Abstract: A storage device with a charge trapping (CT) based memory may include improved data retention performance. Data retention problems, such as charge loss in CT memory may increase for a particular programmed state when a neighboring state is at erased state. Modifying the erase state with post write erase conditioning (PWEC) by pushing up deeply erased states can reduce the lateral charge movement and improve high temperature data retention. In particular, the erase state may be reprogrammed such that the erase distribution is tighter with a higher voltage.

Abstract: A memory device and an operating method thereof are provided. A memory device may include a plurality of source lines coupled to a memory block. The memory device may include a plurality of strings coupled to each of the source lines. The memory device may include a row decoder configured to selectively transmit voltages to local lines corresponding to a selected source line among the source lines.

Abstract: A data storage device according to example embodiments of inventive concepts includes a nonvolatile memory and a memory controller. In the nonvolatile memory, one read unit is configured to store a plurality of codewords. If a fail occurs in one or more codewords stored in the nonvolatile memory, the memory controller may search a read voltage of the nonvolatile memory using a correctable codeword. The data storage device according to example embodiments may predict an optimum read voltage level without performing a valley search operation.

Abstract: Apparatuses and techniques are described for reducing an injection type of program disturb in a memory device. A voltage on a selected word line is increased in a first step from an initial level such as 0 V to an intermediate, pass level such as Vpass, and in a second step from Vpass to a peak program level of Vpgm. A voltage on an adjacent unselected word line can be increased from the initial level to Vpass and then temporarily increased to an elevated level of Vpass_el during the second step increase on the selected word line. This helps reduce the magnitude of a channel gradient between the selected word line and the adjacent word line. The increase to Vpass_el may be implemented for program loops in the later part of a program operation, when Vpgm and the risk of program disturb is relatively high.

Abstract: Embodiments of the present disclosure provide methods, devices, modules, and systems for compensating for floating gate to floating gate (fg-fg) interference in flash memory cell read operations. Compensating for fg-fg interference effects can reduce or prevent read errors. Embodiments of the present disclosure can compensate for fg-fg interference by determining the programmed state of aggressor (or influencing) memory cells that are programmed after a target memory cell. If the aggressor memory cell is in the erased state of Level 0 or is in a programmed state of Level 2-15, the target memory cell is identified as undisturbed. If the aggressor memory cell is programmed to a Level 1 (instead of Level 0 or Levels 2-15), the target memory cell is identified as disturbed. If the target memory cell is disturbed, sensing parameters may be adjusted to compensate for the disruption.

Abstract: A nonvolatile memory device includes: a plurality of word lines that are stacked; a vertical channel region suitable for forming a cell string along with the word lines; and a voltage supplier suitable for supplying a plurality of biases required for a program operation on the word lines, where a negative bias is applied to neighboring word lines disposed adjacent to a selected word line at an end of a pulsing section of a program voltage which is applied to the selected word line.

Abstract: Apparatuses, systems, methods, and computer program products for a dynamic bias voltage are presented. A monitor circuit is configured to determine whether an erase loop count of an erase operation for data word lines of an erase block satisfies a threshold. A bias circuit is configured to adjust a voltage applied to one or more dummy word lines of an erase block in response to an erase loop count for data word lines satisfying a threshold. An erase circuit is configured to perform one or more subsequent erase loops of an erase operation for data word lines with an adjusted voltage applied to one or more dummy word lines.

Abstract: A local X-decoder for a memory system includes a decoding unit configured to generate a word line signal to a memory cell of a memory array of the memory system; and an unselected erase detecting unit coupled to the decoding unit, and configured to increase an absolute voltage coupled to the word line signal from a well of the memory cell according to an unselected erase mode signal generated by an erase mode decoder of the memory system; wherein the word line signal is floating to a same level as the well of the memory cell when the memory cell is unselected in an erase mode of the memory system.

