Abstract: Systems and methods for performing bosonic quantum error correction (QEC) using Gottesman-Kitaev-Preskill (GKP) states are provided. An ancilla quantum mechanical oscillator is used to probe Gaussian noise experienced by a data quantum mechanical oscillator without disturbing the state of the data quantum mechanical oscillator. The ancilla quantum mechanical oscillator is initialized with a GKP state and entangled with the state of a data quantum mechanical oscillator to correlate any noise experienced by the data state with the state of the ancilla quantum mechanical oscillator. The states are then disentangled, and momentum and position quadrature operators of the ancilla quantum mechanical oscillator are measured and used to perform QEC on the information stored in the data quantum mechanical oscillator.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a memory array including a plurality of memory cells, each memory cell having an impedance that varies in accordance with a respective data value stored therein; and a tracking memory cell having an impedance based on a tracking data value stored therein; and a read circuit coupled to the memory array, the read circuit configured to determine an impedance of a selected memory cells with respect to the impedance of the tracking memory cell; read a data value stored within the selected memory cell based upon a voltage change of a signal node voltage corresponding to the impedance of the selected memory cell.

Abstract: An apparatus disclosed herein comprises: a plurality of memory cells and a control circuit coupled to the plurality of memory cells. The control circuit is configured to: acquire a first set of read levels on a wordline of a first block of pages of memory cells; acquire a second set of read levels on a first wordline of a second block of pages of a second set of memory cells in response to determining that the fail bit count of the page after a read operation is above the threshold amount; and acquire a third set of read levels on a second wordline of the second block in response to determining that the fail bit count of the page after the second read operation is above the threshold amount.

Abstract: The present disclosure relates to an integrated chip structure. The integrated chip structure includes a first source/drain region and a second source/drain region disposed within a substrate. A select gate is disposed over the substrate between the first source/drain region and the second source/drain region. A ferroelectric random-access memory (FeRAM) device is disposed over the substrate between the select gate and the first source/drain region. A first sidewall spacer, including one or more dielectric materials, is arranged laterally between the select gate and the FeRAM device. An inter-level dielectric (ILD) structure laterally surrounds the FeRAM device and the select gate and vertically overlies a top surface of the first sidewall spacer.

Abstract: A system and method for storing information in a quantum computer using a quantum storage ring. The method comprises cooling ions in the quantum storage ring to a low temperature; and binding the ions into a lattice structure, forming an ion Coulomb crystal.

Abstract: Methods, systems, and devices for cell data bulk reset are described. In some examples, a write pulse may be applied to one or more memory cells based on an associated memory device transitioning power states. To apply the wire pulse, a first subset of digit lines may be driven to a first voltage and a plate may be driven to a second voltage or a third voltage. While the digit lines and plate are driven to the respective voltages, one or more word lines may be driven to the second voltage or the third voltage. In some instances, the digit lines may be selected (e.g., driven) according to a pattern.

Abstract: A storage circuit includes: the array of a memory cell MC including a variable-resistance element; a conversion circuit that converts the resistance value of each memory cell into the signal level of an electric signal; a reference signal generation circuit that generates a reference signal common to a plurality of columns; a correction circuit that corrects one of the signal level of the reference signal and the signal level of the electric signal for each column of the array of the memory cell; and an RW circuit that determines data stored in the memory cell belonging to a corresponding column by comparing one of the reference level and the signal level of the electric signal, corrected by the correction circuit, and the other of the reference level and the signal level of the electric signal.

Abstract: An integrated circuit includes: a cell array including a plurality of memory cells in a plurality of first rows and a plurality of write assistance cells in at least one second row; a plurality of word lines respectively extending on the plurality of first rows; at least one write assistance line respectively extending on the at least one second row; and a row driver connected to the plurality of word lines and the at least one write assistance line, the row driver being configured to, during a write operation, activate at least one of the plurality of write assistance cells through the at least one write assistance line, wherein each of the plurality of write assistance cells includes the same transistor configuration as each of the plurality of memory cells and has the same footprint as each of the plurality of memory cells.

