Abstract: A circuit includes a plurality of capacitors responsive to a plurality of latches that store a test code. A first bit line is coupled to a bit cell and coupled to a sense amplifier. A second bit line is coupled to the bit cell and coupled to the sense amplifier. A differential charge from a set of the plurality of capacitors is applied to the first bit line and to the second bit line. The set of the plurality of capacitors is determined based on the test code and the test code is independent of an output of the sense amplifier.

Abstract: Systems and methods for determining optimal memory device precharge voltages are provided herein. In addition, systems and methods for providing localized sense amplification and circuit assist circuitry are described herein. Embodiments provide for determining precharge multipliers that may be used to determine the optimal precharge voltage based on a precharge source voltage. According to embodiments, the precharge source voltage may be Vdd or Vcs. Optimizing the precharge voltage maximizes memory device performance and functional characteristics, including, but not limited to, stability, efficiency, power, writability, and reliability.

Abstract: Non-volatile storage devices and techniques for operating non-volatile storage are described herein. One embodiment includes accessing “n” pages of data to be programmed into a group of non-volatile storage elements. The “n” pages are mapped to a data state for each of the non-volatile storage elements based on a coding scheme that evenly distributes read errors across the “n” pages of data. Each of the non-volatile storage elements in the group are programmed to a threshold voltage range based on the data states to which the plurality of pages have been mapped. The programming may include programming the “n” pages simultaneously. In one embodiment, mapping the plurality of pages is based on a coding scheme that distributes a significant failure mode (for example, program disturb errors) to a first of the pages and a significant failure mode (for example, data retention errors) to a second of the pages.

Abstract: A circuit is usable to generate a sense amplifier enable (SAE) signal for a static random access memory (SRAM) circuit. The circuit includes a first tracking bit line, a second tracking bit line, a tracking cell, and a control logic circuit. The second tracking bit line is electrically connected to the first tracking bit line. The tracking cell has a driving terminal and a non-driving terminal, where the non-driving terminal is connected to the second tracking bit line, and the driving terminal is connected to the first tracking bit line and configured to selectively charge or discharge a voltage on the first tracking bit line in response to a control signal. The control logic circuit is coupled to the first tracking bit line and configured to generate the SAE signal in response to the voltage level on the first tracking bit line.

Abstract: In a memory (100), a local data line pair (116, 118) is precharged to a first logic state and a global data line pair (101, 104) is precharged to a second logic state. A selected memory cell is coupled to the local data line pair (116, 118) to develop a differential local data line voltage. The differential local data line voltage is subsequently amplified to form an amplified differential local data line voltage. A selected one of the global data line pair (101, 104) is driven to the first logic state in response to the amplified differential local data line voltage to form a differential global data line voltage.

Abstract: A method for data storage includes providing at least first and second readout configurations for reading storage values from analog memory cells, such that the first readout configuration reads the storage values with a first sense time and the second readout configuration reads the storage values with a second sense time, shorter than the first sense time. A condition is evaluated with respect to a read operation that is to be performed over a group of the memory cells. One of the first and second readout configurations is selected responsively to the evaluated condition. The storage values are read from the group of the memory cells using the selected readout configuration.

Abstract: A memory device includes a memory array including a plurality of memory cells, sensing circuitry coupled to at least a given bitline associated with a particular column of the memory cells of the memory array, and access time acceleration circuitry coupled to the bitline. The access time acceleration circuitry is configured to control an amount of time required by the sensing circuitry to access data stored in a given one of the memory cells in the particular column of memory cells, by providing in a current access cycle at least a selected one of a plurality of different supplemental charging and discharging paths for the bitline based at least in part on data accessed using the bitline in a previous access cycle.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a power supply circuit, an interconnection and a discharging circuit. The memory cell includes a variable resistance element whose resistance varies by application of a voltage. The power supply circuit outputs the voltage to be applied to the memory cell. The interconnection is formed between the power supply circuit and the memory cell and supplies the voltage output from the power supply circuit to the memory cell. The discharging circuit is connected to the interconnection. The discharging circuit discharges electric charge accumulated in the interconnection after a first operation of applying the voltage to the memory cell is ended and before a second operation of applying the voltage to the memory cell next is started.

