Abstract: A semiconductor memory device includes a first comparative device, to which first and second voltages are input; a first capacitor, which accumulates the electrical potential of a first node; a power source, which outputs the first electric current to a second node; a resistor, which generates a third voltage in the second node; a second capacitor, which accumulates the electric potential of the second node; first switches, which make a common connection at a third node possible for the first node and the second node, to which the first capacitor and the second capacitor are connected respectively; and a second comparison device, which uses as an input voltage a fourth voltage, which is obtained as a result of the charge share between the first and the second capacitors and the electrical potential of a fourth node, and equalizes the electrical potential of the fourth node with the fourth voltage.

Abstract: A device that includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a first terminal, a second terminal, a first circuit electrically coupled to the second terminal, a second circuit electrically coupled to the first terminal and the first circuit, and a third circuit electrically coupled to the second circuit. The second semiconductor chip includes a third terminal, a fourth terminal, a fourth circuit electrically coupled to the fourth terminal, a fifth circuit electrically coupled to the third terminal and the fourth circuit, and a sixth circuit electrically coupled to the fifth circuit.

Abstract: A three-dimensional nonvolatile memory device comprises a plurality of cell strings arranged perpendicular to a substrate. The nonvolatile memory device is programmed by identifying a selected word line and a plurality of unselected word lines connected to at least one of the cell stings, and sequentially applying a negative voltage and a pass voltage to the selected and unselected word lines, and then applying a program voltage to the selected word line while continuing to apply the pass voltage to the unselected word lines.

Abstract: A sense amplifier arrangement includes a first sense amplifier having a first input and a second input. A second sense amplifier has a first input and a second input. A switching circuit is configured to selectively couple the first input of the first sense amplifier to a first bit line in the array and the second input of the first sense amplifier to a first bit line in the array to selectively couple the first input of the first sense amplifier to the first bit line in the array, the first input of the second sense amplifier to the second bit line in the array, and the second inputs of the first and second sense amplifiers to a reference voltage.

Abstract: A semiconductor system, a semiconductor memory apparatus, and a method for input/output of data using the same are disclosed. The semiconductor system includes a controller and a memory apparatus where the controller is configured to transmit a clock signal, a data output command, an address signal, and a second strobe signal to a memory apparatus. The memory apparatus is configured to provide data to the controller in synchronization with the second strobe signal, and in response to the clock signal, the data output command, the address signal, and the second strobe signal received from the controller.

Abstract: A method of screening static random access memory (SRAM) arrays to identify memory cells with bit line side pass transistor defects. After writing a known data state to the memory cells under test, a forward back-bias is applied to the load transistors of those cells. A write of the opposite data state is then performed, followed by a read of the memory cells. The process is repeated for the opposite data state.

Abstract: A memory bank includes an array of memory cells, word lines for accessing the memory cells, and word line drivers coupled to the word lines. When the memory bank is being accessed, the word line drivers are coupled to receive a first supply voltage, which is applied to the non-selected word lines of the memory bank. The first supply voltage turns off access transistors of the memory cells coupled to the non-selected word lines. When the memory bank is not being accessed, the word line drivers are coupled to receive a second supply voltage, which is applied to each of the word lines of the memory bank. The second supply voltage turns off the access transistors of the memory cells coupled of the word lines. The first and second supply voltages are selected such that the first supply voltage turns off the access transistors harder than the second supply voltage.

Abstract: A semiconductor memory device includes a power supply circuit configured to supply an intermediate voltage between a power supply voltage and a ground voltage to each of a plurality of memory cells. The power supply circuit firsts generates a first intermediate voltage between the power supply voltage and the ground voltage and a second intermediate voltage between the power supply voltage and the ground voltage. In response to a first control signal, the first intermediate voltage is supplied to an output node and the second intermediate voltage stops. A connection control circuit connects the first output node and a second output node when the second intermediate voltage generating circuit stops its operation.

