Abstract: A latency counter includes an input selecting circuit that selects one of a plurality of signal paths and supplies an internal command to the selected signal path, a shift circuit that switches a correspondence relation between the signal paths and a latch circuit, and an output selecting circuit that causes the internal command taken in the latch circuit to be output. The input selection circuit includes a timing control circuit allocated to each of the signal paths. The timing control circuit includes an SR latch circuit that is set by the internal command and is reset in response to deactivation of a corresponding count value. Therefore, it becomes possible to suppress shortening of an active period of the internal command that is output from the input selecting circuit.

Abstract: A static random access memory (SRAM) test apparatus includes an array of SRAM test cells. The test cells are configured according to a layout with NMOS and PMOS transistors coupleable as inverters and responsive to a first passing gate transistor. At least one of the NMOS and PMOS transistors of a test cell at a predetermined location in the array is coupled to a fixed voltage to force a logic state of an associated inverter. A switching signal coupled to the associated inverter through a second passing gate transistor produces a detectable test current through one of the NMOS and PMOS transistors of the associated inverter of said test cell and through one of the NMOS and PMOS transistors of an associated inverter of an adjacent series-connected test cell.

Abstract: A data input device for use in a memory device to avoid false data being written due to a postamble ringing phenomenon in a write operation is provided. The data input device comprises a buffer, a combinational logic circuit and a flip-flop unit. The buffer receives the data and outputs internal data to the flip-flop unit. The combinational logic circuit receives an external data strobe signal to generate a first data strobe signal and a second data strobe signal. The flip-flop unit stores the data in synchronization with the first data strobe signal and outputs the stored data in synchronization with the second data strobe signal. A last rising edge of the second data strobe signal is generated prior to onset of the postamble ringing on the external data strobe signal, so that a data transferred path in the flip-flop unit is closed prior to onset of the postamble ringing.

Abstract: A sense amplifier arrangement includes a first sense amplifier having a first input and a second input. A second sense amplifier has a first input and a second input. A switching circuit is configured to selectively couple the first input of the first sense amplifier to a first bit line in the array and the second input of the first sense amplifier to a first bit line in the array to selectively couple the first input of the first sense amplifier to the first bit line in the array, the first input of the second sense amplifier to the second bit line in the array, and the second inputs of the first and second sense amplifiers to a reference voltage.

Abstract: An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch.

Abstract: A multi-layer cross-point memory array comprises one or more word line (WL) layers, one or more bit line (BL) layers interleaved with the one or more WL layers, and a plurality of memory layers, each memory layer disposed between an adjacent WL layer and an adjacent BL layer, and each memory layer including memory elements configured between cross-points of WLs and BLs of the adjacent WL and BL layers. Memory elements in successive memory layers of the memory array are configured with opposing orientations, so that half-selected memory elements arising during times when data operations are being performed on selected memory elements in the memory array are subjected to stress voltages of a polarity of which they are least susceptible to being disturbed. The memory elements can be discrete re-writeable non-volatile two-terminal memory elements that are fabricated as part of a BEOL fabrication process used to fabricate the memory array.

Abstract: Provided is a semiconductor memory device including a plurality of memory cells arranged in a matrix, a plurality of word lines arranged corresponding to each row of the memory cells, a plurality of bit line pairs arranged corresponding to each column of the memory cells, a column selector that selects any of the plurality of bit line pairs based on a column selection signal and connects the selected bit line pair to a data line pair, a precharge circuit that precharges the data line pair, a sense amplifier that amplifies a potential difference of the data line pair, and a control circuit that controls current for driving the sense amplifier based on potentials of the data line pair after a lapse of a specified period from start of amplification of the potential difference of the precharged data line pair by the sense amplifier.

Abstract: A NOR architecture for selecting a word line driver in a DRAM is disclosed. Complements of separately decoded addresses in the low, mid and high ranges are used to select a final word line driver. The output of the word line driver is at a potential negative with respect to ground for a deselected word line and a positive potential more positive than the power supply potential for a selected word line.

Abstract: The present invention relates to a magnetic memory cell, which controls the magnetization direction of the free magnetic layer of a Magnetic Tunnel Junction (MTJ) device using a spin torque transfer, and enables the implementation of a magnetic logic circuit, in which memory and logic circuit functions are integrated. The magnetic memory cell includes an MTJ device (10) including a top electrode (11) and a bottom electrode (13), which are provided to allow current to flow therethrough, and a fixed layer (15) and a free layer (17), which are magnetic layers respectively deposited on a top and a bottom of an insulating layer (19), required to insulate the top and bottom electrodes from each other. A current control circuit (50) controls a flow of current flowing between the top and bottom electrodes, and changes a magnetization direction of the free layer according to an input logic level.

