Abstract: A memory system includes: a plurality of memory dies, and a controller selects a second read request, including at least a portion of a plurality of first read requests, so that the memory dies interleave and output data corresponding to the first read requests, and performs a correlation operation for the selected second read request, when the second read request is selected, the controller determines whether the correlation operation is performed or not before a time at which the second read request is selected, determines whether the correlation operation is successful or not, determines a pending credit in response to an operation state of the memory dies at the time at which the second read request is selected, and determines whether to perform the correlation operation or not for the second read request that is selected at the time at which the second read request is selected based on the pending credit.

Abstract: Memory devices may have internal circuitry that employs voltages higher and/or lower than voltages provided by an external power source. Charge pumps are DC/DC converters that may be used to generate the higher voltages internally. The number of available charge pumps in a memory device may be conservatively dimensioned to be high, in some systems to protect yields. Some of the available charge pumps may be disabled during manufacturing or testing to reduce the number of active charge pumps. The testing process may employ dedicated logic in the memory device and the disabling may employ fuse circuitry.

Abstract: A method of managing programming errors in a multilevel NAND flash memory is provided. The multilevel NAND flash memory uses a two-pass programming algorithm—e.g., a first programming pass and a second programming pass—for programming a memory block being organized in pages, sharing a word line. The method comprises performing the first programming pass for at least one memory page, reading the at least one memory page between the first programming pass and the second programming pass, determining an error count value for the at least one programmed memory page, and responsive to determining that the error count value is below a threshold value, performing the second programming pass with active data.

Abstract: A memory device may include: memory cells each having any one of first and second programmed states as a target programmed state; a peripheral circuit configured to perform a program operation so that each memory cell has a threshold voltage corresponding to the target programmed state; and a control circuit configured to control the peripheral circuit. The control circuit may include a program operation controller configured to control the peripheral circuit so that, during the program operation, an intermediate program operation is performed on the memory cells using an intermediate verify voltage, an additional program operation is performed on memory cells each having the second programmed state as a target programmed state if an intermediate verify operation passes, and a final program operation is performed on the memory cells such that each memory cell has a threshold voltage corresponding to the target programmed state.

Abstract: A memory device includes a page with plurality of memory cells and a peripheral circuit that performs at least one program loop. The at least one program loop includes a program voltage applying phase for applying, during a program operation, a program voltage to a word line to which the plurality of memory cells are coupled and a program verify phase for determining whether a selected memory cell among the plurality of memory cells has been completely programmed. The memory device includes control logic that controls the peripheral circuit to: perform an auxiliary verify operation of applying an auxiliary verify voltage to the word line; perform a main verify operation of applying a main verify voltage larger than the auxiliary verify voltage to the word line; and determine a fail of the program operation, based on verify data obtained by performing the auxiliary verify operation and the main verify operation.

Abstract: A system and method for optimization of non-volatile storage operational parameters is provided. The method may utilize a crowdsourcing server to gather performance data for multiple storage devices connected to respective remotely located host systems. The performance data may be transmitted at regular intervals or at predefined events and the crowdsourcing server may aggregate and determine improved operating parameters for each different type of storage device based on the data gathered for multiple instances of that type of storage device. The optimized operating parameters may be selected from pre-stored and pre-qualified operating parameter sets on the respective storage devices that the crowdsourcing server is aware of. The system includes a non-volatile memory and a controller that is configured to log performance data and transmit at least a portion of that logged data to the crowdsourcing server.

Abstract: A circuit may include a voltage line and latch circuitry. The latch circuitry may be characterized by a switching voltage threshold and may be coupled to the voltage line. The latch circuitry may generate an output used to determine a state of a fuse. The circuit may also include generation circuitry coupled to the latch circuitry via the voltage line, wherein the generation circuitry is configured to pre-charge the voltage line to a first voltage between a system logical low voltage and the switching voltage threshold.

Abstract: A circuit includes a program controller configured to perform a program operation with interleaved program-verify loops to program memory cells in a same block. During each program-verify loop, a control gate line voltage supply circuit first supplies a program pulse to a first cell of the block and then, before verifying the first cell, supplies a program pulse to a second cell of the block. After the program pulses are sent, the control gate line supply circuit consecutively supplies verify pulses to the first cell and the second cell such that a delay is introduced between the respective program and verify stages of the first and second cells. Additionally, a constant voltage bias on common control gate lines of the first and second memory cells is applied during the consecutive verify stages. Further, an order of verify pulses may be applied in a reverse order during a verify stage.

