Abstract: Semiconductor memory devices are provided. Each of the semiconductor memory devices may include first and second memory cells. The first memory cell may be connected to a bit line and a complementary bit line. Moreover, each of the semiconductor memory devices may include a discharge circuit connected to the first memory cell via the bit line and the complementary bit line. The discharge circuit may be configured to discharge the first memory cell during a read or write operation of the second memory cell.

Abstract: An integrated circuit device (20, 60) includes a plurality of memory cells (22), which are configured to store data. Multiple P-N junctions (24) are arranged so that a single, respective P-N junction is disposed in proximity to each memory cell and is configured to emit optical radiation during readout from the memory cell with a wavelength matching an emission wavelength of the memory cell.

Abstract: An integrated circuit (IC) includes a memory circuit. The memory circuit includes a plurality of thyristors. The plurality of thyristors are coupled in tandem.

Abstract: A switching device and methods of making and operating the same are provided. In one aspect, a method of operating a switching device is provided that includes providing a MOS transistor that has a gate, a source region, a drain region and a body region. A bipolar transistor is provided that has a collector, a base and an emitter. The body region of the MOS transistor serves as the base of the bipolar transistor and the drain region of the MOS transistor serves as the collector of the bipolar transistor. Activation of the MOS transistor causes the bipolar transistor to turn on. The MOS transistor is activated to turn on the bipolar transistor and the bipolar transistor delivers current to the source region.

Abstract: A bipolar junction transistor may act as a select device for a semiconductor memory. The bipolar junction transistor may be formed of a stack of base and collector layers. Sets of parallel trenches are formed in a first direction down to the base and in a second direction down to the collector. The trenches may be used to form local enhancement implants into the exposed portion of the base and collector in each trench. As a result of the local enhancement implants, in some embodiments, leakage current may be reduced, active current capability may be higher, gain may be higher, base resistance may be reduced, breakdown voltage may be increased, and parasitic effects with adjacent junctions may be reduced.

Abstract: A content addressable memory includes a first plurality of search lines, a second plurality of search lines, a first match line, and a storage location. Each search line of the first plurality of search lines receives a corresponding high voltage level or low voltage level during a match detect operation, and each search line of the second plurality of search lines to receive a corresponding high voltage level or low voltage level during the match detect operation. The storage location of the content addressable memory includes a plurality of CAM cells, each CAM cell a first thyristor and second thyristor.

Abstract: A switching device and methods of making and operating the same are provided. In one aspect, a method of operating a switching device is provided that includes providing a MOS transistor that has a gate, a source region, a drain region and a body region. A bipolar transistor is provided that has a collector, a base and an emitter. The body region of the MOS transistor serves as the base of the bipolar transistor and the drain region of the MOS transistor serves as the collector of the bipolar transistor. Activation of the MOS transistor causes the bipolar transistor to turn on. The MOS transistor is activated to turn on the bipolar transistor and the bipolar transistor delivers current to the source region.

Abstract: A circuit for generating a reference voltage in a memory device includes a switching section, a first voltage generator, a second voltage generator and a comparator. The switching section controls a supply of a power supply voltage in response to a control signal. The first voltage generator generates a reference voltage and a first voltage by dividing the power supply voltage provided through the switching section, and has a negative temperature coefficient characteristic. The second voltage generator generates the reference voltage and a second voltage having a positive temperature coefficient characteristic. The comparator compares the first voltage with the second voltage, and controls the switching section in accordance with the comparison result.

Abstract: A technique of sampling, sensing, reading and/or determining the data state of a memory cell (of, for example, a memory cell array) including an electrically floating body transistor. In this regard, the intrinsic bipolar transistor current component is employed to read and/or determine the data state of the electrically floating body memory cell. During the read operation, the data state is determined primarily by or read (or sensed) substantially using the bipolar current component responsive to the read control signals and significantly less by the interface channel current component, which is negligible relative to the bipolar component. The bipolar transistor current component may be very sensitive to the floating body potential due to the high gain of the intrinsic bipolar transistor of the electrically floating body transistor.

