Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines including at least one edge word line and other data word lines. The memory cells are arranged in strings and are configured to retain a threshold voltage corresponding to data states. The strings are organized in rows and a control means is coupled to the word lines and the strings and identifies the at least one edge word line. The control means programs the memory cells of the strings in particular ones of the rows and associated with the at least one edge word line to have an altered distribution of the threshold voltage for one or more of the data states compared to the memory cells of the strings not in particular ones of the rows and not associated with the at least one edge word line during a program operation.

Abstract: A host stores “context” metadata for logical block addresses (LBAs) in a manner tied to physical location. Notwithstanding log-structured or copy on write processes, the host is then provided with immediate context when the host is called upon to assist a memory controller with data identified by physical location, for example, for memory reconfiguration, garbage collection, wear leveling or other processes. The metadata for example can provide the host with insight as to which data may be moved to enhance performance optimization and where that data can be placed. In one embodiment, the host writes back one or more references that span multiple layers of indirection in concert with write of the underlying data; in another embodiment, the context can point to other metadata.

Abstract: A nonvolatile memory device includes at least one memory block and a control circuit. The at least one memory block includes a plurality of cell strings, each including a string selection transistor, a plurality of memory cells and a ground selection transistor. The control circuit controls a program operation by precharging channels of the plurality of cell strings to a first voltage during a bit-line set-up period of a program loop, applying a program voltage to a selected word-line of the plurality of cell strings during a program execution period of the program loop and after recovering voltages of the selected word-line and unselected word-lines of the plurality of cell strings to a negative voltage smaller than a ground voltage, recovering the voltages of the selected word-line and the unselected word-lines to a second voltage greater than the ground voltage during a recovery period of the program loop.

Abstract: A memory apparatus and method of operation are provided. The memory apparatus includes memory cells connected to word lines and disposed in memory holes organized in rows grouped in strings. The memory cells are configured to retain a threshold voltage. The rows include full circle rows and semi-circle rows in which the memory holes are partially cut by a slit half etch. The memory holes of the semi-circle rows are coupled semi-circle bit lines and the memory holes of the full circle rows are coupled to full circle bit lines. A control means is configured to erase the memory cells in an erase operation. During the erase operation, the control means creates a capacitive coupling between each of the semi-circle bit lines and at least one neighboring one of the full circle bit lines to increase a semi-circle erase voltage applied to each of the semi-circle bit lines.

Abstract: A non-volatile memory device and a non-volatile memory erasing operation method is provided. The method includes the following. A first erasing operation is performed, including reducing a threshold voltage of each of a plurality of memory cells of the non-volatile memory through a first erasing pulse. A first verification operation is performed to confirm whether the threshold voltage of each of the memory cells is less than an erasing target voltage level. In response to at least one of the memory cells failing the first verification operation, a second erasing operation is performed. The second erasing operation includes selecting the at least one memory cell failing the first verification operation, and reducing the threshold voltage of the at least one memory cell to be less than the erasing target voltage level through a second erasing pulse.

Abstract: A memory device comprises a memory cell array and a control circuit. The control circuit applies a pass voltage to each of a selected and unselected word line from a first to second time point whenever a program loop is performed once. Then, the control circuit applies a program voltage to the selected word line and the pass voltage to the unselected word line from the second to third time point, performs a bit line precharge operation from a fourth time point ahead of the first time point to the second time point when a first program loop is performed, and performs the bit line precharge operation from the fourth time point to a fifth time point, which is the same as or ahead of the first time point, when the other program loops are performed.

Abstract: A non-volatile memory device includes a substrate, a plurality of memory blocks grouped into pages, each including an alternating layer stack on the substrate, a plurality of channel holes in the alternating layer stack, and strings of memory cells disposed along the plurality of channel holes, and at least one dummy block adjacent to the plurality of memory blocks, each including an alternating dummy layer stack having multiple conductive layers and multiple dielectric layers alternately laminated on one another on the substrate, the at least one dummy block is disposed at an outskirt of each of the pages of the plurality of memory blocks.

Abstract: A memory system comprises a nonvolatile memory having a plurality of memory cells and a memory controller for controlling the nonvolatile memory. The plurality of memory cells is divided into different groups, and each group is assigned a threshold read count value from a predetermined range of read count values. The memory controller includes a counter which tracks a read count for each group, a determination circuit configured to compare the read count for each group tracked by the counter to the assigned threshold read count value for the group, and a nonvolatile memory read/write circuit configured to read data from the group when the determination circuit indicates the read count for the group has reached the assigned threshold read count value.