Abstract: A memory device may include a phase driver circuit that may output a first voltage for refreshing a plurality of memory cells. The memory device may also include a plurality of word line driver circuits that may receive the first voltage via the phase driver circuit, such that each word line driver circuit of the plurality of word line driver circuits may provide the first voltage to a respective word line associated with a respective portion of the plurality of memory cells. In addition, each word line driver circuit may refresh the respective portion of the plurality of memory cells based on a respective word line enable signal provided to a first switch of the respective word line driver circuit.

Abstract: A nonvolatile memory device includes a memory cell array includes memory cells, a row decoder, a page buffer circuit and a control logic circuit. The row decoder is connected to the memory cells through word lines and includes switches configured to select the word lines, respectively. The page buffer circuit is connected to the memory cell array through bit lines. The control logic circuit is configured to perform operational functions when the row decoder turns on a switch corresponding to a particular word line among the word lines.

Abstract: In general, embodiments of the technology relate to a method for adjusting solid state memory write parameters. The method includes obtaining a performance goal for the solid state memory, receiving a client write request for data from a client, where the client write request comprises a logical address and data to be written. The method further includes determining a physical address corresponding to the logical address, where the physical address comprises a page number for a physical page in the persistent storage, obtaining at least one verify threshold value using the performance goal, issuing a control module program request including the data to be written and the at least one verify threshold value to a storage module, where the storage module comprises the physical page, and programming the data into the physical page of the storage module using the at least one verify threshold value.

Abstract: A memory cell includes a first charge trap transistor and a second charge trap transistor. The first charge trap transistor has a substrate, a first terminal coupled to a first bitline, a second terminal coupled to a signal line, a control terminal coupled to a wordline, and a dielectric layer formed between the substrate of the first charge trap transistor and the control terminal of the first charge trap transistor. The second charge trap transistor has a substrate, a first terminal coupled to the signal line, a second terminal coupled to a second bitline, a control terminal coupled to the wordline, and a dielectric layer between the substrate of the second charge trap transistor and the control terminal of the second charge trap transistor. Charges are either trapped to or detrapped from the dielectric layer of the first charge trap transistor when writing data to the memory cell.

Abstract: A methodology and structure for driving a selected wordline to a negative voltage without the need for a negative wordline voltage generator. The methodology includes the step of boosting a non-selected wordline to a first positive voltage. The methodology proceeds with holding a selected wordline, which is adjacent to and capacitively coupled with the non-selected wordline, at zero voltage. The methodology continues with floating the selected wordline. The methodology proceeds with driving the non-selected wordline to a lower voltage to shift the selected wordline to less than zero volts due to capacitance effects. The methodology continues with the step of accelerating charge loss in a defective memory cell connected to the selected wordline while at a negative voltage during a soft erase operation.

Abstract: A method of operating a memory device includes performing a data read operation on at least one victim sub-block within a memory block containing a plurality of sub-blocks therein, in response to an erase command directed to a selected sub-block within the plurality of sub-blocks. Next, a soft program operation is performed on the at least one victim sub-block. This soft programming operation is then followed by an operation to erase the selected sub-block within the plurality of sub-blocks. This operation to erase the selected sub-block may include providing an erase voltage to a bulk region of a substrate on which the memory block extends, and the at least one victim sub-block may be disposed between the selected sub-block and the substrate.

Abstract: Methods of operating a memory device include programming a page of a memory block of the memory device using a particular starting programming voltage, determining a programming voltage indicative of a programming efficiency of the page of the memory block during programming of the page of the memory block, storing a representation of the programming voltage indicative of the programming efficiency of the page of the memory block, setting a starting programming voltage for a different page of the memory block in response to the stored representation of the programming voltage indicative of the programming efficiency of the page of the memory block, and programming the different page of the memory block using its starting programming voltage.