Abstract: A dynamic random access memory (DRAM) is selectively operable in a sleep mode and another mode. The DRAM has data storage cells that are refreshed in the refresh mode. A boosted voltage is provided for the operation of the DRAM. A boosted voltage provider includes a group of charge pump circuits that are selectively activated by a pump control circuit based on a refresh time for refreshing data in the DRAM cells in the sleep mode.

Abstract: In at least one embodiment, a method includes applying an input voltage external to a semiconductor chip to a first circuit of the semiconductor chip to generate an output voltage external to the semiconductor chip. The first circuit is electrically coupled to a resistive device.

Abstract: A reference generator with programmable m and b parameters and methods of use are provided. A circuit includes a first generator operable to generate a first voltage including a fraction of a supply voltage. The circuit further includes a second generator operable to generate a second voltage. The circuit further includes a mixer and buffer circuit operable to output a reference voltage including a sum of the first and second voltages.

Abstract: Three dimensional cross-point array memory devices and selecting cells within a three dimensional cross-point array memory. In a particular embodiment, three different voltages levels are applied to bit lines of the cross point array to allow for selection of a specific cell. Series of select devices may be implemented to provide a high voltage and a low voltage to specific bit lines, while a middle voltage may also be provided. In a particular embodiment, the select devices comprise Metal-Oxide-Semiconductor Field Effect Transistors (MOSFETs).

Abstract: Electronic apparatus, systems, and methods can include a delayer having an inverter chain, where each inverter of the chain can be operatively regulated using current generators to control variation of the delay time of the delayer. In various embodiments, current generators can be arranged to provide reference voltages to each inverter stage of an inverter chain. Additional apparatus, systems, and methods are disclosed.

Abstract: A semiconductor device includes a first memory cell, a first line, a second line and a first capacitor. The first line is coupled to the first memory cell. The first line supplies a first voltage to the first memory cell. The second line is supplied with a fixed voltage. The first capacitor is coupled between the first and second lines.

Abstract: A device includes a first internal voltage generation circuit generating a first internal voltage in response to an external power supply voltage, a second internal voltage generation circuit generating a second internal voltage in response to the external power supply voltage, the second internal voltage being different in voltage level from the first internal voltage, and a preset signal generation circuit responding to a power-on of the external power supply voltage to the device and generating, independently of the first internal voltage, first and second preset signals that bring the first and the second internal voltage generation circuits into respective initial states, the preset signal generating circuit stopping generation of the first preset signal when the external power supply voltage reaches a first voltage level and stopping generation of the second preset signal when the external power supply voltage reaches a second voltage level different from the first voltage level.

Abstract: A circuit having a sensing circuit and at least one of a first node and a second node is described. The sensing circuit includes a pair of a first type transistors and a pair of a second type transistors. Each transistor of the pair of the first type transistors is coupled in series with a transistor of the pair of the second type transistors. The first node has a first voltage and is coupled to each bulk of each transistor of the pair of the first type transistors. The second node has a second voltage and is coupled to each bulk of each transistor of the pair of the second type transistors.

Abstract: An internal voltage generator of a semiconductor memory device includes a proportional to absolute temperature (PTAT) current generator configured to generate a PTAT current having a varying current in proportion to a temperature change, a current control circuit configured to generate an internal current identical with the PTAT current and generate an internal voltage based on the internal current, and an offset circuit configured to control the internal voltage to a set voltage level.

Abstract: A power mixing circuit capable of maintaining a stable output voltage in a deep-power- down mode is provided. The power mixing circuit includes an input buffer, a power mixing control circuit, a power mixing driver and an output buffer. The input buffer is configured to operate using a first supply voltage, and to generate a first voltage signal in response to an input signal. The power mixing control circuit is configured to generate a power mixing control signal based on a power-up signal and a deep-power-down mode signal. The power mixing driver is configured to operate using an external supply voltage and a second supply voltage, to perform power mixing on the external supply voltage and the second supply voltage, and to generate a second voltage signal. The output buffer is configured to operate using the second supply voltage, and to generate an output signal.