Abstract: A dual bit line precharge architecture and method for low power DRAM which provides the low operating voltage of a non-half supply voltage (VCC/2) precharge with the low memory array current consumption and low memory array noise spike of VCC/2 precharge techniques. The architecture and technique of the present invention provides both reference voltage (VSS) precharged sub arrays and VCC precharged sub arrays on the same DRAM memory either with or without the novel charge sharing or charge recycling circuitry between these two different sub arrays as disclosed herein.

Abstract: Various embodiments of a data transfer circuit of a semiconductor apparatus are disclosed. In one exemplary embodiment, the data transfer circuit may include a first data line, a second data line, a first transfer unit configured to amplify data on the first data line in response to a first control signal and transfer amplified data to the second data line, and a second transfer unit configured to electrically connect the first data line to the second data line in response to a second control signal.

Abstract: A discharge circuit for a floating gate type MOS memory cell transistor disposed in a memory array region of a nonvolatile semiconductor memory device, the memory cell region being formed in P-well, the P-well being formed in an N-well, and the N-well being formed in a P-type semiconductor substrate, includes a word line discharge circuit providing a word line control voltage and a bulk discharge circuit providing a voltage to the P-well during a discharge operation. Constant current transistors and switching transistors in the word line discharge circuit and the bulk discharge circuit are simultaneously turned ON during at least a portion of the discharge operation.

Abstract: Some embodiments include methods and devices having a module and memory cells. The module is configured to reduce the amount of electrons in the sources and drains of the memory cells during a programming operation.

Abstract: A static random access memory (SRAM) includes an SRAM cell to store a bit of data. A word line accesses the SRAM cell, which, responsively, during a read, drives either a bit line true (BLT) or a bit line complement (BLC) low. Both BLT and BLC are precharged to a supply voltage, then, subsequently are discharged to a reference voltage, lower than the supply voltage, prior to the word line being activated. Because the bit lines are at a voltage lower than the supply voltage when the SRAM cell is activated, the SRAM cell stability is improved.

Abstract: A static random access memory (SRAM) includes a data line, a data line bar, and a current path block. The current path block includes at least two transistors configured to provide a current path for the data line in transition from a first logic voltage to a second logic voltage, wherein the current path block is connected to the data line and the data line bar.

Abstract: A data storage device includes a data storage medium and a controller. The controller is configured to control at least one of a reading, erasing, and writing operation on the data storage medium. The controller includes an interface and a power management unit. The interface is configured to exchange at least one of a command, an address, and data with a host. The power management unit is configured to change the power mode of the interface into a power saving mode if: a command input from the host is not executed, data transfer is not actually executed in executing the command, or status information is not reported after the command is executed.

Abstract: Embodiments disclosed herein may relate to controlling a discharge of a capacitive element coupled to a phase change memory cell to produce a specified state in the phase change memory cell.

Abstract: A nonvolatile semiconductor memory device includes a memory cell which stores data and which is capable of being rewritten electrically, a bit line which is connected electrically to one end of a current path of the memory cell, a control circuit which carries out a verify operation to check a write result after data is written to the memory cell, and a voltage setting circuit which sets a charging voltage for the bit line in a verify operation and a read operation and makes a charging voltage in a read operation higher than a charging voltage in a verify operation.

Abstract: A semiconductor memory device can include a first driver configured to generate a pair of first sense amplifier driving signals having an activation period at a predetermined level during command execution; and a second driver that can be configured to generate a pair of second sense amplifier driving signals for increasing a driving strength of a pair of sense amplifiers when logic values of a pair of bit lines are constant during the command execution and decreasing the driving strength of the pair of sense amplifiers when the logic values of the pair of bit lines change.

Abstract: A sense amplifier scheme for SRAM is disclosed. In accordance with one of the embodiments of the present application, a sense amplifier circuit includes a bit line, a sense amplifier output, a power supply node having a power supply voltage, a keeper circuit including an NMOS transistor, and a noise threshold control circuit. The keeper circuit is sized to supply sufficient current to compensate a leakage current of the bit line and maintains a voltage level of the bit line and the noise threshold control circuit lowers a trip point of the sense amplifier output.