Abstract: Technology for a memory device is described. The memory device can include an array of memory cells and a memory controller. The memory controller can receive a request to program a memory cell within the array of memory cells. The memory controller can select a current magnitude and a duration of the current magnitude for a programming set pulse based on a polarity of access for the memory cell, a number of prior write cycles for the memory cell, and electrical distances between the memory cell and wordline/bitline decoders within the array of memory cells. The memory controller can initiate, in response to the request, the programming set pulse to program the memory cell within the array of memory cells. The selected current magnitude and the selected duration of the current magnitude can be applied during the programming set pulse.

Abstract: A program verification method for a nonvolatile memory device includes performing a first failure bit counting operation about a first stage to generate a first failure bit accumulated value and comparing the first failure bit accumulated value and a first failure reference value to determine a program failure. When the first failure bit accumulated value is less than the first failure reference value, a second failure bit counting operation for a second stage is performed to generate a second failure bit accumulated value. The second failure bit accumulated value is compared to a second reference value to determine a program failure. The second failure reference value is different from the first failure reference value.

Abstract: Method of operating a memory include increasing respective threshold voltages of a first subset of memory cells of a plurality of memory cells to threshold voltage levels higher than a particular voltage level in response to applying a first plurality of programming pulses, and subsequently increasing respective threshold voltages of a second subset of memory cells of the plurality of memory cells to threshold voltage levels lower than the particular voltage level in response to applying a second plurality of programming pulses, wherein the first plurality of programming pulses have respective voltage levels within a first range of voltage levels, the second plurality of programming pulses have respective voltage levels within a second range of voltage levels, and a lowest voltage level of the first range of voltage levels is lower than or equal to a highest voltage level of the second range of voltage levels.

Abstract: A level width corresponding to a group of memory cells of a memory component is determined. The determined level width and a target level width is compared. In response to the determined level width being different than the target level width, one or more program step characteristics are adjusted to adjust the determined level width to the target level width.

Abstract: A computer-implemented method according to one embodiment includes determining, after writing data to a non-volatile memory block, one or more delta threshold voltage shift (TVS?) values. One or more overall threshold voltage shift values for the data written to the non-volatile memory block are calculated, the values being a function of the one or more TVS? values to be used when writing data to the non-volatile memory block. The overall threshold voltage shift values are stored. A base threshold voltage shift (TVSBASE) value, the one or more TVS? values, or both the TVSBASE value and the one or more TVS? values are re-calibrated during a background health check after a predetermined number of background health checks without calibration are performed.

Abstract: Embodiments of this application provide a flash interface controller and an operation command processing method, and relate to the field of data storage. Programmable first type microcode and second type microcode are introduced to a flash interface controller. The first type microcode can be modified through programming to adapt to a procedure of parsing an operation command of a new protocol, and the second type microcode can be modified through programming to adapt to a flash bus operation required by a new flash interface standard. An operation command can be parsed by only fixing logics of physical modules in the flash interface controller and reading first type microcode and second type microcode that are related to the operation command. Therefore, various protocols and flash interface standards can be adapted to, and flexibility is good.

Abstract: A method for operating a semiconductor memory device may include applying a program pulse for programming data of a first page included in the semiconductor memory device. The method may include determining whether the number of times of applying the program pulse has exceeded a first critical value. The method may include performing an error bit check on a second page coupled to the same word line as the first page, based on the determined result of whether the first critical value has been exceeded.

Abstract: According to one embodiment, a semiconductor storage device includes: a NAND string with a first set of memory cells including a first memory cell; and a second set of memory cells including a second memory cell disposed above the first memory cell. The number of memory cells included in the first set is different from that of memory cells included in the second set. During a program verify operation when a data item of a level is written to a memory cell of the first set and a memory cell of the second set, a first verify voltage is applied to the gate of the memory cell of the first set and a second verify voltage different from the first verify voltage is applied to the gate of the memory cell of the second set.

Abstract: Disclosed is a system and method for performing direct memory characterization of memory cells in a memory array using peripheral transistors. A memory array is fabricated using a mask layer defining routing for a set of first stage periphery transistors electrically connected to the word lines of the memory array. A revised mask is used for defining a different routing for a set of second stage periphery transistors including different characteristics than the first stage periphery transistors. Testing is conducted by applying a simulated Erase signal to the nonvolatile memory cells and determining which cells are erased. Based on this test, certain characteristics of the first and/or second stage periphery transistors can be identified that provide improved conditions for the nonvolatile memory cells. A product chip can be manufactured using modified versions of the first stage periphery transistors that incorporate the characteristics that provide the improved condition(s).

