Abstract: A memory device includes a block of memory cells having a plurality of levels. Each level includes strips of memory cells extending in a first direction between first and second ends of the block. A first bit line structure, at each level at the first end, is coupled to a first string of memory cells extending from the first end. A second bit line structure, at each level at the second end, is coupled to a second string of memory cells extending from said second end. Bit line pairs extend in the first direction with each including odd and even bit lines. Odd and even bit line connectors connect the odd and even bit lines to the second and first bit line structures, respectively. Each bit line for a series of bit line pairs are separated by a bit line of an adjacent pair of bit lines.

Abstract: An antifuse comprised of an NMOS transistor or an NMOS capacitor includes a first terminal coupled to a gate electrode, a second terminal coupled to a diffusion layer, and a gate insulating film interposed between the gate electrode and the diffusion layer. A programming circuit includes a first programming circuit which has first current drive capability and which performs first programming operation and a second programming circuit which has second current drive capability larger than the first current drive capability and which performs second programming operation to follow the first programming operation. In the first programming operation, the first programming circuit breaks down the gate insulating film by applying a first programming voltage between the first terminal and the second terminal. In the second programming operation, the second programming circuit applies a second programming voltage lower than the first programming voltage between the first terminal and the second terminal.

Abstract: A nonvolatile memory device includes a plurality of memory blocks, and a pass transistor array transmitting a plurality of drive signals to a selected memory block among the plurality of memory blocks in response to a block select signal. The pass transistor array includes high voltage transistors including one common drain and two sources formed in one active region and one of the plurality of drive signals transmitted to the common drain is transmitted to different memory blocks through the two sources.

Abstract: A memory comprises a memory cell, a sense amplifier, and a control unit. The memory cell stores a first bit and a second bit. The sense amplifier senses a first cell current and a second cell current corresponding to the first and the second bits respectively with a voltage applying on the memory cell. The control unit determines a digital state of the first bit by comparing a first reference current with the first cell current or by comparing a reference data with a first delta current between the first cell current and the second cell current.

Abstract: A memory system according to the embodiment comprises a cell array including plural unit cell arrays stacked, each unit cell array containing plural first lines, plural second lines intersecting the plural first lines, and plural memory cells provided at the intersections of the plural first lines and the plural second lines; and an access circuit operative to write data in the memory cell, wherein the access circuit partly has a first part formed at the same height as that of a certain unit cell array in the stacking direction of the plural unit cell arrays and on the periphery of the certain unit cell array.

Abstract: A semiconductor integrated circuit device that detects an operation error of an SRAM caused by a device variation fluctuating with time is provided. In the SRAM, a memory cell has a transfer MOS transistor whose gate is connected to a word line. At the time of a write test of the memory cell, a control circuit including a test/normal operation selection circuit and a word line driver circuit applies a third voltage to the word line in a preparation period before writing test data, thereafter a first voltage to the word line, and a second voltage to the word line at the end of writing. Due to this, the threshold voltage of the transfer MOS transistor, which fluctuates with time, can be controlled. Therefore, it is possible to enhance detection efficiency for a malfunctioning cell of the SRAM due to a temporal variation.

Abstract: Various aspects of a fast, energy efficient write driver capable of efficient operation in a dual-voltage domain memory architecture are provided herein. Specifically, various aspects of the write driver described herein combine a high speed driver with voltage level shifting capabilities that may be implemented efficiently in reducing use of silicon area while using lower power. The write driver circuit shifts or adjusts voltage levels between a first voltage domain to a second voltage domain. In one example, the write driver circuit is coupled to a global write bitline and a local write bitline that is coupled to one or more bitcells (of SRAM memory). The write driver circuit converts a first voltage level at the global write bitline to a second voltage level at the local write bitline during a write operation.