Abstract: A semiconductor device includes a bit line, a memory cell coupled to the bit line, the memory cell being configured such that a current flowing there the memory cell is varied in accordance with information stored M the memory cell, a first transistor coupled at a control electrode thereof to the bit line, a second transistor coupled to the bit line and supplied at a control electrode thereof with a first control signal, a global bit line, and a third transistor coupled in series with the first sistor between a node and the global bit line, the third transistor supplied at a control electrode thereof with a second control signal.

Abstract: A memory system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits for limiting the SET current for the reversible resistance-switching elements. The circuits for limiting the SET current provide a charge on one or more bit lines that is not sufficient to SET the memory cells, and then discharge the bit lines through the memory cells in order to SET the memory cells.

Abstract: A sensing circuit for a flash memory is provided. The sensing circuit includes a first transistor, a detector, and a charge circuit. A drain of the first transistor is coupled to a bias, a gate thereof receives an inverted signal, and a source thereof receives a data. In addition, the drain of the first transistor is further coupled to the detector. Therefore, the detector detects a voltage of the drain of the first transistor. When the voltage of the drain is lower than a threshold voltage, the detector enables a control signal. The charge circuit charges the source of the first transistor when the control signal is enabled, until the voltage of the drain of the first transistor reaches the threshold voltage.

Abstract: A device with non volatile memory cells, with optimized programming, of the type comprising a sector of matrix memory cells organized in rows and columns, with the columns organized in a plurality of global bit-lines associated with at least one plurality of local bit-lines and respectively enabled by a first select signal and by at least one second select signal generated by a decoder, these columns being associated with at least one program load PL controlled by a logic circuit and suitable for applying a programming pulse to a plurality of cells belonging to the enabled bit-lines, comprising a plurality of discharge transistors, each associated with a corresponding column controlled by a control signal complementary to the control signal of the adjacent discharge transistor.

Abstract: A semiconductor memory device including a transistor having a vertical channel structure is provided. The device includes a first sub memory cell array including a first memory cell connected to a first bit lines and including a transistor having a vertical channel structure, a second sub memory cell array including a second memory cell connected to a first inverted bit lines and including a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.

Abstract: An integrated circuit device (e.g., a logic device or a memory device) having a memory cell array which includes (i) a plurality of memory cells, wherein each memory cell is programmable to store one of a plurality of data states, and (ii) a bit line, having a plurality of memory cells coupled thereto. Memory cell control circuitry applies one or more read control signals to perform a read operation wherein, in response to the read control signals, a selected memory cell conducts a current which is representative of the data state stored therein. Sense amplifier circuitry senses the data state stored in the selected memory cell using a signal which is responsive to the current conducted by the selected memory cell. Current regulation circuitry is responsively and electrically coupled to the bit line during a portion of the read operation to sink or source at least a portion of the current provided on the bit line.

Abstract: A semiconductor memory device and method of performing a stress test on a semiconductor memory device are provided. In an example, the semiconductor memory device includes a multiplexer arrangement configured to switch a timing signal that controls an internal timing of the semiconductor memory device from an internal signal to an external signal during a stress mode, and further includes one or more word lines of the semiconductor memory device receiving a stress voltage during the stress mode, a duration of the stress mode based upon the external signal. In another example, the semiconductor memory device includes one or more word lines configured to receive a stress voltage during a stress mode, and a precharge circuit configured to provide a precharge voltage to a bit line of the semiconductor memory device during the stress mode.

Abstract: A system is capable of assisting in reset of a data storage array including data storage array including one or more data storage array nodes. The system includes a control unit coupled to the data storage array configured to produce a control signal to reset the data storage array, and a reset unit communicatively coupled to the data storage array and the control unit configured to reset the data storage array by charge injection to the one or more data storage array nodes.

Abstract: There is provided a semiconductor memory device including: plural memory cells; a selection signal outputting section; a first precharging section that precharges a potential of a data line that outputs, to an exterior, a signal of a level corresponding to data stored in the memory cell; and a bit line selecting section that has, per bit line, a bit line selecting section that comprises (1) a second precharging section, (2) a potential lowering section, and (3) a third precharging section connected to the bit line selection line and the bit line between the second precharging section and a connection point at which the potential lowering section is connected to the bit line, and when the non-selection signal is inputted, the third precharging section precharges the bit line between the second precharging section and the connection point at which the potential lowering section is connected to the bit line.

