Abstract: A method for operating a semiconductor memory device having first and second bit lines, a gate electrode, an insulative layer, and a substrate includes applying first, second, and third biases to the first bit line, the second bit line, and the gate electrode, respectively, to induce carriers from the gate electrode to the insulative layer, where the carriers have the same type of conductivity as majority carriers in the substrate to thereby reduce a threshold voltage of the semiconductor memory device.

Abstract: A NAND flash memory device includes an array of NAND flash memory cells; a plurality of word lines connected to the NAND flash memory cells; and a plurality of bit lines connected to the NAND flash memory cells. Each bit line includes a first bit line portion, a second bit line portion, and a switching device extending between the first and second bit line portions to selectively connect the first and second bit line portions together. At least a first NAND flash memory cell is connected to the first bit line portion, and at least a second NAND flash memory cell is connected to the second bit line portion. By including primary and secondary page buffers, two pages of memory cells connected to a same group of bit lines can be programmed in a single programming operation, to achieve “double-speed” programming.

Abstract: A semiconductor memory device includes a semiconductor layer; a source layer provided in the semiconductor layer; a drain layer provided in the semiconductor layer; a body region provided in the semiconductor layer between the source layer and the drain layer; a gate insulation film provided on the body region; and a gate electrode provided on the gate insulation film, wherein data are written or read out by accumulating electric charge in the body region or releasing electric charge from the body region, and wherein a difference between the potential VSR of the source layer in a data-retaining period and the potential VGR of the gate electrode in the data-retaining period is smaller than a difference between the potential VSW of the source layer in a data write period and the potential VGR.

Abstract: A memory device including a plurality of memory cells, each with a control gate NMOS transistor sharing a floating gate with a program/erase PMOS transistor which is, in turn, connected in series with an access PMOS transistor. The memory cells are formed in a common N-Well formed in a P-substrate, the NMOS transistor being formed in a p-doped pocket or base. The program/erase PMOS includes a gate, and first and second P+ doped regions formed in the N-Well, wherein the first P+ region is electrically connected to a corresponding bit line. The access PMOS includes a gate, and first and second P+ regions formed within the N-Well, wherein the first P+ region is electrically connected to the second P+ region of the program/erase PMOS, and the gate is electrically connected to a corresponding word line.

Abstract: A One Time Programming (OTP) cell structure, a method of fabricating an OTP structure, and a method of programming a OTP cell structure. The OTP structure comprises a semiconductor substrate; an n Metal-Oxide-Semiconductor (nMOS) programming structure formed on the substrate; wherein respective electrical contacts to a source of the nMOS programming structure and to a p-bulk of the substrate are separated for individual biasing of the source and the p-bulk of the substrate.

Abstract: A nonvolatile semiconductor memory device includes a plurality of memory cell units and a memory cell array in which the memory cell units are arranged in matrix. Each of the memory cell units has a given number of electrically writable and erasable memory cell transistors that are connected in a column direction to form a memory cell column. One end of the memory cell column is connected to a bit line via a first select gate transistor, and the other end thereof is connected to a source line via a second select gate transistor. At least part of a gate electrode of one of the first and second select gate transistors is provided in a trench formed in the surface area of a substrate along a direction parallel to a word line.

Abstract: An electrically erasable/programmable CMOS logic memory cell for RFID applications and other mobile applications includes a tunneling capacitor, a control capacitor, and a CMOS inverter that share a single floating gate. A two-phase program/erase operation performs an initial Fowler-Nordheim (F-N) injection phase using the capacitors, and then a Band-to-Band Tunneling (BBT) phase using the CMOS inverter. Both the F-N injection and BBT phases are performed using low currents and low voltages (i.e., 5V or less). The tunneling and control capacitors are fabricated in isolated P-wells (IPWs) including both N+ and a P+ regions to enable the use of both positive and negative programming voltages during the F-N and BBT programming/erasing operations.

