direction and a second direction, a first wiring extending in the first direction, second wirings between the electrode and the first wiring, extending in the second direction and arranged in the first direction, first magnetic members each including a first part electrically connected to the first wiring and a second part electrically connected to the electrode, extending in a third direction, and being positioned between neighboring two of the second wirings when seen from the third direction, and a control circuit. When writing first information to one first magnetic member, the control circuit supplies first current to at least two second wirings positioned on one side of the one first magnetic member in the first direction.

Abstract: A magnetic memory device includes a first magnetic memory device, a second magnetic memory device, a pulse power supplying current pulses to the first and second magnetic memory devices; and a switch configured to selectively connect the pulse power to one of the first and second magnetic memory devices. A resistance value of an MTJ device composed of the first fixed layer, the first non-magnetic layer, and the free layer is different from a resistance value of a MTJ device composed of the second fixed layer, the second non-magnetic layer, and the free layer.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: The present invention is directed to a nonvolatile memory device that includes one or more memory sectors and a read circuit for sensing the resistance state of a magnetic memory cell in the memory sectors. The read circuit includes first and second input nodes; a sense amplifier having first and second input terminals; a reference resistor connected to the first input node at one end and the first input terminal at the other end; a multiplexer having a first input, a second input, and an output, with the first input being connected to the second input node and the output being connected to the second input terminal; a first target resistor and an offset resistor connected in series between the second input node and the second input; and first and second current sources connected to the first and second input terminals, respectively.

Abstract: A data processing method, a data processing circuit, and a computing apparatus are provided. In the method, data is obtained. A first value of a bit of the data is switched into a second value according to data distribution and an accessing property of memory. The second value of the bit is stored in the memory in response to switching the bit.

Abstract: A memory device includes a field effect transistor and a variable-capacitance capacitor. A gate structure includes a gate dielectric and an intermediate electrode. The variable-capacitance capacitor includes a lower capacitor plate comprising the intermediate electrode, an upper capacitor plate comprising a control gate electrode, and a variable-capacitance node dielectric and including an electrical-field-programmable metal oxide material. The electrical-field-programmable metal oxide material provides a variable effective dielectric constant, and a data bit may be stored as a dielectric state of the variable-capacitance node dielectric in the memory device. The variable-capacitance node dielectric provides reversible electrical field-dependent resistivity modulation, or reversible electrical field-dependent movement of metal atoms therein.

Abstract: A first conductive layer is patterned and trimmed to form a sub 30 nm conductive via on a first bottom electrode. The conductive via is encapsulated with a first dielectric layer and planarized to expose a top surface of the conductive via. A second conductive layer is deposited over the first dielectric layer and the conductive via. The second conductive layer is patterned to form a sub 60 nm second conductive layer wherein the conductive via and second conductive layer together form a T-shaped second bottom electrode. MTJ stacks are deposited on the T-shaped second bottom electrode and on the first bottom electrode wherein the MTJ stacks are discontinuous. A second dielectric layer is deposited over the MTJ stacks and planarized to expose a top surface of the MTJ stack on the T-shaped second bottom electrode. A top electrode contacts the MTJ stack on the T-shaped second bottom electrode plug.

Abstract: A sense amplifier reference is generated with the same memory cell columns as data cells in order to match signal paths between the data and reference signals. Each row of data memory cells may have a corresponding set of reference cells, which greatly reduces the number of data cells supported by a reference, and in turn reduces the impact of process variations. A memory array may include data columns, a first reference column in the memory array configured to provide a logic 0 reference signal, and a second reference column in the memory array configured to provide a logic 1 reference signal. A circuit is configured to combine at least the logic 0 reference signal and the logic 1 reference signal to generate a reference signal for a sense amplifier to identify the data signal provided from the data columns.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor memory device includes a substrate having a first interlayer dielectric layer thereon; a lower metal interconnect layer in the first interlayer dielectric layer; a conductive via disposed on the lower metal interconnect layer; a bottom electrode disposed on the conductive via; a dielectric data storage layer having variable resistance disposed on the bottom electrode; a top electrode disposed on the dielectric data storage layer; and a protective layer covering sidewalls of the top electrode, the dielectric data storage layer, and the bottom electrode. The protective layer includes an annular, upwardly protruding portion around a perimeter of the top electrode.

Abstract: Methods, systems, and devices related to counter-based sense amplifier method for memory cells are described. The counter-based read algorithm may comprise the following phases: storing in a counter associated to an array of memory cells the value of the number of bits having a predetermined logic value of the data bits stored in the memory array; reading from said counter the value corresponding to the number of bits having the predetermined logic value; reading the data stored in the array of memory cells by applying a ramp of biasing voltages; counting the number of bits having the predetermined logic value during the data reading phase; stopping the data reading phase when the number of bits having the predetermined logic value is equal to the value stored in said counter.

Abstract: Apparatuses and methods for removing a defective energy storage cell from an energy storage array is described. An apparatus includes an energy storage array including a plurality of energy storage cells, and a cell removal circuit coupled to the energy storage array. The cell removal circuit is configured to prevent a defective energy storage cell of the plurality of energy storage cells from causing other energy storage cells of the plurality of energy storage cells to become defective. A method includes receiving power at a charging node of an energy storage array, the energy storage array including a plurality of energy storage cells. Responsive to failure of an energy storage cell of the plurality of energy storage cells, current is provided through the defective energy storage cell, and responsive to the defective energy storage cell becoming an open circuit, discontinuing provision of the current through the defective energy storage cell.

Abstract: A method of correcting bias temperature instability in memory arrays may include applying a first bias to a memory cell, where the memory cell may include a memory element and a select element, and the first bias may causes a value to be stored in the memory element. The first bias causes a bias temperature instability (BTI) associated with the memory cell to increase. The method may also include applying a second bias to the memory cell, where the second bias may have a polarity that is opposite of the first bias, and the value stored in the memory element remains in the memory element after the second bias is applied. The second bias may also cause the BTI associated with the memory cell to decrease while maintaining any value stored in the memory cell.