Abstract: Aspects of the disclosure provide an integrated circuit (IC) chip having a memory controller. The memory controller includes a memory interface circuit configured to interface the IC chip with a memory chip having a memory array, and a first control circuit. The memory chip has a configuration circuit for adjusting one or more configurations of the memory chip. The first control circuit is configured to control the memory interface circuit and to communicate with the configuration circuit in the memory chip via the memory interface circuit to adjust the one or more configurations of the memory chip.

Abstract: A semiconductor memory device includes: a plurality of memory blocks; a plurality of bit-line sense amplifiers shared by neighboring memory blocks among the plurality of the memory blocks, and suitable for sensing and amplifying data read from memory cells coupled to activated word lines through bit lines, and outputting the amplified data through a plurality of segment data lines; a word line driver suitable for activating word lines of memory blocks that do not share the bit-line sense amplifiers during a test mode; and a weak cell detection circuit suitable for compressing the amplified data transferred through the plurality of the segment data lines for generating compressed data and detecting a weak cell based on the compressed data during the test mode.

Abstract: A disclosed example to reduce a threshold voltage drift of a selector device of a memory cell includes providing an applied voltage to the selector device of the memory cell, the applied voltage being less than a threshold voltage of the selector device, and reducing the threshold voltage drift of the memory cell by maintaining the applied voltage at the selector device for a thresholding duration to activate the selector device.

Abstract: The present disclosure includes apparatuses and methods related to performing logical operations using sensing circuitry. An example apparatus comprises an array of memory cells and sensing circuitry coupled to the array. The sensing circuitry can include a sense amplifier coupled to a pair of complementary sense lines and a compute component coupled to the sense amplifier via pass gates coupled to logical operation selection logic. The logical operation selection logic can be configured to control pass gates based on a selected logical operation.

Abstract: A clock mode configuration circuit for a memory device is described. A memory system includes any number of memory devices serially connected to each other, where each memory device receives a clock signal. The clock signal can be provided either in parallel to all the memory devices or serially from memory device to memory device through a common clock input. The clock mode configuration circuit in each memory device is set to a parallel mode for receiving the parallel clock signal, and to a serial mode for receiving a source synchronous clock signal from a prior memory device. Depending on the set operating mode, the data input circuits will be configured for the corresponding data signal format, and the corresponding clock input circuits will be either enabled or disabled. The parallel mode and the serial mode is set by sensing a voltage level of a reference voltage provided to each memory device.

Abstract: According to one embodiment, a semiconductor device includes: a first semiconductor chip including a first via and a second via; and a second semiconductor chip including a third via and a fourth via and being located above the first semiconductor chip. The first semiconductor chip includes: a first detector capable of coupling to the third via through the second and fourth vias; and a first current source configured to control an output current in accordance with a voltage of the third via detected by the first detector.

Abstract: A method for evaluating a chip manufacturing process is described comprising measuring, for each of a plurality of chips manufactured in a chip manufacturing process, a bit failure rate of the chip, determining a distribution of bit failure rates from the measured bit failure rates; determining a maximum allowed bit failure rate from a given chip failure rate limit, determining a value representing the probability that a chip manufactured in the chip manufacturing process is below the maximum allowed bit failure rate and determining, based on the value, whether the chip manufacturing process is suitable for the chip failure rate limit.

Abstract: The present invention relates to a magnetism detection device. First and second switch units switch a direction of a current flown from a bias generating unit across two opposite terminals of four terminals of a hall sensor, and switch a direction of a voltage to be available in remaining two opposite terminals in the direction orthogonal to the direction of the current, respectively, so that in a first period, a polarity of a hall electromotive force is a first polarity and a polarity of the hall offset voltage alternates four times, and in a second period, the polarity of the hall electromotive force is a second polarity opposite to the first polarity and the polarity of the hall offset voltage alternates four times.