Abstract: A semiconductor integrated device having a plurality of memory cells, each including a floating gate, a control gate and an auxiliary gate formed over a side surface of the floating gate through an insulator film. Auxiliary gates coupled to selected memory cells function to generate hot electrons and are alternately arranged with other auxiliary gates functioning to prevent write errors in the non-selected memory cells.

Abstract: A non-volatile memory cell and method of fabrication are provided. The non-volatile memory cell includes a substrate of a first conductivity type, a first dopant region of a second conductivity type in the substrate, a second dopant region of the first conductivity type in the first dopant region, a first isolation region overlaying a portion of the substrate, the first dopant region, and the second dopant region, a second isolation region overlaying another portion of the substrate, the first dopant region, and the second dopant region, a contact region of the first conductivity type in the second dopant region, the contact region extending between the first isolation region and the second isolation region and being more heavily doped than the second dopant region, a gate dielectric atop the first isolation region and a portion of the contact region, and a gate conductor atop the gate dielectric.

Abstract: Shifts in the apparent charge stored on a floating gate (or other charge storing element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other adjacent charge storing elements). The problem occurs most pronouncedly between sets of adjacent memory cells that have been programmed at different times. To compensate for this coupling, the read process for a given memory cell will take into account the programmed state of an adjacent memory cell.

Abstract: A non-volatile memory cell formed on a sidewall of MOS transistor and method of operating the same are disclosed. The MOS based non-volatile memory cell is formed in the n-well and compatible with CMOS processes comprising a selecting gate, two ONO spacers, a p+ source/drain, and a p extended source region and an n extended drain. To program the cell, two strategies can be taken: (1) a band to band hot electron injection can be carried out and (2) channel hot hole induced hot electron injection. To read the nonvolatile cell, a reverse read is taken. In the reading process, the biased on the selecting gate has to make sure form a channel beneath selecting gate having its narrower end contacting with a the depletion boundary due to a reverse bias exerted on the source and n-well body so that if the cell stored with electron therein, a hole current flowing from the drain to the source can be read. To erase the datum in the cell, two approaching can be carried out.

Abstract: A cost efficient nonvolatile memory cell may include an inverter, an access gate coupled to the inverter for controlling access to the memory cell, and a control gate. The inverter may include a floating gate at an input of the inverter, the floating gate formed in a first polysilicon layer, and a tunnel window formed in a tunnel oxide area, wherein the tunnel oxide area is covered by at least a portion of the floating gate. The control gate may control charge on the floating gate, and may be formed in a second polysilicon layer, wherein the second polysilicon layer is above the first polysilicon layer.

Abstract: Variations in memory array and cell configuration are shown, which eliminate punch-through disturb, reverse-tunnel. Several configurations are shown which range from combined and separate source lines for each row of cells, a two transistor cell containing a read transistor and a program transistor connected by a merged floating gate, and a two transistor cell where the program transistor has an extra implant to raise the Vt of the transistor to protect against punch-through disturb. A method is also described to rewrite disturbed cells, which were not selected to be programmed.

Abstract: A nonvolatile semiconductor memory device including: a first capacitor, one end of the first capacitor being connected to a floating node; a detection transistor, a gate electrode of the detection transistor being connected to the floating node; a second capacitor, one end of the second capacitor being connected to the floating node, and the other end of the second capacitor being connected to a drain of the detection transistor; and an auxiliary capacitor, one end of the auxiliary capacitor being connected to the floating node, wherein, at least during write operation, a control gate voltage is supplied to the other end of the first capacitor, a control drain voltage is supplied to the other end of the second capacitor, and a capacitance ratio correction voltage which is higher than a voltage of the floating node is supplied to the other end of the auxiliary capacitor.

