Abstract: In one aspect, a method for NOR flash cell-array programming in a neural circuit includes the step of erasing a cell array. The method includes the step of programming a set of reference cells of a reference cell array to a target reference threshold voltage (Vt_ref). The method includes the step of generating, with the reference cells, a current or voltage, reference signal. The method includes the step of using the reference signal to bias the neural cells during verification of program state of the neural cells to achieve their respective target threshold voltages (Vt_cell). The method includes the step of programming a set of neural cells of a neural cell array to their respective target threshold voltages.

Abstract: A memory opening or a line trench is formed through an alternating stack of insulating layers and sacrificial material layers. A memory opening fill structure or a memory stack assembly is formed, which includes a vertical stack of discrete intermediate metallic electrodes formed on sidewalls of the sacrificial material layers, a gate dielectric layer, and a vertical semiconductor channel. Backside recesses are formed by removing the sacrificial material layers selective to the insulating layers, and a combination of a ferroelectric dielectric layer and an electrically conductive layer within each of the backside recesses. The electrically conductive layer is laterally spaced from a respective one of the discrete intermediate metallic electrodes by the ferroelectric dielectric layer. Ferroelectric-metal-insulator memory elements are formed around the vertical semiconductor channel.

Abstract: A current demarcation voltage is determined, where the current demarcation voltage is to be applied to a memory cell for reading a state of the memory cell. A plurality of test demarcation voltages is determined based on the current demarcation voltage and a space between a first threshold voltage distribution corresponding to a first state of the memory cell and a second threshold voltage distribution corresponding to a second state of the memory cell. For each test demarcation voltage, an error rate of reading the state of the memory cell based on a respective test demarcation voltage is determined. A test demarcation voltage having the lowest error rate from the plurality of test demarcation voltages is determined. The current demarcation voltage is set to correspond to the test demarcation voltage having the lowest error rate.

Abstract: FET IC structures that enable formation of high-Q inductors in a “flipped” SOI IC structure made using a back-side access process, such as an single layer transfer (SLT) process. Essentially, the interconnect layer superstructure of an IC is split into two parts, a “lower” superstructure and an “upper” superstructure. In various embodiments, one or more low-resistance interconnect layers are fabricated within an upper superstructure formed after the application of a back-side access process, allowing fabrication of inductors in one or more low-resistance interconnect layer. A significant advantage of such IC structures is that the low-resistance interconnect layer or layers are relocated from being near the handle wafer of a conventional SLT IC to being spaced away from the handle wafer by intervening structures. Fabricating inductors in such spaced low-resistance interconnect layer or layers reduces electromagnetic coupling with the handle wafer and thus increases the Q factor of the inductors.

Abstract: A memory device includes memory cells coupled to a word line. The memory device includes a controller coupled to the word line. The controller is configured to program the memory cells coupled to the word line. The controller is configured to verify a programmed status of a first subset of the memory cells coupled to the word line and a programmed status of a second subset of the memory cells coupled to the word line, based on the programmed status of the first subset of the memory cells.

Abstract: Disclosed herein is a memory cell. The memory cell may act both as a combined selector device and memory element. The memory cell may be programmed by applying write pulses having different polarities. Different polarities of the write pulses may program different logic states into the memory cell. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities of the write pulses.

Abstract: A method includes sending data access requests to storage units regarding a set of encoded data slices. The method further includes, when a write transaction is pending for the set of encoded data slices, receiving proposal records from the storage units. The method further includes interpreting the proposal records to determine an ordering of visible versions of the set of encoded data slices stored by the storage units. The method further includes determining whether a threshold number of encoded data slices of a desired version of the set of encoded data slices is visible. The method further includes, when the threshold number of encoded data slices is visible, determining whether to proceed with the data access request. The method further includes, when determined to proceed with the data access request, sending a request to proceed with the data access request to the storage units.

Abstract: Disclosed herein is a memory cell. The memory cell may act both as a combined selector device and memory element. The memory cell may be programmed by applying write pulses having different polarities. Different polarities of the write pulses may program different logic states into the memory cell. The memory cell may be read by read pulses all having the same polarity. The logic state of the memory cell may be detected by observing different threshold voltages when the read pulses are applied. The different threshold voltages may be responsive to the different polarities of the write pulses.