Abstract: A method for operating a controller that controls a memory device includes: replacing a bad block of a superblock with a replacement block to form a reproduced superblock; controlling the memory device to perform a program operation on the reproduced superblock according to an interleaving scheme; moving data stored in the replacement block to a pseudo-replacement block when the program operation on the reproduced superblock is completed; and releasing the replacement block from the reproduced superblock.

Abstract: The present disclosure relates to a method of forming a memory structure. The method includes depositing a ferroelectric random access memory (FeRAM) stack over a substrate. The FeRAM stack has a ferroelectric layer and one or more conductive layers over the ferroelectric layer. The FeRAM stack is patterned to define an FeRAM device stack. A sidewall spacer is formed along a first side of the FeRAM device stack, and a select gate is formed along a side of the sidewall spacer that faces away from the FeRAM device stack. A source region is formed within the substrate and along a second side of the FeRAM device stack, and a drain region is formed within the substrate. The drain region is separated from the FeRAM device stack by the select gate.

Abstract: Apparatuses and methods for reducing row address (RAS) to column address (CAS) delay are disclosed. An example apparatus includes a memory including a memory cell coupled to a first digit line in response to a wordline being set to an active state, and a sense amplifier configured to, during a sense operation, couple a first gut node to the first digit line and couple a second gut node to a second digit line in response to an isolation signal. The sense amplifier is further configured to, after the first gut node is coupled to the first digit line and the second gut node is coupled to the second digit line, drive the first digit line to a first sense voltage of a first control signal and drive the second digit line to a second sense voltage of a second control signal based on a data state of the memory cell.

Abstract: Provided are apparatus and methods for compensating fabrication process variation of on-chip component(s) in shared memory bank. The method includes tracking a flip voltage level and tracking a discharge leakage current to disconnect a keeper circuit from the local read bit-line. The method includes controlling a read current and the discharge leakage current based on determining at least one of fast transistor and slow transistor associated with the at least one the keeper circuit and a bit-cell.

Abstract: A sensing circuit, a sensing method and a memory device are provided. The sensing method is applied to the memory device having the sensing circuit. The sensing circuit includes a compensation source and a sensing module. The compensation source is capable of providing a compensating current to a first node during a read cycle. The sensing module is coupled to the first node. A cell of the memory device is coupled to the first node. The cell is capable of generating a cell current during the read cycle, and the sensing module determines that the cell is in a first storing state or a second storing state in response to a relationship between the compensating current and the cell current.

Abstract: In some embodiments, a semiconductor device includes an SRAM cell, an emulator and a suppressing device. The SRAM cell, enabled by a word line, includes a first inverter formed by a first PMOS transistor and a first NMOS transistor and stores a first data at an output of the first inverter. The emulator is configured to emulate the first inverter operating in a condition that the PMOS transistor is weaker than the first NMOS transistor in driving strength. The suppressing device is configured to, in response to a voltage at an output of the emulator, selectively suppress a voltage level of the word line.

Abstract: A memory system includes: a bit counter and a regression analyzer. The bit counter is configured to generate a plurality of count values based on data read from selected memory cells using a plurality of different read voltages, each of the plurality of count values being indicative of a number of memory cells of a memory device having threshold voltages between pairs of the plurality of different read voltages. The regression analyzer is configured to determine read voltage for the selected memory cells based on the plurality of count values using regression analysis.

Abstract: A circuit includes an input/output (IO) circuit, a first node configured to have a first voltage level, a second node configured to have a second voltage level, a third node, and a switching circuit. The IO circuit has a set of transistors, and the third node is coupled to bulks of the set of transistors. The switching circuit is configured to couple the first node to the third node when the IO circuit is operated in an active mode; and couple the second node to the third node when the IO circuit is operated in an inactive mode. The first voltage level causes the set of transistors to have a first threshold voltage, the second voltage level causes the set of transistors to have a second threshold voltage, and an absolute value of the second threshold voltage is greater than that of the first threshold voltage.

