Abstract: Methods of providing an air- and/or moisture-barrier coating on at least a portion of a two-dimensional material are described. In particular, the methods provide an improved approach for providing a doped two-dimensional material, preferably graphene, on a substrate wherein at least a portion of the two-dimensional material is coated with an air- and/or moisture-barrier coating that comprises an inorganic oxide, fluoride or sulfide. Two-dimensional materials provided with an air- and/or moisture impermeable inorganic oxide, fluoride or sulfide coating and an electronic device comprising the same are also described.

Abstract: A non-volatile memory device may include a control plug formed over a substrate. A floating gate may be formed over the substrate, the floating gate surrounding the control plug and being separated from the control plug by a gap. A first charge blocking layer may be formed over sidewalls of the floating gate to fill the gap.

Abstract: A system for detecting a laser attack on an integrated circuit chip formed in a semiconductor substrate, including a detection device capable of detecting voltage variations of the substrate. The system includes P-type first wells and N-type second wells extending in a P-type upper portion of the substrate; an N-type buried layer extending under at least a portion of the first and second wells; biasing contacts for the second wells and the buried layer; ground contacts for the first wells; and substrate contacts for detecting a substrate voltage, the detection contacts surrounding the first and second wells. The detection device comprises a resistor having a first terminal connected to said ground contacts of the first wells and a second terminal connected to said substrate contacts; and a comparator connected in with the resistor configured to detect a potential difference across the resistor.

Abstract: A resistor divider including two resistors, which is connected to a control gate of a P-channel non-volatile memory element, and two switch transistors connected in parallel to the two resistors are used to adjust the potential of the control gate so that a potential of a floating gate is set in the vicinity of a threshold of the memory element in writing. In the P-channel non-volatile memory element, because the potential of the floating gate is set in the vicinity of the threshold of the memory element, the electric field between a pinch-off point and a drain becomes stronger so that hot carriers are more likely to be generated. Consequently, the write characteristics are improved, and writing can be performed at a low voltage.

Abstract: Offset voltages developed on floating nodes on inputs to high-performance amplifiers that are DC isolated from the data signals input to amplifiers are cancelled by connecting a highly resistive element between the input node and a predetermined potential, particularly useful in proximity communication systems in which two chips are connected through capacitive or inductive coupling circuits formed jointly in the two chips. The resistive element may be an off MOS transistor connected between the node and a desired bias voltage or a MOS transistor with its gate and drain connected to the potential. Multiple bias voltages may be distributed to all receivers and locally selected by a multiplexer for application to one or two input nodes of the receiver. The receiver output can also serve as a predetermined potential when the resistive element has a long time constant compared to the data rate or the resistive element is non-linear.

Abstract: A controller for dynamic redefinition of a short stack initialization to provide a low cost generic controller. The controller may be built with a network variable interface which has its variables initially selected by the time of the completion of the build. Thus, if different network variables are desired, then the controller needs to be placed with the builder or special technician for implementing the changes. The present invention modifies that controller so as to provide a capability of changing the network variables without the need of the builder or anyone else to modify the network variables in the controller's interface. The network variables may now be changed by an operator or customer, even while that controller is in operation.

Abstract: Memory devices are disclosed, such as those that include a semiconductor-on-insulator (SOI) NAND memory array having a boosting plate. The boosting plate may be disposed in an insulator layer of the SOI substrate such that the boosting plate exerts a capacitive coupling effect on a p-well of the memory array. Such a boosting plate may be used to boost the p-well during program and erase operations of the memory array. During a read operation, the boosting plate may be grounded to minimize interaction with p-well. Systems including the memory array and methods of operating the memory array are also disclosed.

Abstract: An efficient erasure is performed. The voltage of a source line SL is manipulated in units of a sector providing a plurality of memory cells. An erase command is received for the desired memory cells to be erased in a plurality of word line WL units arranged within a sector and all data within the sector, which includes the desired memory cells to be erased, is saved in a separate memory. Erasure is then performed for the entire sector, and among the saved data the data outside the desired memory cells to be erased is returned to the memory cells.