Abstract: A device includes a memory, an error correction code (ECC) decoder, and an ECC input adjuster. The ECC decoder is configured to perform a first decode operation to decode a first portion of a representation of data read from the memory based on one or more decode parameters and to perform a second decode operation to decode a second portion of the representation of data based on one or more adjusted decode parameters. The ECC input adjuster is configured to adjust one or more decode parameters to set the one or more adjusted decode parameters based on a count of bits of the first portion that are erroneous.

Abstract: A data storage device includes a memory device including memory regions classified into a plurality of memory groups each corresponding to a plurality read bias voltage groups; and a controller suitable for: performing for a target memory region a read retry operation based on a first read bias voltage group corresponding to a memory group in which the target memory region is included, and performing an additional read retry operation based on at least one of remaining read bias voltage groups excluding the first read bias voltage group among the plurality of read bias voltage groups, according to a result of the read retry operation.

Abstract: A device includes a memory and a controller coupled to the memory. The controller is configured to determine a first count of bits of a representation of data that are estimated to be erroneous and a second count of bits of the representation of data that have high estimated reliability and are estimated to be erroneous. The controller is further configured to modify at least one read parameter or at least one decode parameter based on the first count and the second count.

Abstract: A method for operating a data storage device includes reading a plurality of data chunks from a plurality of pages corresponding to target memory cells coupled to a target word line based on read biases; obtaining discrimination data corresponding to the target memory cells based on discrimination biases; determining an unreliable bit in a target data chunk among the plurality of data chunks based on the plurality of data chunks and the discrimination data; and determining whether the unreliable bit is an error bit.

Abstract: A data storage device includes a non-volatile memory and a controller. The non-volatile memory includes a word line coupled to a plurality of storage elements. A method includes detecting a condition associated with a defect in the word line. A first subset of the plurality of storage elements and a second subset of the plurality of storage elements are determined based on an estimated location of the defect. The method further includes determining a first read threshold for the first subset and a second read threshold for the second subset.

Abstract: In an embodiment, a method for monitoring the state of health of an electronic data carrier involves using a reader device to determine the state of health of the electronic data carrier by reading a parameter value indicative of a state of health from the electronic data carrier. In an embodiment, a system for monitoring a state of health of an electronic data carrier comprising a reader device operable to read data from the electronic data carrier. The reader device is arranged to determine the state of health of the electronic data carrier by reading a parameter value indicative of the state of health from the electronic data carrier.

Abstract: A method includes sending data access requests to storage units regarding a set of encoded data slices. The method further includes, when a write transaction is pending for the set of encoded data slices, receiving proposal records from the storage units. The method further includes interpreting the proposal records to determine an ordering of visible versions of the set of encoded data slices stored by the storage units. The method further includes determining whether a threshold number of encoded data slices of a desired version of the set of encoded data slices is visible. The method further includes, when the threshold number of encoded data slices is visible, determining whether to proceed with the data access request. The method further includes, when determined to proceed with the data access request, sending a request to proceed with the data access request to the storage units.

Abstract: A method for managing memory operations in a storage device having a plurality of data blocks, the method including steps for determining a number of page reads for each of the plurality of data blocks and determining a dwell time for each of the plurality of data blocks. In certain aspects, the method further includes steps for associating the plurality of data blocks with a plurality of rank groups based on the number of page reads and the dwell time associated with each of the plurality of data blocks and selecting a data block, from among the plurality of data blocks, for memory reclamation based on the associated rank group and the selected data block. A storage system and computer-readable media are also provided.

Abstract: According to one embodiment, a memory system acquires HB information and SB1 information through SB4 information on each of four pages including LOWER, MIDDLE, UPPER, and HIGHER pages from a NAND memory 100 that includes QLCs each being capable of retaining a 4-bit value. An ECC circuit 260 of a memory controller 200 decodes the acquired HB information and SB1 to SB4 information on the four pages.