Abstract: Memories having a controller configured to perform methods during programming operations including apply a first voltage level to a data line selectively connected to a selected memory cell selected, apply a lower second voltage level to a select gate connected between the data line and the memory cell, decrease the voltage level applied to the data line from the first voltage level to a third voltage level while continuing to apply the second voltage level to the select gate, increase the voltage level applied to the select gate from the second voltage level to a fourth voltage level after the voltage level of the data line settles to the third voltage level, and apply a programming voltage to the memory cell after increasing the voltage level applied to the select gate to the fourth voltage level.

Abstract: A method includes determining a quantity of refresh operations performed on a block of a memory device of a memory sub-system and determining a quantity of write operations and a quantity of read operations performed to the block. The method also includes determining the block is read dominant using the quantity of write operations and the quantity of read operations and determining whether the quantity of refresh operations has met a criteria. The method further includes, responsive to determining that the block is read dominant and that the quantity of refresh operations has met the criteria, modifying trim settings used to operate the block of the memory device.

Abstract: Apparatuses and techniques are described for modifying program and erase parameters in a memory device in which memory cells can be operated in a single bit per cell (SLC) mode or a multiple bits per cell mode. In one approach, the stress on a set of memory cells in an SLC mode is reduced during programming and erasing when the number of program-erase cycles for the block in the SLC mode is below a threshold. For example, during programming, the program-verify voltage and program voltages can be reduced to provide a shallower than normal programming. During erasing, the erase-verify voltage can be increased while the erase voltages can be reduced to provide a shallower than normal erase. When the number of program-erase cycles for the block in the SLC mode is above the threshold, the program and erase parameters revert to a default levels.

Abstract: In a distribution shaping method, information compression and distribution shaping are executed at the same time. A symbol sequence of a predetermined length is allocated to an input bit sequence of a predetermined length on a one-to-one basis. In the allocation, a bit sequence smaller in entropy is allocated a symbol sequence smaller in average power.

Abstract: A memory apparatus and a control method are provided. The memory apparatus includes a non-volatile memory array having plural memory groups, and the control method is applied to the non-volatile memory array. The memory groups jointly share a first well, and the control method is applied to the non-volatile memory array. A first memory group among the memory groups is erased according to a first erase command after the memory apparatus is power-on, and a first amount of the memory groups are recovered in a first erase-recover procedure after the first memory group is erased. A second memory group among the memory groups is erased according to a second erase command after the first erase-recover procedure, and a second amount of the memory groups are recovered in a second erase-recover procedure after the second memory group is erased. The first amount is greater than the second amount.

Abstract: A memory device includes a memory cell region including a first metal pad, a peripheral circuit region including a second metal pad and vertically connected to the memory cell region by the first and second metal pads, a memory cell array in the memory cell region including cell strings including memory cells, word lines respectively connected to the memory cells, bit lines connected to one side of the cell strings, and a ground selection line connected to the cell strings, a control logic in the peripheral circuit region including a precharge control circuit for controlling precharge on partial cell strings among the cell strings and controlling a plurality of data program steps on the memory cells, and a row decoder in the peripheral circuit region for activating at least some of the word lines in response to a control of the control logic.

Abstract: Provided is a storage device that performs a read operation by using a time interleaved sampling page buffer. The storage device controls a sensing point in time, when bit lines of even page buffer circuits are sensed, and a sensing point in time, when bit lines of odd page buffer circuits are sensed, with a certain time difference, and performs an Even Odd Sensing (EOS) operation in a stated order of even sensing and odd sensing. The storage device performs a two-step EOS operation and performs a main sensing operation on a selected memory cell according to a result of the two-step EOS operation.