Abstract: An integrated circuit for storing data, and for application in a memory card that operates in cooperation with at least one of an external acquisition system and an external processing system includes input/output terminals for receiving the data to be stored, and an electrically programmable non-volatile memory for storing the data in digital format. The memory includes a first terminal for receiving a programming signal for enabling storage of the data, and a second terminal for receiving a reading signal for enabling output of the stored data via the input/output terminals. A memory control circuit is connected to the first and second terminals of the electrically programmable non-volatile memory, and to the input/output terminals for generating programming and reading signals based upon the command signal. The electrically programmable non-volatile memory is erasable by electromagnetic radiation for permitting a non-electrical erasure of the stored data.

Abstract: A memory device having a plurality of memory cells employs a method to detect a light attack on the memory device. The method utilizes at least one memory cell to detect a light attack when the memory cell is in an inactive state, and outputs a signal indicating whether a light attack is detected. In one case, the method includes turning off all of the memory cells of memory blocks of the memory device that are not currently being accessed for a read/write operation; sensing a leakage current of at least one of the memory cells of the memory blocks that are not currently being accessed for a read/write operation; and detecting a light attack on the memory device when a leakage current of the one of the memory cells of the memory blocks that are not currently being accessed for a read/write operation is greater than a threshold.

Abstract: A semiconductor device has a semiconductor substrate that in turn has a top semiconductor layer portion and a major supporting portion under the top semiconductor layer portion. An interconnect layer is over the semiconductor layer. A memory array is in a portion of the top semiconductor layer portion and a portion of the interconnect layer. The memory is erased by removing at least a portion of the major supporting portion and, after the step of removing, applying light to the memory array from a side opposite the interconnect layer. The result is that the memory array receives light from the backside and is erased.

Abstract: Disclosed are a semiconductor device and a method of fabricating the same. The semiconductor device can include a first wafer including a light emitting diode (LED), a second wafer including a flash cell formed corresponding to the LED, and a conductive via that electrically connects the first wafer to the second wafer.

Abstract: A data storage includes a part of functioning for, when data reading operation is carried out on a storage part storing data for a case where the data storage is handled in a predetermined manner, causing predetermined data different from target data to be read out instead of the target data.

Abstract: The integration period of an imaging cell, or the time that an imaging cell is exposed to light energy, is substantially increased by utilizing a single-poly, electrically-programmable, read-only-memory (EPROM) structure to capture the light energy. Photogenerated electrons are formed in the channel region of the EPROM structure from the light energy. The photogenerated electrons are then accelerated into having ionizing collisions which, in turn, leads to electrons being injected onto the floating gate of the EPROM structure at a rate that is proportionate to the number of photons captured by the channel region.

Abstract: The present invention provides a flash memory integrated circuit and a method of fabricating the same. A tunnel dielectric in an erasable programmable read only memory (EPROM) device is nitrided with a hydrogen-bearing compound, particularly ammonia. Hydrogen is thus incorporated into the tunnel dielectric, along with nitrogen. The gate stack is etched and completed, including protective sidewall spacers and dielectric cap, and the stack lined with a barrier to hydroxyl and hydrogen species. Though the liner advantageously reduces impurity diffusion through to the tunnel dielectric and substrate interface, it also reduces hydrogen diffusion in any subsequent hydrogen anneal. Hydrogen is provided to the tunnel dielectric, however, in the prior exposure to ammonia.

Abstract: A method and apparatus are disclosed for detecting if a semiconductor circuit has been exposed to ultra-violet light. An ultra-violet light detection circuit detects exposure to ultra-violet light and will automatically activate a security violation signal. The security violation signal may optionally initiate a routine to clear sensitive data from memory or prevent the semiconductor circuit from further operation. The ultra-violet light detection circuit detects whether a semiconductor circuit has been exposed to ultra-violet light, for example, by employing a dedicated mini-array of non-volatile memory cells. At least two active bit lines, blprg and bler, are employed corresponding to program and erase, respectively. One of the bit lines is only programmable and the other bit line is only eraseable. Generally, all of the bits in the dedicated non-volatile memory array are initially in approximately the same state, which could be erased, programmed or somewhere in between.