Abstract: A codeword is generated from a message. One or more anchor values are appended to the codeword at predetermined anchor positions. Before the codeword is stored in a memory block, the locations and values of stuck cells in the memory block are determined. Based on the values and positions of the stuck cells, the values of the codeword are remapped so that values of the codeword that are the same as the values of the stuck cells are placed at the positions of the stuck cells. The remapped codeword is stored in the memory block. When the message is later read, the original codeword can be recovered from the remapped codeword based on the locations of the anchor values in the remapped codeword.

Abstract: Disclosed are a semiconductor device and a manufacturing method thereof. The semiconductor device includes: source select lines, word lines, drain select lines, and a bit line stacked on a substrate in which a first cell string region and a second cell string region are defined; channel layers and memory layers vertically passing through the source select lines, the word lines, and the drain select lines in each of the first cell string region and the second cell string region; and a common source line vertically passing through the source select lines, the word lines, and the drain select lines at centers of the first cell string region and the second cell string region, and extended to a lower side of the source select lines.

Abstract: A method of operating a nonvolatile memory device includes: first programming a target transistor of a cell string of the nonvolatile memory device, wherein the target transistor has a first threshold voltage distribution after the first programming, and wherein the cell string includes a plurality of transistors; and second programming the target transistor of the cell string, wherein the first transistor has a second threshold voltage distribution after the second programming, wherein a width of the second threshold voltage distribution is less than a width of the first threshold voltage distribution.

Abstract: Techniques are disclosed for accurately sensing memory cells without having to wait for a voltage that creeps up on word line after a sensing operation to die down. The word line creep up could cause electrons to trap in shallow interface traps of a memory cell, hence impacting its threshold voltage. In one aspect, trapped electrons are removed (e.g., de-trapped) from shallow interface traps of a memory cell using a weak erase operation. Therefore, problems associated with word line voltage creep up are reduced or prevented. Thus, the memory cell can be sensed without waiting, while still providing an accurate result. The weak erase could be part of a sensing operation, but that is not required. For example, the weak erase could be incorporated into the beginning part of a read operation, which provides for a very efficient solution.

Abstract: A method of making a vertical NAND device includes forming a lower portion of a memory stack over a substrate, forming a lower portion of memory openings in the lower portion of the memory stack, and at least partially filling the lower portion of the memory openings with a sacrificial material. The method also includes forming an upper portion of the memory stack over the lower portion of the memory stack and over the sacrificial material, forming an upper portion of the memory openings in the upper portion of the memory stack to expose the sacrificial material in the lower portion of the memory openings, removing the sacrificial material to connect the lower portion of the memory openings with a respective upper portion of the memory openings to form continuous memory openings, and forming a semiconductor channel in each continuous memory opening.

Abstract: Various embodiments describe an integrated non-volatile component. The component may include a surface contact with associated mating contact wherein a ferroelectric layer is used as a conductive channel having variable conductivity and the surface contact and/or the associated mating contact are/is embodied as a rectifying contact and, as a result of an applied voltage between the surface contact and the associated mating contact, a non-volatile space charge zone forms in the surface contact terminal region and/or mating contact terminal region in the ferroelectric layer.

Abstract: There is a need to solve a possible system malfunction when a power supply voltage decreases steeply. To solve this problem, a control method is provided for a voltage detection system having an interrupt mode and a reset mode. First and second detection levels are configured. When a power supply voltage is higher than the first detection level, a latch circuit is placed in a first state to enable the interrupt mode. When the power supply voltage becomes lower than or equal to the first detection level, an interrupt signal is generated to change the latch circuit from the first state to a second state and enable the reset mode. A system reset is issued when the power supply voltage becomes lower than or equal to the second detection level in the reset mode.