Abstract: An internal voltage generating circuit and a semiconductor memory device including the internal voltage generating circuit are disclosed. The internal voltage generating circuit includes a first voltage generating circuit, a second voltage generating circuit, and a third voltage generating circuit. The first voltage generating circuit stabilizes a first external supply voltage to generate a first internal voltage. The second voltage generating circuit stabilizes the first external supply voltage and a second external supply voltage to generate a second internal voltage having a voltage level higher than the first internal voltage. The third voltage generating circuit stabilizes the second internal voltage to generate a third internal voltage having a voltage level lower than the second internal voltage. Accordingly, the semiconductor memory device may be insensitive to a change in an external supply voltage and have small power consumption.

Abstract: According to one embodiment, a semiconductor storage device includes a memory cell array and a control circuit. The memory cell array has memory cells arranged therein at respective intersections between a plurality of first wirings and a plurality of second wirings. Each of the memory cells has a variable resistance element. The control circuit is configured to apply a voltage to a selected one of the first wirings and to a selected one of the second wirings. The control circuit includes a plurality of charge pump circuits and a plurality of clock oscillator circuits. The charge pump circuits generate a voltage applied to the first and second wirings. Each of the clock oscillator circuits is configured to supply a clock signal to a certain number of the charge pump circuits to control the timing of operation thereof. The clock oscillator circuits are configured to output clock signals at different frequencies.

Abstract: A memory module includes a ground terminal, a power terminal, a voltage regulator down, and a storing unit. The power terminal and the ground terminal are connected to a power source that supplies a first direct voltage. The voltage regulator down is connected to the power terminal and configured for converting the first direct current voltage to a second direct current voltage. The storing unit is connected the voltage regulator down for storing data and reading or writing data when the storing unit receives the second direct current voltage.

Abstract: According to an embodiment, a semiconductor device includes a power supply switch and a first regulator. One end of the power supply switch is connected to an input terminal. The other end of the power supply switch is connected to an output terminal. The first regulator includes a power supply terminal connected to the one end of the power supply switch, and a voltage output terminal connected to the other end of the power supply switch. The first regulator is configured to control a voltage of the voltage output terminal to approach a target voltage based on a voltage of the power supply terminal. The target voltage is switched to a first voltage or a second voltage. The first voltage is equal to or more than the voltage of the power supply terminal. The second voltage is lower than the voltage of the power supply terminal.

Abstract: A voltage driving circuit comprises a current bias generating unit and a voltage driving unit. The current bias generating unit is configured to receive a mode signal and to generate a mode selection current in response to the mode signal. The voltage driving unit is coupled to the current bias generating unit, and is configured to receive the mode selection current and to drive an output voltage at a slew rate that is set according to the mode selection current. The voltage driving unit can include a plurality of stages, where each stage is configured to drive the output voltage at a respective different slew rate according to the mode signal.

Abstract: An internal voltage generation circuit includes a vblh voltage generation circuit that generates a voltage vblh that is supplied as a high-voltage power supply of a sense amplifier, and a voltage distribution control circuit that has a first current source that pulls down an output node and a second current source that pulls up the output node. The output node is pulled down by the first current source operating, and the voltage thereof is maintained at a voltage that corresponds to a lower limit of a detection voltage value. The output node is pulled up by the second current source operating, and the voltage thereof is maintained at a voltage that corresponds to an upper limit of the detection voltage value.

Abstract: Methods for operating a semiconductor memory array including dynamically adjusting control line voltages (e.g., unselected word line or unselected bit line voltages) based on one or more array conditions associated with the semiconductor memory array are described. The one or more array conditions may include a temperature associated with the semiconductor memory array or a particular number of write cycles associated with the semiconductor memory array. In some embodiments, an intermediate voltage is generated based on the one or more array conditions and applied to the unselected word lines and the unselected bit lines of the semiconductor memory array. The one or more intermediate voltages may be generated such that a first voltage difference across unselected memory cells sharing a selected word line is different from a second voltage difference across other unselected memory cells sharing a selected bit line based on the one or more array conditions.