Abstract: This disclosure provides techniques hierarchical address virtualization within a memory controller and configurable block device allocation. By performing address translation only at select hierarchical levels, a memory controller can be designed to have predictable I/O latency, with brief or otherwise negligible logical-to-physical address translation time. In one embodiment, address transition may be implemented entirely with logical gates and look-up tables of a memory controller integrated circuit, without requiring processor cycles. The disclosed virtualization scheme also provides for flexibility in customizing the configuration of virtual storage devices, to present nearly any desired configuration to a host or client.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a word line, a bit line, a first transistor, a second transistor and a driver. The word line is electrically coupled to a gate of the memory cell. The bit line is electrically coupled to one end of the memory cell. The first transistor includes a first gate electrically coupled to the bit line. The second transistor is coupled to a first end of the first transistor. The driver is configured to apply a voltage to the first gate of the first transistor. In a read operation, the driver varies a voltage to be applied to the first gate of the first transistor based on a read voltage applied to the word line.

Abstract: A memory controller includes an interface and a processor. The interface communicates with memory cells that store data in predefined Programming Voltages (PVs). The processor is configured to produce observation samples that each includes (i) a target sample read from a target memory cell in a target Word Line (WL), and (ii) neighbor samples read from neighbor memory cells. Based on the observation samples, the processor is further configured to jointly estimate Cross-Coupling Coefficients (CCFs), by searching for CCFs that aim to minimize a predefined function of distances calculated between transformed observation samples that have been transformed using the CCFs and combinations of PVs that are closest to the respective transformed observation samples, to apply, based on the CCFs, cross-coupling cancelation to readout samples retrieved from the memory cells to produce enhanced readout samples, and to perform a storage operation related to reading data, using the enhanced readout samples.

Abstract: A control method of a memory device is provided. When a target memory cell whose source is connected to a first source line needs to be read, a word line controller provides a first voltage to a word line corresponding to the target memory cell and also provides the first voltage to a word line corresponding to the next row of the target memory cell, so that the period when the word line corresponding to the target memory cell remains at the first voltage overlaps the period when the word line corresponding to the next row of the target memory cell remains at the first voltage. When the target memory cell needs to be read, a source line controller provides a second voltage to the first source line, and provides a third voltage to the second source line; the third voltage is not equal to the second voltage.

Abstract: A semiconductor memory device includes a latch defined on a circuit chip; and a bit line select transistor defined in a first memory chip stacked in the circuit chip and a second memory chip stacked on the first memory chip. The bit line select transistors exchange data with the latch.

Abstract: A host stores “context” metadata for logical block addresses (LBAs) in a manner tied to physical location. Notwithstanding log-structured or copy on write processes, the host is then provided with immediate context when the host is called upon to assist a memory controller with data identified by physical location, for example, for memory reconfiguration, garbage collection, wear leveling or other processes. The metadata for example can provide the host with insight as to which data may be moved to enhance performance optimization and where that data can be placed. In one embodiment, the host writes back one or more references that span multiple layers of indirection in concert with write of the underlying data; in another embodiment, the context can point to other metadata.

Abstract: A 3D memory device may include a first set of memory layers, a second set of memory layers above the first set of memory layers, and a first dummy memory layer between the first and second memory layers. The 3D memory device may include a plurality of NAND memory strings each extending through the first and second set of memory layers and the first dummy memory layer. The 3D memory device may include a word line (WL) driving circuit that, when programming one of the first set of memory layers, may be configured to apply a second pre-charge voltage to the first dummy memory layer during the pre-charge period. The second pre-charge voltage may overlap with the first pre-charge voltage and ramp down prior to the first pre-charge voltage.

Abstract: Some embodiments include apparatuses and methods of using such apparatuses. One of the apparatuses includes a semiconductor material, a pillar extending through the semiconductor material, a select gate located along a first portion of the pillar, memory cells located along a second portion of the pillar, and transistors coupled to the select gate through a portion of the semiconductor material. The transistors include sources and drains formed from portions of the semiconductor material. The transistors include gates that are electrically uncoupled to each other.

Abstract: Systems, methods, and apparatus including computer-readable mediums for managing open blocks in memory systems such as NAND flash memory devices are provided. In one aspect, a memory system includes a memory and a memory controller. The memory includes multiple blocks each having a plurality of word lines. The memory controller is coupled to the memory and configured to: evaluate a read disturbance level of an open block, the open block having one or more programmed word lines and one or more blank word lines, and in response to determining that the read disturbance level of the open block is beyond a threshold level, manage each memory cell in at least one of the blank word lines to have a smaller data storing capacity than each memory cell in at least one of the one or more programmed word lines so as to reduce impact of read disturbance.

