Abstract: A field programmable gate array (FPGA) utilizing resistive switching memory technology is described. The FPGA can comprise a switching block interconnect having a set of signal input lines and a set of signal output lines. Respective intersections of the signal input lines and signal output lines can have two resistive switching memory cells, a current differential latch, and a switching transistor (also referred to as a pass gate transistor) arranged in a circuit. Resistance states of the resistive switching memory cells can be programmed to control an output voltage state of the current differential latch. The output voltage state is latched into the current differential latch which can drive a gate of the switching transistor to activate or deactivate the switching transistor, which in turn activates or deactivates an intersection of the FPGA.

Abstract: Disclosed is a nonvolatile memory, which includes a plurality of input/output pads connectable to a plurality of data lines, an enable input pad, an enable output pad, and a chip address initialization circuit. The chip address initialization circuit receives a current chip address through the plurality of input/output pads, stores the current chip address in response to a current enable signal received through the enable input pad, outputs a next enable signal through the enable output pad, and outputs a next chip address through the plurality of input/output pads.

Abstract: Methods, systems, and devices for cache management in a memory subsystem are described. An interface controller may include a first buffer and a second buffer. The interface controller may use the first and second buffers to facilitate operating a volatile memory as a cache for a non-volatile memory. During an access operation, the interface controller may use the buffer to transfer data between the volatile memory, non-volatile memory, and another device. In response to the access operation, the interface controller may use the second buffer to transfer second data from the volatile memory to the non-volatile memory.

Abstract: An imaging device in which noise can be reduced, and an electronic device using this device. The imaging device includes a light receiving element, and a read circuit. A field effect transistor in the read circuit has a semiconductor layer in which a channel is formed, a gate electrode that covers the semiconductor layer, and a gate insulating film disposed between the semiconductor layer and the gate electrode. The semiconductor layer has a main surface, and a first side surface on one end side of the main surface in a gate width direction of the field effect transistor. The gate electrode has a first portion that faces the main surface via the gate insulating film, and a second portion that faces the first side surface via the gate insulating film. A crystal plane of the first side surface is a plane or a plane equivalent to the plane.

Abstract: A memory device and an operation method thereof are provided. The memory device includes memory cells, each having a static random access memory (SRAM) cell and a non-volatile memory cell. The SRAM cell is configured to store complementary data at first and second storage nodes. The non-volatile memory cell is configured to replicate and retain the complementary data before the SRAM cell loses power supply, and to rewrite the replicated data to the first and second storage nodes of the SRAM cell after the power supply of the SRAM cell is restored.

Abstract: Apparatuses and methods related to an artificial intelligence accelerator in memory are disclosed. An apparatus can include a number of registers configured to enable the apparatus to operate in an artificial intelligence mode to perform artificial intelligence operations and an artificial intelligence (AI) accelerator configured to perform the artificial intelligence operations using the data stored in the number of memory arrays. The AI accelerator can include hardware, software, and or firmware that is configured to perform operations associated with AI operations. The hardware can include circuitry configured as an adder and/or multiplier to perform operations, such as logic operations, associated with AI operations.

Abstract: Described apparatuses and methods enable communication between a host device and a memory device to establish relative delays between different data lines. If data signals propagate along a bus with the same timing, simultaneous switching output (SSO) and crosstalk can adversely impact channel timing budget parameters. An example system includes an interconnect having multiple data lines that couple the host device to the memory device. In example operations, the host device can transmit to the memory device a command indicative of a phase offset between two or more data lines of the multiple data lines. The memory device can implement the command by transmitting or receiving signals via the interconnect with different relative phase offsets between data lines. The host device (e.g., a memory controller) can determine appropriate offsets for a given apparatus. Lengths of the offsets can vary. Further, a system can activate the phase offsets based on frequency.

Abstract: A memory device including an interface to receive one or more clock signals and one or more data signal a dual-sensing stage dual-tail latch arranged at the interface. The dual-sensing stage dual-tail latch includes a sensing stage to sense a differential voltage between a first signal and a second signal and to provide a first differential voltage output and a second differential voltage output to a first node and a second node, respectively. The dual-sensing stage dual-tail latch includes a complimentary sensing stage arranged in parallel with the sensing stage and to sense the differential voltage between the first signal and the second signal, where a first complimentary differential output voltage and a second complimentary differential output of the complimentary sensing stage are coupled to the first node and the second node. The dual-sensing stage dual-tail latch includes a latch stage to receive the outputs from the first node and the second node.