Abstract: An erasable programmable read only memory includes two serially connected P-type metal-oxide semiconductor (MOS) transistors, wherein a first P-type MOS transistor acts as select transistor, a gate of the first P-type MOS transistor is coupled to select gate voltage, a first node of the first P-type MOS transistor connected to source line voltage, a second node of the first P-type MOS transistor connected to a first node of a second P-type MOS transistor, wherein a second node of the second P-type MOS transistor is connected to bit line voltage, wherein a gate of the second P-type MOS transistor serves as a floating gate, wherein the erasable programmable read only memory does not need to bias a certain voltage on a control gate for programming and thereby injecting hot carriers onto the floating gate, and wherein the erasable programmable read only memory is capped by dielectric materials which are transparent to ultraviolet (UV) light.

Abstract: A method and apparatus are disclosed for detecting if a semiconductor circuit has been exposed to ultra-violet light. An ultra-violet light detection circuit detects exposure to ultra-violet light and will automatically activate a security violation signal. The security violation signal may optionally initiate a routine to clear sensitive data from memory or prevent the semiconductor circuit from further operation. The ultra-violet light detection circuit detects whether a semiconductor circuit has been exposed to ultra-violet light, for example, by employing a dedicated mini-array of non-volatile memory cells. At least two active bit lines, blprg and bler, are employed corresponding to program and erase, respectively. One of the bit lines is only programmable and the other bit line is only eraseable. Generally, all of the bits in the dedicated non-volatile memory array are initially in approximately the same state, which could be erased, programmed or somewhere in between.

Abstract: The presents invention provides an initialization method of a P-type silicon nitride read only memory. A P-type silicon nitride read only memory is provided. An ultra-violet light is uniformly radiated onto the P-type silicon nitride read only memory. Electron traps are thus evenly distributed in a silicon nitride layer of the P-type silicon nitride read only memory. The P-type silicon nitride read only memory is thus uniformly programmed to a low threshold voltage (Low|Vt|) to achieve the device initialization effect.

Abstract: A method and apparatus for erase operations of a flash memory block. In one embodiment, a method comprises erasing a predetermined percent of rows in a memory block, analyzing a number of erase pulses used to erase the predetermined percent and calculating an acceptable number of additional erase pulses which could be applied to the memory block to erase the remaining rows. In another embodiment, a flash memory device comprises a memory array, a controller and a register. The memory array has a plurality of blocks of flash memory cells. The memory cells in each block are arranged in rows. The controller is used to control memory operations to the memory array and the register is coupled to the controller to track the erase status of each row of memory cells.

Abstract: One-time UV-programmable read-only memory (1) comprising a number of memory cells in the form of MOS transistors (T) which are arranged in a matrix of rows and columns, each transistor comprising a source and a drain zone (12) and a channel zone (13) formed in a surface zone (11) of a semiconductor substrate (10). Said semiconductor zones adjoin a surface (14) of the semiconductor substrate on which surface a layer structure (17) is formed comprising floating gates (16) and control gates (15). The layer structure is provided with windows (18) through which UV radiation can reach the edges of the floating gates. The memory is further provided with means for generating an electric voltage between the substrate (10) and the control gates (16) during programming the memory by means of UV radiation. Thus, the memory can be programmed without being externally contacted during programming.

Abstract: The invention proposes a simple method to lower the threshold voltage of UV erased EPROM and OTP memories. During the erasure, a voltage is applied to the control gate (10) or wordline (2) which is on-chip generated as a photovoltage by means of photodiode (12) irradiated by radiation (15) during erasure. Because the wordlines are coupled to further zones forming photosensitive pn-junctions in the semiconductor body, measures are taken to prevent that, due to charge transport across said junctions, the generated photovoltage is decreased too strongly.

Abstract: A secured electrically modifiable non-volatile memory includes a circuit to determine if memory cells therein have been exposed to ultraviolet radiation. The memory includes at least one additional memory cell, called a reference cell, and an associated read circuit for detecting any erasure of the reference cell by ultraviolet radiation. At each access to the memory, the reference cell is read by the associated read circuit. If the state of the reference cell is different from its initial electrical state, then operation of the memory is stopped.

Abstract: To improve the efficiency of UV erasing in a non-volatile memory, there is proposed to carry out the erase step at an elevated temperature, for example, a temperature lying between 200 and 300° C. In this way a decrease of about 0.5 volt of the threshold voltage of the erased cell may be obtained compared to a standard UV erasure. This makes it also possible to lower the supply voltage.