Abstract: Memory devices might include a controller for access of an array of memory cells and a differential storage device comprising a pair of gate-connected non-volatile memory cells, wherein the controller is configured to cause the memory device to obtain information indicative of a data value stored in a particular memory cell of the array of memory cells, program additional data to the particular memory cell, determine if a power loss to the memory device is indicated while programming the additional data to the particular memory cell, and, if a power loss to the memory device is indicated, selectively program one memory cell of the pair of gate-connected non-volatile memory cells responsive to the information indicative of the data value stored in the particular memory cell.

Abstract: Apparatuses and techniques are described for increasing channel boosting of NAND string during programming by applying a periodic low word line bias during programming. In one aspect, a low pass voltage, VpassL, is applied to designated word lines to create periodic low points or dips in the channel boosting level. A normal pass voltage, Vpass, is applied to other unselected word lines. The low points create barriers to the movement of electrons in the channel toward the selected word line, to prevent the electrons from pulling down the voltage at the channel region which is adjacent to the selected word line. VpassL can be applied to designated word lines at the source and/or drain sides of the selected word line. A control circuit can be configured with various parameters for implementing the techniques.

Abstract: An operating method of a memory system includes preprogramming multi-page data of a memory controller to a nonvolatile memory device, generating a state group code based on multi-bit data of the multi-page data, and each state group data of the state group code having less number of bits than corresponding multi-bit data, detecting sudden power-off occurring after the preprogramming, backing up, in response to the detecting of the sudden power-off occurring, the state group code to the nonvolatile memory device, recovering, after power is recovered from the sudden power-off, the multi-page data from the nonvolatile memory device, based on the state group code, reprogramming the multi-page data to the nonvolatile memory device, and reprogramming, in response to the detecting of the sudden power-off not occurring, the multi-page data of the memory controller to the nonvolatile memory device.

Abstract: Methods, systems, and devices for erasure decoding for a memory device are described. In accordance with the described techniques, a memory device may be configured to identify conditions associated with an erasure, a possible erasure, or an otherwise indeterminate logic state (e.g., of a memory cell, of an information position of a codeword). Such an identification may be used to enhance aspects of error handling operations, including those that may be performed at the memory device or a host device (e.g., error handling operations performed at a memory controller external to the memory device). For example, error handling operations may be performed using speculative codewords, where information positions associated with an indeterminate or unassigned logic state are assigned with a respective assumed logic state, which may extend a capability of error detection or error correction compared to handling errors with unknown positions.

Abstract: A memory device has a plurality of blocks of memory cells and a plurality of bit lines, each block including a group of word lines, and a set of NAND strings. Each block in the plurality of blocks of memory cells has a plurality of sub-blocks, each sub-block including a distinct subset of the set of NAND strings of the block selected, and a respective sub-block string select line. Control circuits are configured to execute a program operation including applying word line voltages and string select line voltages at a precharge level to precharge the set of NAND strings in the selected block, then lowering the gate voltages on all the sub-block string select lines of the block, and then lowering the word line voltages on the group of word lines. Thereafter, the program of cells in a selected sub-block is executed.

Abstract: An operating method and a non-volatile memory device are provided. The non-volatile memory device includes a memory array including a plurality of memory cells. The operating method includes applying a first program voltage signal to selected word lines connected to selected memory cells during a first program period and measuring a first threshold voltage, applying a second program voltage signal to the selected word lines during a second program period and measuring a second threshold voltage, applying a test bit line voltage signal to selected bit lines and applying a third program voltage signal to the selected word lines during a third program period and measuring a third threshold voltage and determining the enhanced bit line voltage by comparing a difference between the third threshold voltage and the second threshold voltage with a difference between the second threshold voltage and the first threshold voltage.

Abstract: This disclosure provides techniques for managing memory which match per-data metrics to those of other data or to memory destination. In one embodiment, wear data is tracked for at least one tier of nonvolatile memory (e.g., flash memory) and a measure of data persistence (e.g., age, write frequency, etc.) is generated or tracked for each data item. Memory wear management based on these individually-generated or tracked metrics is enhanced by storing or migrating data in a manner where persistent data is stored in relatively worn memory locations (e.g., relatively more-worn flash memory) while temporary data is stored in memory that is less worn or is less susceptible to wear. Other data placement or migration techniques are also disclosed.