Abstract: Apparatuses and techniques are described for optimizing a program operation in a memory device. A storage location stores programing data for each word line, such as a program voltage for a set of memory cells. The set of memory cells may be periodically evaluated to determine updated programming setting(s). In one approach, the evaluation involves repeatedly sensing the set of memory cells between a program pulse and a verify signal in a program loop. The word line voltage can be stepped down to an intermediate voltage, then ramped down at a controlled rate while repeatedly sensing the memory cells, such as to detect an upper or lower tail of a threshold voltage distribution. The position of the tail can indicate a degree of over programming and this information can be used to adjust the programming setting(s) in a subsequent program operation.

Abstract: In a method for operating a semiconductor device, the method may include: sorting program states of a memory cell that stores multi-bit data into a plurality of groups; applying different bias voltages to bit lines corresponding to a selected group among the plurality of groups; applying a program voltage to a selected word line corresponding to the selected group; verifying whether each of selected memory cells corresponding to the selected word line is programmed to a respective target program state; applying an inhibition voltage to bit lines coupled to programmed memory cells; and selecting a next group to be programmed until the plurality of groups are programmed.

Abstract: A data holding characteristic of a memory cell is improved in a memory system in which data is encoded and written to a memory cell. A first candidate parity generation unit generates, as a first candidate parity, a parity for detecting an error in an information section in which a predetermined value is assigned in a predetermined variable area. A second candidate parity generation unit generates, as a second candidate parity, a parity for detecting an error in the information section in which a value different from the predetermined value is assigned in the predetermined variable area. A selection unit selects a parity that satisfies a predetermined condition from among the first and second candidate parities as a selection parity. An output unit outputs a codeword constituted by the information section corresponding to the selection parity and the selection parity.

Abstract: A non-volatile memory apparatus and a refresh method thereof are provided. A control circuit determines whether threshold voltages of memory cells in a memory sectors are larger than a refresh read reference voltage and smaller than a refresh program verify reference voltage, and the control circuit determines that a memory cell needs refreshing if the threshold voltage of the memory cell is larger than the refresh read reference voltage and smaller than the refresh program verify reference voltage.

Abstract: A non-volatile memory device includes multiple word lines, and a voltage generator. Some of the word lines correspond to a deterioration area. The voltage generator is configured to generate a program voltage provided to multiple memory cells through the word lines. Control logic implemented by the non-volatile memory device is configured to control a program operation and an erase operation on the word lines. The deterioration area includes word lines of a first group and word lines of a second group. The control logic is configured to control a program sequence so that each of the word lines of the second group is programmed after an adjacent word line of the first group is programmed, and to control a distribution so that a threshold voltage level corresponding to an erase state of each of the word lines of the first group is higher than a threshold voltage level corresponding to an erase state of each of the word lines of the second group.

Abstract: A semiconductor memory device includes an n-type semiconductor region, first to fourth conductive layers above the n-type semiconductor region, a p-type semiconductor region, a semiconductor layer between the n-type semiconductor region and the p-type semiconductor region and extending through the conductive layers, charge storage regions between the conductive layers and the semiconductor layer, a control circuit that executes a first read sequence and a second read sequence following the first read sequence, a comparison circuit that compares the first data read in the first read sequence to the second data read in the second read sequence, and a determination circuit that selects one of the first data and the second data as a true read value. The first and second read sequences each have an off step and an off voltage applied during the first read sequence is different from an off voltage applied during the second read sequence.

Abstract: A semiconductor memory device includes a first circuit configured to process data received from and transmitted to an external controller, a second circuit configured to execute calibration on the first circuit, and a control circuit configured to control the second circuit to execute the calibration on the first circuit in response to a calibration command received from the external controller. In response to a first calibration command, the control circuit controls the second circuit to execute the calibration on the first circuit. In response to a second calibration command that is received after the first calibration command, the control circuit controls the second circuit to execute the calibration on the first circuit if a first condition is met and to not execute the calibration on the first circuit if the first condition is not met.