Abstract: An MRAM having improved integration density and ability to use a magnetic tunneling junction (MTJ) layer having a low MR ratio, and methods for manufacturing and driving the same, are disclosed. The MRAM includes a semiconductor substrate having a bipolar junction transistor (BJT) formed thereon, a bit line coupled to an emitter of the BJT, an MTJ layer coupled to the BJT, a word line coupled to the MTJ layer, a plate line coupled to the BJT so as to be spaced apart from the MTJ layer, and an interlayer dielectric formed between components of the MRAM, wherein the MTJ layer is coupled to a base and a collector of the BJT, the plate line is coupled to the collector, and an amplifying unit for amplifying a signal while data is read out from the MTJ layer is coupled to the bit line, thereby allowing precise reading of the data.

Abstract: Device and method for memory cell isolation. The memory cell includes a resistive component, such as a magnetic random access memory (MRAM) cell, and an isolation component, such as a four-layer diode. The memory cell may be included in a memory array. The method includes rapidly applying a forward bias across the isolation element to activate the isolation element.

Abstract: Device and method for memory cell isolation. The memory cell includes a resistive component, such as a magnetic random access memory (MRAM) cell, and an isolation component, such as a four-layer diode. The memory cell may be included in a memory array. The method includes rapidly applying a forward bias across the isolation element to activate the isolation element.

Abstract: Microelectromechanical (MEMS) devices that use MEMS electromagnetic actuators to selectively generate displacement forces are disclosed herein. According to one exemplary embodiment disclosed herein, a MEMS device may include a substrate having a surface, an actuable element at least partially formed from the substrate, and an electromagnetic actuator disposed on the substrate for selectively applying a first force to the actuable element to displace the actuable element along a path. The actuable element may have a base and an arm coupled to the base. The base may include a portion comprised of a magnetic material. The electromagnetic actuator may comprise an electrically conductive coil, and the path of the actuable element may pass through a coil gap in the coil. The electromagnetic actuator may also comprise a magnetic core about which the electrically conductive coil may be wound.

Abstract: A reference voltage generation circuit is provided which includes a p-channel type MOSFET used as an input transistor to allow a sufficient current to flow through a differential amplifier even if the threshold voltages of MOSFETs used in the differential amplifier significantly increase. A push-pull conversion circuit is coupled to the differential amplifier and has a double end configuration to provide a sufficiently high level to drive a p-channel output buffer. This arrangement allows a stable operation at a sufficiently low power supply voltage even if the threshold voltages of the MOSFETs forming the differential amplifier are high. It also allows quick activation when the power is turned on and provides high stability.

Abstract: A semiconductor device includes a bipolar transistor whose emitter-collector voltage is set to satisfy a condition IBE<ICB according to a voltage applied across a base and emitter where IBE is the base current flowing through a base-emitter path in a forward direction, and ICB is the base current flowing through a collector-base path in a reverse direction.

Abstract: Memory cells which are adjacent to each other along a column direction share a bipolar transistor driving the potential level of a corresponding bit line. Other memory cells which are adjacent to each other in the column direction share another bipolar transistor driving the potential level of another corresponding bit line. Each bipolar transistor drives the potential level of the corresponding bit line in response to storage information of a selected memory cell, whereby data can be read at a high speed with a low power supply voltage.

Abstract: A memory system is organized as a matrix including a memory cell at each intersection of a bit line with write and read word lines Each memory cell comprises a first FET 20 having its gate coupled to a write word line and its drain coupled to a bit line, a second FET 22 having its source coupled to the bit line and its drain coupled to a read word line, and first and second negative resistance devices 24,26 coupled in series between a supply voltage and a substrate voltage, the common point SN of the series-connected negative resistance devices being coupled to the source of the first PET and to the gate of the second FET. Preferably, the first FET 20 is a p-channel device, the second FET 22 is an n-channel device, and the first and second negative resistance devices 24,26 are RTDs. In a second embodiment, a memory system has a memory cell at each intersection of a bit line with a word line.