Abstract: Disclosed is a memory device. The memory device includes a memory cell array that includes a target cell, a row decoder that drive a word line, and a write driver and sense amplifier that are configured to drive a bit line and a source line. The row decoder is configured to drive the word line in a first program operation and a second program operation. Between a start of the first program operation and an end of the second program operation, the write driver and sense amplifier are configured to continuously drive a bit line connected to the target cell with a second driving voltage or drive a source line connected to the target cell with a third driving voltage.

Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.

Abstract: Provided herein may be a memory controller and a method of operating the same. The memory controller may include a control component configured to control an operation of a semiconductor memory device including a plurality of memory cells in response to a request from a host. The control component may be configured to select a subset of memory cells, among all memory cells in a selected page of the semiconductor memory device, and to determine an optimal read voltage based on the select subset of memory cells.

Abstract: A method of operating a memory device includes performing a data read operation on at least one victim sub-block within a memory block containing a plurality of sub-blocks therein, in response to an erase command directed to a selected sub-block within the plurality of sub-blocks. Next, a soft program operation is performed on the at least one victim sub-block. This soft programming operation is then followed by an operation to erase the selected sub-block within the plurality of sub-blocks. This operation to erase the selected sub-block may include providing an erase voltage to a bulk region of a substrate on which the memory block extends, and the at least one victim sub-block may be disposed between the selected sub-block and the substrate.

Abstract: Provided herein may be a memory controller and a method of operating the same. The memory controller may include a control component configured to control an operation of a semiconductor memory device including a plurality of memory cells in response to a request from a host. The control component may be configured to select a subset of memory cells, among all memory cells in a selected page of the semiconductor memory device, and to determine an optimal read voltage based on the select subset of memory cells.

Abstract: Provided herein may be a memory controller and a method of operating the same. The memory controller may include a control component configured to control an operation of a semiconductor memory device including a plurality of memory cells in response to a request from a host. The control component may be configured to select a subset of memory cells, among all memory cells in a selected page of the semiconductor memory device, and to determine an optimal read voltage based on the select subset of memory cells.

Abstract: An apparatus includes a programming circuit configured to supply a program pulse to increase a threshold voltage of a memory cell. The apparatus also includes a sensing circuit configured to determine that the threshold voltage of the memory cell satisfies a trigger threshold voltage in response to the program pulse. The apparatus further includes a damping circuit configured to increase a voltage of a bit line connected to the memory cell after initiation of and during a second program pulse in response to the threshold voltage of the memory cell satisfying the trigger threshold voltage, the second program pulse being sent by the programming circuit.

Abstract: Techniques are described for reducing program disturb including neighbor word interference in a memory device. Voltages applied to the word lines adjacent to the selected word line WLn during program and read operations are adjusted. The adjacent word lines include WLn?1, a source-side adjacent word line of WLn, and WLn+1, a drain side adjacent word line of WLn. In one aspect, VWLn?1<VWLn+1 during the verify tests of the program operation for the data states above the lowest programmed data state and VWLn?1=VWLn+1 during the verify test for the lowest programmed data state. Also, VWLn?1<VWLn+1 during a read operation which distinguishes between the programmed data states and VWLn?1=VWLn+1 during a read operation which distinguishes between erased state and the lowest programmed data state.

Abstract: Described herein are embodiments related to first-pass dynamic program targeting (DPT) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device performs a DPT operation on the memory cell to calibrate a first program-verify (PV) target corresponding to a first first-pass programming distribution and a second PV target corresponding to a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

Abstract: Azimuthally-split metal-semiconductor alloy floating gate electrodes can be formed by providing an alternating stack of insulating layers and spacer material layers, forming a dielectric separator structure extending through the alternating stack, and forming memory openings that divides the dielectric separator structure into a plurality of dielectric separator structures. The spacer material layers are formed as, or are replaced with, electrically conductive layers, which are laterally recessed selective to the insulating layers and the plurality of dielectric separator structures to form a pair of lateral cavities at each level of the electrically conductive layers in each memory opening. After formation of a blocking dielectric layer, a pair of physically disjoined metal-semiconductor alloy portions are formed in each pair of lateral cavities as floating gate electrodes. A tunneling dielectric layer and a semiconductor channel layer is subsequently formed in each memory opening.