Abstract: A two-sided, staged programming operation is applied to a memory having first and second stacks of memory cells C1(i) and C2(i), i being the physical level of a cell. The staged programming operation includes applying a preliminary program stage S1, an intermediate program stage S2, and a final program stage S3 to memory cells in the first and second stacks. In a programming order the final program stage S3 is applied to memory cells in the first and second stacks at each level (i) for which the intermediate program stage S2 has already been applied to the memory cells in any neighboring levels (levels i+1 and i?1). The intermediate program stage S2 is applied only to memory cells for which the preliminary program stage S1 has already been applied to the cells in any neighboring levels (levels i+1 and i?1).

Abstract: A non-volatile memory cell includes a selection transistor having an insulated selection gate embedded in a semiconducting substrate region. A semiconducting source region contacts a lower part of the insulated selection gate. A state transistor includes a floating gate having an insulated part embedded in the substrate region above an upper part of the insulated selection gate, a semiconducting drain region, and a control gate insulated from the floating gate and located partially above the floating gate. The source region, the drain region, the substrate region, and the control gate are individually polarizable.

Abstract: A memory device is provided that includes a memory controller coupled to a memory array. The memory controller is adapted to perform a closed loop training interval and perform an open loop programming interval. The closed loop training interval determines a corresponding first state successful voltage and a corresponding second state successful voltage for a first group of memory cells each including a barrier modulated switching structure. The open loop programming interval programs a second group of memory cells each including a barrier modulated switching structure to a first state and a second state using the corresponding first state successful voltage and the corresponding second state successful voltage, respectively.

Abstract: The present disclosure relate a method of operating a semiconductor memory device including at least two memory blocks sharing one block word line. The method including applying an erase voltage to a source line commonly coupled to the memory blocks, one of which is a selected memory block and applying a first voltage to the block word line and a third voltage to a global word line of an unselected memory block of the memory blocks when the erase voltage is applied to the source line, wherein the first voltage is higher than a turn-on voltage to turn on a pass transistor coupled to the block word line, and wherein the third voltage floats a local word line included in the unselected memory block according to a level of the first voltage.

Abstract: A method and a system for determining bit values in a non-volatile memory having a number of cells each for storing a bit value are disclosed. The method includes the steps of: a) providing a first test sensing voltage to the cells and calculating a cell count; b) providing another test sensing voltage to the cells and calculating a difference of the cell counts between this step and previous step; c) providing still another test sensing voltage and calculating another difference of the cell counts between this step and previous step; d) processing step c) for N times; e) calculating differential amounts of cell counts and assigning an index number to each group of cells; f) choosing a voltage as an updated sensing voltage.

Abstract: A storage device includes storage circuitry and multiple memory blocks. The multiple memory blocks are arranged in an array, and each of the memory blocks includes multiple memory cells. A maximal number of programming cycles that a memory block of the multiple memory blocks sustains depends on a distance of the memory block from an edge of the array. The storage circuitry is configured to apply to the memory blocks programming cycles so that a number of programming cycles that can be applied to a respective memory block is based on a respective distance of the respective memory block from the edge of the array.

Abstract: A semiconductor device includes a substrate including a memory cell region and a contact region, a string structure including conductive layers and first interlayer insulating layers alternately stacked over the substrate and protruded toward a lower layer from the memory cell region toward the contact region, barrier rib patterns spaced apart from one another over the conductive layers in the contact region and configured to open the layers of the conductive layers in the contact region through the spaced spaces, and first contact plugs filled into the space between barrier rib patterns adjacent to each other and coupled to the conductive layers in the contact region.

Abstract: A memory system may include: a memory device having a plurality of blocks; and a controller suitable for performing a count operation on each of the blocks in response to a preset number of write requests, and performing a wear leveling operation based on the result of the count operation on each of the blocks.