Abstract: A semiconductor memory has bit lines, word lines, ground lines, and memory cells. The bit lines intersect the word and ground lines, to form intersections where the memory cells are arranged, respectively. Each of the memory cells consists of a double-emitter resonance-tunnel-hot-electron transistor. This transistor has a collector, a first emitter, and a second emitter. Each base-emitter junction of the transistor has an N-shaped negative differential current-voltage characteristic that shows a relatively small gain up to a peak current and a relatively large gain after a valley current. The transistor has a resonance tunnel barrier and a collector barrier so that most of electrons injected from a first level are reflected by the collector barrier, to provide no collector current, and electrons from a second level or electrons thermally excited pass over the collector barrier, to provide a collector current. The first emitter of each transistor is connected to a corresponding one of the ground lines.

Abstract: A logic circuit is provided for a memory device which can be operated at a high speed with a lower voltage power source level than conventional devices. This logic circuit can be used in a multi-bit test circuit executing the wired-OR-logic operation of complementary logic signals from a plurality of pre-sense amplifiers, receiving the output of the wired-OR-logic operation by an emitter follower using a bipolar transistor, and outputting an AND signal of the complementary logic signals by a level comparing circuit. A sense amplifier is also provided for executing the wired-OR-logic operation of complementary logic signals from a plurality of pre-sense amplifiers, raising the level of the output of the wired-OR-logic operation by a level shift circuit having a semiconductor element for applying an inverse bias potential to an input signal, executing the wired-OR-operation of the shifted up output and outputs from other blocks, and receiving and amplifying the output of the wired-OR-logic operation.

Abstract: A memory cell structure with the reduced number of bit line contacts, contributing to high integration and high reliability of a DRAM is provided. Each of memory cells (M1, M2, M3, M4) of the DRAM includes a field effect transistor and a capacitor (I, II, III, IV) connected thereto. The field effect transistor constituting each of the memory cells has a combination of two gates: a transfer gate (A) of a low Vth and a sub-transfer gate (a) of a high Vth, a transfer gate (B) of a high Vth and a sub-transfer gate (b) of a low Vth, a transfer gate (C) of a high Vth and a sub-transfer gate (c) of a low Vth, and a transfer gate (D) of a low Vth and a sub-transfer gate (d) of a high Vth. The four memory cells share a bit line contact.

Abstract: A memory device comprises a row address signal line Ax, a pair of column address signal lines Ay1, Ay2, a standby signal line Sb, a memory cell provided at an area where the row address signal line Ax intersects with the column address signal lines Ay1, Ay2, and a row address signal line driver BD provided on one end of the row address signal line. The row address signal line driver BD comprises a driver transistor BDTr of a double-emitter type, driver transistor BDTr including one collector electrode CBD, and two emitter electrodes of different areas and exhibiting negative differential characteristics. The smaller-area emitter electrode EBD1 is grounded, and the collector electrode CBD is connected to the row address signal line Ax.

Abstract: In a static random access memory device where thin film transistors are used memory cell loads, first and second semiconductor layers having source regions, channel regions and drain regions of the thin film transistors partly oppose first and second conductive layers serving as gate electrodes thereof. A third conductive layer for receiving a definite potential opposes at least the channel regions of the first and second semiconductor layers.

Abstract: A semiconductor memory device equipped with a flash-clear function has a plurality of flip-flop type memory cells each of which is formed by a first multi-emitter transistor and a second multi-emitter transistor, a clear line and a switching circuit. Each of the memory cells is connected between a word top line and a word bottom line. The second multi-emitter transistor has emitter nodes the number of which is smaller than that of emitter nodes of the first multi-emitter transistor. Some of the emitter nodes of the first multi-emitter transistor are connected to the clear line. Through the switching circuit, a current source is selectively connected to the word bottom line and the clear line. Since the first multi-emitter transistor is controlled by the clear line, the content of the same data can easily be written into a plurality of memory cells without such memory cells being caused to change their characteristics.