Abstract: A method of forming a vertical string of memory cells comprises forming a lower stack comprising first alternating tiers comprising vertically-alternating control gate material and insulating material. An upper stack is formed over the lower stack, and comprises second alternating tiers comprising vertically-alternating control gate material and insulating material having an upper opening extending elevationally through multiple of the second alternating tiers. The lower stack comprises a lower opening extending elevationally through multiple of the first alternating tiers and that is occluded by occluding material. At least a portion of the upper opening is elevationally over the occluded lower opening. The occluding material that occludes the lower opening is removed to form an interconnected opening comprising the unoccluded lower opening and the upper opening.

Abstract: Apparatuses and methods of data transmission between semiconductor chips are described. An example apparatus includes: a data bus inversion (DBI) circuit that receives first, second and third input data in order, and further provides first, second and third output data, either with or without data bus inversion. The DBI circuit includes a first circuit that latches the first input data and the third input data; a second circuit that latches the second input data; a first DBI calculator circuit that performs first DBI calculation on the latched first input data and the latched second input data responsive to the first circuit latching the first input data and the second circuit latching the second input data, respectively; and a second DBI calculator circuit that performs second DBI calculation on the latched second data and the latched third input data responsive to the first circuit latching the third input data.

Abstract: A method for fixing outlier bits is provided in the invention. The method is applied to a memory device, and a memory array of the memory device is divided into a plurality of blocks. The method includes the steps of setting an initial voltage and a terminal voltage of a margin read (MGRD) operation in each block, wherein the initial voltage is set in a distribution of a threshold voltage of each block; finding a MGRD spec corresponding to each block at a range defined by the initial voltage and the terminal voltage; detecting outlier bits in each block according to the MGRD spec corresponding to each block; and fixing the outlier bits in each block.

Abstract: Techniques are described for reducing an injection type of program disturb in a memory device. A charge isolation region is created in a channel of a NAND string on the source side of the selected word line, WLn, and spaced apart from WLn by one or more other word lines, when the program voltage is increased to a program voltage (Vpgm). The isolation region is created by applying 0 V or other low voltage to an isolation word line. The isolation region is maintained for a first portion of a time period in which Vpgm is applied. The charge isolation region can be modified based on factors associated with a risk of program disturb including the magnitude of Vpgm, the position of WLn in a set of word lines and an ambient temperature.

Abstract: Apparatuses and methods for temperature related error management are described. One or more apparatuses for temperature related error management can include an array of memory cells and a write temperature indicator appended to at least one predetermined number of bytes of the stored data in the array of memory cells. The apparatuses can include a controller configured to determine a numerical temperature difference between the write temperature indicator and a read temperature indicator and determine, from stored operations, an error management operation for the stored data based, at least in part, on comparison of the numerical temperature difference to a temperature difference threshold.

Abstract: Embodiments of this application provide a flash interface controller and an operation command processing method, and relate to the field of data storage. Programmable first type microcode and second type microcode are introduced to a flash interface controller. The first type microcode can be modified through programming to adapt to a procedure of parsing an operation command of a new protocol, and the second type microcode can be modified through programming to adapt to a flash bus operation required by a new flash interface standard. An operation command can be parsed by only fixing logics of physical modules in the flash interface controller and reading first type microcode and second type microcode that are related to the operation command. Therefore, various protocols and flash interface standards can be adapted to, and flexibility is good.

Abstract: Technology for a memory device is described. The memory device can include an array of memory cells and a memory controller. The memory controller can receive a request to program a memory cell within the array of memory cells. The memory controller can select one or more timing offsets for a programming pulse based on one or more of a polarity of access for the memory cell, a number of prior write cycles for the memory cell, or electrical distances between the memory cell and wordline/bitline decoders within the array of memory cells. The memory controller can initiate, in response to the request, the programming pulse with the one or more selected timing offset to program the memory cell within the array of memory cells.