Abstract: According to one embodiment, a semiconductor storage device includes a three-dimensional memory cell array, write drivers, and a program voltage control circuit. In the three-dimensional memory cell array, memory cells are three-dimensionally arranged. The write drivers are arranged to be distributed under the three-dimensional memory cell array and apply a program voltage to the memory cells during writing in the memory cells. The program voltage control circuit is arranged around the three-dimensional memory cell array and performs control for making the write drivers to generate the program voltage.

Abstract: A sense-amplifier circuit of a memory, which includes a sense-amplifier unit, a first switch unit and a second switch unit. The sense-amplifier unit is constituted by a plurality of transistor switches and having a first, a second, a third and a fourth connection terminal. The first switch unit is configured to be parallel coupled between the first and second connection terminals of the sense-amplifier unit. The second switch unit is configured to be parallel coupled between the third and fourth connection terminals of the sense-amplifier unit. The first and second switch units each are constituted by a plurality of transistor switches coupled in parallel and are configured to control each of the parallel-coupled transistor switches on or off in the first and second switch units so as to calibrate a sensing range of the sense-amplifier unit. A calibrating method for a sense-amplifier circuit of a memory is also provided.

Abstract: The invention contained herein provides electrical circuits and driving methods to operate a memory cell comprising a capacitance coupled to a breakover conduction switch such as a thyristor, DIAC or one or more complementary transistor pairs. The memory cell comprises a cell capacitance for storing a memory state and for capacitively coupling an applied voltage to the switch. During operation, pulses are applied to write, read or maintain the cell's memory state. An illumination cell comprises an LED, OLED or electroluminescent material in series with each memory cell. Breakover conduction charge passes through the switch and the emissive element to charge the cell capacitance. A memory array of breakover conduction memory cells may be organized into rows and columns for reading and writing an addressable array memory cells. An organic light emitting display memory array may be fabricated using organic light emitting devices and/or materials.

Abstract: A semiconductor memory device, a semiconductor memory module, and a semiconductor memory system including the same, the semiconductor memory device including a command/address input buffer that receives a command/address signal and a command/address reference voltage signal, wherein the command/address input buffer is configured to amplify a difference between the command/address signal and the command/address reference voltage signal, and is further configured to output the amplified difference between the command/address signal and the command/address reference voltage signal, and a chip selection input buffer that receives a chip selection signal and a chip selection reference voltage signal, wherein the chip selection input buffer is configured to amplify a difference between the chip selection signal and the chip selection reference voltage signal, and is further configured to output the amplified difference between the chip selection signal and the chip selection reference voltage signal, wherein a volt

Abstract: According to one embodiment, a semiconductor device includes a first voltage generator, a second voltage generator, a first MOS transistor, and a controller. The first voltage generator outputs a first voltage to a first node. The second voltage generator outputs a second voltage to a second node. The first MOS transistor is capable of short-circuiting the first node and second node. The controller performs a control operation to short-circuit the first node and second node by turning on the first MOS transistor. The controller controls a period in which the first MOS transistor is kept in an on state based on time.

Abstract: A digital memory system includes a memory controller having a driver configured for generating a digital signal. A memory module has a receiver in communication with the driver. The driver is configured for selectively directing the digital signal to the receiver of the memory module. A voltage control module is configured for determining a traffic intensity at which the digital signal is directed to the receiver and dynamically adjusting the reference voltage as a function of the traffic intensity at which the digital signal is directed to the receiver.

Abstract: Provided are a semiconductor memory device and a memory system including the same, which may calibrate a level of an output voltage in consideration of channel environment and a mismatch in on-die termination (ODT) resistance of a memory controller. The memory system includes a memory controller and a semiconductor memory device. The semiconductor memory device is configured to generate a reference voltage based on driving information of the memory controller, and calibrate an output voltage level based on a reference voltage when the semiconductor memory device is electrically connected to the memory controller.