Abstract: A semiconductor memory device comprises a memory cell transistor that includes two active parts each including therein an emitter and a base and showing a negative differential resistance. The collector layer is shared commonly by the two active parts and is connected to a bit line, while the emitters forming the two active parts are connected to respective word lines that form a word line pair. The bit line and the word lines forming the word line pair are biased to realize a bistable operational state in the memory cell transistor to hold the information.

Abstract: An SCR type memory apparatus which is short in access time, easy in setting current values upon reading and writing and easy in constructing a peripheral circuit with less power supply voltage limitation is described. The semiconductor memory apparatus comprises of a basic cell circuit which includes an SCR type memory cell. The SCR type memory cell includes a pair of pnp transistors and a pair of double emitter transistors. The basic cell circuit also includes a pair of write npn transistors. The collector of each write npn transistor is connected to a voltage holding node of the SCR type memory cell and the base is connected to a word selecting line.

Abstract: A bipolar memory array and memory cell. The memory cell has a pair of cross coupled NPN storage transistors and a pair of PNP load transistors. The collector of each of the load transistors is connected to one of the storage transistors. A base, common to both load transistors, are connected to a drain line. The word line is connected to an emitter common to both of the load transistors. The cell is connected to a bit line pair through Schottky Barrier Diodes (SBD's) or, alternatively, through emitters of transistors which share a common base and a common collector with the cross coupled storage transistors.

Abstract: A semiconductor integrated circuit device including a level conversion circuit in which the simplifying of the circuit and the increasing of the speed of operation have been attained is provided.A pair of complementary output signals amplified to a required signal level by a current switch circuit including differential transistors which receive an input signal and a reference voltage are inputted into a pair of emitter follower circuits. An emitter follower output transistor is driven by an output signal from one emitter follower circuit, while an N-channel MOSFET provided between the output transistor and a current source used as a load is driven by an output signal from the other emitter follower circuit, to obtain a level-amplified output signal from an emitter of the output transistor.

Abstract: A cache memory apparatus made up of a memory cell array (300) and a match detection circuit is disclosed. The match detection circuit produces a detection signal related to whether a search data coincides with a data read out of the memory cell array (300). The match detection circuit applies complementary signals (d, d) of the data read from the memory cell array (300) to the bases of bipolar differential transistors (10, 11), the gates of a pair of field effect transistors (16, 17) are supplied with complementary signals (a, a) of the search data, and the bases of a pair of emitter-follower transistors (12, 13) are connected to the collectors of the bipolar differential transistors (10, 11), thereby producing a detection signal (HITO) from the jointly-connected emitters thereof.

Abstract: Disclosed is a bipolar SRAM including, in each memory cell, two NPN multiemitter transistors, with a base of one transistor being cross-connected to a collector of the other transistor. The respective collectors of these two multiemitter transistors in an arbitrary memory cell are connected to the same positive word line through a load. The first emitter of one of these two multiemitter transistors and the first emitter of the other transistor are connected to the same negative word line. Only when the positive word line corresponding to this negative word line is not selected, a data holding current flows to the negative word line from the first emitter of the transistor having a H level collector potential out of these two multiemitter transistors, and when the corresponding positive word line is selected, the negative word line is controlled not to allow the data holding current to flow.

Abstract: A bit line discharge and sense circuit is provided for use with a static RAM that includes a row and column array of memory cells addressable via first and second bit lines and also a row select line. Each memory cell includes a transistor pair, wherein the first and second bit lines are coupled to an emitter of a first and second transistor comprising the transistor pair. The invention couples two current sources via the associated bit lines to the emitter of each transistor in the cell. A first current source is coupled when the cell is selected and provides a first current value having a bit line capacitance discharge current component and a first transistor read current component. A second current source is coupled to the same emitter when the cell is selected, and provides a lower current value. The first current source rapidly discharges capacitance associated with the associated bit line on the selected cell.