Abstract: Apparatuses and methods for accessing memory are described. An example method includes accessing memory cells of a memory section, and sharing a source of an inactive sense amplifier section with an active sense amplifier section coupled to the memory cells of the memory section during a memory access operation to the memory section coupled to the active sense amplifier section. An example apparatus includes a memory section and a first sense amplifier section associated with the memory section. The first sense amplifier section includes a sense amplifier and includes a read/write circuit coupled to a first source associated with the first sense amplifier section. The source associated with the first sense amplifier section is coupled to a source associated with a second sense amplifier section. The second sense amplifier section is configured to be inactive during a memory access operation to the memory section.

Abstract: An integrated circuit includes a node setting block connected to a reference node and suitable for setting a voltage level of the reference node to a reference voltage level, a plurality of control voltage generation units connected in series to a reference node and suitable for generating a plurality of control voltages of which voltage level is variable and a current sensing circuit suitable for sensing a variation of a current flowing through a signal transmission line by using the plurality of control voltages, the signal transmission line connected to an internal circuit and a voltage level of the signal transmission line being fixed.

Abstract: A control circuit, a memory device and a voltage control method thereof are provided. The memory device includes a memory cell, a voltage regulator circuit and the control circuit. The control circuit receives a clock signal, and determines a clock frequency of the clock signal so as to generate a control signal. An operation voltage is converted into an internal supply voltage for supplying the control circuit by the voltage regulator circuit according to the control signal.

Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: Provided is an integrated circuit including circuits driven in different voltage domains. The integrated circuit includes a logic circuit configured to be driven by a first power supply voltage having a first power supply voltage level, and a memory circuit configured to be driven by a second power supply voltage having a second power supply voltage level different from the first power supply voltage level. The memory circuit includes a circuit configured to interface with the logic circuit, configured to be supplied with power at the second power supply voltage level in response to an output signal, and configured to shift a level of a signal having the first power supply voltage level received from the logic circuit to the second power supply voltage level. The first power supply voltage corresponds to a first voltage domain, and the second power supply voltage corresponds to a second voltage domain.

Abstract: A semiconductor memory device includes a plurality of memory banks each including a plurality of circuit areas selected based on an address signal, any one of which is selected by a corresponding bank selective signal (source transistor control signals), and a selective activation circuit that, from among circuit areas included in a memory bank that is selected based on the bank selective signal, activates any one of the circuit areas based on the address signal, and deactivates at least one of rest of the circuit areas. According to the present invention, the power consumption can be reduced in an active state by a dynamic power control in response to an address signal, not by entire power control by an external command.

Abstract: Disclosed herein is a device that includes: a plurality of first standard cells arranged on a semiconductor substrate in a first direction, each of the first standard cells including at least one field-effect transistor; and a first power supply wiring extending in the first direction along one end of the first standard cells in a second direction. The field-effect transistor including a gate electrode formed on a gate wiring layer. The first power supply wiring being formed on the gate wiring layer.

Abstract: According to one embodiment, a synchronous rectification type power circuit includes a first power terminal to which a voltage on a high potential side is supplied, a second power terminal to which a voltage on a low potential side is supplied, an output terminal that outputs an output voltage to a load having an inductance and a capacitor, a first switch unit connected between the first power terminal and the output terminal, a second switch unit connected between the second power terminal and the output terminal, a control signal generating circuit which controls ON/OFF of the first and second switch units, and a control circuit that compares the output voltage with a predetermined reference voltage for a predetermined period when the second switch unit is turned OFF. A timing for turning OFF the second switch unit is adjusted based on a result of the comparison.

Abstract: A system having an integrated circuit (IC) device can include a die formed on a semiconductor substrate and having a plurality of first wells formed therein, the first wells being doped to at least a first conductivity type; a global network configured to supply a first global body bias voltage to the first wells; and a first bias circuit corresponding to each first well and configured to generate a first local body bias for its well having a smaller setting voltage than the first global body bias voltage; wherein at least one of the first wells is coupled to a transistor having a strong body coefficient formed therein, which transistor may be a transistor having a highly doped region formed below a substantially undoped channel, the highly doped region having a dopant concentration greater than that the corresponding well.

Abstract: An integrated circuit (IC) with a novel configurable routing fabric is provided. The configurable routing fabric has signal paths that propagate signals between user registers on user clock cycles. Each signal path includes a set of configurable storage elements and a set of configurable logic elements. Each configurable storage element in the path is reconfigurable on every sub-cycle of the user clock cycle to either store an incoming signal or to pass the incoming signal transparently.