Abstract: A circuit includes first and second bit lines, a second power node having a voltage level below that of a first power node, a reference node having a reference voltage level, first and second pass gates and drivers, first and second logic gates coupled to the second power node, first and second conversion circuits coupled between the first power node and respective first and second logic and pass gates, and first and second NOR gates coupled between the second power node and respective first and second logic gates and drivers. The first and second pass gates selectively couple the first and second bit lines to the first power node responsive to the respective second and first logic gates and conversion circuits, and the first and second drivers selectively couple the first and second bit lines to the reference node responsive to the respective first and second logic and NOR gates.

Abstract: A highly read data manager of a memory device receives a request to perform receives a request to perform a data relocation operation on a first wordline of a plurality of wordlines for a memory device, the memory device comprising a plurality of multi-level memory cells, wherein each multi-level memory cell comprises a plurality of pages; determines at the first wordline comprises data stored at one or more high read disturb pages of the plurality of pages; determines whether the data comprises a characteristic that satisfies a threshold criterion in relation to additional data stored on additional wordlines of the plurality of wordlines; responsive to determining that the data comprises the characteristic that satisfies the threshold criterion, identifies one or more low read disturb pages of the plurality of pages of a target wordline for relocating the data; and responsive to identifying the one or more low read disturb pages of the target wordline, stores at least a portion of the data at the one or more

Abstract: A memory device includes a memory array having a plurality of memory cells arranged along a plurality of rows extending in a row direction and a plurality of columns extending in a column direction. The memory array also includes a plurality of write assist cells connected to the plurality of memory cells. At least one write assist cell of the plurality of write assist cells is in each of the plurality of columns and connected to respective ones of the plurality of memory cells in a same column.

Abstract: A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.

Abstract: In certain aspects, a memory device includes a memory cell array having rows of memory cells, word lines respectively coupled to the rows of memory cells, and a peripheral circuit coupled to the memory cell array through the word lines. Each memory cell is configured to store a piece of N-bits data in one of 2N levels, where N is an integer greater than 1. The level corresponds to one of 2N pieces of N-bits data. The peripheral circuit is configured to program, in a first pass, a row of target memory cells, such that each of the row of target memory cells is programmed into one of 2N/m intermediate levels based on the piece of N-bits data to be stored in the target memory cell, where m is an integer greater than 1. The peripheral circuit is also configured to program, in a second pass after the first pass, the row of target memory cells, such that each target memory cell is programmed into one of the 2N levels based on the piece of N-bits data to be stored in the target memory cell.

Abstract: Various implementations described herein refer to an integrated circuit having a first memory structure and a second memory structure. The first memory structure is disposed in a first area of the integrated circuit, and the first memory structure has first memory cells with first transistors. The second memory structure is disposed in a second area of the integrated circuit that is different than the first area, and the second memory structure has second memory cells with second transistors that are separate from the first transistors. The second transistors of the second memory cells are arranged to provide an output oscillating frequency for detecting variation of performance of the first transistors of the first memory cells.

Abstract: A circuit includes a tracking word line, a power switch, a tracking bit line, a sense circuit. The power switch is coupled between the tracking word line and a first node. The power switch is configured to discharge a voltage level on the first node in response to a clock pulse signal transmitted through the tracking word line to the power switch. The tracking bit line is coupled between the first node and a plurality of tracking cells in a memory array. The sense circuit is coupled between the first node and a second node. The sense circuit is configured to generate a negative bit line enable signal in response to that the voltage level on the first node is below a threshold voltage value of the sense circuit.