Abstract: A self-timed memory includes a plurality of write timer cells. A reference write driver circuit writes a logic low value to a true side of the write timer cells. Each write timer cell includes a pullup transistor whose gate is coupled to an internal true node. Self-timing is effectuated by detecting a completion of the logic value write at a complement side of the write timer cells and signaling a reset of the self-timer memory in response to detected completion. To better align detected completion of the write in write timer cells to actual completion of a write in the memory, a gate to source voltage of the write timer cell pullup transistor is lowered by increasing a lower logic level voltage at the internal true node in connection with driver circuit operation to write a low logic state into the true side of the write timer cell.

Abstract: A circuit for generating a write signal includes a pre-emphasis signal generator that receives location information of a to-be-programmed memory cell and generates a pre-emphasis signal depending on the location information of the to-be-programmed memory cell, and a write driver that generates a program signal corresponding to data to be programmed in the to-be-programmed memory cell. A write signal is generated by combining the program signal with the pre-emphasis signal supplied from the pre-emphasis signal generator, and the write signal output to the to-be-programmed memory cell.

Abstract: Apparatuses, sense circuits, and methods for compensating for a voltage increase on a wordline in a memory is described. An example apparatus includes a bitline, a memory cell coupled to the bitline, a bipolar selector device coupled to the memory cell, a wordline coupled to the bipolar selector device, and a wordline driver coupled to the wordline. The apparatus further includes a model wordline circuit configured to model an impedance of the wordline and an impedance of the wordline driver, and a sense circuit coupled to the bitline and to the model wordline circuit. The sense circuit is configured to sense a state of the memory cell based on a cell current and provide a sense signal indicating a state of the memory cell. The sense circuit is further configured to adjust a bitline voltage responsive to an increase in wordline voltage as modeled by the model wordline circuit.

Abstract: Sense amplifiers, memories, and apparatuses and methods for sensing a data state of a memory cell are disclosed. An example apparatus includes a differential amplifier configured to amplify a voltage difference between voltages applied to first and second amplifier input nodes to provide an output. The example apparatus further includes first and second capacitances coupled to the first and second amplifier input nodes. A switch block coupled to the first and second capacitances is configured to couple during a first phase a reference input node to the first and second capacitances and to the first amplifier input node. The switch block is further configured to couple during the first phase an output of the amplifier to the second amplifier input node to establish a compensation condition. During a second phase, the switch block couples its input nodes to the first and second capacitances.

Abstract: A nonvolatile memory device includes: a driving voltage generation unit configured to generate a driving voltage of a core bias line included in a memory cell current path; a comparison unit configured to compare a voltage level of the core bias line with a predetermined limit level in response to a virtual negative read signal; and a compensation driving unit configured to compensation-drive the core bias line in response to an output signal of the comparison unit.

Abstract: Included are reference cells each including a variable resistance element which reversibly changes between a predetermined low resistance state LR and a predetermined high resistance state HR according to an application of an electric signal, a comparator which compares resistance values of the reference cells, a pulse generation circuit which generates an electric signal for setting the reference cells to LR or HR, and a control circuit which controls operations where application of the generated electric signal to one of the reference cells corresponding to a comparison result of the comparator and application of a new electric signal generated by the pulse generation circuit to one of the reference cells corresponding to a new comparison result of the comparator are repeated, and then one of the reference cells corresponding to a final comparison result of the comparator is connected to an output terminal.

Abstract: A method for reading a memory element within a crossbar array includes switching a column line connected to a target memory element of the crossbar array to connected to an input of a current mirror; applying an error voltage to unselected rows of the crossbar array; applying a sense voltage to a row line connected to the target memory element; and outputting a current with said current mirror.

