Abstract: Standard memory circuits are used for executing a sum-of-products function between data stored in the memory and data introduced into the memory. The sum-of-products function is executed in a manner substantially similar to a standard memory read operation. The memory circuits are standard or slightly modified SRAM and DRAM cells, or computing memory arrays (CAMs).

Abstract: A data sensing method for a dynamic random access memory including a storage capacitor configured to store data, a bit line, a transistor connecting the storage capacitor and the bit line, a reference bit line, and a sense amplifier connecting the bit line and the reference bit line. The data sensing method comprises the steps of turning off the transistor when the stored data is a predetermined value before enabling the sense amplifier to sense the voltage of the bit line and the reference bit line, and turning on the transistor when the stored data is opposite to the predetermined value such that a charge sharing process occurs between the storage capacitor and a parasitic capacitor of the bit line before enabling the sense amplifier to sense the voltage of the bit line and the reference bit line.

Abstract: A system includes a master device and a first memory module having a plurality of integrated circuit memory devices and a plurality of integrated circuit buffer devices that operate in first and second modes of operation (bypass mode). In a first mode of operation, a first memory module provides read data from the plurality of integrated circuit memory devices (via a integrated circuit buffer device) on a first signal path to the master and a second memory module simultaneously provides read data from its plurality of integrated circuit memory devices (via another integrated circuit buffer device on the second module) on a third signal path coupled to the master device.

Abstract: A memory device comprises a non-volatile electrically alterable memory which is susceptible to read disturbance. The device has a control circuit for controlling the operation of the non-volatile memory. The device further has a first volatile cache memory. The first volatile cache memory is connected to the control circuit and is for storing data to be written to or read from the non-volatile memory, as cache for the memory device. The device further has a second volatile cache memory. The second volatile cache memory is connected to the control circuit and is for storing data read from the non-volatile memory as read cache for the memory device. Finally the control circuit reads data from the second volatile cache memory in the event of a data miss from the first volatile cache memory, and reads data from the non-volatile memory in the event of a data miss from the first and second volatile cache memories.

Abstract: Circuitry and a method for indicating a multiple-type memory is disclosed. The multiple-type memory includes memory blocks in communication with control logic blocks. The memory blocks and the control logic blocks are configured to emulate a plurality of memory types. The memory blocks can be configured into a plurality of vertically stacked memory planes. The vertically stacked memory planes may be used to increase data storage density and/or the number of memory types that can be emulated by the multiple-type memory. Each memory plane can emulate one or more memory types. The control logic blocks can be formed in a substrate (e.g., a silicon substrate including CMOS circuitry) and the memory blocks or the plurality of memory planes can be positioned over the substrate and in communication with the control logic blocks. The multiple-type memory may be non-volatile so that stored data is retained in the absence of power.

Abstract: A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.

Abstract: In a configuration having a nonvolatile memory and a volatile memory, when storage information of the nonvolatile memory is changed and an abnormal operation occurs due to temporary blackout, ?-ray or others, the abnormal operation is recovered to a normal operation regardless of the presence of the detection of the abnormal operation. A reset to be inputted to the nonvolatile memory is collectively transmitted for each 1 bit, each 1 word or each predetermined arbitrary bit, and the collectively transmitted reset serving as one unit is periodically transmitted, so that the abnormal operation is recovered to a normal operation without input signals from outside even if the storage information of the nonvolatile memory is changed due to temporary blackout, ?-ray or others.

Abstract: A non-volatile semiconductor memory apparatus includes a first memory area configured to include a plurality of non-volatile memory cells, a second memory area configured to include a plurality of memory cells whose write speed is faster than the plurality of non-volatile memory cells, and a host interface configured to control the first and second memory areas, wherein the first and second memory areas are configured to be provided with the same address signal and command signal from the host interface.

Abstract: In synchronism with an active command, a row address and a column address are simultaneously received, and a page address is received in synchronism with a read command or a write command. Word drivers select a word line based on the row address, and column switches select a bit line based on the column address. A page address decoder selects any one of read/write amplifiers corresponding to each page based on the page address. With this configuration, a specification for a DRAM such as an access cycle can be satisfied without arranging an amplifier for each bit line, and thus it becomes possible to secure a compatibility with a DRAM while reducing a chip area.