Abstract: A semiconductor device includes a substrate supporting a plurality of layers that include at least one modulation doped quantum well (QW) structure offset from a quantum dot in quantum well (QD-in-QW) structure. The modulation doped QW structure includes a charge sheet spaced from at least one QW by a spacer layer. The QD-in-QW structure has QDs embedded in one or more QWs. The QD-in-QW structure can include at least one template/emission substructure pair separated by a barrier layer, the template substructure having smaller size QDs than the emission substructure. A plurality of QD-in-QW structures can be provided to support the processing (emission, absorption, amplification) of electromagnetic radiation of different characteristic wavelengths (such as optical wavelengths in range from 1300 nm to 1550 nm).

Abstract: Adaptive write operations for non-volatile memories select programming parameters according to monitored programming performance of individual memory cells. In one embodiment of the invention, programming voltage for a memory cell increases by an amount that depends on the time required to reach a predetermined voltage and then a jump in the programming voltage is added to the programming voltage required to reach the next predetermined voltage. The adaptive programming method is applied to the gate voltage of memory cells; alternatively, it can be applied to the drain voltage of memory cells along a common word line. A circuit combines the function of a program switch and drain voltage regulator, allowing independent control of drain voltage of selected memory cells for parallel and adaptive programming. Verify and adaptive read operations use variable word line voltages to provide optimal biasing of memory and reference cells during sensing.

Abstract: Read disturb due to hot electron injection is reduced in a 3D memory device by controlling the magnitude and timing of word line and select gate ramp down voltages at the end of a sensing operation. In an example read operation, a predefined subset of word lines includes source-side and drain-side word lines. For the predefined subset of word lines, word line voltages are ramped down before the voltages of the select gates are ramped down. Subsequently, for a remaining subset of word lines, word line voltages are ramped down, but no later than the ramping down of the voltages of the select gates. The timing of the ramp down of the selected word line depends on whether it is among the predefined subset or the remaining subset. The predefined subset can include a number of adjacent or non-adjacent word lines.

Abstract: A semiconductor memory device and a method of operating the same are provided. The device may include a memory cell array including a plurality of memory blocks and a peripheral circuit configured for selecting one of the plurality of memory blocks and performing a program operation on selected memory cells of the selected memory block when the program operation is performed. The peripheral circuit may be configured to float a plurality of source select lines and a plurality of drain select lines of an unselected memory block of the plurality of memory blocks when the program operation is performed.

Abstract: A magnetostrictive position sensor achieves an improved signal to noise ratio by implementing several electronic control features, including: enclosing a waveguide within an approximately tubular return conductor, adjusting the energy of an interrogation pulse and then clamping the waveguide, tracking the peak voltage of a sensed signal, cutting off the signal of a pickup during the time period outside of a signal time frame, adjusting the pass band of a filter based on an interrogation rate and waveguide length, zeroing and scaling a signal without digitizing the signal, and avoiding noise from an interrogation voltage generator.

Abstract: Memory devices configured to determine if an error exists in read data and to respond to determined errors, as well as methods of operating such memory devices. In at least one embodiment, an internal controller of a memory device periodically performs internal error correction operations on stored user data and corrects user data in the memory device independently from instructions from an external memory access device. In further memory devices, an internal controller performs internal error correction operations on stored user data and adjusts trim values that define voltages to be utilized during a read operation in response to determining that the read user data comprises an error.

Abstract: When writing a multi-state non-volatile memory, a de-trapping operation is included in the programming cycle. To reduce the performance penalty of including a de-trapping operation, the programming cycle of a single series of increasing pulses alternating with verify operations is replaced with a cycle including a pulse from each of two or more staircases, where each staircase is for a corresponding subset of the data states. After the multiple pulses, but before the following verify, a de-trapping operation is inserted in the programming cycle.

Abstract: An operation method of a multi-level memory is provided. A first read voltage lower than a standard read voltage is applied to a doped region in a substrate at one side of a control gate of the memory, so as to determine whether a first storage position and a second storage position are both at the lowest level.

Abstract: A nonvolatile memory device includes bit and source lines alternately arranged parallel to each other and even strings and odd strings alternately arranged between the bit lines and the source lines and each including drain selection transistors, memory transistors, and a source selection transistor. The drain selection transistors include a first drain selection transistor with the same structure as the memory transistors and a second drain selection transistor with the same structure as the source selection transistor. The nonvolatile memory device further includes an even drain selection line connected to the first drain selection transistors of the even strings and the second drain selection transistors of the odd strings and an odd drain selection line connected to the second drain selection transistors of the even strings and the first drain selection transistors of the odd strings.

