Abstract: A magnetic memory includes magnetic memory elements corresponding to magnetic memory cells and at least one shift register. Each magnetic memory element includes a pinned layer, a free layer, and a nonmagnetic spacer layer between the pinned and free layers. The free layer is switchable between stable magnetic states when a write current is passed through the magnetic memory element. The shift register(s) correspond to the magnetic memory elements. Each shift register includes domains separated by domain walls. A domain is antiparallel to an adjoining domain. The shift register(s) are configured such that an equilibrium state aligns a portion of the domains with the magnetic memory elements. The shift register(s) are also configured such that each domain wall shifts to a location of an adjoining domain wall when a shift current is passed through the shift register(s) in a direction along adjoining domains.

Abstract: A semiconductor device includes a non-volatile memory unit, a data line configured to transfer data sequentially outputted from the non-volatile memory unit, and a shift register unit configured to include a plurality of registers that shift and store the data transferred through the data line in synchronization with a clock. The semiconductor device includes a non-volatile memory unit having an e-fuse array, and transfers the data stored in an e-fuse array to other constituent elements of the semiconductor device that use the data of the e-fuse array in order to have the data stored in the e-fuse array, including diverse setup information and repair information.

Abstract: A memory has a serial interface. The serial interface is programmable to either use separate dedicated input and output pads, or to use one bidirectional pad. When one bidirectional pad is used, the interface signal count is reduced by one.

Abstract: One embodiment of the present invention sets forth an abstracted memory subsystem comprising abstracted memories, which each may be configured to present memory related characteristics onto a memory system interface. The characteristics can be presented on the memory system interface via logic signals or protocol exchanges, and the characteristics may include any one or more of, an address space, a protocol, a memory type, a power management rule, a number of pipeline stages, a number of banks, a mapping to physical banks, a number of ranks, a timing characteristic, an address decoding option, a bus turnaround time parameter, an additional signal assertion, a sub-rank, a number of planes, or other memory-related characteristics. Some embodiments include an intelligent register device and/or, an intelligent buffer device. One advantage of the disclosed subsystem is that memory performance may be optimized regardless of the specific protocols used by the underlying memory hardware devices.

Abstract: According to example embodiments, a semiconductor memory device includes a memory cell array, a multi-purpose register, a data output circuit, and a mode register. The memory cell array is configured to store data. The multi-purpose register is configured to store a data pattern. The data output circuit is configured to output the stored data during a first output mode and output the stored data pattern during a second output mode. The mode register is configured to set the first or second output mode according to a logic level of a portion of a content of the mode register.

Abstract: A non-volatile memory device is provided, which includes a first block for storing a first data group including a test data, a second block for storing a second data group including a complementary data to the first data group, a differential sense amplifier for generating an output value based on a difference between two input signals, a diagnostic circuit for performing a failure diagnosis using a value from the differential sense amplifier, and a control circuit which performs control such that a signal based on the test data and the complementary data is set to the input signal of the differential sense amplifier and the diagnostic circuit executes a failure diagnosis of the differential sense amplifier. The non-volatile memory device performs a failure diagnosis with high reliability capable of distinguishing between a failure of sense amplifier and a failure of a memory cell.

Abstract: A nonvolatile semiconductor storage device includes an identification code generating circuit, a simultaneous write bit count calculation circuit, a write range calculation circuit, and a program pulse generating circuit. The identification code generating circuit generates an identification code to be assigned to every one of bits to be written, and the simultaneous write bit count calculation circuit calculates the number of bits to be written simultaneously, the number being equalized based on the generated identification code, within a range that does not exceed a maximum simultaneously writable bit number. The write range calculation circuit calculates a write range, based on the calculated number of bits to be written simultaneously, and the program pulse generating circuit generates a program pulse based on write data and on the generated identification code and the calculated write range.

Abstract: A semiconductor memory device, includes a data terminal provided to transfer a data therethrough, a strobe terminal provided to be related in the data terminal and to transfer a strobe signal therethrough a command terminal provided to receive a command that communicates the data with an outside thereof, and a preamble resister configured to be capable of specifying a length of a preamble of the strobe signal prior to the communicating.