Abstract: An inexpensive nonvolatile memory having high performance which makes random write and readout possible an unlimited number of times is provided. A unit memory cell is formed of a MISFET having a channel body that is electrically isolated from a semiconductor substrate and a resistance change element having a two-terminal structure with one end electrically connected to a drain of the MISFET. The MISFET functions as a volatile memory element, and the resistance change element functions as a nonvolatile memory element, so that information stored in the MISFET is copied to the resistance change element before the power is turned OFF and information stored in the resistance change element is transferred to the MISFET when the power is turned ON, and thus, the MISFET is used as a volatile memory which makes random write and readout possible.

Abstract: A memory system including a random access memory (RAM) array and a corresponding redundant RAM array which stores information redundant to the RAM array, where a designed cell circuit topology of cells within the redundant RAM array differs from a designed cell circuit topology of cells within the RAM array. The redundant RAM array is selectively accessed when accessing the RAM array to store data to the redundant RAM array for failed cells of the RAM array.

Abstract: A semiconductor memory device comprises a memory cell array and a sense amplifier circuit. The memory cell array includes a first NMOS transistor which has a gate electrode connected to a word line and has one source/drain region connected to a bit line. The sense amplifier circuit includes a second NMOS transistor which has a gate electrode connected to the bit line and has one source/drain region connected to a predetermined voltage. In the semiconductor memory device, each of the first and second MOS transistors is a floating body type NMOS transistor, and the predetermined voltage is supplied to the bit line at least in a precharge operation, thereby preventing characteristic deterioration due to accumulation of holes in the floating body.

Abstract: A semiconductor memory device comprises a memory cell array and a forming controller. The memory cell array includes a plurality of first memory cells each having a structure in which dielectric material is sandwiched between two electrodes, and the memory cell array is divided into a plurality of areas capable of being designated. The forming controller controls to perform “forming” for the first memory cells in an area selectively designated from the plurality of areas of the memory cell array, and as a result of the forming, the first memory cells are changed to non-volatile second memory cells.

Abstract: Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

Abstract: A non-volatile memory system is formed of floating gate memory cells arranged in blocks as the smallest unit of memory cells that are erasable together. The system includes a number of features that may be implemented individually or in various cooperative combinations. One feature is the storage in separate blocks of the characteristics of a large number of blocks of cells in which user data is stored. These characteristics for user data blocks being accessed may, during operation of the memory system by its controller, be stored in a random access memory for ease of access and updating. According to another feature, multiple sectors of user data are stored at one time by alternately streaming chunks of data from the sectors to multiple memory blocks. Bytes of data in the stream may be shifted to avoid defective locations in the memory such as bad columns. Error correction codes may also be generated from the streaming data with a single generation circuit for the multiple sectors of data.

Abstract: A data sensing method for a dynamic random access memory including a storage capacitor configured to store data, a bit line, a transistor connecting the storage capacitor and the bit line, a reference bit line, and a sense amplifier connecting the bit line and the reference bit line. The data sensing method comprises the steps of turning off the transistor when the stored data is a predetermined value before enabling the sense amplifier to sense the voltage of the bit line and the reference bit line, and turning on the transistor when the stored data is opposite to the predetermined value such that a charge sharing process occurs between the storage capacitor and a parasitic capacitor of the bit line before enabling the sense amplifier to sense the voltage of the bit line and the reference bit line.

Abstract: A combination memory device including a static random access memory (SRAM) and a read only memory (ROM) comprises first memory cells and second memory cells arranged in rows and columns, in which each of the first memory cells includes an SRAM cell and a ROM cell and is arranged adjacent to at least one of the second memory cells, and each of the second memory cells includes an SRAM cell and does not include a ROM cell.

Abstract: A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the

Abstract: An integrated circuit device includes a semiconductor substrate and an array of random access memory (RAM) cells, which are arranged on the substrate in first columns and are configured to store data. A computational section in the device includes associative memory cells, which are arranged on the substrate in second columns, which are aligned with respective first columns of the RAM cells and are in communication with the respective first columns so as to receive the data from the array of the RAM cells and to perform an associative computation on the data.

Abstract: Systems and methods are directed to verification of configuration data stored in memory cells. For example, in one embodiment, an integrated circuit such as a programmable logic device includes a plurality of non-volatile memory cells and a plurality of volatile memory cells adapted to receive and store data provided from the plurality of non-volatile memory cells. A comparator is adapted to compare stored data from the plurality of volatile memory cells with the data values of the plurality of non-volatile memory cells. Control circuitry is responsive to the comparator to control whether configuration data from the plurality of non-volatile memory cells is loaded to the plurality of volatile memory cells.