Abstract: According to one embodiment, a non-volatile programmable switch according to this embodiment includes first and second non-volatile memory transistors, and a common node that is connected to the output side terminals of the first and second non-volatile memory transistors, and a logic transistor unit that is connected to the common node. A length of a gate electrode of the first and second non-volatile memory transistors in a channel longitudinal direction is shorter than a length of the charge storage film in the channel longitudinal direction.

Abstract: A memory device is provided, including a back gate including a first portion of electrically conductive material, a first portion of dielectric material arranged on the back gate, a semiconductor nanobeam arranged on the first portion of dielectric material, a second portion of dielectric material covering the semiconductor nanobeam, a portion of material configured to receive electrons and holes, and configured to store electrical charges and covering the second portion of dielectric material, a third portion of dielectric material covering the portion of material configured to perform storage of electrical charges, and a front gate including a second portion of electrically conductive material covering the third portion of dielectric material.

Abstract: A semiconductor device according to an embodiment includes: a first transistor including a gate connected to a first interconnection, a first source, and a first drain, one of the first source and the first drain being connected to a second interconnection; and a second transistor including a gate structure, a second source, and a second drain, one of the second source and second drain being connected to a third interconnection and the other of the second source and second drain being connected to a fourth interconnection. The gate structure includes a gate insulation film, a gate electrode, and a threshold-modulating film provided between the gate insulation film and the gate electrode to modulate a threshold voltage, the other of the first source and first drain of the first transistor is connected to the gate electrode.

Abstract: In one embodiment there is set forth a method comprising providing a semiconductor structure having an electrode, wherein the providing includes providing a phase transition material region and wherein the method further includes imparting energy to the phase transition material region to induce a phase transition of the phase transition material region. By inducing a phase transition of the phase transition material region, a state of the semiconductor structure can be changed. There is further set forth an apparatus comprising a structure including an electrode and a phase transition material region, wherein the apparatus is operative for imparting energy to the phase transition material region to induce a phase transition of the phase transition material region without the phase transition of the phase transition material region being dependent on electron transport through the phase transition material region.

Abstract: A memory comprises a memory cell, a sense amplifier, and a control unit. The memory cell stores a first bit and a second bit. The sense amplifier senses a first cell current and a second cell current corresponding to the first and the second bits respectively with a voltage applying on the memory cell. The control unit determines a digital state of the first bit by comparing a first reference current with the first cell current or by comparing a reference data with a first delta current between the first cell current and the second cell current.

Abstract: The present invention relates to a nonvolatile memory device and to a method for manufacturing same. According to the present invention, the blocking insulation layer of a nonvolatile memory device having a typical SONOS structure is replaced with a threshold voltage switching material, which changes to a low resistance state only while a voltage greater than a threshold voltage is applied while maintaining a high resistance state under normal conditions and returning to the high resistance state when the applied voltage is removed. The present invention performs a program operation by injecting charges from a gate electrode layer into a charge trap layer through an insulation layer formed of the threshold voltage switching material after applying a voltage pulse greater than the threshold voltage to the gate electrode layer.

Abstract: According to one embodiment, a semiconductor integrated circuit includes nonvolatile memory areas, each includes a first nonvolatile memory transistor, a second nonvolatile memory transistor and an output line, the first nonvolatile memory transistor includes a first source diffusion region, a first drain diffusion region and a first control gate electrode, the second nonvolatile memory transistor includes a second source diffusion region, a second drain diffusion region and a second control gate electrode, the output line connected the first drain diffusion region and the second drain diffusion region, and logic transistor areas, each includes a logic transistor, the logic transistor includes a third source diffusion region, a third drain diffusion region and a first gate electrode.