Abstract: The invention is directed to a layout of nonvolatile memory device. The memory cell has a gate electrode, a first doped electrode, and a second doped electrode. The first doped electrode is coupled to the bit line. The gate electrode is coupled to one separated word line. A shared coupled capacitor structure is coupled between all of memory cells of the adjacent bit lines from the second doped electrode. The capacitor structure has at least two floating-gate MOS capacitors. Each floating-gate MOS capacitor has a floating-gate transistor having a floating gate, a first S/D region and a second S/D region; and a MOS capacitor coupled to the floating gate. The first S/D region is coupled to the second doped electrode of the corresponding one of the transistor memory cells, and the second S/D region is shared with an adjacent one of the floating-gate transistor.

Abstract: A storage device that is capable of receiving an analog signal and storing it as a digital signal. The storage device includes an input node configured to receive an analog input voltage and two non-volatile storage cells. A second non-volatile memory cell is coupled to receive the analog input signal from the input node. The second non-volatile memory cell is capable of being programmed to a one of a plurality of programming states. The first non-volatile memory cell, which is coupled to the second non-volatile memory cell, is also capable of being programmed to one of a plurality of programming states. During operation, the second non-volatile memory cell and the first non-volatile memory cell are both programmed to a selected second programming state indicative of the magnitude of the analog input voltage. The first programming state and the second programming state are together are indicative of a digital value commensurate with the magnitude of the analog input voltage.

Abstract: An memory device, and method of making same, that includes source and drain regions defining a channel region therebetween. A select gate is formed over and insulated from a first portion of the channel region. A conductive floating gate is disposed over and insulated from the source region and a second portion of the channel region. A notch is formed in the floating gate bottom surface having an edge that is either aligned with an edge of the source region or is disposed over the source region. A conductive control gate is disposed adjacent to the floating gate. By having the source region terminate under the thicker insulation region provided by the notch, the breakdown voltage of the source junction is increased. Alternately, the lower portion of the floating gate is formed entirely over the source region, for producing fringing fields to control the adjacent portion of the channel region.

Abstract: An array of multi-level non-volatile memory transistors features a transistor construction with a conductive polysilicon control gate having opposed sidewalls insulatively spaced just above the substrate. Conductive polysilicon spacers are separated from the opposed sidewalls by thin tunnel oxide. Source and drain implants are beneath or slightly outboard of the spacers. Insulative material is placed over the structure with a hole cut above the control gate for contact by a gate electrode connected to, or part of, a conductive word line. The array has auxiliary low voltage transistors which may be made at the same time as the formation of the memory transistors. The auxiliary transistors apply opposite phase clock pulses to source and drain electrodes of transistors in the array so that first one side of each memory transistor may be written to, or read, then the other side.

Abstract: A semiconductor integrated device having a plurality of memory cells, each including a floating gate, a control gate and an auxiliary gate formed over a side surface of the floating gate through an insulator film. Auxiliary gates coupled to selected memory cells function to generate hot electrons and are alternately arranged with other auxiliary gates functioning to prevent write errors in the non-selected memory cells.

Abstract: In accordance with a method of programming an NVM array that includes 4-transistor PMOS non-volatile memory (NVM) cells having commonly connected floating gates, for all the cell's in the array that are to be programmed, all the electrodes of the cell are grounded. Then, an inhibiting voltage Vn is applied to the bulk-connected source region Vr of the cell's read transistor Pr, to the commonly connected drain, bulk and source regions Ve of the cell's erase transistor Pe, and to the drain region Dr of the read transistor Pr. The source region Vp and the drain region Dp of the cell's programming transistor Pw are grounded. The bulk Vnw of the programming transistor Pw is optional; it can be grounded or remain at the inhibiting voltage Vn. For all cells in the NVM array that are not selected for programming, the inhibiting voltage Vn is applied to Vr, Ve and Dr and is also applied to Vp, Dp and Vnw.

Abstract: A non-volatile memory device has a channel region between source/drain regions, a floating gate, a control gate, a first dielectric region between the channel region and the floating gate, and a second dielectric region between the floating gate and the control gate. The first dielectric region includes a high-K material. The non-volatile memory device is programmed and/or erased by transferring charge between the floating gate and the control gate via the second dielectric region.