Abstract: A system and method are provided for simulating an aspect of a memory circuit. Included is an interface circuit that is in communication with a plurality of memory circuits and a system. Such interface circuit is operable to interface the memory circuits and the system for simulating at least one memory circuit with at least one aspect that is different from at least one aspect of at least one of the plurality of memory circuits. In accordance with various embodiments, such aspect may include a signal, a capacity, a timing, and/or a logical interface.

Abstract: A hybrid solid-state memory system is provided for storing data. The solid-state memory system comprises a volatile solid-state memory, a non-volatile solid-state memory, and a memory controller. Further, a method is provided for storing data in the solid-state memory system. The method comprises the following steps. A write command is received by the memory controller. Write data is stored in the volatile memory in response to the write command. Data is transferred from the volatile memory to the non-volatile memory in response to a data transfer request.

Abstract: A memory includes a first memory device including an array of phase changing memory cells. The first memory device is of a first memory type. The integrated circuit includes a second memory device including an array of phase changing memory cells. The second memory device is of a second memory type that is different than the first memory type. The first and second memory devices are packaged together into a single memory device.

Abstract: A system and method are provided for simulating an aspect of a memory circuit. Included is an interface circuit that is in communication with a plurality of memory circuits and a system. Such interface circuit is operable to interface the memory circuits and the system for simulating at least one memory circuit with at least one aspect that is different from at least one aspect of at least one of the plurality of memory circuits. In accordance with various embodiments, such aspect may include a signal, a capacity, a timing, and/or a logical interface.

Abstract: Systems and methods for reducing instability and writability problems arising from relative variations between voltages at which memory cells and logic components that access the memory cells operate by inhibiting memory accesses when the voltages are not within an acceptable operating range. One embodiment comprises a pipelined processor having logic components which receive power at a first voltage and a set of SRAM cells which receive power at a second voltage. A critical condition detector is configured to monitor the first and second voltages and to determine whether the ratio of these voltages is within an acceptable range. When the voltages are not within the acceptable range, an exception is generated, and an exception handler stalls the processor pipeline to inhibit accesses to the SRAM cells. When the voltages return to the acceptable range, the exception handler resumes the pipeline and completes handling of the exception.

Abstract: A multi-chip semiconductor memory device includes of a plurality of memory chips sharing a predetermined chip enable signal. Each of the plurality of memory chips includes an active internal power supply generation circuit configured to convert an external power supply voltage into an internal power supply voltage and to be disabled in response to deactivation of a predetermined drive control signal. Each of the plurality of memory chips also includes a conversion control circuit for generating the drive control signal, wherein the drive control signal is deactivated in an interval in which any of the plurality of memory chips is in an active interval.

Abstract: In one embodiment, an apparatus comprises a queue, write control logic coupled to the queue and operable in a write clock domain, and a first-in, first-out buffer (FIFO) coupled to the write control logic. The queue is configured to store a plurality of data items, wherein each data item has a type which is one of a plurality of types of data items that can be stored in the queue. The write control logic is configured to maintain write pointers that identify entries in the queue for each of the plurality of types. The write control logic is configured to update the write pointer corresponding to an input type for an input data item written to the queue. Additionally, the write control logic is configured to enqueue a write event in the FIFO to transport the enqueue event to a read clock domain different from the write clock domain.

Abstract: A processor-based system includes a processor coupled to core logic through a processor bus. This includes a dynamic random access memory (“DRAM”) memory buffer controller. The DRAM memory buffer controller is coupled through a memory bus to a plurality of a dynamic random access memory (“DRAM”) modules and a flash memory module, which are at the same hierarchical level from the processor. Each of the DRAM modules includes a memory buffer to the memory bus and to a plurality of dynamic random access memory devices. The flash memory module includes a flash memory buffer coupled to the memory bus and to at least one flash memory device. The flash memory buffer includes a DRAM-to-flash memory converter operable to convert the DRAM memory requests to flash memory requests, which are then applied to the flash memory device.