Abstract: An apparatus for moving a magnetic domain wall and a memory device using a magnetic field application unit are provided. The apparatus for moving a magnetic domain wall includes a magnetic layer having a plurality of magnetic domains; current supply units that are disposed on both sides of the magnetic layer and supply current to the magnetic layer; and a magnetic field application unit that is disposed on at least one surface of the magnetic layer and applies a magnetic field to the magnetic layer.

Abstract: A latency counter includes an input selecting circuit that selects one of a plurality of signal paths and supplies an internal command to the selected signal path, a shift circuit that switches a correspondence relation between the signal paths and a latch circuit, and an output selecting circuit that causes the internal command taken in the latch circuit to be output. The input selection circuit includes a timing control circuit allocated to each of the signal paths. The timing control circuit includes an SR latch circuit that is set by the internal command and is reset in response to deactivation of a corresponding count value. Therefore, it becomes possible to suppress shortening of an active period of the internal command that is output from the input selecting circuit.

Abstract: A memory circuit may include a shift register ring including single-bit shift registers. The circuit may include a clock connected to the shift registers to shift bits within the shift register ring, and a counter connected to the clock and indicating positions of the bits in the shift register ring.

Abstract: An access buffer, such as page buffer, for writing to non-volatile memory, such as Flash, using a two-stage MLC (multi-level cell) operation is provided. The access buffer has a first latch for temporarily storing the data to be written. A second latch is provided for reading data from the memory as part of the two-stage write operation. The second latch has an inverter that participates in the latching function when reading from the memory. The same inverter is used to produce a complement of an input signal being written to the first latch with the result that a double ended input is used to write to the first latch.

Abstract: A resister configuration control device which is capable of updating resister configuration values during a non-display period without increasing a circuit scale. A FIFO selector 103 receives register configuration value information comprising a register configuration value and address information, and selects a transmission destination to which the register configuration value information is to be sent, from FIFOs 108 and 109 based on the address information and sends the register configuration value information to the selected destination. The FIFO 108 or 109 temporarily stores the register configuration value information sent from the FIFO selector 103, and reads-out and outputs the register configuration value information in predetermined timing.

Abstract: A memory integrated circuit has an array of nonvolatile memory cells, bit lines accessing the array of nonvolatile memory cells, and bit line discharge circuitry. The bit lines have multiple discharge paths for a bit line at a same time, during a program operation.

Abstract: An anti-fuse circuit including a programmable module, a read module, and a control module is provided. The programmable module has a plurality of data cells. The read module is coupled to the programmable module. During a normal operation, the read module distinguishes which one or more of the data cells are stressed. The control module is coupled to the programmable module. During a stress operation, the control module controls each stressed data cell to be coupled to a high voltage, a low voltage, and a control voltage. The first end of each stressed data cells is coupled to the low voltage, the second end of each stressed data cells is coupled to the high voltage, and the control end of each stressed data cells is coupled to the control voltage during the stress operation.

Abstract: Provided are a semiconductor device including a fuse and a method of operating the same. The semiconductor device includes a fuse array, a first register unit, and a second register unit. The fuse array includes a plurality of rows and columns. The first register unit receives at least one row of fuse data from the fuse array. Fuse data of the at least one row of fuse data is received in parallel by the first register unit. The second register unit receives the fuse data at least one bit at a time from the first register unit.

Abstract: A semiconductor memory device may include a mode-register reading controller and a mode register. The mode-register reading controller generates a control signal for loading data into an input/output line in response to an enable signal, during a mode-register reading operation. The control signal is generated in response to a mode-register read signal when there is a reset command is input. The mode register loads the data into the input/output line in response to the control signal.