Abstract: A method for programming a split gate memory cell comprises the following steps. First, a split gate memory cell formed on a semiconductor substrate of a first conductive type, e.g., p-type, is provided. The split gate memory cell has two bitlines of a second conductive type, e.g., n-type, a select gate, a floating gate, a wordline and a dielectric layer deposited between the floating gate and the semiconductor substrate, wherein the select gate and floating gate are transversely disposed between the two bitlines, the wordline is above the select gate and floating gate. Second, a positive voltage is applied to the wordline so as to turn on the floating gate, and a negative voltage is applied to the bitline next to the floating gate, whereby a bias voltage across the tunnel dielectric layer is generated for programming, that is, the so called F-N programming.

Abstract: An electrically erasable and programmable memory includes a memory array and a non-volatile register integrated with the memory array. The memory array includes normal memory cells arranged in rows and columns. Normal bit lines are coupled to the columns of the normal memory cells, and word lines are coupled to the rows of the normal memory cells. The non-volatile register includes at least one memory point. Each memory point includes at least one normal memory cell coupled to one of the normal bit lines. Each normal memory cell includes a floating-gate transistor having a floating gate and a tunnel window associated with the floating gate. A selection transistor is coupled to the floating-gate transistor. Each memory point further includes at least one special memory cell including a floating-gate transistor having a floating gate coupled to the floating gate of the normal memory cell. The special memory cell is devoid of a tunnel window.

Abstract: One aspect of the present subject matter relates to a one-device non-volatile memory cell. The memory cell includes a body region, a first diffusion region and a second diffusion region formed in the body region. A channel region is formed in the body region between the first diffusion region and the second diffusion region. The memory cell includes a gate insulator stack formed above the channel region, and a gate to connect to a word line. The gate insulator stack includes a floating plate to selectively hold a charge. The floating plate is connected to the second diffusion region. The memory cell includes a diode that connects the body region to the second diffusion region such that the floating plate is charged when the diode is reversed biased. Other aspects are provided herein.

Abstract: An array of multiple-gate memory cells includes sectors. The sectors include at least one row of multiple-gate memory cells. The multiple-gate memory cells comprise a semiconductor body and a plurality of gates arranged in series on the semiconductor body. A charge storage structure on the semiconductor body includes charge trapping locations beneath each of all or some of the gates in the plurality of gates. Word lines and bit lines source and drain bias voltages to the semiconductor body near a first gate and a last gate in the series, and to the plurality of gates are included. The multiple-gate memory cell includes a continuous, multiple-gate channel region beneath the plurality of gates in the series, with charge storage locations between some or all of the gates. Sector select lines are included to couple selected sectors to the bit lines.

Abstract: A split-gate, P-channel flash memory cell having a band-to-band hot electron (BBHE) programming method is defined to improve the endurance characteristics of performance of the cell. The split-gate, P-channel structure, which includes a P+ drain, P+ source, floating gate and a control gate, advantageously improves protection from over-erase and hot-hole trap conditions, and improves programming speed and higher injection efficiency. The cell is erased by a polysilicon-polysilicon tunneling technique.

Abstract: A nonvolatile memory and a method of operating the same are proposed. The nonvolatile memory has single-gate memory cells, wherein a structure of a transistor and a capacitor is embedded in a semiconductor substrate. The transistor comprises a first conducting gate stacked on the surface of a dielectric with doped regions formed at two sides thereof as a source and a drain. The capacitor comprises a doped region, a dielectric stacked thereon, and a second conducting gate. The conducting gates of the capacitor and the transistor are electrically connected together to form a single floating gate of the memory cell. The semiconductor substrate is p-type or n-type. Besides, a back-bias program write-in and related erase and readout operation ways are proposed for the single-gate memory cells.