Abstract: It is an object to obtain a memory element (DRAM) storing multilevel data easily. The amount of charge accumulated in a capacitor of a memory element (DRAM) is controlled by changing the potential of a wiring (a bit line), which is used for writing data to the memory element (DRAM), in a period in which a transistor included in the memory element (DRAM) is on. Thus, multilevel data stored in the memory element (DRAM) can be obtained without a complex configuration of a semiconductor device including the memory element (DRAM).

Abstract: In one embodiment, a memory includes a plurality of bit lines and a write driver for driving a driven bit line selected from the plurality of bit lines during a write operation. The write driver is coupled to an internal node. A first stage clamping circuit is operable to clamp the internal node to a clamping voltage if the write operation is not enabled and is further operable to unclamp the internal node during the write operation. The memory further includes a multiplexer for selectively coupling the driven bit line to the internal node. A second stage clamping circuit is operable to clamp the plurality of bit lines to a clamping voltage if the write operation is not enabled and is further operable to unclamp the driven bit line during the write operation.

Abstract: Memory technology adapted to store data in a binary format. Such technology includes a semiconductor memory device having memory cells, each having a substrate and at least three graphene layers that are oriented to define a graphene stack disposed in a plane. The graphene stack of each memory cell is connected to a bit line and to a ground connection so that a conductive path is defined in the plane of the graphene stack. The in-plane conductivity of the graphene stack of each memory cell is altered during programming of the memory cell to define a binary value of bits stored in the memory cell.

Abstract: Embodiments of a memory are disclosed that may allow for a negative boost of data lines during a write. The memory device may include a data input circuit, an address decode circuit and a plurality of sub-arrays. Each of the sub-arrays may include a plurality of columns, a write selection circuit, a first write driver circuit, a second write driver circuit, and a boost circuit. Each of the columns may include a plurality of data storage cells. The write selection circuit may select a column of the plurality of columns. Each of the write driver circuits may be configured to discharge a data line of a selected column into a common node. The boost circuit may be configured to initialize the common node to the first voltage level and couple the common node to a second voltage level, where the second voltage level is lower than the first voltage level.

Abstract: When writing into an antifuse memory element finishes, a value of resistance of the memory element rapidly decreases; accordingly, an output voltage of a boosting circuit which produces a writing voltage rapidly decreases. By detecting a change in the output voltage of the boosting circuit to control a writing command, the writing operation can be stopped immediately after the memory element is shorted. Thus, unnecessary current consumption caused by continuing a writing operation on the shorted memory element can be suppressed.

Abstract: Providing for improved write processes of a semiconductor memory are disclosed herein. By way of example, a programmable write assist can be provided that includes partially discharging a supply voltage applied to a memory cell. Partially discharging the supply voltage can improve write speeds to the memory cell, as well as improve reliability of the write process. A write assist circuit can cause the discharging in response to a resistance-modulated signal. Moreover, the resistance-modulated signal can be configured to control an amount or speed of the discharging of the supply voltage. Further, modulation control can be provided to mitigate discharging of the supply voltage beyond a target level, to reduce data loss in a target data cell or an adjacent data cell.

Abstract: A memory device having complementary global and local bit-lines, the complementary local bit-lines being connectable to the complementary global bit-lines by means of a local write receiver which is configured for creating a full voltage swing on the complementary local bit lines from a reduced voltage swing on the complementary global bit lines. The local write receiver comprises a connection mechanism for connecting the local to the global bit-lines and a pair of cross-coupled inverters directly connected to the complementary local bit lines for converting the reduced voltage swing to the full voltage swing on the complementary local bit lines.

Abstract: An apparatus and method for executing a write operation in a static random access memory (SRAM) array including memory cells that are coupled to a plurality of word lines and to a plurality of bit lines are provided. A clock signal is generated to start a write operation. A pulse is generated on the plurality of word lines in response to the clock signal. An operation voltage of the SRAM array is lowered for a period of time during the write operation. The period of time is controlled and the pulse is ended using a tracking circuit. The tracking circuit includes a plurality of tracking memory cells. The plurality of tracking memory cells have a timing characteristic that emulates a timing characteristic of the SRAM array during the write operation. The tracking circuit controls the period of time and ends the pulse based on the emulated timing characteristic.