Abstract: A nonvolatile storage including a plurality of blocks each serving as one unit in erasing operation and performs a plurality of erasing operations successively, the nonvolatile storage comprising: a volatile memory cell array for storing erase setting information on each block, the information indicating whether or not its associated block is a target to be erased; a write amplifier for writing the erase setting information in the volatile memory cell array; a first readout amplifier for reading out the erase setting information on a target block from the volatile memory cell array upon start of the erasing operation; and a second readout amplifier for reading out the erase setting information on a target block from the volatile memory cell array upon start of readout operation.

Abstract: A phase change memory is provided with a write data register, an output data selector, a write address register, an address comparator and a flag register. Write data is not only written into a memory cell but also retained by the write data register until the next write cycle. If a read access occurs to that address before the next write cycle, data is read out from the register without reading the data from the memory cell array. Without elongating the cycle time, it is possible not only to use a long time to write data into a memory cell therein but also to make longer the interval between the time when a write operation is done and the time when the subsequent read operation is made from that memory cell. As a result, data can be written reliably.

Abstract: A method for passing data from an input to an output of a domino read access path in domino read SRAM memory including receiving at least a portion of the input data from a latch configuration, gating a global precharge signal, gating a bit select circuitry signal, driving the input data statically through a transmission gate of a static bypass multiplexer to the global dot of the domino read SRAM memory, initiating a write around cycle signal, offsetting the write around signal input into the static bypass multiplexer and the precharge signal by at least one phase using a wave shaper, driving the input data from the global dot through a keeper circuit, and driving the input data from the keeper circuit to at least one NAND gate of a pair of cross-coupled NAND gates, the pair of cross-coupled NAND gates being configured in a transparent state.

Abstract: A temperature control circuit, comprising: a plurality of temperature sensors each configured to measure a temperature of a corresponding memory chip chosen from a plurality of memory chips, and to generate a sensor output signal that is set to a first voltage if the measured temperature of the corresponding memory chip meets a temperature requirement, and is set to a floating voltage if the measured temperature of the corresponding memory chip does not meet the temperature requirement, the sensor output signal being connected to an intermediate node; a current source connected to the intermediate node; and a control circuit configured to provide chip control signals to the plurality of memory chips.

Abstract: A flash memory 1 based on the multilevel storage technology for storing the information of two or more bits is provided with four banks 2a to 2d. For example, in the left side of the bank 2a, a data latch 6a is provided along one short side of the bank 2a, while in the right side thereof, a data latch 6b is provided along the other short side of the bank 2a. At the lower side of the data latches 6a, 6b, arithmetic circuits 7a, 7b are provided. The data latches 6a, 6b are respectively formed of SRAMs. A sense latch 5a is divided to one half in the right and left directions with reference to the center of sense latch row. The divided sense latch 5a is connected with the data latches 6a, 6b via the signal lines respectively allocated along both short sides of the bank 2a.

Abstract: A flash memory device comprises an array of memory cells capable of storing different numbers of bits per cell. A page buffer circuit for the flash memory device comprises a plurality of page buffers, each operating during programming, erasing, and reading operations of the memory cells. A control logic unit controls functions of the page buffers in accordance with the number of bits stored in corresponding memory cells.

Abstract: A precharge signal generation circuit outputs a precharge signal including a pulse every access cycle with respect to a data register in a first mode, and generates a precharge signal by masking the signal including the pulse every access cycle with respect to the data register when access to a memory cell other than a predetermined memory cell in the data register is designated in a second mode. A first precharge circuit precharges a bit line pair in response to activation of the precharge signal.

Abstract: A page mode multi-level NAND-type memory employs two different verify levels per data state and comprises a first data storage circuit which is connected to a memory cell and which stores externally inputted data of a first logic level or a second logic level, a second data storage circuit which is connected to the memory cell and which stores the data of the first logic level or second logic level read from the memory cell, and a control circuit which controls the memory cell and the first and second data storage circuits and which reproduces the externally inputted data and writing the data into the memory cell.

Abstract: Systems and methods provide non-volatile memory architectures for programmable logic devices. For example, a programmable logic device may include logic blocks, input/output blocks, and configuration memory to store configuration data for configuration of the logic blocks and the input/output blocks. A first non-volatile memory may store user information, besides configuration data, and a first port includes a dedicated serial peripheral interface to provide access to the first non-volatile memory.

Abstract: A control device and method are used for adjusting the refresh rate of a memory module in a computer system. The device includes a thermo sensor and a control circuit. In the control method, the thermo sensor actively outputs a temperature change signal in response to the temperature change in the memory module when a capacitor of the memory module incurs an aggravated current leakage due to the temperature rise. Next, the control circuit adjusts the refresh rate in response to the temperature change signal and refreshes the memory module at the refresh rate.