Abstract: According to one embodiment, there is provided a fusion memory including a first memory cell array formed of a NAND cell unit and a second memory cell array formed of a DRAM cell on a semiconductor substrate. The NAND cell unit is formed of a non-volatile memory cell having a two-layer gate structure in which a first gate and a second gate are stacked, and a selective transistor connecting the first and second gates of the non-volatile memory cell. The DRAM cell is formed of a cell transistor having a structure same as the structure of the selective transistor, and a MOS capacitor having a structure same as the structure of the non-volatile memory cell or the selective transistor.

Abstract: A 3D memory device includes an improved dual gate memory cell. The improved dual gate memory cell has a channel body with opposing first and second side surfaces, charge storage structures on the first and second side surfaces, and a gate structure overlying the charge storage structures on both the first and second side surfaces. The channel body has a depth between the first and second side surfaces less than a threshold channel body depth, combined with the gate structure which establishes an effective channel length of the cell greater than a threshold length. The combination of the channel body depth and effective channel length are related so that the cell channel body can be fully depleted, and sub-threshold leakage current can be suppressed when the memory cell has a high threshold state under a read bias.

Abstract: To provide a semiconductor device with such a new structure that the effect of variation in transistor characteristics can be reduced to achieve less variation in the output voltage of a memory cell. A memory cell includes a source follower (common drain) transistor for reading data held in a gate. A voltage applied to a transistor generating a reference current flowing through the memory cell is determined so that a gate-source voltage is approximately equal to the threshold voltage of the transistor. With such a structure, data stored in the memory cell can be read as a voltage that is less influenced by variation of transistors such as the field-effect mobility and the size.

Abstract: A graphene memory includes a source and a drain spaced apart from each other on a conductive semiconductor substrate, a graphene layer contacting the conductive semiconductor substrate and spaced apart from and between the source and the drain, and a gate electrode on the graphene layer. A Schottky barrier is formed between the conductive semiconductor substrate and the graphene layer such that the graphene layer is used as a charge-trap layer for storing charges.

Abstract: A method for adaptive voltage range management in non-volatile memory is described. The method includes establishing an adaptive voltage range for a memory element of an electronic memory device. The memory element includes at least two states. The adaptive voltage range comprises a lower state and an upper state. The method also includes establishing an adjustment process to implement a first adjustment of an abode characteristic of a first state and to implement a second adjustment of an abode characteristic of a second state in the adaptive voltage range in response to a trigger event, wherein the first adjustment of an abode characteristic of the first state is different from the second adjustment of an abode characteristic of the second state.

Abstract: Memory devices and methods of operating memory devices are shown. Configurations described include a memory cell string having an elongated n type body region and having select gates with p type bodies. Configurations and methods shown can provide a reliable bias to a body region for memory operations such as erasing.

Abstract: The present invention provides a memory circuit in which, while the power is not supplied, a data signal that has been held in a memory section corresponding to a volatile memory can be held in a capacitor in a memory section corresponding to a nonvolatile memory. In the nonvolatile memory section, a transistor whose channel is formed in an oxide semiconductor layer allows a signal to be held in the capacitor for a long period. Thus, the memory circuit can hold a logic state (data signal) even while the power supply is stopped. A potential applied to a gate of the transistor whose channel is formed in an oxide semiconductor layer is raised by a booster circuit provided between a wiring for carrying power supply potential and the gate of the transistor, allowing a data signal to be held even by one power supply potential without malfunction.

Abstract: A method for data storage includes accepting data for storage in an array of analog memory cells, which are arranged in rows associated with respective word lines. At least a first page of the data is stored in a first row of the array, and at least a second page of the data is stored in a second row of the array, having a different word line from the first row. After storing the first and second pages, a third page of the data is stored jointly in the first and second rows.

Abstract: A non-volatile memory device (and method of manufacture) is disclosed and structured to enable a write operation using an ionization impact process in a first portion of the device and a read operation using a tunneling process in a second portion of the device. The non-volatile memory device (1) increases hot carrier injection efficiency, (2) decreases power consumption, and (3) enables voltage and device scaling in the non-volatile memory devices.

Abstract: A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region and having the first conductivity type; and a gate positioned betw