Abstract: A method of selectively programming nonvolatile memory cells in which multiple programming voltages are used to obtain the desired voltage on the storage nodes of the cells selected for programming, while the storage nodes of unselected cells remain undisturbed.

Abstract: An memory device, and method of making same, that includes source and drain regions defining a channel region therebetween. A select gate is formed over and insulated from a first portion of the channel region. A conductive floating gate is disposed over and insulated from the source region and a second portion of the channel region. A notch is formed in the floating gate bottom surface having an edge that is either aligned with an edge of the source region or is disposed over the source region. A conductive control gate is disposed adjacent to the floating gate. By having the source region terminate under the thicker insulation region provided by the notch, the breakdown voltage of the source junction is increased. Alternately, the lower portion of the floating gate is formed entirely over the source region, for producing fringing fields to control the adjacent portion of the channel region.

Abstract: An integrated nonvolatile memory circuit having a plurality of control devices. Separate devices execute distinct control, erase, write and read operations, thereby allowing each device to be individually selected and optimized for performing its respective operation.

Abstract: A method of programming a nonvolatile memory cell in which a ramped control voltage is used to obtain the desired voltage on the storage node.

Abstract: Novel memory cells utilize source-side injection, allowing very small programming currents. If desired, to-be-programmed cells are programmed simultaneously while not requiring an unacceptably large programming current for any given programming operation. In one embodiment, memory arrays are organized in sectors with each sector being formed of a single column or a group of columns having their control gates connected in common. In one embodiment, a high speed shift register is used in place of a row decoder to serially shift in data for the word lines, with all data for each word line of a sector being contained in the shift register on completion of its serial loading. In one embodiment, speed is improved by utilizing a parallel loaded buffer register which receives parallel data from the high speed shift register and holds that data during the write operation, allowing the shift register to receive serial loaded data during the write operation for use in a subsequent write operation.

Abstract: A memory device includes a coupling capacitor and a field-effect transistor. The coupling capacitor is formed from (1) a first dopant region in a second dopant region on a substrate, (2) a gate dielectric atop the first dopant region, and (3) a first gate conductor atop the gate dielectric. The coupling capacitor has the first gate conductor coupled to a second gate conductor of the field-effect transistor. A voltage can be applied to the second dopant region to isolate the coupling capacitor from the substrate by reverse biasing a PN junction formed between the first dopant region and the second dopant region.

Abstract: A selection transistor for a group of memory cells, preferably composed of 16-32 memory cells, is respectively introduced into the feed lines to the memory cells The selection transistor is opened to a line group for reading, while the control gates of all lines are low potential, and the current for each reading column leading through said line group is measured and stored. In a second step, the control gate of the line to be read is brought to a higher reading potential and the resulting current is compared to the previous current.

Abstract: A method of designing and fabricating a control unit for electronic microcontrollers or microprocessors that includes fabricating a finite state machine having at least one combinatorial network, the finite state machine having a plurality of control subunits, each control subunit structured to correspond to one combinatorial logic network. Each unit in the plurality of control subunits is independently connected to an arbitration block to provide information about a possible future state and to receive a present state command.

Abstract: A floating gate circuit has a level shift circuit. The floating gate circuit includes: a floating gate; a first and second tunnel device formed respectively between a first and second tunnel electrode; a first circuit coupled to the floating gate for generating an output voltage at an output terminal; a level shift circuit having a third tunnel device coupled between the output terminal and the first tunnel electrode; and a second circuit for causing a first current to flow through the first and second tunnel devices and for causing a second current to flow through the third tunnel device. The floating gate circuit then settles to a steady state condition during the set mode such that the first and second currents are approximately equal and the floating gate voltage and the output voltage are approximately equal.