Abstract: A multi-port memory cell utilizes a storage cell to define complementary data storage nodes. Each read port of the memory cell includes two FETs respectively coupled between one of a pair of complementary data-out lines and a read enable line to isolate the read ports. Each of the gates of the two read port FETs is connected to one of the corresponding data storage nodes. The storage cell is read by pulling current from the read enable line and monitoring the difference between the complementary data-out lines.

Abstract: A memory system (10) is disclosed including a memory array (14), decoder circuit (16), and sensing circuit (17). The memory array includes a plurality of two-port CMOS memory cells (42) arranged in columns and rows that are selectively addressed by the decoder circuit. The bipolar sensing circuit responds to data stored in an addressed memory cell in the following manner. A column decoder (28) in the decoder circuit provides information to a source select multiplexer (30) and a column read access port (18) to selectively couple information stored in the memory cell to an output stage (20). At the output stage a comparison is made between the stored data and a reference voltage provided by a threshold circuit (38) to produce an output indicating the sensed level. The memory cells are preferably asymmetrically designed for hysteretic operation. The resultant bipolar/CMOS memory system advantageously combines the attributes of high density, high speed, and low power consumption.

Abstract: There is described a double stage sense amplifier (4) in bipolar technology achieving very high speed operation without saturation or connection problems. For each memory cell column of the computer member system (1), a first stage or column sense stage (4.1) amplifies the differential input signal (V) produced on the pair of bit lines (BLL, BLR) according to the information read from one CMOS memory cell of the memory cell array (3.1) to provide a first differential output signal (V1) available at output terminals (10.1, 10.2). The output terminals of all the first stage (4.1 to 4.n) are connected to a first-data out bus comprised of the data lines (DLC1, DLT1). A second stage or final stage (4') amplifies the first differential output signal developed on the data lines to provide a second differential output signal (V2) at output terminals (17.1, 17.2). The second stage of the common base amplifier type is comprised of two transistors (T9, T10).

Abstract: This invention relates generally to the static, random access, semiconductor memory arrays which incorporate split-emitter memory cells. The latter are accessed during a read cycle of a selected memory cell by precharging all the bit lines of unselected memory cells associated with the word line of the selected cell. This is accomplished by switchably connecting a voltage source to all the unselected bit lines which charges their bit line capacitances. Then, when read current sources are switchably connected to both the selected and unselected memory cells and the associated word line is switched to a WORD SELECT source, the read current associated with the unselected bit lines flows via charging switches to the precharge voltage sources and the read current associated with the selected bit lines along with dynamic current from uncharged selected bit line capacitances flows into the selected cell.

Abstract: A bipolar memory array arranged in a row and column matrix is responsive to a plurality of word line driver transistors for selecting one row of memory cells thereof. The current flowing through each memory cell is provided by a pair or lateral PNP transistor current source loads. The collectors of the word line driver transistors are commonly connected for distributing the source of collector current flowing therethrough between the bases of all of the laterla PNP transistor current sources of the entire memory array which maintains a constant current flow through each of the memory cells during the select and deselect cycles thereby maintaining a constant memory cell array power dissipation which allows for expanded capacity of the memory array and a performance improvement.

Abstract: A bipolar random access memory comprises a plurality of memory cells arranged in row and column formation, a plurality of word lines provided in correspondence to respective rows of the memory cells, a plurality of bit lines provided in correspondence to respective columns of the memory cells, a row addressing part connected to each of the plurality of word lines, a column addressing part connected to each pair of the adjacent bit lines, a read/write controller supplied with a cell information to be written into an addressed memory cell and further with a read/write control signal indicating whether the random access memory is to be operated in a reading mode or in a writing mode and acting as a current source in the reading and writing modes, a first current control part provided in each column of the memory cells so as to be connected to one of the bit lines in a column selected by the column addressing part at the first side of each of the memory cells, a second current control part provided in each column

Abstract: An alpha radiation immune integrated circuit memory cell has a pair of secondary transistors connected to cross-couple the primary transistors to form a flow, secondary storage node. The secondary transistors are biased to a standby current that, in combination with the parasitic capacitances in the new cell, establishes a time constant sufficient to maintain the state of the secondary nodes during an alpha hit on the primary nodes, so that alpha immunity is achieved without added capacitance. A write boost circuit increases the current in the secondary transistors during a write operation. A memory array is formed of rows of such cells with all of the secondary emitters of each row coupled to a common emitter standby current source.