Abstract: A semiconductor memory device comprises a memory cell configured to output data to a pair of bitlines, a variable delay circuit configured to receive a sense amplifier enable signal, adjust a delay of the sense amplifier enable signal by changing a slope of a delay based on a variable external power supply voltage, and output a delayed sense amplifier enable signal, and a bitline sense amplifier configured to amplify a voltage difference between the pair of bitlines in response to the delayed sense amplifier enable signal and output the amplified voltage difference to a pair of input/output lines.

Abstract: A semiconductor device includes first and second lines, and a switch between the first and second lines. The switch temporary and electrically connects the first and second lines to each other, when the first signal line is transitioned from a first level to a second level while the second signal line is transitioned from the second level to the first level.

Abstract: An apparatus for implementing a write assist for a memory array includes a common discharge node configured to provide a discharge path for precharged write data lines and bit lines selected during a write operation of the memory array; negative boost circuitry configured to introduce a voltage lower than a nominal logic low supply voltage onto the common discharge node following the discharge of the common discharge node, write data lines and bit lines; and a clamping device coupled to the common discharge node, the clamping device configured to limit the magnitude of negative voltage applied to common discharge node by the negative boost circuitry so as to prevent activation of non-selected bit switches.

Abstract: A circuit includes a first node; a second node; a first PMOS transistor having a source coupled to the first node, a drain coupled to a first control transistor, and a gate driven by a first voltage; and a first NMOS transistor having a source coupled to the second node, a drain coupled to the first control transistor, and a gate driven by a second voltage. The first PMOS transistor is configured to automatically turn off based on the first voltage and a first node voltage at the first node. The first NMOS transistor is configured to automatically turn off based on the second voltage and a second node voltage at the second node. When the first PMOS transistor, the control transistor, and the first NMOS transistor are on, the first node voltage is lowered while the second voltage is raised.

Abstract: A charge pump and method of operation are provided. The charge pump includes a first boosting unit configured to receive a pre-charge voltage and electrically charge a first MOS capacitor during a pre-charge period, and to boost a voltage of a connection node to a first output voltage during a boosting operation period, and a second boosting unit configured to receive the pre-charge voltage and electrically charge a second MOS capacitor during the pre-charge period, and to receive the first output voltage and boost a voltage of an output node to a second output voltage during the boosting operation period. Here, the pre-charge voltage is applied to electrically charge a parasitic capacitor during a parasitic capacitor charging period between the pre-charge period and the boosting operation period.

Abstract: A non-volatile semiconductor storage device according to one aspect of the present invention includes a plurality of sense amplifier circuit that are configured to carry out a plurality of read cycles on a plurality of bit lines connected to those memory cells that are selected by a selected one of the word lines. During the second and subsequent read cycles, supply of a read current is ceased to those bit lines when it is determined in the preceding read cycle that a current not less than a certain determination current level flows therethrough, and the read current is supplied only to the remaining bit lines. A setup time of the bit lines in the first read cycle is set shorter than a setup time of the bit lines in the second and subsequent read cycles.

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage.

Abstract: A circuit and method precharge a selected bit-line in a read only memory (ROM) array during a precharge period of a read cycle. At least one bit-line adjacent to the selected bit-line is discharged during the precharge period. After the precharge period, the selected bit-line is read such that parasitic capacitance effects on the selected bit-line are reduced.

Abstract: Systems and methods, including computer software for performing operations enable interleaving of charging operations in a charging pump. A first charge pump is charged to a predetermined level, and a first operation is performed using a charge stored in the first charge pump after it reaches the predetermined level. A second charge pump is charged during a time that overlaps with performing the first operation. A second operation is performed using a charge stored in the second charge pump as a result of charging the second charge pump.

Abstract: Provided are a nonvolatile memory and related method of programming same. The nonvolatile memory includes a memory cell array with a plurality of nonvolatile memory cells and a write circuit. The write circuit is configured to write first logic state data to a first group of memory cells during a first program operation using an internally generated step-up voltage, and second logic state data to a second group of memory cells during a second program operation using an externally supplied step-up voltage.

Abstract: In a content addressable memory device, before search operations in two TCAM cells connected to first and second match lines, respectively, a memory controller connects the first match line to a power source and connects the second match line to a ground, and then connects the first and second match lines to each other so as that electric potentials of the first and second match lines are the same as each other.