Abstract: A chip, a self-calibration circuit and method for chip parameter offset upon power-up are disclosed. The circuit includes a counting circuit, a calibration data latch circuit, a calibration data selection circuit and a parameter calibration circuit. The counting circuit outputs a sequentially scanned counting signal when receiving a valid enabling signal. The calibration data latch circuit latches the counting signal when receiving a valid latch signal. The calibration data selection circuit selects the counting signal latched by the calibration data latch circuit as a calibration signal when receiving the valid latch signal, otherwise selects the counting signal currently outputted as the calibration signal. The parameter calibration circuit implements a parameter calibration based on the calibration signal in a calibration mode, while outputs the valid latch signal when the parameter calibration satisfies a preset requirement.

Abstract: A writing method for a non-volatile memory device includes; performing a sensing operation, comparing write data with read data retrieved by the sensing operation, determining whether the write data is set state when the write data and the read data are the same, performing a set operation when the write data is set state, and not performing a write operation when the write data is not set data.

Abstract: A non-destructive memory array implements a full adder. The array includes a column connected by a bit line and a full adder unit. The column stores a first bit in a first row of the bit line, a second bit in a second row of the bit line, and an inverse of a carry-in bit in a third row of the bit line. The full adder unit stores, in the second and third rows of the bit line, a sum bit and a carry out bit output, respectively, of adding the first bit, the second bit and the carry-in bit. The full adder unit does not overwrite any of the bits when a full adder table indicates that the sum bit and the carry out bit are equivalent to the second bit and the carry-in bit.

Abstract: A timing generator, a timing generating method and an associated control chip are provided, wherein the timing generator includes a receiving circuit, a transmitting circuit coupled to the receiving circuit, and a control unit respectively coupled to the receiving circuit and the transmitting circuit. The receiving circuit may be configured to receive a timing data set from a storage device. The transmitting circuit may be configured to select a specific signal type within multiple signal types according to the timing data set, and output an output signal having the specific signal type with a specific time length, wherein the timing data set indicates the specific signal type and the specific time length. The control unit may be configured to control operations of the receiving circuit and the transmitting circuit.

Abstract: Structures including non-volatile memory elements and methods of forming such structures. The structure includes a first non-volatile memory element, a second non-volatile memory element, and temperature sensing electronics coupled to the first non-volatile memory element and the second non-volatile memory element.

Abstract: A memory device includes: first power pins in a first power area and configured to receive a first power voltage; data pins configured to transmit or receive data signals, the data pins being arranged in a first region and in a second region each including the first power area; control pins configured to transmit or receive control signals in the first region and in the second region; second power pins in a second power area between the first region and the second region and configured to receive a second power voltage different from the first power voltage; and ground pins in the second power area and configured to receive a ground voltage.

Abstract: Disclosed herein are related to an integrated circuit including a semiconductor layer. In one aspect, the semiconductor layer includes a first region, a second region, and a third region. The first region may include a circuit array, and the second region may include a set of interface circuits to operate the circuit array. A side of the first region may face a first side of the second region along a first direction. The third region may include a set of header circuits to provide power to the set of interface circuits through metal rails extending along a second direction. A side of the third region may face a second side of the second region along the second direction. In one aspect, the first side extending along the second direction is shorter than the second side extending along the first direction, and the metal rails are shorter than the first side.

Abstract: A memory storage apparatus including a memory circuit and a memory controller is provided. The memory circuit is configured to store data. The memory controller is coupled to the memory circuit via a data bus. The memory controller performs initial setting of the memory circuit on the basis of a width of the data bus. In addition, an operating method of a memory storage apparatus is also provided.

Abstract: A semiconductor device is provided, which contains a memory bank including M primary word lines and R replacement word lines, a row/column decoder, and an array of redundancy fuse elements. A sorted primary failed bit count list is generated in a descending order for the bit fail counts per word line. A sorted replacement failed bit count list is generated in an ascending order of the M primary word lines in an ascending order. The primary word lines are replaced with the replacement word lines from top to bottom on the lists until a primary failed bit count equals a replacement failed bit count or until all of the replacement word lines are used up. Optionally, the sorted primary failed bit count list may be re-sorted in an ascending or descending order of the word line address prior to the replacement process.