Abstract: A method of generating a test pattern of a memory chip includes generating and outputting a pattern enabling signal according to a first pattern signal and a second pattern signal, generating and outputting a first pre-input-output signal and a second pre-input-output signal according to a memory bank signal, a section signal, and the pattern enabling signal, executing an exclusive-OR logic operation on a third input-output signal and the second pattern signal to generate and output a first enabling signal, generating and outputting a first input-output signal and a second input-output signal according to the first enabling signal, the first pre-input-output signal and the second pre-input-output signal, and writing a predetermined logic voltage to each memory cell of the memory chip according to the first input-output signal and the second input-output signal.

Abstract: A SRAM device which can set a threshold voltage of a selection transistor appropriate for all the cells on an SRAM array is disclosed. The SRAM device uses a field effect transistor as the selection transistor. The field effect transistor includes a gate to drive the transistor and a terminal to control a threshold voltage, which are electrically separated from each other. The SRAM device also includes a circuit which, in a reading operation, gradually increases a voltage supplied to the terminal at the start of the reading to control the threshold of the selection transistor.

Abstract: A semiconductor memory apparatus includes a memory cell array including a plurality of chips, a control circuit configured to control an internal operation of the memory cell array, a power circuit configured to supply power to the control circuit, and a mode setting circuit configured to output a flag signal for power supply control based on a mode register set command and data received through a data input/output pad, in response to a clock enable signal.

Abstract: Such a device is disclosed that includes a terminal, a first voltage generator generating, when activated, a voltage at the terminal and stopping, when deactivated, generating the voltage, and a second voltage generator generating, when activated, the voltage at the terminal and stopping, when deactivated, generating the voltage. The first voltage generator being configured to be activated in response to a first control signal taking an active level and deactivated in response to the first control signal taking an inactive level, and the second voltage generator being configured to be activated in response to each of the first control signal and a second control signal taking an active level and deactivated in response to at least one of the first and second control signal taking an inactive level.

Abstract: The described devices, systems and methods include an electro-static discharge clamp with a latch to prevent false triggering of an electro-static discharge protection circuit in response to fluctuations in a power supply rail.

Abstract: A processor-based system includes a processor coupled to core logic through a processor bus. This includes a dynamic random access memory (“DRAM”) memory buffer controller. The DRAM memory buffer controller is coupled through a memory bus to a plurality of a dynamic random access memory (“DRAM”) modules and a flash memory module, which are at the same hierarchical level from the processor. Each of the DRAM modules includes a memory buffer to the memory bus and to a plurality of dynamic random access memory devices. The flash memory module includes a flash memory buffer coupled to the memory bus and to at least one flash memory device. The flash memory buffer includes a DRAM-to-flash memory converter operable to convert the DRAM memory requests to flash memory requests, which are then applied to the flash memory device.

Abstract: A one-of-n storage cell for use in an N-nary dynamic logic (NDL) circuit. The storage cell may accept an input value and provide a complemented output value that corresponds to the input value. However, if an input value that corresponds to a precharge input value is received, the output value remains the previous output value. The storage cell may be implemented to accept either inverted or non-inverted one-of-n NDL signals and to provide as an output either non-inverted or inverted one-of-N NDL signals, respectively, where N is greater than two.

Abstract: A NAND architecture for selecting a word line driver in a DRAM is disclosed. Separately decoded addresses in the low, mid and high ranges are used to select a final word line driver. The output of the word line driver is at a potential negative with respect to ground for a deselected word line and a positive potential more positive than the power supply potential for a selected word line.

Abstract: A logic circuit for a semiconductor memory device, includes a first logic portion which stores data from a first data signal, and generates a second data signal based on the first data signal, a second logic portion which generates a first address signal and stores an address from the first address signal where data from the second data signal is to be written, and a third logic portion which generates a flag signal which indicates whether the data stored in the first logic portion is valid.

Abstract: A memory system that includes a first bit line coupled to a first set of dynamic random access memory (DRAM) cells, a second (complementary) bit line coupled to a second set of DRAM cells, and a sense amplifier coupled to the first and second bit lines. The sense amplifier includes a pair of cross-coupled inverters (or a similar latching circuit) coupled between the first and second bit lines, as well as a first select transistor coupling the first bit line to a first global bit line, and a second select transistor coupling the second bit line to a second global bit line. The first and second select transistors are independently controlled, thereby enabling improved read and write access sequences to be implemented, whereby signal loss associated with bit line coupling is eliminated, ‘read bump’ conditions are eliminated, and late write conditions are eliminated.