Abstract: One aspect of the present subject matter relates to a one-device non-volatile memory cell. The memory cell includes a body region, a first diffusion region and a second diffusion region formed in the body region. A channel region is formed in the body region between the first diffusion region and the second diffusion region. The memory cell includes a gate insulator stack formed above the channel region, and a gate to connect to a word line. The gate insulator stack includes a floating plate to selectively hold a charge. The floating plate is connected to the second diffusion region. The memory cell includes a diode that connects the body region to the second diffusion region such that the floating plate is charged when the diode is reversed biased. Other aspects are provided herein.

Abstract: A novel structure of nonvolatile memory is disclosed. The non-volatile memory includes two serially connected PMOS transistors. The characteristic of the devices is that bias is not necessary to apply to the floating gate during the programming mode. Thus, the control gate is omitted for the structure or layout, thereby saving the space for making the control gate. The carrier may be “automatically injected” into floating gate for programming the status of the devices.

Abstract: An embodiment of the invention provides a circuit and method for optimizing an index hashing function in a cache memory on a microprocessor. A programmable index hashing function is designed that allows the index hashing function to be programmed after the microprocessor has been fabricated. The index hashing function may be “tuned” by running an application on the microprocessor and observing the performance of the cache memory based on the type of index hashing function used. The index hashing function may be programmed by several methods.

Abstract: An integrated circuit that may include an array such as a static random access memory (SRAM) with high threshold device array devices and in selected other devices to reduce leakage. Devices with high threshold have a thicker gate oxide or a high k dielectric gate oxide that is selected based on threshold voltage (VT) variations with gate oxide dielectric type or gate oxide thickness for the particular technology, e.g., PD SOI CMOS. High threshold devices may be used in non-core circuits, e.g., test circuits. Also, non-critical paths may be identified and a non-critical path margin identified. A thicker device threshold is selected for non-critcal path FETs based on the non-critical path margin. Non-critical path delays are re-checked. FETs are formed with the selected thicker gate oxide for any non-critical paths passing the re-check and in array FETs with non-selected FETs being formed with normal gate oxide thickness.

Abstract: A complimentary non-volatile memory (CNVM) cell includes an n-channel transistor and a p-channel transistor that have drains connected like a CMOS inverter, and that are controlled by a shared floating gate and a shared control gate. The CNVM cell is programmed by band-to-band tunneling (BBT) electrons generated in the source of p-channel transistor, and is erased by BBT holes generated in the source of n-channel transistor (or by back tunneling of electrons from the floating gate). Read out is performed using a select transistor connected to the drains of the n-channel and p-channel transistors.

Abstract: A self aligned method of forming a semiconductor memory array of floating gate memory cells in a semiconductor substrate, and an array formed thereby, whereby each memory cell includes a trench formed into a surface of a semiconductor substrate, spaced apart source and drain regions with a channel region formed therebetween. The drain region is formed underneath the trench, and the channel region includes a first portion that extends substantially vertically along a sidewall of the trench and a second portion that extends substantially horizontally along the surface of the substrate. An electrically conductive floating gate is formed over and insulated from at least a portion of the channel region and a portion of the source region. An electrically conductive control gate is formed having a first portion disposed in the trench and a second portion formed over but insulated from the floating gate.

Abstract: A method and circuit for programming a floating gate in a differential floating gate circuit to an input set voltage. The circuit includes a differential amplifier circuit for comparing the voltage on a floating gate with an input set voltage, and a gain stage for amplifying any voltage differential between those two voltages. During a set mode, an erase and a program tunnel device operate in a dual conduction mode for modifying the voltage on the floating gate. The output at the gain stage is used to modify the voltage across the erase tunnel device via a feedback loop until the differential floating gate circuit settles to a steady state condition such that the floating gate voltage is approximately equal to the input set voltage. Thereafter, during a read mode, the differential floating gate circuit may be reconfigured to preferably function as a voltage comparator with a built-in voltage reference.

Abstract: For particularly flexible and space-saving information storage, in the case of a floating gate memory cell and a corresponding semiconductor memory device, the invention includes providing a floating gate configuration with a plurality of floating gates. Each of the floating gates is configured for substantially independent information storage. As a result, a plurality of information units can be stored independently of one another in the memory cell.