Abstract: The present invention discloses a computing array based on 1T1R device, operation circuits and operating methods thereof. The computing array has 1T1R arrays and a peripheral circuit; the 1T1R array is configured to achieve operation and storage of an operation result, and the peripheral circuit is configured to transmit data and control signals to control operation and storage processes of the 1T1R arrays; the operation circuits are respectively configured to implement a 1-bit full adder, a multi-bit step-by-step carry adder and optimization design thereof, a 2-bit data selector, a multi-bit carry select adder and a multi-bit pre-calculation adder; and in the operating method corresponding to the operation circuit, initialized resistance states of the 1T1R devices, word line input signals, bit line input signals and source line input signals are controlled to complete corresponding operation and storage processes.

Abstract: Stochastic or near-stochastic physical characteristics of resistive switching devices are utilized for generating data distinct to those resistive switching devices. The distinct data can be utilized for applications related to electronic identification. As one example, data generated from physical characteristics of resistive switching devices on a semiconductor chip can be utilized to form a distinct identifier sequence for that semiconductor chip, utilized for verification applications for communications with the semiconductor chip or utilized for generating cryptographic keys or the like for cryptographic applications.

Abstract: To provide a data processing system that includes a nonvolatile memory device capable of storing multilevel data and enables increasing storage capacity of a main memory device when the data processing system is activated. The data processing system includes an arithmetic processing device, a main memory device, and a nonvolatile memory device. The main memory device includes a volatile memory device, and the nonvolatile memory device is configured to store multilevel data in one memory cell. When the data processing system is deactivated, the nonvolatile memory device stores binary data, whereby the stored data can be held for a long time. Upon activation, the nonvolatile memory device stores multilevel data, whereby increasing storage capacity. When the storage capacity is increased, a free space is generated in the nonvolatile memory device, which can be used as a part of the main memory device of the data processing system.

Abstract: Aspects of the disclosure provide for a circuit. In some examples, the circuit includes a Zener diode, a first current source, a first n-type field effect transistor (FET), a first inverter circuit, and a second current source. The Zener diode has a cathode coupled to a first node and an anode coupled to a second node. The first current source has a first terminal coupled to the second node and a second terminal coupled to a ground terminal. The first n-type FET has a gate terminal coupled to the second node, a source terminal coupled to the ground terminal, and a drain terminal coupled to a third node. The first inverter circuit has an input coupled to the third node and an output coupled to a fourth node. The second current source has a first terminal coupled to a fifth node and a second terminal coupled to the third node.

Abstract: An apparatus includes a NMOS transistor having a drain, a first PMOS transistor having a drain connected to the drain of the NMOS transistor, a level shifter having an input and an output, the input of the level shifter being connected to the drain of the NMOS transistor and the drain of the first PMOS transistor, a first digital logic circuit having a drain and a gate, a first inverter having an input connected to the Aoutput of the level shifter and the drain of the first digital logic circuit, and a second digital logic circuit having an output connected to the gate of the first digital logic circuit, at least one condition being set in the apparatus during a read operation.

Abstract: A method, includes: applying a read voltage at a first read voltage level to read a memory cell for detecting a resistance level of the memory cell; applying the read voltage at a second read voltage level, different from the first read voltage level, to read the memory cell for determining a waveform type has been utilized to program the memory cell; recognizing data bits stored in the memory cell. The data bits stored in the memory cell comprise a first data bit and at least one second data bit. The first data bit is recognized according to the waveform type and is irrelevant with the resistance level. The at least one second data bit is recognized according to the resistance level and is irrelevant with the waveform type. A device is also disclosed herein.

Abstract: A method for processing data read/write includes receiving a data read/write request. The data read/write request includes a command type, data, an address, a resource identifier, and a priority level. If the read/write request is the read request, determining whether the read request meets a first placement rule, the first rule being that the address of the read request is different from any and all write request addresses in the write command queue. If the first placement rule is not satisfied, the data stored in the conflicting (i.e., duplicated) address of the write request in the write command queue is acquired as the read data. A data read/write processing apparatus and a computer readable medium related to the data read/write processing method are also disclosed.

Abstract: The invention relates to a method for generating a request, from a formal language instruction defining a set of ports of an interconnection network, said request including an addressing command for each one of the ports defined in the instruction, said method including the following steps: Receiving, by a communication module, a formal language instruction defining a set of ports, Processing, by a processing module, the formal language instruction so as to generate a set of numbers encoded on at least one byte, each number including position bits, each one of the position bits allowing to identify a port and at least one authorization bit, the at least one authorization bit allowing to define access rights on the ports, and Encoding, by an encoding module, the set of numbers so as to generate the request including the addressing command.