Abstract: A semiconductor storage apparatus according to the present invention includes a plurality of memory cells, a plurality of word lines, a plurality of pairs of bit lines, a plurality of sense amplifiers, a pair of common data lines, a data-to-be-written output circuit configured to, in writing data, set voltages of the common data lines forming the pair, a column selection signal output unit configured to output a plurality of column selection signals, and a plurality of column selection gates, in which in writing the data, the column selection signal output unit selectively turns on one of the column selection gates by setting each of voltages of the column selection signals to one of a level of a higher-potential power supply voltage and a level of a lower-potential power supply voltage, before activating the sense amplifiers.

Abstract: A logic chip and memory chip stacked over the logic chip, the logic chip having a first surface facing the memory chip and a second surface opposite to the first surface and including: first and second internal input/output circuit units for exchanging signals; first external input/output circuit unit for exchanging signals through first external input/output pads formed according to an external interface standard of a first memory over the second surface; and second external input/output circuit unit for exchanging signals through second external input/output pads formed according to an external interface standard of a second memory over the second surface, wherein semiconductor device operates in one of a first mode in which the first internal input/output circuit unit and the first external input/output circuit unit are enabled and a second mode in which the first and second internal input/output circuit units and the second external input/output circuit unit are enabled.

Abstract: A memory cell with a decoupled read/write path includes a switch comprising a first terminal connected to a first line and a second terminal connected to a second line, a resistive switching device connected between a gate of the switch and a third line, and a conductive path between the gate of the switch and the second line.

Abstract: A semiconductor memory device includes a memory cell array having memory cells coupled to a plurality of word lines and a peripheral circuit group configured to supply a pass voltage to unselected word lines among the plurality of word lines, wherein the peripheral circuit group stepwise raises the pass voltage supplied to the unselected word lines to a target level.

Abstract: A memory array assembly and a method for performing a write operation without disturbing data stored in other SRAM cells are provided. The memory array assembly comprises a plurality of SRAM cells, a plurality of avoid-disturb cells, a plurality of sense amplifiers and a plurality of write drivers. The SRAM cells are arranged in rows and columns, wherein each column is coupled to an avoid-disturb cell, a sense amplifier, and a write driver. The avoid-disturb cell receives a select signal capable of assuming first or second states. An output of the sense amplifier is coupled to an input of the write driver when the select signal is in the first state. A data-in bus is coupled to the input of the write driver if the select signal is in the second state. The write driver then sends the output signal to the SRAM cell.

Abstract: Among other things, techniques for facilitating a write operation to a bit cell are provided. A pulse generator initializes lowering of an internal voltage level associated with a bit cell that is to be written to by a write operation. In this way, the bit cell is placed into a writeable voltage state, such that a potential of the bit cell can be overcome by the write operation. A voltage detector sends a reset signal to the pulse generator based upon the pulse generator lowering the internal voltage level past a reset trigger level. Responsive to receiving the reset signal, the pulse generator initializes charging of the internal voltage level to an original voltage level. In this way, the lowering of the internal voltage level is controlled so that one or more other bit cells are not affected (e.g., suffer data retention failure) by the relatively lower internal voltage level.

Abstract: A method of writing a first state or a second state to a memory cell may be provided. Writing the first state to the memory cell may include electrically connecting a first switch in electrical connection to a first end of the memory cell to a first voltage and electrically connecting a second switch in electrical connection to a second end of the memory cell to a fourth voltage to apply a first potential difference to cause formation of the first state in the memory cell. Writing the second state to the memory cell may include electrically connecting the first switch to the second voltage and electrically connecting the second switch to the third voltage to apply a second potential difference to cause formation of the second state in the memory cell.