Abstract: Provided herein may be a memory controller and a method of operating the same. The memory controller may include a control component configured to control an operation of a semiconductor memory device including a plurality of memory cells in response to a request from a host. The control component may be configured to select a subset of memory cells, among all memory cells in a selected page of the semiconductor memory device, and to determine an optimal read voltage based on the select subset of memory cells.

Abstract: According to one embodiment, a semiconductor storage device includes: a NAND string with a first set of memory cells including a first memory cell; and a second set of memory cells including a second memory cell disposed above the first memory cell. The number of memory cells included in the first set is different from that of memory cells included in the second set. During a program verify operation when a data item of a level is written to a memory cell of the first set and a memory cell of the second set, a first verify voltage is applied to the gate of the memory cell of the first set and a second verify voltage different from the first verify voltage is applied to the gate of the memory cell of the second set.

Abstract: A system for improving utilization of a nonvolatile flash memory device which has pages whose guaranteed per-cycle erase time and guaranteed number of cycles are known, the system comprising erase time determination functionality for individual pages; de-facto total erase-time accumulation functionality incrementing, for each erase cycle to which an individual page is subjected, by the individual page's de facto erase time per cycle as provided by the erase time measurement functionality; and flash memory page usage monitoring functionality operative to control usage of pages in flash memory including selecting at least one individual flash memory page depending on a comparison between the individual flash memory page's de facto total erase time and a guaranteed erase time computed as a product of the guaranteed per-cycle erase time and of the guaranteed number of cycles.

Abstract: The invention is directed to an electronic device. A memory device having improved reliability according to an embodiment includes a memory cell array including a plurality of memory cells, a peripheral circuit performing a program operation on selected memory cells, among the plurality of memory cells, and a control logic controlling the peripheral circuit to perform an additional program operation on memory cells corresponding to a deep erased state where the memory cells has a threshold voltage having a lower voltage level than a threshold voltage of an erase state, among the selected memory cells, after the program operation is completed.

Abstract: A system and method for utilizing a security key stored in non-volatile memory, and for generating a PUF-based data set on an integrated circuit including non-volatile memory cells, such as flash memory cells, are described. The method includes storing a security key in a particular block in a plurality of blocks of the non-volatile memory array; utilizing, in a security logic circuit coupled to the non-volatile memory array, the security key stored in the particular block in a protocol to enable access via a port by external devices or communication networks to data stored in blocks in the plurality of blocks; and enabling read-only access to the particular block by the security logic for use in the protocol, and preventing access to the particular block via the port.

Abstract: Provided is an operation method for a memory device. The memory device includes a memory array having a plurality of word lines and a plurality of bit lines. The operation method for the memory device includes: applying a program voltage to at least one selected word line of the word lines; and during a high level of the program voltage, based on respective locations of a plurality of selected bit line, which are to be written into data 0, on the word lines, applying different plurality of bit line voltages to the selected bit line which are to be written into data 0.

Abstract: A method for programming a non-volatile memory and a memory system are provided. Each of multiple cells of the non-volatile memory stores data having at least 2 bits. The method includes the following steps. At least one programming pulse is provided for programming a target cell of the cells. At least one program-verify pulse is provided for verifying whether the target cell is successfully programmed. It is determined that whether a threshold voltage of the target cell is greater than or equal to a program-verify voltage. When the threshold voltage is greater than or equal to the program-verify voltage, the target cell is set as successfully programmed. Next, a post-verifying operation is performed to the successfully programmed cell. The post-verifying operation includes determining whether the threshold voltage of the target cell is greater than or equal to a post-verifying voltage.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate. Memory stack structures are located in a memory array region, each of which includes a memory film and a vertical semiconductor channel. Contact via structures located in the terrace region and contact a respective one of the electrically conductive layers. Each of the electrically conductive layers has a respective first thickness throughout the memory array region and includes a contact portion having a respective second thickness that is greater than the respective first thickness within a terrace region. The greater thickness of the contact portion prevents an etch-through during formation of contact via cavities for forming the contact via structures.

Abstract: The present invention provides circuits, systems, and methods for programming a floating gate. As described herein, a floating gate tunneling device is used with an analog comparison device in a circuit having a floating reference node and an offset-mitigating feedback loop for iteratively programming a floating gate or multiple floating gates.