Abstract: A memory transistor has a pair of separate floating gates overlying end regions of a channel and a control gate that overlies the floating gates and a central region of the channel. The memory transistor effectively operates as a pair of floating gate transistors with an intervening select transistor. Each floating gate can be charged to store a distinct binary, analog, or multi-bit value. The direction of the channel current controls which floating gate receives channel hot electron injection during programming and which floating gate state is sensed during reading. A read operation biases the word line higher that the threshold voltage used to store data and compares the resulting channel to reference currents to identify a stored binary, analog, or multi-bit value. The threshold voltage range can include negative threshold voltages, which increases the available range for multi-bit-per-floating gate storage.

Abstract: A method of forming a semiconductor memory having rows and columns of memory cells is as follows; forming a plurality of rows of program gate lines from a second layer polysilicon; forming a plurality of rows of select gate lines from a third polysilicon layer; forming a plurality of rows of diffusion source lines: forming a plurality of local bitlines from a first layer metal, the cells along each column being divided into a pre-designated number of groups, and drains of the cells in each group being connected to a local bitline extending across the cells in the group of cells; and forming a plurality of global bitlines from a second layer metal extending along every two columns of cells, each global bitline being configured to selectively provide electrical connection to the local bitlines along the corresponding two columns of cells.

Abstract: A Scalable Two-Transistor Memory (STTM) cell array having a 4F2 unit cell area, where F is the minimum feature size. The data lines and the bit lines alternate and are adjacent to each other along the Y-axis direction, and the word lines are laid out along the X-axis direction. Each STTM cell consists of a floating gate MOS sensing transistor at the surface of a semiconductor substrate, with a vertical double sidewall gate multiple tunnel junction barrier programming MOS transistor on top of the sensing transistor. A data line connects all source regions of the programming transistors and a bit line connects all the source/drain regions of the sensing transistors in a column direction. A word line connects all double sidewall gate regions of programming transistors in a row direction. This invention also deals with a column addressing circuit as well as the driving method for the circuit.

Abstract: A contactless NOR-type memory array of the present invention comprises a plurality of integrated floating-gate layers formed on a shallow-trench isolation structure, a plurality of word lines having an interlayer dielectric layer formed on an elongated control-gate layer for each word line, a plurality of common-source bus lines having a silicided conductive layer formed over a flat bed for each common-source line and, a plurality of bit lines with each bit line being integrated with a plurality of silicided conductive islands formed on the common-drain diffusion regions. The contactless NOR-type memory array of the present invention offers a cell size of 4F2, no contact problems for shallow source/drain junction of the cell, lower common-source bus line resistance and capacitance, and better density*speed*power product as compared to existing NAND-type memory array.

Abstract: An EEPROM cell includes a sense transistor and a select transistor, each having a first active region (110, 114) formed in a substrate, and sharing a second active region (112). The EEPROM cell may also include a floating gate (125) having a first portion (FG2) forming a gate region for said sense transistor, and a second portion (FG1) overlying the second active region and forming a program junction with said second active region. The first portion of said floating gate has a concentration of an impurity greater than a concentration of said impurity in the second portion of the floating gate.

Abstract: In a semiconductor integrated circuit device including a third gate, the present invention improves miniaturization and operation speed and reduces a defect density of an insulator film. In a semiconductor integrated circuit device including a well of a first conductivity type formed in a semiconductor substrate, a source/drain diffusion layer of a second conductivity type inside the well, a floating gate formed over the semiconductor substrate through an insulator film, a control gate formed and isolated from the floating gate through an insulator film, word lines formed by connecting the control gates and a third gate formed and isolated from the semiconductor substrate, the floating gate and the control gate through an insulator film and different from the floating gate and the control gate, the third gate is buried into a space of the floating gates existing in a direction vertical to the word line and a channel.