Abstract: A decoder circuit with reduced leakage configured to decode an address and drive one of a number of word lines may be implemented with two-high logic gates in a pre-decode stage, a decode stage, and a word line driver stage. Such decoder circuits may include, in the word line driver stage, a number of two-high NOR gates configured to drive one of a number of word lines. In some embodiments, the two-high logic gates that share common inputs are implemented with multi-output static logic.

Abstract: A semiconductor device with reduced leakage current and a method of manufacturing these reduced leakage current semiconductor devices are disclosed. The reduced leakage current semiconductor devices may be used for both static circuits and dynamic circuits. The reduced leakage current semiconductor devices reduce leakage current in the device when the node is not transitioning which occurs more than 95% of the time.

Abstract: The propagation delay of a signal through multiple load devices coupled sequentially along a conductor is improved by separating a subset of the load devices that is more distant from the signal source, and coupling the more distant subset to the signal through a fly-over conductor that bypasses the subset that is nearer to the signal source. The technique is applicable to subsets of bit cells in a random access memory (SRAM) coupled to a given word line, or to word line decoder gates coupled sequentially to a strobe signal, as well as other circuits wherein load devices selectable as a group can be divided into subsets by proximity to the signal source. In an SRAM layout with multiple levels, different metal deposition layers carry the conductor legs between the load devices versus the fly-over conductor bypassing the nearer subset.

Abstract: A memory macro comprises a plurality of memory cells, a plurality of first amplifying circuits, a first driver circuit, and a first level shifter. The plurality of memory cells is arranged in groups of a first direction and groups of a second direction. Each amplifying circuit is coupled to a plurality of first memory cells arranged in a first group of the first direction via a first data line. The first driver circuit is configured to drive the plurality of first amplifying circuits. The first level shifter is configured to level shift an input signal operating in a first power domain to an output signal operating in a second power domain. The output signal of the first level shifter is for use by the first driver circuit. The first driver circuit and a sense amplifier of an amplifying circuit operate in the second power domain.

Abstract: According to one embodiment, a non-volatile semiconductor storage device includes a memory cell array, a row decoder, a potential generating circuit, first plural potential selection circuits, a second potential selection circuit, a first discharge circuit, and a second discharge circuit. The first plural potential selection circuits select one of output potentials of the potential generating circuit by receiving a first control signal and apply the selected output potential to a first signal line. The second potential selection circuit applies a potential of the first signal line to a second signal line connected to the row decoder by receiving a second control signal. The first discharge circuit is arranged in the first potential selection circuit. The second discharge circuit is arranged in the second potential selection circuit.

Abstract: A page buffer comprises a static latch configured to store data received from an external device, and a dynamic latch configured to receive the data stored in the static latch through a floating node, the dynamic latch comprising a storage capacitor, a write transistor configured to write the data of the floating node to the storage capacitor, and a read transistor configured to read the data of the storage capacitor, and the write transistor and the read transistor sharing the floating node.

Abstract: A PLD in which a configuration memory is formed using a nonvolatile memory with a small number of transistors and in which the area of a region where the configuration memory is disposed is reduced is provided. Further, a PLD that is easily capable of dynamic reconfiguration and has a short startup time is provided. A programmable logic device including a memory element, a selector, and an output portion is provided. The memory element includes a transistor in which a channel is formed in an oxide semiconductor film, and a storage capacitor and an inverter which are connected to one of a source and a drain of the transistor. The inverter is connected to the selector. The selector is connected to the output portion.

Abstract: A semiconductor device includes NAND gates and switches to form a circuit to hold data, and a capacitor electrically connected to the circuit via a transistor to store the data held in the circuit. The transistor has a channel formation region including an oxide semiconductor.