Abstract: A memory device includes a single or a plurality of memory chips. In the memory device (memory module), the single memory chip or each of the plurality of memory chips has a memory part storing control data such as specification data and function data, and control data stored on the memory part is rewritable. Control data stored on the memory part separately disposed on each memory chip enables separate use of the memory chip, which improves compatibility and flexibility of the memory.

Abstract: A memory module fast in random accesses, large in capacity, and low in fabricating cost. And the memory module can assure high security. The memory module consists of a flash memory, a dynamic random access memory, and a control circuit. The control circuit enables data transfer between the flash memory and the dynamic random access memory only with a read operation for a specific address in the memory module. When reading data from the memory module, the control circuit refreshes the dynamic random access memory. Thus the present invention can realize a large capacity and low cost memory module capable of reading data fast reading and assuring high security.

Abstract: A semiconductor multi-chip package includes: a first semiconductor memory chip having n address pads, a first control pad, and a first address controller; and a second semiconductor memory chip whose memory density is greater, e.g., at least 1.5 times greater, than the first semiconductor memory chip and which is disposed on the first semiconductor memory chip, and has (n+1) address pads, a second control pad, and a second address controller. The n address pads of the first semiconductor memory chip and the n address pads of the second semiconductor memory chip are respectively connected to corresponding n address pins. The first and second control pads are connected to a control pin. The first and second address controllers are operable in a mutually exclusive manner, e.g., manner of activation, according to a signal applied to the control pin.

Abstract: A multi-port volatile memory device can include a first port that is configured for data transfer to/from an external host system and the device. A volatile main memory core is configured to store data received thereat and read requested stored data thereform. A volatile sub memory core can be configured to store data received thereat and read requested stored data therefrom. A main interface circuit can be coupled to the first port and can be configured to provide data to/from the volatile main memory core and the first port in a master mode and can be configured to provide data to/from the volatile sub memory core and the first port in a slave mode. A second port can be configured for data transfer to/from an external non-volatile memory device and the device and a sub interface circuit can be coupled to the second port and configured to provide data to/from the volatile sub memory core and the second port in the slave mode.

Abstract: A router including a lookup execution unit including a plurality of stages, a forwarding table memory arranged in hierarchy including addressable sectors, blocks, and entries, and a crossbar having an address crossbar for selectively coupling one of the plurality of stages to a sector of the memory so that data from the sector can be read. In one example, any one of the stages of the plurality of stages may be selectively and dynamically coupled with any one of the sectors of the forwarding table memory for providing an address to a particular sector of the memory to read data therefrom.

Abstract: A multi-port volatile memory device can include a first port that is configured for data transfer to/from an external host system and the device. A volatile main memory core is configured to store data received thereat and read requested stored data thereform. A volatile sub memory core can be configured to store data received thereat and read requested stored data therefrom. A main interface circuit can be coupled to the first port and can be configured to provide data to/from the volatile main memory core and the first port in a master mode and can be configured to provide data to/from the volatile sub memory core and the first port in a slave mode. A second port can be configured for data transfer to/from an external non-volatile memory device and the device and a sub interface circuit can be coupled to the second port and configured to provide data to/from the volatile sub memory core and the second port in the slave mode.

Abstract: A non-volatile memory, such as a Flash memory, is configured to perform a random multi-page read operation. The memory may include a core array of non-volatile memory cells and input lines for receiving an indication of the random multi-page read operation. Further, the memory may include a multi-level volatile memory coupled to the core array that is configured to simultaneously process multiple pages of data from the core array in a pipelined manner. Output lines are coupled to the multi-level volatile memory and output the pages of data from the memory device.

Abstract: A multi-port volatile memory device includes a first port configured for data transfer to/from an external host system and the device. A volatile main memory core is configured to store data received thereat and read requested stored data thereform. A volatile sub memory core is configured to store data received thereat and read requested stored data therefrom. A main interface circuit is coupled to the first port and configured to provide data to/from the volatile main memory core and the first port in a master mode and configured to provide data to/from the volatile sub memory core and the first port in a slave mode. A second port is configured for data transfer to/from an external non-volatile memory device and the device. A sub interface circuit is coupled to the second port and configured to provide data to/from the volatile sub memory core and the second port in the slave mode.