Abstract: Systems and methods for reconfiguring ECU tasks for ensuring that a vehicle is operational upon failure of a task or an ECU. A first on-board reconfiguration strategy is generated and executed by an on-board unit of the vehicle to bring the vehicle to a safe state and a second off-line reconfiguration strategy is generated by a remote center unit and then executed by the on-board unit.

Abstract: A semiconductor device may include, but is not limited to, a first signal line, a second signal line, and a first shield line. The first signal line is supplied with a first signal. The first signal is smaller in amplitude than a potential difference between a power potential and a reference potential. The second signal line is disposed in a first side of the first signal line. The second signal line is supplied with a second signal. The second signal is smaller in amplitude than the potential difference. The first shield line is disposed in a second side of the first signal line. The second side is opposite to the first side. The first shield line reduces a coupling noise that is applied to the first shield line from the second side.

Abstract: Disclosed is a memory module which includes a memory chip; an external input/output terminal having an electrical signal input/output terminal and an optical signal input/output terminal; an optical signal processor configured to convert a first optical signal input through the optical signal input/output terminal into a first internal electrical signal and to convert a second internal electrical signal into a second optical signal; and a controller configured to provide a first data signal to the memory chip in response to a first external electrical signal input through the electrical signal input/output terminal or the first internal electrical signal and to transfer the second internal electrical signal to the optical signal processor or to output a second external electrical signal to the electrical signal input/output terminal in response to a second data signal output from the memory chip.

Abstract: Some embodiments regard a method comprising: controlling a row of cells of a memory array with a first signal; controlling a column of cells of the memory array with a second signal; transferring data from a cell activated by both the first signal and the second signal to a pair of bit lines associated with the cell; and using the data from the pair of bit lines as read data and as data written back to the cell to ensure the cell stores valid data.

Abstract: An apparatus for measuring data setup/hold time is capable of effectively measuring a setup/hold time of data, and includes a data generating unit for delaying an external clock signal according to counting signals and generating an internal clock signal and data signals from the delayed external clock signal in response to test signals, a flag signal generating unit for generating flag signals according to the internal clock signal and the data signals, and a counter for producing the counting signals in response to the flag signals.

Abstract: In one embodiment, a semiconductor integrated circuit has memory cells. Each of the memory cells has non-volatile memories and switching elements. The non-volatile memories and switching elements are connected in series between a first power source and a second power source. Output wirings of at least two of the memory cells are connected to each other. Input wirings are connected with control gates of the switching elements included in each of the at least two memory cells. A plurality of the switching elements included in one of the at least two of the memory cells is turned off, when an input signal or an inverted signal is inputted. Further, another plurality of the switching elements included in another one of the at least two of memory cells other than the one of the memory cells is turned on, when the input signal or the inverted signal is inputted.

Abstract: A memory chip including a plurality of storage elements, a receiver and a program module. Each of the storage elements has a measurable parameter. The receiver receives N target values from a memory controller, where N is an integer greater than zero. The programming module adjusts corresponding measurable parameters of N storage elements of the plurality of storage elements to the N target values.

Abstract: In a memory cell array, a plurality of memory cells connected to word lines and bit lines are arranged in a matrix. A data storage circuit is connected to the bit lines and stores write data. The data storage circuit includes at least one static latch circuit and a plurality of dynamic latch circuits when setting 2k threshold voltages (k is a natural number equal to 3 or more) in each memory cell in the memory cell array. A control circuit refreshes data by moving the data in one of the plurality of dynamic latch circuits to the static latch circuit and further moving the data in the static latch circuit to one of the plurality of dynamic latch circuits.

Abstract: A setting circuit includes a selection unit configured to select one of a predefined code and an external code in response to a test signal, and a setting information generation unit configured to generate setting information in response to the code selected by the selection unit.

Abstract: A semiconductor memory device includes a pad, an impedance calibration circuit configured to provide a first code value corresponding to an impedance value coupled to the pad, a PVT sensing control circuit configured to provide a second code value corresponding to a PVT variation, and an output driver configured to receive data and to pull up or pull down the pad in response to the first code value and second code value.

Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: A memory circuit includes a first plurality of memory arrays disposed in a column fashion. The memory circuit includes a first plurality of keepers each of which is electrically coupled with a corresponding one of the first plurality of memory arrays. A first current limiter is electrically coupled with and shared by the first plurality of keepers. A first plurality of sector switches each are electrically coupled between the first current limiter and a respective one of the first plurality of keepers.

Abstract: A semiconductor package includes a memory controller chip, a plurality of first memory chips configured to store normal data, a second memory chip configured to store error information for correcting or detecting error of the normal data, and an interface unit configured to interface the memory controller chip, the plurality of first memory chips, and the second memory chip.

Abstract: A memory macro comprises a plurality of memory array segments, each having a predetermined number of data inputs and outputs. A segment decoder circuit is configured to: receive a first value indicating a number of memory partitions among which the memory array segments are to be divided, and output a plurality of signals for selectively activating one or more of the plurality of memory array segments to be accessed based on the first value. A plurality of output drivers are coupled to the segment decoder circuit and to respective ones of the outputs. The plurality of output drivers are configured to selectively output data from the respective outputs of each of the respective activated memory array segments.

Abstract: A method and apparatus is provided for idling a clock synchronizing circuit during at least a portion of time during execution of a refresh operation in a memory device. In a memory device receiving an external clock signal, a method and apparatus for executing a refresh operation is provided that includes initiating at least one refresh operation in the memory device, and ceasing generation of an internal clock signal timed with respect to the external clock signal for at least a portion of the time in which at least one refresh operation takes to complete.

Abstract: A semiconductor memory device includes a plurality of memory cells, a plurality of bit lines respectively connected to the memory cells, a plurality of first and second word lines respectively connected to the memory cells, a plurality of first drivers for driving the first word lines selected during a read operation, and a plurality of second drivers for driving the second word lines selected during a write operation, the second driver having a different drive capability from the first driver's.

Abstract: A memory circuit includes a first plurality of memory arrays disposed in a column fashion. The memory circuit includes a first plurality of keepers each of which is electrically coupled with a corresponding one of the first plurality of memory arrays. A first current limiter is electrically coupled with and shared by the first plurality of keepers.

Abstract: A static CAM includes a plurality of entries E each including a number of CAM cells B and a summary S. Each CAM cell B is associated with a memory cell M and a comparator C. Generally, the CAM receives as input i number of lookup data lines. When data is received, memory cells M provide compared data for corresponding comparators C in CAM cells B to compare the compared data to the received data. If all compared data match all received data lines for an entry, then there is a hit for that entry. But if any compared data does not match the corresponding data line, then there is a miss for that line and therefore a miss for that entry. Depending on applications, the CAM returns an address if there is a hit for one or a plurality of entries.

Abstract: A nonvolatile semiconductor storage device includes first and second intersecting wires; a electrically rewritable memory cell disposed at each intersection of the first second wires, including a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire to a standby voltage larger than a reference voltage prior to programming a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying to the selected first wire a program voltage for programming of the selected variable resistor and applying to the non-selected second wire a control voltage which prevents the rectifying device from turning ON.

Abstract: According to one embodiment, a semiconductor memory device includes a plurality of memory cells, a logic gate chain, and a counter. The memory cells are capable of retaining data and are associated with the columns. The logic gate chain includes a plurality of logic gates associated with the columns. Each of the logical gates outputs a logical level to a next-stage logical gate in the series connection. The logic level indicates presence or absence of verify-failure in the associated column. The counter counts the number of output times of the logic level indicating the presence of the verify-failure in a final-stage logic gate of the series connection. A content indicated by the logic level output from each of the logic gates is inverted at a boundary of the logic gate associated with the column having the verify-failure in the logic gate chain.

Abstract: A dynamic random access memory (DRAM) device having memory cells is operated in a self-refresh mode and a normal mode. A mode detector provides a self-refresh mode signal in the self-refresh mode of operation. It includes a free-running oscillator for generating an oscillation signal independent of the self-refresh mode signal. In response to the oscillation signal, a self-request controller provides a self-refresh request signal in the self-refresh mode. The self-refresh signal is asynchoronized with the self-fresh mode signal and is provided to an address circuit to select a wordline for refreshing the memory cells thereof. The self-refresh request controller includes logic circuitry for arbitrating timing between initial active edges of the oscillation signal and the self-refresh mode signal and providing the self-refresh request and ceasing it, regardless of conflict between the self-refresh mode signal and the oscillation signal upon self-refresh mode entry and exit.