Abstract: A method is for driving a nonvolatile memory device, where the nonvolatile memory device includes a memory cell array composed of resistance memory cells. The method includes electrically connecting a clamping circuit, a line resistor and a selected one of the resistance memory cells in series between a sensing node and a ground. The method further includes adjusting at least one of a clamping voltage of the clamping circuit and a resistance of the line resistor according to a relative location of the selected one of the resistance memory cells within the memory cell array, and applying a read current to the sense node and sensing a voltage of the sense node to read a data stored in the selected one of the resistance memory cells.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell array, a data bus, a transfer controller, column blocks, and a column selector. The data bus is divided into stages. The transfer controller serially transfers data such that the data are respectively allocated to the stages. The column blocks temporarily stores the data. The column selector selects a column block for each of the stages from the column blocks, and transfers the data parallel between the stages and the column blocks selected for the stages. The data bus extends from one end to the other in a direction in which the column blocks are arranged, and returns from the other end to the one end.

Abstract: A semiconductor device comprises transmission lines, inverting circuits, first, second and third switches, global sense amplifiers, and a control circuit. The first switch switches between the transmission line and the input of the inverting circuit, the second switch switches between the transmission line and the output of the transmission line, and the third switch switches between the adjacent transmission lines. The control circuit turns off the first and second switches so that the transmission lines are brought into a floating state in a state where signals of the transmission lines are held in the inverting circuits by the global sense amplifiers. After charge sharing of the transmission lines occurs by turning on the third switches within a predetermined period, the control circuit turns off the second switches so that the transmission lines are inverted and driven via the inverting circuits and the second switches.

Abstract: A memory assist apparatus includes a detection circuit and a compensation circuit. The detection circuit is configured to provide a detection signal indicating whether a bit line configured to provide read access to a data bit stored at a memory bit cell has a voltage below a predetermined threshold. The compensation circuit is configured to pull down the voltage of the bit line if the detection signal indicates that the voltage of the bit line is below the predetermined threshold.

Abstract: A semiconductor storage apparatus according to the present invention includes a plurality of memory cells, a plurality of word lines, a plurality of pairs of bit lines, a plurality of sense amplifiers, a pair of common data lines, a data-to-be-written output circuit configured to, in writing data, set voltages of the common data lines forming the pair, a column selection signal output unit configured to output a plurality of column selection signals, and a plurality of column selection gates, in which in writing the data, the column selection signal output unit selectively turns on one of the column selection gates by setting each of voltages of the column selection signals to one of a level of a higher-potential power supply voltage and a level of a lower-potential power supply voltage, before activating the sense amplifiers.

Abstract: A circuit includes a memory cell having a ground reference node, a switch coupled to the ground reference node, and a mode changing circuit having an output coupled to the switch. The mode changing circuit is configured to change a logic state of the output between a first output logic state and a second output logic state in response to a change in an operational voltage and/or temperature, thereby set the memory cell in a first mode in which the ground reference node is at first reference level or in a second mode in which the ground reference node is at a second reference level different from the first reference level.

Abstract: A method of inspecting a variable resistance nonvolatile memory device detecting a faulty memory cell of a memory cell array employing a current steering element, and a variable resistance nonvolatile memory device are provided. The method of inspecting a variable resistance nonvolatile memory device having a memory cell array, a memory cell selection circuit, and a read circuit includes: determining that a current steering element has a short-circuit fault when a variable resistance element is in a low resistance state and a current higher than or equal to a predetermined current passes through the current steering element, when the resistance state of the memory cell is read using a second voltage; and determining whether the variable resistance element is in the low or high resistance state, when the resistance state of the memory cell is read using a first voltage.

Abstract: Circuitry to provide a supply voltage. A voltage regulator is coupled to receive a target reference signal. The voltage regulator generates a supply voltage (Vtt) and is coupled to receive the supply voltage as an input signal. An upper limit comparator receives an upper limit voltage signal that is higher than the target reference voltage signal and the supply voltage to generate a “too high” signal when the supply voltage exceeds an upper threshold. A lower limit comparator receives a lower limit voltage signal that is lower than the target reference voltage signal and the supply voltage to generate a “too low” signal when the supply voltage is below a lower threshold. A pull up current source is coupled to pull the supply voltage up in response to the too low signal. A pull down current source is coupled to pull the supply voltage down in response to the too high signal.