Abstract: A method and system for determining a respective threshold voltage of each of a plurality of transistors in a memory array. The method includes: applying a ramp voltage to gates of the plurality of transistors, wherein the ramp voltage is configured to increase based on an incrementing digital code; as the ramp voltage is being applied, generating a respective control signal in response to sensing a predetermined threshold current along a respective bitline in the memory array, wherein each transistor in the memory array is in communication with a respective bitline in the memory array; and for each transistor in the memory array, latching a current value of the incrementing digital code in response to the respective control signal corresponding to the transistor being generated. The current value of the incrementing digital code latched by each register corresponds to the threshold voltage of the corresponding transistor.

Abstract: A nonvolatile memory device (NVM), memory system and apparatus include control logic configured to perform a method of applying negative voltage on a selected wordline of the NVM. During a first time a first high voltage level is applied to the channel of a transistor of a address decoder and a ground voltage is applied to the well of the transistor. And, during a second time a second high voltage level is applied to the channel of the transistor, and within the second time interval a first negative voltage is applied to the well of the transistor. The first high voltage level is higher than the second high voltage level, and a voltage applied on the selected wordline is negative within the second time interval.

Abstract: An object is to provide a semiconductor device with a novel structure, which can hold stored data even when power is not supplied and which has an unlimited number of write cycles. The semiconductor device is formed using a memory cell including a wide band gap semiconductor such as an oxide semiconductor. The semiconductor device includes a potential change circuit having a function of outputting a potential lower than a reference potential for reading data from the memory cell. When the wide band gap semiconductor which allows a sufficient reduction in off-state current of a transistor included in the memory cell is used, a semiconductor device which can hold data for a long period can be provided.

Abstract: A keeper of an integrated circuit includes a first transistor having a first gate being coupled with an output end of an inverter. A second transistor is coupled with the first transistor in series. The second transistor has a second gate being coupled with an input end of the inverter.

Abstract: A static random access memory (SRAM) macro includes a first power supply voltage and a second power supply voltage that is different from the first power supply voltage. A precharge control is connected to the second power supply voltage. The precharge control is coupled to a bit line through a bit line precharge. At least one level shifter receives a level shifter input. The level shifter converts the level shifter input having a voltage level closer to the first power supply voltage than the second power supply voltage to a level shifter output having a voltage level closer to the second power supply voltage than the first power supply voltage. The level shifter output is provided to the precharge control.

Abstract: An apparatus, system, and method are disclosed for improving performance in a non-volatile solid-state storage device. Non-volatile solid-state storage media includes a plurality of storage cells. An input module receives source data for storage in the plurality of storage cells of the non-volatile solid-state storage media. Some or all of the bits of the source data are transformed to take into account a voltage level of an empty state of the plurality of storage cells. A write module writes the transformed source data to the plurality of storage cells of the non-volatile solid-state storage media.

Abstract: A non-volatile semiconductor memory device includes: a memory component in which an electric charge discharging rate between two electrodes is different in accordance with logic of stored information; a sense amplifier that detects the logic of the information by comparing a discharge electric potential of a wiring to which one of the electrodes of the memory component is connected with a reference electric potential; and a load capacitance changing unit that changes load capacitance of a sense node of the sense amplifier to which the discharge electric potential is input or both the load capacitance of the sense node and load capacitance of a reference node of the sense amplifier to which the reference electric potential is input in accordance with the logic of the information read out by the memory component.

Abstract: A circuit comprises a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a third NMOS transistor, and a fourth NMOS transistor. The PMOS transistors and the NMOS transistors are configured to provide a first voltage reference node having a first reference voltage and a second voltage reference node having a second reference voltage. The first reference voltage and the second reference voltage serve as a first reference voltage and a second reference voltage for a memory cell, respectively.

Abstract: An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies.

Abstract: A semiconductor memory device comprises a memory cell array, first and second bit lines, first and second amplifiers, and a sense amplifier control circuit. An amplifying element in the first sense amplifier amplifiers the signal of the first bit line and converts it into an output current. The second bit line is selectively connected to the first bit line via the first sense amplifier. A signal voltage decision unit in the second sense amplifier determines the signal level of the second bit line being supplied with the output current. The sense amplifier control circuit controls connection between the amplifying element and the unit in accordance with a determination timing, which switches the above connection from a connected state to a disconnected state at a first timing in a normal operation and switches in the same manner at a delayed second timing in a refresh operation.