Abstract: A page buffer circuit includes: a main latch unit configured to have a main latch value which is dependent on a sub latch output signal, and output the main latch value to a first node; a sub latch unit configured to latch a voltage of a second node as a sub latch value in response to a storage enable signal, and generate the sub latch output signal according to the sub latch value when an output enable signal is activated; and a voltage determination unit connected between the first node and the second node, and configured to electrically connect or disconnect the first node to or from the second node in response to the storage enable signal, and determine a voltage level of the second node in response to the storage enable signal.

Abstract: The present invention is directed to systems and methods for improving access to non-volatile solid-state storage systems. Embodiments described herein provide a physical chunk number (PCN), or a physical page number (PPN), by which a controller can access the next available chunks (or pages) in a programming sequence optimized by concurrency. By incrementing the PCN, the controller can program consecutive chunks in the optimized programming sequence. In one embodiment, the programming sequence is determined at the time of initial configuration and the sequence seeks to synchronize data programming and data sending operations in subcomponents of the storage system to minimize contention and wait time. In one embodiment, the PCN includes an index portion to a superblock table with entries that reference specific blocks within the subcomponents in a sequence that mirrors the optimized programming sequence, and a local address portion that references a particular chunk to be programmed or read.

Abstract: One embodiment of the present invention sets forth an abstracted memory subsystem comprising abstracted memories, which each may be configured to present memory-related characteristics onto a memory system interface. The characteristics can be presented on the memory system interface via logic signals or protocol exchanges, and the characteristics may include any one or more of, an address space, a protocol, a memory type, a power management rule, a number of pipeline stages, a number of banks, a mapping to physical banks, a number of ranks, a timing characteristic, an address decoding option, a bus turnaround time parameter, an additional signal assertion, a sub-rank, a number of planes, or other memory-related characteristics. Some embodiments include an intelligent register device and/or, an intelligent buffer device. One advantage of the disclosed subsystem is that memory performance may be optimized regardless of the specific protocols used by the underlying memory hardware devices.

Abstract: A circuit for counting in an N-bit string a number of bits M, having a first binary value includes N latch circuits in a daisy chain where each latch circuit has a tag bit that controls each to be either in a no-pass or pass state. Initially the tag bits are set according to the bits of the N-bit string where the first binary value corresponds to a no-pass state. A clock signal having a pulse train is run through the daisy chain to “interrogate” any no-pass latch circuits. It races right through any pass latch circuit. However, for a no-pass latch circuit, a leading pulse while being blocked also resets after a pulse period the tag bit from “no-pass” to “pass” state to allow subsequent pulses to pass. After all no-pass latch circuits have been reset, M is given by the number of missing pulses from the pulse train.

Abstract: Methods for sensing, memory devices, and memory systems are disclosed. In one such memory device, a local sense circuit provides sensing of an upper group of memory cells while a global sense circuit provides sensing of a lower group of memory cells. Data sensed by the local sense circuit is transferred to the global sense circuit over local data lines or a global transfer line that is multiplexed to the local data lines. An alternate embodiment uses the local sense circuit to sense both upper and lower groups of memory cells.

Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: In a particular embodiment, a method includes discharging a first dynamic node at a first discharge circuit of a first dynamic circuit structure in response to receiving an asserted discharge signal. The first dynamic circuit structure includes the first dynamic node at a first voltage level and a first keeper circuit that is disabled when the asserted discharge signal is received. The asserted discharge signal has a second voltage level that is different from the first voltage level. A second keeper circuit of a second dynamic circuit structure is enabled responsive to discharging the first dynamic node to maintain a second dynamic node of the second dynamic circuit structure at the first voltage level.

Abstract: A semiconductor device includes a plurality of semiconductor memories, a clock signal synchronization circuit, and a first circuit. The clock signal synchronization circuit is electrically coupled to the plurality of semiconductor memories. The first circuit is electrically coupled to the plurality of semiconductor memories. The first circuit changes a bit width of data. The data is transferred between the first circuit and the plurality of semiconductor memories.