Abstract: Provided herein is a memory device and a method of operating the memory device. The memory device may include a plurality of memory cells; a peripheral circuit configured to verify a program operation on the plurality of memory cells using a first verify voltage; and a control logic configured to control the peripheral circuit to suspend the program operation in response to a suspend command and verify the program operation on the plurality of memory cells using a second verify voltage in response to a resume command input after the suspend command. The second verify voltage may have a lower voltage level than the first verify voltage.

Abstract: A controller may control a memory device including memory blocks. The controller may include a processor configured to generate a command queue in response to a write command, a wear level management block configured to check a wear level of each memory block based on an erase/program pulse count variation, and manage the memory blocks such that each memory block belong to an SLC memory block group or an MLC memory block group, and a memory device control circuit configured to control the memory device to perform a write operation in response to the command queue. The memory device control circuit may select a first memory block belong to the SLC memory block group when the write operation is an operation for important data, and select a second memory block belong to the MLC memory block group when the write operation is an operation for normal data.

Abstract: Feedback relating to errors in memory operations on a plurality of memory cells is received by a memory sub-system. At least one processing level corresponding to a program distribution is updated based on the feedback to adjust an error measure between pages of the plurality of memory cells and to adjust a read window budget within a page of the plurality of cells. The updating of the at least one processing level is based on information for the at least one processing level that is stored in a data-structure.

Abstract: A memory device includes a memory cell array including cell strings, respectively connected between string select lines and ground select lines, and wordlines connected to memory cells, a control logic to generate a first voltage provided to the string select lines, and a second voltage provided to the ground select lines, and to adjust voltage levels of the first and second voltages to control a channel boosting level of the cell strings, and a row decoder to provide a read voltage, a read pass voltage, and the first and second voltages to the memory cell array under control of the control logic. The control logic generates one of the first and second voltage as a pre-pulse voltage. The row decoder provides a third voltage to at least one of the wordlines.

Abstract: A memory system includes: a plurality of dies including a plurality of memory blocks; and a memory controller for outputting a normal program command when a die including a selected memory block is a normal die having an electrical characteristic higher than or equal to a reference value in a program operation, and outputting a partial program command and a partial erase command when the die including the selected memory block is a low status die having an electrical characteristic lower than the reference value.

Abstract: According to various aspects, a memory cell arrangement is provided, the memory cell arrangement including a control circuit configured to carry out a de-trapping writing scheme to write at least one memory cell of the memory cell arrangement into a memory state, the de-trapping writing scheme including providing one or more write voltage pulses and one or more de-trapping voltage pulses at the at least one memory cell, wherein the one or more de-trapping voltage pulses have opposite polarity with respect to the one or more write voltage pulses, and wherein one or more properties of the one or more write voltage pulses and of the one or more de-trapping voltage pulses are varied as long as the memory cell is not in the memory state.

Abstract: A flash memory device includes a memory string, a selection switch, a first power source and a second power source. The memory string has a plurality of memory cells. A first memory cell in the memory string is coupled to a first word line, and the first word line is selected to be a programmed word line and the first memory cell is selected to be an inhibited cell, during a first time period, the selection switch is turned on according to a selection signal, and the first power source pulls up voltages on the global bit line and the local bit line to a first voltage. During a second time period, the selection switch is turned-off according to the selection signal, a word line voltage on the first word line is pulled up to pump up the voltage on the local bit line to a second voltage.

Abstract: A method of operating a controller that controls a non-volatile memory device having a first memory block and a second memory block. The controller may detect invalid data of the first memory block, determine whether the detected invalid data is less than a reference value, and execute a secure erase operation of changing a voltage distribution of the detected invalid data based on a result of the determination. According to this method, it may be possible to enhance security of data stored in the non-volatile memory device, to prevent a physical erase operation from being excessively performed, and to increase the life span of the non-volatile memory device.

Abstract: According to one embodiment of the present invention, an apparatus is disclosed. The apparatus includes a memory array having a plurality of memory cells. The apparatus further includes memory access circuits coupled to the memory array and configured to perform write operations responsive to control signals. The apparatus further includes control logic coupled to the memory access circuits and configured to apply a set of write parameters based, at least in part, on a number of write operations performed by the memory access circuits and further configured to provide control signals to the memory access circuits to perform write operations on the plurality of memory cells according to the set of write parameters.