Abstract: The variable resistance nonvolatile storage device includes a memory cell (300) that is formed by connecting in series a variable resistance element (309) including a variable resistance layer (309b) which reversibly changes based on electrical signals each having a different polarity and a transistor (317) including a semiconductor substrate (301) and two N-type diffusion layer regions (302a, 302b), wherein the variable resistance layer (309b) includes an oxygen-deficient oxide of a transition metal, lower and upper electrodes (309a, 309c) are made of materials of different elements, a standard electrode potential V1 of the lower electrode (309a), a standard electrode potential V2 of the upper electrode (309c), and a standard electrode potential Vt of the transition metal satisfy Vt<V2 and V1<V2, and the lower electrode (309a) is connected with the N-type diffusion layer region (302b), the electrical signals being applied between the lower and upper electrodes (309a, 309c).

Abstract: A semiconductor memory device includes: a memory-cell array provided between a first region and a second region, and including a plurality of memory cells; a first row decoder and a second row decoder; a first power line provided in the first region; a second power line provided in the first region; a first power-supply circuit configured to supply the first voltage to the first power line and to the second power line; a first switching circuit; and a second switching circuit. In a write operation, the first switching circuit connects the first power line and the first power-supply circuit to each other whereas the second switching circuit disconnects the second power line and the first power-supply circuit from each other.

Abstract: A memory using techniques to extract the data content of its storage elements, when the distribution of stored states is degraded, is presented. If the distribution of stored states has degraded, secondary evaluations of the memory cells are performed using modified read conditions. Based upon the results of these supplemental evaluations, the memory device determines the read conditions at which to best decide the data stored.

Abstract: A phase change random access memory device includes: a sense amplifier driving unit configured to compare an input voltage applied through an input signal line with a reference voltage and amplify an output signal in response to the comparison result; an input unit configured to receive an input signal from the input signal line and transmit the received signal to the sense amplifier driving unit; and a coupling prevention unit including a plurality of MOS transistors sharing a bulk bias, coupled between the sense amplifier driving unit and the input unit, and configured to control a sensing margin in response to a level of the input signal.

Abstract: A digital voltage boost circuit, optionally working in parallel with an analog voltage regulator, periodically injects a constant amount of current each cycle into the bit line of a high density memory array to eliminate the bias voltage reduction which would otherwise occur. This results in a much faster recovery time and reduces the semiconductor real estate required. A pulse generator in the boost circuit generates one or more current modulation signals which control corresponding current supply devices in a current source. The boost circuit drives a constant amount of current to the bias voltage node each memory cycle.

Abstract: In some embodiments, write wordline boost may be obtained from wordline driver boost and/or from bit line access transistor boost.

Abstract: A solid-state memory in which each memory cell is constructed of complementary metal-oxide-semiconductor (CMOS) inverters implemented with dual stress liner (DSL) technology. Asymmetry is incorporated into each memory cell by constructing one of the inverter transistors or the pass-gate transistor using the stress liner with opposite stress characteristics from its opposing counterpart. For example, both of the p-channel load transistors and one of the n-channel driver transistors in each memory cell may be constructed with a compressive nitride liner layer while the other driver transistor is constructed with a tensile nitride liner layer. In another implementation, one of the n-channel pass-gate transistors is constructed with a compressive nitride liner layer while the other pass-gate transistor is constructed with a tensile nitride liner layer. Improved cell stability due to the resulting asymmetric behavior is implemented in a cost-free manner.

Abstract: A method of operating a non-volatile memory device includes storing one or more addresses of word lines (WLs), but not the entire addresses of the WLs, into a latch, the WLs disposed between a string selection line (SSL) and a ground selection line (GSL), selecting a first WL from the latch, performing an erasing operation on memory cells associated with the string selection line (SSL), the memory cells associated with the SSL constituting a memory block, and verifying the erasing operation on memory cells associated with the selected first WL.