Abstract: A semiconductor memory device includes a security controller. When a one time programmable (OTP) device is programmed, the semiconductor memory device prohibits lock-status information pre-stored in an OTP lock register from being changed to an unlock status, such that it increases the stability of data stored in an OTP area. The semiconductor memory device includes an OTP device configured to determine whether or not data is changed according to a lock/unlock status when a program command is received, and an OTP controller configured to prohibit the lock status from being changed to the unlock status.

Abstract: A non-volatile memory device includes: first and second planes each comprising a plurality of non-volatile memory cells; first and second buffer corresponding to the first and second planes, respectively; an input/output control unit configured to selectively control input/output paths of data stored in the first and second page buffers; a flash interface connected to the input/output control unit; and a host connected to the flash interface.

Abstract: Provided is a delay adjustment device for adjusting delay of a strobe signal, which specifies when to read a data signal on a data line, with respect to the data signal in order to perform data transfer with an external memory. A testing unit 150 included in a delay adjustment unit is provided with a memory bandwidth monitoring unit 212 that monitors memory bandwidth in use on the data line used for data transfer with a memory circuit. The testing unit 150 performs delay adjustment when the memory bandwidth in use is lower than a predetermined threshold. Delay adjustment is performed by delaying the strobe signal from the data signal by a variety of predetermined delays and determining whether data transfer is successful at each delay, calculating an optimal delay, and thereafter delaying the strobe signal by the calculated delay.

Abstract: An anti-fuse circuit including a plurality of programmable units and a test module is provided. The programmable units receive a stress voltage, a program data, and a write enable signal. During a programming period, the programmable units sequentially transmit the program data. When the write enable signal is enabled, the stress voltage stresses the programmable units according to the program data, and the programmable units output programming results for test. The test module is coupled to the programmable units and receives the program data and the programming results. During a test period, the test module compares the programming results with the program data and outputs different logic levels according to a result of the comparison of the first programming results and the program data. A method for anti-fuse programming and test adapted to the foregoing anti-fuse circuit is also provided.

Abstract: A latch based memory device includes a plurality of latches and a method of testing the latch based memory device that includes serially connecting the latches with each other so as to form a shift register chain. A bit sequence is input into the shift register chain to shift the bit sequence through the shift register chain. A bit sequence is outputted and shifted through the shift register chain, and the input bit sequence is compared with the output sequence to evaluate the functionality of the latches in a first test phase and to test the remaining structures of the latch based memory device in a second test phase by using, e.g., a conventional scan test approach.

Abstract: A variable reference voltage circuit for performing memory operation on non-volatile memory includes a multi-level voltage source and a selector circuit. The multi-level voltage source generates multiple voltages. The selector circuit includes a selector input and a selector output. The selector input is coupled to the multi-level voltage source to selectively couple any of the multiple voltages to the selector output. The selector output of the selector circuit is coupled to a non-volatile memory array to provide the NV memory array with a selectable program voltage for programming the NV memory array and a selectable erase voltage for erasing the NV memory array.

Abstract: A DRAM controller component generates a timing signal and transmits, to a DRAM, (i) write data that requires a first time interval to propagate from the DRAM controller component to the DRAM and to be sampled by the DRAM on one or more edges of the timing signal, (ii) a clock signal that requires a second time interval to propagate from the DRAM controller component to the DRAM, and (iii) a write command, associated with the write data, to be sampled by the DRAM on one or more edges of the clock signal. The DRAM controller component includes series-coupled delay elements to generate respective incrementally delayed signals, and a multiplexer to select one of the delayed signals to time the transmission of the write data, such that transmission of the write data is delayed based on a difference between the first time interval and the second time interval.

Abstract: In one embodiment of the invention, a memory integrated circuit is provided including a memory array, a register, and control logic coupled to the register. The memory array in the memory integrated circuit stores data. The register includes one or more bit storage circuits to store one or more identity bits of an identity value. The control logic provides independent sub-channel memory access into the memory integrated circuit in response to the one or more identity bits stored in the register.