Abstract: A multi-state memory system with encoding that minimizes half-select currents. The system includes an array of row and column conductors with a plurality of storage cells each capable of being placed into any of three or more physical states. An encoder is connected to receive data bits for storage and to apply activation signals to the row and column conductors to write information to the storage cells. The encoder is programmed to encode the data bits into entries in an array having one row corresponding with each row conductor and one column corresponding with each column conductor; select entries in the array according to half-select currents of the storage cells; apply a predetermined one-dimensional mapping that increases the value of at most one entry in the array to obtain a mapped array; and write entries of the mapped array into the storage cells.

Abstract: A driver for a semiconductor memory includes: a selection controller configured to output a target charge current select signal and a bucket charge current select signal in response to an inputted memory cell address and a target charge current value and a bucket charge current value, which are to be applied to a memory cell of the memory cell address; a current supply unit configured to supply a target charge current to the memory cell of the memory cell address in response to the target charge current select signal; and a bucket charge current supply unit configured to supply a bucket charge current to the memory cell of the memory cell address, in order to pre-charge the memory cell of the memory cell address in response to the bucket charge current select signal.

Abstract: A write leveling calibration system and method for double data-rate dynamic random access memory includes performing write leveling at two different frequencies to determine to which of two successive rising clock cycle edges each data strobe signal would be aligned as a result of applying the write leveling delay determined by the write-leveling procedure. The determination can then be used to ensure that the data strobe signals of all source synchronous groups are aligned with the same edge of the clock signal.

Abstract: A circuit configuration is described including a first input for inputting a first set of digital input data, an output for outputting digital output data, and a control input for receiving a control signal. At least two register units are provided and the circuit configuration is designed to write, as a function of the control signal, into a first register unit optionally at least a part of the first set of input data or of the second set of digital input data and to write into a second register unit optionally at least a part of the first set of input data or of the second set of input data.

Abstract: A negative voltage generator includes a variable-capacitance negative voltage generating unit, a switching unit and a positive voltage applying unit. The negative voltage generating unit includes a plurality of coupling capacitors for varying the capacitance in which the negative voltage is charged. The negative voltage generating unit selects at least one coupling capacitor of the plurality of coupling capacitors according to the number of rows (size) of a memory bank to which data is written, and charges the at least one selected coupling capacitor to a negative voltage. The switching unit selects one bitline of a bitline pair having complementary first and second bitlines in response to the data, and connects the at least one selected coupling capacitor to the selected bitline. The positive voltage applying unit applies a positive (high) voltage to an other bitline of the bitline pair.

Abstract: Providing for capacitive programming of two-terminal memory devices is described herein. By way of example, a capacitance circuit can be precharged to a predetermined program voltage to facilitate programming one or more memory cells. The capacitance circuit can be disconnected from a power source and connected instead to the memory cell(s), enabling charge stored by the capacitance circuit to discharge through the memory cell(s). A current at the memory cell(s) can program the cell, while a total amount of discharge is limited to the charge stored by the capacitance circuit. Limiting the total charge can serve to also limit joule heating of the target memory cell, power consumption of a memory device, as well as other benefits.

Abstract: Apparatuses and methods are disclosed, including an apparatus with a first differential amplifier to amplify an input signal into a first output signal, a second differential amplifier to amplify the input signal into a second output signal that is complementary to the first output signal, and a feedback resistance coupled between the first output signal and the second output signal. Additional apparatuses and methods are described.

Abstract: A semiconductor memory device includes a write controller configured to transmit a first input data that is supplied through a first pad, to a first global I/O line and a second global I/O line when a write operation is executed in a test mode. The semiconductor memory device further includes a first write driver configured to store the first input data via the first global I/O line in a first cell block when the write operation is executed in the test mode. The semiconductor memory device further includes a first I/O line driver configured to supply signals to the first global I/O line and a first test I/O line in response to a first output data supplied from the first cell block when a read operation is executed in the test mode.