Abstract: A memory system includes: a semiconductor memory device; and a controller capable of issuing a first read instruction and a second read instruction different from the first read instruction. When receiving the first read instruction, the semiconductor memory device reads first data and second data from a memory cell array, holds the first data and the second data in the latch circuit, and outputs the first data to the controller. When receiving the second read instruction, the semiconductor memory device outputs third data based on the second data held by the latch circuit to the controller. The controller performs soft decision processing using the third data.

Abstract: Methods of operating a memory include receiving data for programming to a plurality of memory cells of the memory, redistributing the received data in a reversible manner, programming the redistributed data to the plurality of memory cells, and programming respective second data to each memory cell of the plurality of memory cells containing the redistributed data, wherein the respective second data for any memory cell of the plurality of memory cells has a same data value as the respective second data for each remaining memory cell of the plurality of memory cells.

Abstract: When selectively erasing one sub-block, a control circuit applies, in a first sub-block, a first voltage to bit lines and a source line, and applies a second voltage smaller than the first voltage to the word lines. Then, the control circuit applies a third voltage lower than the first voltage by a certain value to a drain-side select gate line and a source-side select gate line, thereby performing the erase operation in the first sub-block. The control circuit applies, in a second sub-block existing in an identical memory block to the selected sub-block, a fourth voltage substantially identical to the first voltage to the drain side select gate line and the source side select gate line, thereby not performing the erase operation in the second sub-block.

Abstract: A planar material layer stack including a lower etch stop dielectric layer, a sacrificial semiconductor layer, and an upper etch stop dielectric layer is formed over a source semiconductor layer on a substrate. An alternating stack of insulating layers and spacer material layers is formed. The spacer material layers are formed as, or are subsequently replaced with, electrically conductive layers. An array of memory stack structures is formed. A source cavity is formed by removing the sacrificial semiconductor layer and portions of the memory films. Source strap structures are formed by a selective semiconductor deposition process on the vertical semiconductor channels and the source semiconductor layer. A dielectric fill material layer fills a remaining volume of the source cavity.

Abstract: A reading circuit for a charge-retention circuit stage is provided with a storage capacitor coupled between a first biasing terminal and a floating node, and a discharge element coupled between the floating node and a reference terminal. The reading circuit further has an operational amplifier having a first input terminal that is coupled to the floating node and receives a reading voltage, a second input terminal receives a reference voltage, and an output terminal on which it supplies an output voltage, the value of which is a function of the comparison between the reading voltage and the reference voltage and indicative of a residual charge in the storage capacitor. A shifting stage shifts the value of the reading voltage of the floating node, before the comparison is made between the reading voltage and the reference voltage for supplying the output voltage.

Abstract: A nonvolatile memory device includes: first memory cells connected to a first source line and a first bit line; second memory cells connected to a second source line and a second bit line; and a sense amplifier circuit connected to the first and second source lines and the first and second bit lines. The sense amplifier circuit includes: a first sense amplifier configured to apply a first read voltage to the first bit line and output a first amount of current of a selected first memory cell; a second sense amplifier configured to apply a second read voltage to the second bit line and output a second amount of current of a selected second memory cell; and a comparator configured to compare the first amount of current with the second amount of current to identify data of the selected first memory cell.

Abstract: Embodiments are related to systems and methods for data storage, and more particularly to systems and methods for storing and accessing data from a flash memory.

Abstract: A computer memory system, delay calibration circuit, and method of operating a delay calibration circuit are provided. The disclosed method includes providing a delay-line ring oscillator on silicon of a chip, providing at least one counter on the silicon of the chip, and measuring a chip-specific delay for performing an operation with the chip by synchronizing the at least one counter and operation of the delay-line ring oscillator with a timing trigger.

Abstract: Embodiments are related to systems and methods for data storage, and more particularly to systems and methods for storing and accessing data from a flash memory.