Abstract: The present invention relates to a method for timing acquisition and carrier frequency offset estimation of an OFDM communication system and an apparatus using the same. For this purpose the present invention provides a method for calculating at least one auto-correlation and calculating an observation value by performing a sliding sum on the at least one auto-correlation, and calculating a peak point of an absolute value of the observation as frame timing. In addition, the present invention provides a method for generating a third OFDM symbol that is generated by delaying a second OFDM symbol, calculating an observation value through the second and third OFDM symbols, and calculating a phase difference from a result of multiplication of the observation value and a conjugate complex value of the observation value such that a carrier frequency offset can be estimated.

Abstract: In one embodiment, an integrated circuit includes at least one logic circuit supplied by a first supply voltage and at least one memory circuit coupled to the logic circuit and supplied by a second supply voltage. The memory circuit is configured to be read and written responsive to the logic circuit even if the first supply voltage is less than the second supply voltage during use. In another embodiment, a method includes a logic circuit reading a memory cell, the logic circuit supplied by a first supply voltage; and the memory cell responding to the read using signals that are referenced to the first supply voltage, wherein the memory cell is supplied with a second supply voltage that is greater than the first supply voltage during use.

Abstract: To provide a semiconductor device including switch transistor provided between a sub-data line and a main data line. Upon transferring data, the semiconductor device supplies a potential of a VPP level to a gate electrode of the switch transistor when causing the switch transistor to be a conductive state, and supplies a potential of a VPERI level to the gate electrode when causing the switch transistor to be a non-conductive state. According to the present invention, because a potential of the gate electrode is not decreased to a VSS level when causing the switch transistor to be a non-conductive state, it is possible to reduce a current required to charge and discharge a gate capacitance of the switch transistor. Furthermore, because the VPP level is supplied to the gate electrode when causing the switch transistor to be a conduction state, a level of a signal after transfer never drops down by the amount of the threshold voltage.

Abstract: A nonvolatile semiconductor memory device is provided, which includes an input buffer provided with a first inverter that can electrically adjust circuit threshold values, a circuit: threshold value monitor provided with a second inverter having the same circuit configuration as the first inverter to detect the circuit threshold values of the first inverter when the input and output of the second inverter are short-circuited, respectively, a memory storing parameter values that correspond to the circuit threshold values detected by the circuit threshold value monitor, and a data-reader circuit reading the parameter values given to the first inverter from the memory.

Abstract: A level shifter including a level shifter module configured to i) receive an input signal, wherein the input signal varies between a first level and a second level, ii) receive a first voltage supply signal and a second voltage supply signal, and iii) generate a latch control signal based on the input signal and one of the first voltage supply signal and the second voltage supply signal. The level shifter further includes a latch module configured to i) receive the latch control signal, ii) receive the second voltage supply signal and a third voltage supply signal, and iii) generate an output signal based on the latch control signal and one of the second voltage supply signal and the third voltage supply signal.

Abstract: A method for operating a register stage of a dual function data register. A data register having master and slave latching circuits is used for concurrently storing two different words of data. Data is shifted into the master latching circuit in response to a first clock signal, and data stored in the master latching circuit is shifted into the slave latching circuit in response to a second clock signal. The first and second clocks are generated from a source clock in response to a control signal, which can be asserted at different times to initiate shifting operations from either the master latching circuit or the slave latching circuit. In otherwords, shifting operations can be initiated either on a rising edge of the source clock, or on a falling edge of the source clock.

Abstract: A structure and method for increasing the operating speed and reducing the overall programming time of a memory array are provided herein. The method and structure reduce the maximum write current consumption, for writing a plurality of data bits to a NVM array, by writing the data bits sharing an activated word line at different times (e.g., activating bit lines associated with an activated word line at different times). The write operation of respective data bits, which individually utilize only a fraction of the overall write window of the bits, are interleaved so that the maximum write current of respective bits are offset in time from the maximum write current of another bit, allowing a larger number of data bits to be written without exceeding system specifications (e.g., maximum current) and reducing overall memory write time.