Abstract: A semiconductor apparatus may include a command receiving circuit, a multiplexing circuit, and a DQ circuit. The command receiving circuit may be configured to latch signal bits of a command according to a clock signal, and output the latched signal bits as latched signals. The multiplexing circuit may be configured to receive the latched signals from the command receiving circuit, and selectively output the latched signals according to a flag signal which is internally generated within the semiconductor apparatus. The DQ circuit may be configured to receive the selectively outputted latched signals from the multiplexing circuit and receive the flag signal, and configured to output the selectively outputted latched signals and the flag signal as a feedback command to the outside of the semiconductor apparatus through a plurality of DQ pins.

Abstract: Methods, systems, and devices for a modified write voltage for memory devices are described. In an example, the memory device may determine a first set of memory cells to be switched from a first logic state (e.g., a SET state) to a second logic state (e.g., a RESET state) based on a received write command. The memory device may perform a read operation to determine a subset of the first set of memory cells (e.g., a second set of memory cells) having a conductance threshold satisfying a criteria based on a predicted drift of the memory cells. The memory device may apply a RESET pulse to each of the memory cells within the first set of memory cells, where the RESET pulse applied to the second set of memory cells is modified to decrease voltage threshold drift in the RESET state.

Abstract: An apparatus includes a sense amplifier, a plurality of storage memory cells coupled to the sense amplifier via a first digit line, and a plurality of offset memory cells coupled to the sense amplifier via a second digit line. The plurality of storage memory cells and the plurality of offset memory cells can comprise an array of memory cells. Each of the storage memory cells and the offset memory cells can include a respective capacitor having a particular capacitance.

Abstract: A processing device in a memory system receives a data access request identifying a memory cell in a first segment of the memory system comprising at least a portion of at least one memory device. The processing device determines a temperature difference between a current temperature associated with the memory cell and a baseline temperature of the memory system and identifies a temperature compensation value specific to the first segment of the memory system, the temperature compensation value corresponding to the temperature difference. The processing device adjusts, based on an amount represented by the temperature compensation value, an access control voltage applied to the memory cell.

Abstract: As described, an apparatus may include a memory cell corresponding to a memory address and an access line forming at least a portion of the memory cell. The apparatus may include a first decoder associated with a first delivery driver coupled to a first end of the access line and a second decoder associated with a second delivery driver coupled to another end of the access line.

Abstract: Subject matter disclosed herein relates to memory devices and, more particularly, to programming a memory cell.

Abstract: A memory of an electronic device includes a first memory region and a second memory region. A memory allocation method includes: receiving a request for memory allocation, the request for memory allocation including a memory capacity to be allocated; comparing the memory capacity to be allocated and a capacity range of a preset memory block to obtain a comparison result; according to the comparison result, allocating a memory block with the memory capacity from at least one of the first memory region or the second memory region.

Abstract: Latch circuitry configured to latch data for use in the memory device. The latch circuitry includes latch cells each configured to store a bit of the data. The latch circuitry also includes a data line coupled to a first side of the latch cells and a data false line coupled to a second side of the latch cells. The latch circuitry also includes a write driver that includes an input configured to receive the data to be stored in the latch cells and a pair of inverters coupled to the input and configured to output a data signal to a first side of the latch cells. The latch circuitry also includes an inverter coupled to the input and configured to generate a data false signal to a second side of the latch cells. The data used to generate the data false signal is not passed through the pair of inverters.

Abstract: A memory component includes a first memory bank. The first memory bank has a plurality of sub-arrays having sub-rows of memory elements. The memory component includes a write driver, coupled to the first memory bank, to perform a write operation of an entire sub-row of a sub-array. To perform the write operation, the write driver is to load a burst of write data to the memory bank. The memory bank may then activate a plurality of sense amplifiers associated with a plurality of memory elements of the entire sub-row to load the burst of write data to the plurality of sense amplifiers.

Abstract: Memory systems and memory programming methods are described.