Abstract: A memory circuit includes a transistor having a channel in an oxide semiconductor layer, a capacitor, a first arithmetic circuit, a second arithmetic circuit, a third arithmetic circuit, and a switch. An output terminal of the first arithmetic circuit is electrically connected to an input terminal of the second arithmetic circuit. The input terminal of the second arithmetic circuit is electrically connected to an output terminal of the third arithmetic circuit via the switch. An output terminal of the second arithmetic circuit is electrically connected to an input terminal of the first arithmetic circuit. An input terminal of the first arithmetic circuit is electrically connected to one of a source and a drain of the transistor. The other of the source and the drain of the transistor is electrically connected to one of a pair of electrodes of the capacitor and to an input terminal of the third arithmetic circuit.

Abstract: In a Multi Level Cell (MLC) memory array block in which lower pages are written first, before any upper pages, the lower page data is subject to an exclusive OR (XOR) operation so that if any lower page becomes uncorrectable by ECC (UECC) then the page can be recovered using XOR. Lower pages in such blocks may be written in nonsequential order.

Abstract: A semiconductor memory device according to an embodiment includes a memory cell array that includes a plurality of cell columns each configured by a plurality of memory cells, and a column control circuit that includes a plurality of sense amplifier-data latch units each including a plurality of sense amplifiers that detect and amplify data of the memory cells and a plurality of data latches. One of the plurality of sense amplifier-data latch units is a first sense amplifier-data latch unit and another of the plurality of sense amplifier-data latch units is a second sense amplifier-data latch unit, the first sense amplifier-data latch unit and the second sense amplifier-data latch unit having different numbers of the cell columns capable of being handled.

Abstract: A shift register structure is presented that can be used in fixed or variable rate serial to parallel data conversions. In an 1 to N conversion, data is received off an m-bit serial data bus and loaded into a N by m wide latch, before being transfer out onto an (N×m)-wide parallel data bus. Based on information on how of the N m-bit wide data units are to be ignored, the data will be clocked out at a variable rate. When loading data off the serial bus into the latch, upon refresh the current data is loaded into all N units of the latch, with one less latch being loaded at each subsequent clock. When the content of a unit of latch is to be ignored on the parallel bus, that unit is closed at the same time as the preceding unit so that it is left with redundant data.

Abstract: A memory array includes wordlines, local bitlines, two-terminal memory elements, global bitlines, and local-to-global bitline pass gates and gain stages. The memory elements are formed between the wordlines and local bitlines. Each local bitline is selectively coupled to an associated global bitline, by way of an associated local-to-global bitline pass gate. During a read operation when a memory element of a local bitline is selected to be read, a local-to-global gain stage is configured to amplify a signal on or passing through the local bitline to an amplified signal on or along an associated global bitline. The amplified signal, which in one embodiment is dependent on the resistive state of the selected memory element, is used to rapidly determine the memory state stored by the selected memory element.

Abstract: A mechanism is provided in a data processing system for enhancing wiring structure for a cache supporting an auxiliary data output. The mechanism splits the data cache into a first data portion and a second data portion. The first data portion provides a first set of data elements and the second data portion provides a second set of data elements. The mechanism connects a first data path to provide the first set of data elements to a primary output and connects a second data path to provide the second set of data elements to the primary output. The mechanism feeds the first data path back into the second data path and feeds the second data path back into the first data path. The mechanism connects a secondary output to the second data path.

Abstract: An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell.

Abstract: A repairable multi-layer memory chip stack wherein each of the memory chips of the chip stack includes a control unit, a decoding unit, a memory array module and a redundant repair unit comprising at least one redundant repair element. The decoding unit receives a memory address from an address bus, and correspondingly outputs a decoded address. The memory array module determines whether to allow a data bus to access the data of the memory array module corresponding to a decoded address in accordance with an activation signal of the control unit. The redundant repair element includes a valid field, a chip ID field, a faulty address field and a redundant memory. When the valid field is valid, the value of the chip ID field matches the ID code, and the value of the faulty address field matches the decoded address, the redundant memory is coupled to the data bus.