Abstract: Provided is a semiconductor device and an operating method thereof. The operating method of the semiconductor device includes performing a soft program operation on a top dummy cell and a bottom dummy cell, among dummy cells stacked in a vertical direction, by applying a first soft program voltage to a bottom dummy word line coupled to the bottom dummy cell and a second soft program voltage greater than the first soft program voltage to a top dummy word line coupled to the top dummy cell formed above the bottom dummy cell.

Abstract: A memory device includes first and second memory strings, first and second word lines and a controller. The first memory string includes first and second memory cells, a first select transistor, a second select transistor, and a third select transistor between the first and second memory cells. The second memory string includes third and fourth memory cells, a fourth select transistor above the third memory cell, a fifth select transistor below the fourth memory cell, and a sixth select transistor between the third and fourth memory cells. The first word line is electrically connected to gates of the first and third memory cells. The second word line is electrically connected to gates of the second and fourth memory cells. The controller is configured to execute a read operation on one of the memory cells, the read operation including a first phase and a second phase after the first phase.

Abstract: Apparatus and methods are disclosed, such as an apparatus that includes a string of charge storage devices associated with a pillar (e.g., of semiconductor material), a source gate device, and a source select device coupled between the source gate device and the string. Additional apparatus and methods are described.

Abstract: A program method of a memory device include determining whether valid data is stored in memory cells of a word line adjacent to a selection word line upon which a program operation is to be performed; when the valid data is not stored in the memory cells of the word line adjacent to the selection word line, performing, based on data to be written to the selection word line, a pre-program operation on the word line adjacent to the selection word line; and after the performing of the pre-program operation, performing, based on a program command, the program operation on the selection word line.

Abstract: Provided is a read method for a nonvolatile memory device for reading data with an optimum read voltage. The read method includes reading data of a first set of memory cells connected to a first word line, by dividing the data of the first set of memory cells into M pages and individually reading data from the M pages. The reading data includes performing an on-chip valley search (OVS) operation on a first valley of two adjacent threshold voltage distributions of the first set of memory cells when reading each of the M pages, and performing a data recover read operation via a read operation on a second word line adjacent to the first word line, based on a result of the OVS operation. In the data recover read operation, a read operation on the first word line is not performed.

Abstract: A method fabricates a lateral non-volatile storage cell. The lateral non-volatile storage cell includes a first transistor including a first transistor body formed on a dielectric layer. The first transistor includes a source region and drain region on opposite sides of the first transistor body. A second transistor is laterally adjacent to the first transistor and includes a second transistor body, parallel with the first transistor body, formed on the dielectric layer. A first layer of gate oxide of a first thickness is formed over the first transistor body, and a second layer of gate oxide of a second thickness is formed over a portion of the second transistor body. The first thickness and the second thickness are different. A floating gate is formed over the first layer of gate oxide, the second layer of gate oxide, and the dielectric layer.

Abstract: A memory system includes an interface and storage circuitry. The interface is configured to communicate with a plurality of memory cells that store data by setting the memory cells to analog voltages representative of respective storage values. The storage circuitry is configured to receive data for storage, to measure a temperature at a time of programming the received data, and, to program the received data to the memory cells using a first programming scheme when the measured temperature falls within a predefined normal temperature range, and otherwise to program the received data to the memory cells using a second programming scheme having a lower net storage utilization than the first programming scheme.

Abstract: The present disclosure relates to phase change memory control. An apparatus includes a memory controller. The memory controller includes a word line (WL) control module and a bit line (BL) control module. The memory controller is to determine a WL address based, at least in part, on a received memory address. The memory controller is further to determine a BL address. The apparatus further includes a parameter selection module to select a value of a control parameter based, at least in part, on at least one of the WL address and/or the BL address.

Abstract: A memory system is configured to program different memory cells to different final targets for a common data state based on distance to one or more edges of a word line layer.

Abstract: A nonvolatile memory device includes a memory cell array and a row decoder circuit. The row decoder circuit turns on memory cells of a plurality of cell strings of a selected memory block after applying a first prepulse to a first dummy word line connected to first dummy memory cells after applying a second prepulse to a second dummy word line connected to second dummy memory cells.