Abstract: Reading methods of nonvolatile memory devices including a substrate and a plurality of memory cells which are stacked in a direction intersecting the substrate. The reading methods apply a bit line voltage to a plurality of bit lines and apply a first string selection line voltage to at least one selected string selection line. The reading methods apply a second string selection line voltage to at least one unselected string selection line and apply a read voltage to a plurality of word lines. The reading methods apply a first ground selection line voltage to at least one selected ground selection line and apply a second ground selection line voltage to at least one unselected ground selection line.

Abstract: A nonvolatile semiconductor memory device includes a write control unit that performs a first write operation with respect to a first threshold distribution, a first verify operation on the first threshold distribution, and a second write operation on the basis of a result of the first verify operation, and then starts a third write operation with respect to a second threshold distribution.

Abstract: There is provided, for example, a write assist circuit for controlling the voltage level of a memory cell power supply line coupled to an SRAM memory cell to be written in the write operation. The write assist circuit reduces the voltage level of the memory cell power supply line to a predetermined voltage level, in response to a write assist enable signal that is enabled in the write operation. At the same time, the write assist circuit controls the reduction speed of the voltage level of the memory cell power supply line, according to the pulse width of a write assist pulse signal. The pulse width of the write assist pulse signal is defined in such a way that the greater the number of rows (or the longer the length of the memory cell power supply line), the greater the pulse width.

Abstract: An integrated circuit device comprises a semiconductor substrate, a first memory block on the substrate comprising NAND memory cells, a second memory block on the substrate comprising NAND memory cells, and controller circuitry. The first and second memory blocks are configurable to store data for a first pattern of data usage in response to a first operation algorithm to read, program and erase data, and for a second pattern of data usage in response to a second operation algorithm to read, program and erase data, respectively. The controller circuitry is coupled to the first and second memory blocks, and is configured to execute the first and second operation algorithms, wherein a word line pass voltage for read operations applied in the first operation algorithm is at a lower voltage level than a second word line pass voltage for read operations applied in the second operation algorithm.

Abstract: A method for programming data is provided for a memory storage device having a rewritable non-volatile memory module and a buffer memory. The method includes receiving a plurality of data including a first-type data and at least one second-type data, and a size of the first-type data is smaller than a data size threshold. The method includes temporarily storing the plurality of data into the buffer memory, and programming the first-type data and at least one part of the at least one second-type data stored in the buffer memory into a physical program unit set if it is determined that the plurality of data are complied with a predetermined condition. The method includes obtaining writing statuses of the first-type data and the at least one part of the at least one second-type data at the same time.

Abstract: Memory hole diameter in a three dimensional memory array may be calculated from characteristics that are observed during programming. Suitable operating parameters may be selected for operating a block based on memory hole diameters. Hot counts of blocks may be adjusted according to memory hole size so that blocks that are expected to fail earlier because of small memory holes are more lightly used than blocks with larger memory holes.

Abstract: A nonvolatile memory device comprises a resistive memory cell, a write driver configured to write data to the resistive memory cell during a write period comprising a plurality of loops, and a sense amplifier configured to verify whether the data is correctly written to the resistive memory cell in each of the loops. Where the sense amplifier verifies that the data is correctly written in a k-th loop among the loops, the write driver is disabled from a (k+1)-th loop to an end of the write period.

Abstract: An integrated circuit may include memory interface circuitry for communicating with off-chip memory. The memory interface circuitry may receive data signals and data strobe signals from different memory devices via respective data ports and data strobe ports. The memory interface circuitry may be operable in at least first and second modes. In the first mode, data signals from each memory device may be received at two respective data ports while the data strobe signal from one memory device is used to clock the data signals at two corresponding read capture registers. In the second mode, data signals from first and second memory devices may be received via first and second data ports, respectively. The data strobe signal from the first memory device may be ignored while the data strobe signal from the second memory device is used to clock the data signals at two corresponding read capture registers.