Abstract: A disclosed circuit arrangement includes a bank of efuse cells, first and second sense amplifiers coupled to input signals representing constant logic-1 and logic-0 values, respectively, a storage circuit, an efuse control circuit, and an efuse security circuit. The efuse control circuit inputs signals from the bank of efuse cells and signals that are output from the first and second sense amplifiers, and stores data representative of values of the signals in the storage circuit. The efuse security reads the data from the storage circuit and generates an alert signal having a state that indicates a security violation in response to data representative of the value of the signal from the first sense amplifier indicating a logic-0 value or data representative of the value of the signal from the second sense amplifier indicating a logic-1 value.

Abstract: Various implementations described herein are directed to a device having memory circuitry having bitcells coupled together via bitlines. The device may include polarity swapping circuitry having multiple conductive paths that are configured to couple the bitlines together. In some instances, first paths of the multiple conductive paths couple the bitlines together via first passgates, and second paths of the multiple conductive paths couple the bitlines together via second passgates.

Abstract: Memory systems and memory programming methods are described. According to one aspect, a memory system includes program circuitry configured to provide a program signal to a memory cell to program the memory cell from a first memory state to a second memory state, detection circuitry configured to detect the memory cell changing from the first memory state to the second memory state during the provision of the program signal to the memory cell to program the memory cell, and wherein the program circuitry is configured to alter the program signal as a result of the detection and to provide the altered program signal to the memory cell to continue to program the memory cell from the first memory state to the second memory state.

Abstract: A semiconductor device includes a drive control circuit and a write control circuit. The drive control circuit generates a pre-drive control signal and a drive control signal based on a latch command and generates a pattern drive control signal based on a pattern latch command. The write control circuit stores drive data generated from data inputted based on the pre-drive control signal and the drive control signal or stores the drive data driven to a predetermined logic level based on the pattern drive control signal.

Abstract: The present disclosure includes apparatuses and methods related to storing a data value in a sensing circuitry element. An example method comprises sensing a first data value with a sense amplifier of a sensing circuitry element, moving a second data value from a first storage location of a compute component to a second storage location of the compute component, and storing, in the first storage location, a third data value resulting from a logical operation performed on the first data value and the second data value. The logical operation can be performed by logic circuitry of the sensing circuitry element.

Abstract: Techniques and mechanisms for changing a consistency with which a cell circuit (“cell”) settles into a given state. In one embodiment, a cell settles into a preferred state based on a relative polarity between respective voltages of a first rail and a second rail. Based on the preferred state, a hot carrier injection (HCI) stress is applied to change a likelihood of the cell settling into the preferred state. Applying the HCI stress includes driving off-currents of two PMOS transistors of the cell while the relative polarity is reversed. In another embodiment, a cell array comprises multiple cells which are each classified as being a respective one of a physically unclonable function (PUF) type or a random number generator (RNG) type. A cell is selected for biasing, and a stress is applied, based on each of: that cell's preferred state, that cell's classification, and another cell's classification.

Abstract: A writing method of a resistive memory storage apparatus includes: applying one of a set voltage and a reset voltage serving as a first selected voltage to a memory cell and obtaining a first read current; applying a disturbance voltage to the memory cell and obtaining a second read current; and determining whether a relationship between the first and second read currents satisfies a preset relationship, and if not, applying the other of the set voltage and the reset voltage serving as a second selected voltage to the memory cell and applying the first selected voltage to the memory cell again. A polarity of the disturbance voltage is different from that of the first selected voltage, and the absolute value of the disturbance voltage is less than that of the second selected voltage. A resistive memory storage apparatus is also provided.

Abstract: A memory device includes a memory which has memory areas, and a controller has a first mode and a second mode. Upon receipt of write data, the controller writes data in the memory areas while managing correspondence between logical addresses of write data and memory areas which store corresponding write data. A plurality of the memory areas constitutes a management unit. The controller in the first mode is able to write pieces of data in respective memory areas and configured to maintain data in memory areas in one management unit which contains data to be updated. The controller in the second mode writes pieces of data in respective memory areas in the ascending order of logical addresses of the pieces of data and invalidates data in memory areas in one management unit which contains updated data.