Abstract: According to the present invention, a semiconductor storage device includes: a first memory cell array including: a first bit line; a first plate line; a first memory cell; a first sense amplifier; a first reference power line configured to supply first reference voltage; a first switching module configured to control a connection between the first reference power line and the first bit line; a second memory cell array including: a second bit line; a second plate line; a second memory cell; a second sense amplifier; a second reference power line configured to supply second reference voltage; a second switching module configured to control a connection between the second reference power line and the second bit line; a control module configured to generate the control signal so as to control a time difference between the first memory cell array and the second memory cell array in precharge operation.

Abstract: A memory circuit includes a plurality of memory cells and a plurality of bit lines and row lines connected to the memory cells for accessing selected memory cells. The memory circuit includes a programmable voltage source adapted for connection to at least one bit line and operative to precharge the bit line to a prescribed voltage level prior to accessing a selected one of the memory cells coupled to the bit line. A control circuit coupled to the bit line is operative to oppose discharge of the bit line during at least a portion of a given memory read cycle. A tracking circuit connected to the control circuit is operative to control a delay in activation of the control circuit and/or a duration of time the control circuit is active as a function of a parameter affecting signal development time of a data signal on the bit line.

Abstract: A memory employs a low-level current source to access a phase change memory cell. The current source charges an access capacitor in order to store sufficient charge for an ensuing access. When a memory cell is accessed, charge stored on the capacitor is discharged through the phase change memory, supplying a current to the phase change memory cell that is sufficient for the intended access operation and greater than that provided directly by the current source.

Abstract: A Read Only Memory (ROM) device includes a ROM array, a row address decoder, a column address decoder, a column multiplexer, and a control circuit. Data is stored in bit cells in the ROM array. The control circuit generates control signals for reading the ROM. The row address decoder selects a word line. The column address decoder enables a bit line. The data is sensed from a bit cell corresponding to the selected word line and the enabled bit line by a corresponding sense amplifier and delivered on a data output pin of the ROM. The control signals for enabling the bit line and the sense amplifier operate at a higher voltage than supply voltage of the ROM. This reduces the ROM read time.

Abstract: A design structure embodied in a machine readable medium used in a design process includes computational memory device having an array of memory cells arranged in rows and columns, and a pair of read word lines associated with each row of the array. The array is configured to implement, for a given cycle, either a read operation of data contained in a single selected row, or one of a plurality of different bit wise logical operations on data contained in multiple selected rows.

Abstract: A processor including a memory and a control module. The memory has an array of cells. The control module is configured to: determine a number of access cycles along a first word line; determine an extended period based on the number of the access cycles; generate a word line signal to maintain the first word line in an activated state during (i) an initial period and (ii) the extended period; and access a first cell during the extended period. The first cell is connected to the first word line. The control module is further configured to deactivate the word line and maintain the first word line in a deactivated state while accessing a second cell connected to the first word line. The accessing of the second cell is based on a bit line separation provided during the extended period.

Abstract: A system comprises a storage cell coupled to multiple bitlines and a transistor that couples to the multiple bitlines in parallel with the storage cell. The transistor is activated while the storage cell is read.

Abstract: In a memory (100), a local data line pair (116, 118) is precharged to a first logic state and a global data line pair (101, 104) is precharged to a second logic state. A selected memory cell is coupled to the local data line pair (116, 118) to develop a differential local data line voltage. The differential local data line voltage is subsequently amplified to form an amplified differential local data line voltage. A selected one of the global data line pair (101, 104) is driven to the first logic state in response to the amplified differential local data line voltage to form a differential global data line voltage.

Abstract: A unique number is formed with logic states from a static random access memory (SRAM), which is laid out to be balanced so that memory cells within the SRAM assume a non-random logic state when power is applied to the SRAM. The unique number is formed by grounding the word lines and bit lines before power is applied to the memory cells, applying power to the memory cells to assume the non-random logic state, reading the non-random logic states held by the memory cells, and forming the unique number from the logic states read from the memory cells.

Abstract: A memory system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits for limiting the SET current for the reversible resistance-switching elements. The circuits for limiting the SET current provide a charge on one or more bit lines that is not sufficient to SET the memory cells, and then discharge the bit lines through the memory cells in order to SET the memory cells.