Abstract: Methods, systems, and devices for data-based polarity write operations are described. A write command may cause a set of data to be written to a set of memory cells. To write the set of data, a write operation that applies voltages across the memory cells based on a logic state of data to be written to the memory cells may be used. During a first interval of the write operation, a voltage may be applied across a memory cell based on a logic state of a data bit to be written to the memory cell. During a second interval of the write operation, a voltage may be applied across the memory cell based on an amount of charge conducted by the memory cell during the first interval.

Abstract: Systems, devices, and methods are presented that allow a data channel to adaptively vary a change in a reference voltage used to read data from a solid state memory. The change in the reference voltage may be determined based on a measured error statistic of the solid state memory. A hard decision low density parity check (HLDPC) decoder may be utilized in conjunction with a soft decision low density parity check (SLDPC).

Abstract: A nonvolatile memory device includes a nonvolatile memory cell including a first cell transistor and a second cell transistor electrically coupled to a bit line in parallel and configured to respectively have a first physical size and a second physical size, a cell transistor selector coupled between the nonvolatile memory cell and a ground voltage terminal to control electrical connections between the first cell transistor and the ground voltage terminal, and between the second cell transistor and the ground voltage terminal, and a read voltage selection circuit suitable for selectively supplying one of a first read voltage and a second read voltage to the bit line.

Abstract: Apparatuses and techniques are described for performing an erase operation for a set of memory cells, where the erase operation includes an all word line erase phase to save time followed by an odd-even word line erase phase to improve data retention. A transition to the odd-even word line erase phase can be triggered when the memory cells pass a first verify test which indicates that the threshold voltages of the memory cells have decreased below a first voltage. Or, the transition can be triggered when a threshold number of erase-verify iterations have been performed. The erase operation may be completed when the memory cells pass a second verify test which indicates that the threshold voltages of the memory cells have decreased below a second voltage which is less than the first voltage.

Abstract: Provided herein may be a semiconductor memory device and a method of operating the same. The semiconductor memory device may include peripheral circuits configured to perform a verify operation on selected memory cells by applying a verify voltage to a word line, and perform a compensation program operation on the selected memory cells by applying a compensation program voltage to the word line; and a control logic configured to control the peripheral circuits such that the compensation program operation is performed by applying the compensation program voltage to the selected memory cells to be programmed to a selected threshold voltage distribution among the threshold voltage distributions other than a highest threshold voltage distribution, wherein the compensation program voltage has a positive voltage lower than the main program voltage most recently applied to the word line.

Abstract: A memory device includes a memory array. The memory array has a plurality of memory cells arranged in rows and columns. The gates of the memory cells in the same row are coupled to each other and connected to a word line. The drains of the memory cells in the same column are coupled to each other and connected to a bit line. The sources of the memory cells in the same row are coupled to each other, and the sources of the memory cells in the two adjacent rows are connected to different respective source lines.

Abstract: The present disclosure relates to method of operating a memory device, the memory device includes a memory cell array, a voltage generator, and control logic. The voltage generator configured to increase a power supply voltage. The control logic is configured to store a time based on the increased power supply voltage and a reference voltage. The reference voltage is a voltage level used to perform an operation on the memory cell array.

Abstract: Various implementations described herein are directed to device having a clock generator that provides write reference signals. The device may include a voltage divider that receives the write reference signals and provides an output reference signal based on write polarity of the write reference signals. The device may include a voltage regulator that receives the output reference signal and provides a regulated voltage to a load based on the output reference signal.

Abstract: According to one embodiment, there is provided a non-volatile semiconductor storage device including a non-volatile memory, a monitoring section, a determining section, and a notification processing section. The non-volatile memory includes a plurality of memory cells driven by word lines and a voltage generating section that generates a read voltage to be applied to the word lines. The monitoring section monitors a change in a threshold distribution of the plurality of memory cells upon performing a read processing to read data from the plurality of memory cells by applying the read voltage to the word lines. The determining section determines a degree of deterioration of the non-volatile memory in accordance with a monitoring result by the monitoring section. The notification processing section notifies a life of the non-volatile memory in accordance with a determining result by the determining section.

Abstract: Nonvolatile memory devices, operating methods thereof, and memory systems including the same. A nonvolatile memory device may include a memory cell array and a word line driver. The memory cell array may include a plurality of memory cells. The word line driver may be configured to apply word line voltages to a plurality of word lines connected to the plurality of memory cells, respectively. Magnitudes of the word line voltages may be determined according to locations of the plurality of word lines.