Abstract: There is implemented memory cells and corresponding signal lines associated therewith in bipolar type static random access memories employing wirings of multi-layer construction for transmitting a common signal therethrough such as with respect to the individual word lines. The word lines implemented are formed from at least a pair of stacked conductive layers and which layers have interposed therebetween an insulating film. The pair of layers form a pair of wiring lines wherein together they form a work line and wherein the wiring lines are, furthermore, interconnected at predetermined intervals along the lengths thereof. This leads to the ability to decrease the chip size of semiconductor integrated circuits noting that a decrease in the voltage drop of a signal line results, and to prevent electromigration in the signal (wiring) lines.

Abstract: A switched load diode cell has been developed wherein first and second multi-emitter NPN transistors are provided having bases cross coupled to the other's collectors in typical latch fashion as shown in FIG. 5. A PN diode is provided having an anode coupled to the select line through a load resistor and a cathode coupled to the collector of each associated multi-emitter transistor. A parasitic lateral PNP transistor associated with the PN diode is provided having an emitter coupled to the select line through the same load resistor and a collector connected to the base of the associated multi-emitter transistor. A relatively low resistance load of about 500.OMEGA. is connected between the common node which consists of the emitter of the parasitic lateral PNP transistor and the anode of the PN diode and the select line. In this way, a switched load diode cell is provided.

Abstract: A READ-WHILE-WRITE current-mode logic RAM cell suitable for use in a RAM device having the ability to simultaneously write and read data.The RAM cell contains a bit-cell consisting of flip-flop configured transistors differentially connected to a constant current source, a multiple-emitter transistor network tied to each bit-cell load resistor which prevents the bit-cell from saturating, separate READ and WRITE data lines, and READ and WRITE buffer transistors having READ and WRITE control lines.

Abstract: There is implemented memory cells and corresponding signal lines associated therewith in bipolar type static random access memories employing wirings of multi-layer construction for transmitting a common signal therethrough such as with respect to the individual word lines. The word lines implemented are formed from at least a pair of stacked conductive layers of a material whose principal component is aluminum and which layers have interposed therebetween an insulating film. The pair of layers form a pair of wiring lines corresponding together to a word line and wherein the wiring lines are, furthermore, interconnected at predetermined intervals along the lengths thereof. This leads to the ability to decrease the chip size of semiconductor integrated circuits noting that a decrease in the voltage drop of a signal line results, and to prevent electromigration in the signal (wiring) lines.

Abstract: A sense amplifier is provided for a bipolar random access memory that has memory cells arranged in a column and a pair of bit lines for said column of memory cells. A first bipolar transistor has its collector-emitter path coupled to one of the bit lines of a pair, and a base coupled through a diode means to the second bit line. A second bipolar transistor has its collector-emitter path coupled to the second bit line and its base coupled through a second diode to the first bit line. The collectors of both of the bipolar transistors are coupled to provide an output signal. Resistors are coupled to a pulse source and to both of the bases of the bipolar transistors. A current sink is coupled to both of the select bit lines. The diode means are connected so as to be forward biased when the base-emitter junction of the transistor to which the diode means is coupled is also forward biased.

Abstract: This invention relates generally to Static Random Access Memory (SRAM) cells and more particularly, relates to a SRAM cell wherein soft-error due to .alpha.-particle radiation is reduced by permitting the potential at the common-emitter node of the cross-coupled transistors of the memory cell to swing freely. Still more particularly, it relates to a SRAM cell wherein the common-emitter node of the cell is decoupled from a heavily capacitively loaded word line with its common constant current source by means of a constant current source or current mirror disposed in each cell between the common-emitter node and the word line.