Abstract: A semiconductor memory apparatus including a test circuit configured for generating compressed data by comparing and compressing data stored in a plurality of memory cells inside a memory bank during a first test mode, and configured for outputting the compressed data as test data to an input/output pad through one selected global line during the first test mode, and the test circuit is configured for transmitting the compressed data to a plurality of global lines during a second test mode, combining the compressed data loaded in the respective global lines during the second test mode, and outputting the combination result as the test data to the input/output pad during the second test mode.

Abstract: A system and method to read and write data at a memory cell that includes multiple non-volatile memories is disclosed. In a particular embodiment, a memory device includes a plurality of memory cells. At least one of the memory cells includes a first non-volatile memory including a first resistive memory element and a second multi-port non-volatile memory including a second resistive memory element. Each of the first non-volatile memory and the second non-volatile memory is accessible via multiple ports.

Abstract: A low density One-Time Programmable (OTP) memory is disclosed to achieve low gate count and low overhead in the peripheral circuits to save the cost. A maximum-length Linear Feedback Shift Register (LFSR) can be used to generate 2n?1 address spaces from an n-bit address. The registers used in the address generator can have two latches. Each latch has two cross-coupled inverters with two outputs coupled to the drains of two MOS input devices, respectively. The inputs of the latch are coupled to the gates of the MOS input devices, respectively. The sources of the MOS input devices are coupled to the drains of at least one MOS device(s), whose gate(s) are coupled to a clock signal and whose source(s) are coupled to a supply voltage. The two latches can be constructed in serial with the outputs of the first latch coupled to the inputs of the second latch.

Abstract: A memory device that, in certain embodiments, includes a plurality of memory elements connected to a bit-line and a delta-sigma modulator with a digital output and an analog input, which may be connected to the bit-line. In some embodiments, the delta-sigma modulator includes a circuit with first and second inputs and an output. The circuit is configured to combine (add or subtract) input signals. The first input may be connected to the analog input. The delta-sigma modulator may also include an integrator connected to the output of the circuit, an analog-to-digital converter with an input connected to an output of the integrator and an output connected to the digital output, and a digital-to-analog converter with an input connected to the output of the analog-to-digital converter and an output connected to the second input of the circuit.

Abstract: The disclosure relates to a device for storing a frequency, wherein the device comprises (i) a comparator having an input, an output, a supply voltage input, and a supply voltage output, and (ii) a memristor connected between the input and the comparator and the output of the comparator.

Abstract: To provide a semiconductor device which can perform initialization to a first state of two states of the first state and a second state, and which can generate a signal having a potential corresponding to the initialized first state. The present invention is the semiconductor device which can perform initialization to “0” (a first state) of two states of “0” and “1” (a second state), and which can generate a signal having a potential corresponding to initialized “0”. The semiconductor device 10 includes a plurality of flip-flop circuits 2 that are connected in parallel and which can hold the two states of “0” and “1”; and an AND circuit 3 which generates and outputs a signal having a potential corresponding to “0” when a state held in at least one flip-flop circuit 2 among the flip-flop circuits 2 is “0”. The AND circuit is connected to the flip-flop circuits 2.

Abstract: A memory macro comprises a plurality of memory array segments, each having a predetermined number of data inputs and outputs. A segment decoder circuit is configured to: receive a first value indicating a number of memory partitions among which the memory array segments are to be divided, and output a plurality of signals for selectively activating one or more of the plurality of memory array segments to be accessed based on the first value. A plurality of output drivers are coupled to the segment decoder circuit and to respective ones of the outputs. The plurality of output drivers are configured to selectively output data from the respective outputs of each of the respective activated memory array segments.

Abstract: A local evaluation circuit for a memory array includes first and second NAND gates and first, second, third, and fourth switches. The first switch is configured to couple a first node of the second NAND gate to a first power supply node in response to a first read signal. The second switch is configured to couple a first node of the first NAND gate to the first power supply node in response to a second read signal. The third switch is configured to couple a second node of the first NAND gate to a second power supply node in response to the first read signal. The fourth switch is configured to couple a second node of the second NAND gate to the second power supply node in response to the second read signal.