Abstract: A memory array in a memory device is coupled to an analog I/O data interface that enables analog voltage levels to be written to the memory array. The I/O interface comprises a plurality of analog data paths that each includes a capacitor for storing charge corresponding to a target voltage to which a selected memory cell, coupled to its respective data path, is to be programmed. A plurality of comparators can be included in the I/O interface, with each such comparator coupled to a respective bit line. Such a comparator can compare a threshold voltage of a selected memory cell to its target voltage and inhibits further programming when the threshold voltage equals or exceeds the target voltage.

Abstract: A semiconductor memory device includes a plurality of memory cells, a plurality of bit lines respectively connected to the memory cells, a plurality of first and second word lines respectively connected to the memory cells, a plurality of first drivers for driving the first word lines selected during a read operation, and a plurality of second drivers for driving the second word lines selected during a write operation, the second driver having a different drive capability from the first driver's.

Abstract: An integrated circuit can include an input/output (I/O) bank. The I/O bank can include a plurality of byte clock groups. Each byte clock group can include at least one phaser configured to clock circuit elements of the byte clock group at a frequency at which a source synchronous device coupled to the byte clock group communicates data.

Abstract: Apparatus, systems, and methods are disclosed that operate to encode register bits to generate encoded bits such that, for pairs of addresses, an encoded bit to be coupled to a first address in a memory device may be exchanged with an encoded bit to be coupled to a second address in the memory device. Apparatus, systems, and methods are disclosed that operate to invert encoded bits in logic circuits in the memory device if original bits were inverted. Additional apparatus, systems, and methods are disclosed.

Abstract: A circuit includes a reference data line configured to receive a reference voltage value, a memory cell, a data line coupled to the memory cell and configured to have a data logic value associated with data stored in the memory cell, a first circuit coupled to the reference data line and to the data line, and an output node configured to selectively receive the data logic value from the data line or receive the data logic value through the first circuit, based on the reference voltage value and a trip point used to trigger the first circuit to provide the data logic value through the first circuit.

Abstract: A three-terminal Ovonic Threshold Switch (OTS) is used to provide current to a Phase Change Memory Switch (PCMS) cross point array. The current is started by sending a small current into the second terminal of the three-terminal OTS allowing a larger current to flow from the first terminal to the third terminal of the three-terminal OTS. A method of making the three-terminal OTS is also presented.

Abstract: A capacity and density enhancement circuit for a sub-threshold memory unit array which can decrease the drain current in the bit lines and enhance the pull-up capability of memory cells. The capacity and density enhancement circuit is composed of a first enhancement transistor, a second enhancement transistor, a first mask transmission gate, a second mask transmission gate, a first logic memory capacitor and a second logic memory capacitor.

Abstract: A method includes generating, from a representation of a first integrated circuit, a representation of a second integrated circuit. The representation of the first integrated circuit includes a plurality of representations of operative memory channel interfaces including a representation of a first operative memory channel physical interface. The representation of the second integrated circuit includes a representation of a pseudo-memory channel physical interface and at least a representation of a second operative memory channel physical interface. The generating includes replacing an instantiation of a first circuit of the representation of the first operative memory channel physical interface with an instantiation of a second circuit. The instantiation of the second circuit is a representation of a circuit that is logically equivalent to a first circuit represented by the instantiation of the first circuit.

Abstract: A circuit structure is provided for performing a logic function within a memory. A plurality of read word line transistors are provided that receive a read word line signal and, upon receiving the read word line signal, the plurality of read word line transistors provide a path from a plurality of bit-line transistors associated with a plurality of physically adjacent memory cells to a read bit-line. In response to an associated memory cell within the memory storing a first value, each of the plurality of read bit-line transistors turns on and provides a path to ground thereby causing a first output value to be output on the read bit-line. In response to all of the plurality of memory cells storing a second value, the plurality of read bit-line transistors turn off thereby preventing a path to ground and a second output value is output on the read bit-line.

Abstract: The semiconductor memory device includes a first memory cell array including at least one first memory cell and at least one second memory cell corresponding to the at least one first memory cell, a first low bit line connected to the at least one first memory cell, a first low complementary bit line connected to the at least one second memory cell, a first switch unit having a first terminal connected to the first low bit line, a second switch unit having a first terminal connected to the first low complementary bit line, a first global bit line connected to a second terminal of the first switch unit, a first global complementary bit line connected to a second terminal of the second switch unit, and a plurality of sensing amplifying units connected to the first global bit line and the first global complementary bit line.