Abstract: A semiconductor memory device includes a pad configured to receive a first write data from outside of the semiconductor memory device, and a write circuit configured to generate a plurality of second write data which are to be written in memory cells of all banks to be tested in response to a test mode signal, data strobe signals, a write enable signal, and the first write data transferred through the pad.

Abstract: A method for driving a nonvolatile memory apparatus includes: a data storage preparation step of setting a write control voltage to a first level of voltage; a data storage step of driving a driving transistor through the write control voltage to generate a write current, and storing an external data in a memory cell through the write current; a data detection step of varying the write control voltage by a predetermined level from a preset voltage level, and reading the data stored in the memory cell; and a data verification step of determining whether the stored data coincides with the external data or not, and repeating the data storage step and the data detection step according to a result of the determining.

Abstract: A resistance change memory device includes: a memory cell formed of a variable resistance element and a diode connected in series, the state of the variable resistance element being reversibly changed in accordance with applied voltage or current; and a stabilizing circuit so coupled in series to the current path of the memory cell as to serve for stabilizing the state change of the memory cell passively.

Abstract: A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation.

Abstract: A method for measuring a write current of a semiconductor memory device includes the steps of: programming initial data into memory cells which are to be programmed substantially at the same time; determining whether the memory cells are programmed into the same state or not; inputting test data when the memory cells are programmed into the same state; setting write current paths of the memory cells by comparing the initial data and the test data; and measuring a write current consumed when the test data are programmed into the memory cells.

Abstract: A memory device includes: a plurality of nonvolatile memory sections configured to allow one memory cell to record data of a plurality of bits, and to include a corresponding number of pages to the plurality of bits in accordance with a plurality of the memory cells as a write control unit; and a control section configured to control writing and reading data to and from the plurality of nonvolatile memory sections, wherein among the plurality of nonvolatile memory sections, if data is written into one of the nonvolatile memory sections, the data is written for each page in sequence from a low-order page to a high-order page, and when the data is written into the low-order page, control is performed such that the data to be written into the low-order page is written into any area of the other of the nonvolatile memory sections at same timing.

Abstract: A three-dimensional array adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes.

Abstract: A semiconductor memory device includes a memory cell block including memory cells, a random value generation circuit configured to generate random value data using a page address and a column address, a page buffer section connected to bit lines of the memory cell block and configured to store input data inputted in response to the column address and the random value data, and a controller configured to control the page buffer section to generate random data by performing a logic operation on the input data and the random value data stored in the page buffer section.

Abstract: A semiconductor device avoids the disturb problem and the collision between write and read operations in a DP-SRAM cell or a 2P-SRAM cell. The semiconductor device 1 includes a write word line WLA and a read word line WLB each coupled to memory cells 3. A read operation activates the read word line WLB corresponding to the selected memory cell 3. A write operation activates the write word line WLA corresponding to the selected memory cell 3. The selected write word line WLA is activated after activation of the selected read word line WLB in an operation cycle that performs both read and write operations.

Abstract: A write control device includes a switching unit configured to selectively supply a write current in response to a driving control signal, a driving unit configured to supply a driving current to a memory cell corresponding to the write current applied through the switching unit, and an over-driving control unit coupled to an output node of the driving unit and configured to over-drive the output node in response to the driving control signal.

Abstract: A semiconductor memory includes a memory cell array that includes data cells of x bits and redundant cells of y bits for each word; a position-data storage unit that stores, for each word, defective-cell position data of defective cells of the data cells and the redundant cells; and a read circuit that reads data from cells of x bits based on the defective-cell position data stored in the position-data storage unit for a specified word of which address is specified as read address, the cells of x bits being formed by the data cells of x bits and the redundant cells of y bits of the specified word other than the defective cells.

Abstract: A memory device uses a global input/output line or a pair of complementary global input/output lines to couple write data signals and read data signals to and from a memory array. The same input/output line or pairs of complementary global input/output lines may be used for coupling both write data signals and read data signals.