Abstract: A memory device that includes a pair of non-volatile memory cells, a first memory cell including a first memory gate and a first select gate, and a second memory cell including a second memory gate and a second select gate. The first and second memory cells share a source line, and the first and second memory gates are not connected to one another.

Abstract: Apparatuses and methods for inferring threshold voltage distributions associated with memory cells via interpolation are described herein. A number of embodiments include determining soft data for a group of memory cells each programmed to one of a number of data states, wherein the soft data comprises a number of different soft data values, determining a quantity of memory cells associated with each of the different soft data values, and inferring at least a portion of a threshold voltage distribution associated with the group of memory cells via an interpolation process using the determined quantities of memory cells associated with each of the different soft data values.

Abstract: A data programming method and a memory storage device are provided. The method includes: programming a plurality of first type physical units in a rewritable non-volatile memory module to store first data; encoding the first data to generate encoded data; receiving second data; and programming at least one of a plurality of second type physical units in the rewritable non-volatile memory module corresponding to the first type physical units to store at least a part of the second data after the first data is encoded. Therefore, the correcting ability for correcting errors in pair physical units in multi-channel programming procedure may be improved.

Abstract: A non-volatile semiconductor memory device capable of eliminating influence of bit line (BL) leakage on reading and a reading method thereof. The non-volatile semiconductor memory device includes a memory array, a semiconductor well having a plurality of erase units, and a source switch array having a plurality of source switches. Each of the source switches is coupled to a common source line of one erase unit of the semiconductor well. Only one source switch among the source switches coupled to a selected erase unit among the erase units of the semiconductor well for reading is enabled during a reading operation. Thus, the BL leakage is prevented from affecting the reading operation on memory cells of the memory array, thereby improving the reliability of the non-volatile semiconductor memory device.

Abstract: Methods and apparatuses for single level cell caching are described. According to one example, a method includes receiving, at a memory device, a first set of data to be stored in a lower page of multilevel memory cells, storing the first set of data in a page of single level memory cells, storing the first set of data in the lower page of the multilevel memory cells, receiving, at the memory device, a second set of data to be stored in an upper page of the multilevel memory cells, and storing the second set of data directly in the upper page of the multilevel memory cells.

Abstract: Read operations are performed in a multi-plane memory device. A state machine interfaces an external controller to each plane of memory cells to allow reading from selected word lines in the planes. In one approach, different types of read operations are performed in different planes, such as a multi-level cell read, e.g., a lower, middle or upper page read and a single-level cell (SLC) read. When the read operation in one plane uses fewer read voltages than another plane, the read data can be output early from the one plane while read operations continue on the other plane. The external controller can also command a cache release for one plane after outputting data from the caches of another plane. Read voltages can be set for each plane in a respective set of registers.

Abstract: Techniques disclosed herein cope with cross-temperature effects in non-volatile memory systems. One technology disclosed herein includes an apparatus and method that scrubs a block of non-volatile memory cells responsive to a determination that variance in word line program temperatures in the block exceeds a threshold. Such blocks having large variance in programming temperatures for different word lines can potentially have high BERs when reading. This may be due to the difficulty in having one set of read levels that are optimum for all word lines in the block.

Abstract: An integrated circuit includes a NAND string including a string selection transistor SST and a ground selection transistor GST disposed at either end of series-connected memory storage cells MC. Each of the memory storage cells is a memory transistor having a floating gate, and at least one of the string selection transistor SST and the ground selection transistor GST is a memory transistor having a floating gate. The threshold voltage Vth of programmable string selection transistors SST and the ground selection transistor GST is variable and user controllable and need not be established by implantation during manufacture. Each of the programmable string selection transistors SST and the ground selection transistors GST in a memory block may be used to store random data, thus increasing the memory storage capacity of the flash memory device.