Abstract: A fail-safe level shifter switching with high speed and operational for a wide range of voltage supply includes a cascode module, and one or more speed enhancer modules. The cascode module receives one or more input logic signal for generating a plurality of output signals with a reduced switching time. The speed enhancer modules are coupled to the cascode module for facilitating faster charging and discharging of nodes of the cascode module and improving the robustness and operating voltage range of cascode module.

Abstract: A semiconductor memory device includes a cell array unit having a plurality of banks each having a plurality of blocks, and a refresh controller configured to set at least one of the blocks as a test block, perform a refresh operation on the blocks except for the test block in a self-refresh operation period, determine a refresh period of the test block, and then set another one of the blocks as the test block.

Abstract: Semiconductor devices include a plurality of fuses and a plurality of program circuits, respective ones of which are configured to program respective ones of the plurality of fuses. The devices further include a shift register configured to activate at least two of the program circuits. In some embodiments, the shift register includes a first shift register configured to generate first select signals and a second shift register configured to generate second select signals corresponding to data to be programmed to the plurality of fuses. Respective ones of the program circuits may be configured to program respective ones of the fuses responsive to respective pairs of the first select signals and the second select signals.

Abstract: According to example embodiments, a semiconductor memory device includes a memory cell array, a multi-purpose register, a data output circuit, and a mode register. The memory cell array is configured to store data. The multi-purpose register is configured to store a data pattern. The data output circuit is configured to output the stored data during a first output mode and output the stored data pattern during a second output mode. The mode register is configured to set the first or second output mode according to a logic level of a portion of a content of the mode register.

Abstract: An array of memory bit cells are operable to provide a memory device having data shifting capability, so that data can be flexibly stored and retrieved from the memory device in both parallel and serial fashions. The memory array can thus be used for conventional memory storage operations, and also for operations, such as matrix operations, that provide for the alteration of the arrangement of stored data elements.

Abstract: Systems and methods for reducing delays between successive write and read accesses in multi-bank memory devices are provided. Computer circuits modify the relative timing between addresses and data of write accesses, reducing delays between successive write and read accesses. Memory devices that interface with these computer circuits use posted write accesses to effectively return the modified relative timing to its original timing before processing the write access.

Abstract: A mode-register reading controller includes a switching signal generator, first and second transmitters, and a control signal generator. The switching signal generator generates a switching signal that is activated when the reset command is input during a mode-register reading operation. The first transmitter buffers and transfers the mode-register read signal in response to the switching signal. The second transmitter, in response to the switching signal, delays and transfers the enable signal at a predetermined delay time. The control signal generator receives a signal from one of the first and second transmitters and generates a first control signal and a second control signal for transferring the data into a data output buffer from the input/output line.

Abstract: A semiconductor memory device includes first and second memory chips and a control logic configured to execute an interleave program between the first and second memory chips. The control logic receives write data to be written into first and second memory blocks of the first memory chip. If the first and second memory blocks are normal blocks, the control logic simultaneously performs a program operation for the first and second memory blocks. If one memory block of the first and second memory blocks is a bad block, the control logic writes the received write data corresponding to the one memory block into a storage circuit.

Abstract: A semiconductor memory device includes n stages of memory cell units, sense amplifier units, and shift registers. N units of the shift registers are connected to one another on the left end sides. The signal processing units and the reversed signal processing units are disposed adjacent to one another in each of the n units of the shift registers. The signal processing units located on the odd-numbered positions counted from the input end side are connected to one another. The reversed signal processing units located on the even-numbered positions counted from the input end side are connected to one another. The signal processing units located on the end opposite to the input end side are connected to the reversed signal processing units located on the end opposite to the input end side. Each of the signal processing units includes the logic circuit unit and the flip-flop while each of the reversed signal processing units includes the reversed logic circuit unit and the reversed flip-flop.

Abstract: A clock signal generation apparatus for generating a reference clock signal for outputting data in synchronization with an external clock signal from a semiconductor memory device, including: a clock signal generation unit for receiving an internal clock signal to generate the reference clock signal according to a control signal; and a control unit for generating the control signal based on a read command, a write command and an external address.