Abstract: A bipolar random access memory having no write recovery time. During a data write operation, while the memory state of the memory cell is being shifted, a data bypass circuit sets a sense latch in the sense amplifier to store the new state to which the memory cell is being set. To prevent the sense latch from being shifted by transient write recovery currents charging bit line parasitic capacitances following the data write operation, a read/write transmission circuit isolates the sense amplifier from the bit lines, diverts current from the sense amplifier to a source of high voltage to charge the parasitic capacitances, and then realigns the sense amplifier to the bit lines.

Abstract: A hybrid ECL memory includes a hybrid memory array 36 which utilizes cross coupled CMOS latches (70). Each CMOS latch (70) is accessed by an ECL decoder (40) and an ECL Word Line driver (42) to read data therefrom. Data is accessed through a bipolar transistor (120) for output to an ECL sense amp. The column select operation is provided by an ECL decoder (50) to select both the Read and the Write operation. The Write operation is provided with emitter coupled logic by pulling up one of the storage nodes in the CMOS latch (70) with a low source impedance PNP transistor (122). Selection is provided by varying the Word Line between two voltages through a low source impedance transistor (78) with the voltages being ECL compatible.

Abstract: A transistor memory cell device comprising a pair of cross-coupled transistors constituting storage elements for storing binary information and having column drive emitter inputs to which a relatively high column drive current is applied for the selective read or write operation of storage elements of the cell device. A constant current source provides a relatively low value hold current to maintain the binary digit information stored in the storage elements in the absence of column drive current. A voltage clamping dual emitter transistor has the emitters thereof connected directly to the respective base-collector interconnections of the cross-coupled transistors, with the base of the clamping transistor having applied to it an offset voltage higher than a voltage applied to a non select line connected to the collector circuits of the cross-coupled transistors.

Abstract: A semiconductor memory device comprises an address line, a write line, a read line, and a memory cell connected to the address, write and read lines, where the memory cell comprises a power source, an RHET, a switching element and a data transfer element. The power source is coupled to a base of the RHET through a first resistor so that the RHET has a plurality of stable states. The switching element is coupled between the write line and the base of the RHET, and is controlled by a signal from the address line. The data transfer element is coupled between a collector of the RHET and the read line, and the collector is coupled to the power source through a second resistor. When reading an information from the memory cell, a signal corresponding to one of the plurality of stable states of the RHET is transmitted to the read line via the data transfer element.

Abstract: An integrated bipolar memory cell with random access, includes an upper word line, a lower word line, two bit lines, two transistors each having two emitters, a base and a collector fed back crosswise to the base of the other transistor, two Schottky diodes, two low-resistance load resistors each forming a series circuit with a respective one of the Schottky diodes, two high-resistance load resistors each forming a parallel circuit with a respective one of the series circuits, each of the parallel circuits being connected between a respective one of the collectors and the upper word line defining active regions of the memory cell, one of the emitters of each of the transistors being connected to the lower word line, the other of the emitters of each of the transistors being connected to a respective one of the bit lines, and an external capacitance connected between the collectors outside the active regions.

Abstract: Load resistors are connected in series between the PNP portions of the SCRs and the upper word-line. The load presented to the NPN portions of the SCRs is thus a composite formed of a PNP transistor in series with a resistor. The resistor causes a downward shift of voltage due to IR drop on the ON side of the cell and provides a dramatic improvement in writing speed. During a write operation, the IR drop across the resistor on the ON side of the cell collapses as current declines, and the consequent rise in voltage is coupled to the low base line, significantly shortening the time required to raise its voltage sufficiently to securely write the cell.

Abstract: A semiconductor memory device including at least word lines and bit lines with memory cells located at each cross point therebetween. Each of the word lines is divided to form segmented word lines and each of the word line segments is driven by an individual private word driver. The individual private word drivers are activated together in response to a word selection signal. Level shifting diodes are employed in the bit line drivers to offset a voltage level change caused by the segment word drivers.