Abstract: Voltage coupling/decoupling devices are provided within DRAM devices for improving the bias sensing of sense amplifiers and thus the refresh performance. The voltage coupling/decoupling devices couple or decouple bias voltage from corresponding digit lines coupled to the sense amplifiers. By coupling and decoupling voltage from the digit lines, the time interval between refresh operations can be increased.

Abstract: A memory arrangement including a memory block and a controller. The memory block comprises a plurality of memory cells, wherein each memory cell operable to store one of a plurality of different levels of charge. The controller is configured to write (i) a first reference signal threshold into a first memory cell and (ii) a second reference signal threshold into a second memory cell. The first reference signal threshold corresponds to a first level of charge of the plurality of different levels of charge, and the second reference signal threshold corresponds to a second level of charge of the plurality of different levels of charge. Each of the first level of charge and the second level of charge is used to calibrate a read back of any of the one of the plurality of different levels of charge stored among the plurality of memory cells in the memory block.

Abstract: A nonvolatile memory device comprises a nonvolatile cell array comprising a memory cell and a reference cell, a clamping circuit electrically connected to the memory cell and configured to clamp a voltage applied to a data sensing line during a read operation, and a clamping voltage generation unit configured to generate a clamping voltage responsive to a first voltage having a level based on the reference cell, and to feed back the clamping voltage to the clamping circuit.

Abstract: The semiconductor device includes a memory cell including a first transistor including a first channel formation region, a first gate electrode, and first source and drain regions; a second transistor including a second channel formation region provided so as to overlap with at least part of either of the first source region or the first drain region, a second source electrode, a second drain electrode electrically connected to the first gate electrode, and a second gate electrode; and an insulating layer provided between the first transistor and the second transistor. In a period during which the second transistor needs in an off state, at least when a positive potential is supplied to the first source region or the first drain region, a negative potential is supplied to the second gate electrode.

Abstract: Sense amplifiers, memories, and apparatuses and methods for sensing a data state of a memory cell are disclosed. An example apparatus includes a differential amplifier configured to amplify a voltage difference between voltages applied to first and second amplifier input nodes to provide an output. The example apparatus further includes first and second capacitances coupled to the first and second amplifier input nodes. A switch block coupled to the first and second capacitances is configured to couple during a first phase a reference input node to the first and second capacitances and to the first amplifier input node. The switch block is further configured to couple during the first phase an output of the amplifier to the second amplifier input node to establish a compensation condition. During a second phase, the switch block couples its input nodes to the first and second capacitances.

Abstract: An electronic device includes a functional unit and a current compensation unit. The functional unit operates based on a power supplied by an external host through power supply lines and generates a control signal based on an amount of power consumption of the functional unit. The current compensation unit compensates a change in a power supply current based on the control signal, where the power supply current is a current flowing through the power supply lines.

Abstract: A method for reading a memory element within a crossbar array includes switching a column line connected to a target memory element of the crossbar array to connected to an input of a current mirror; applying an error voltage to unselected rows of the crossbar array; applying a sense voltage to a row line connected to the target memory element; and measuring an output current of the current mirror.

Abstract: In one aspect, the invention concerns a memory system that compensates for power level variations in sense amplifiers for multilevel memory. For example, a compensation circuit can be employed to compensate for current or voltage variations in the power supplied to multilevel memory sense amplifiers. As another example, compensation can be accomplished by application of a bias voltage to the power supply. Another example is a sense amplifier configured with improved input common mode voltage range. Such sense amplifiers can be two-pair and three-pair sense amplifiers. Further examples of the invention include more simplified sense amplifier configurations, and sense amplifiers having reduced leakage current.

Abstract: Systems and methods are disclosed for testing dies in a stack of dies and inserting a repair circuit which, when enabled, compensates for a delay defect in the die stack. Intra-die and inter-die slack values are determined to establish which die or dies in the die stack would benefit from the insertion of a repair circuit.

Abstract: Provided is a semiconductor memory device including a plurality of memory cells arranged in a matrix, a plurality of word lines arranged corresponding to each row of the memory cells, a plurality of bit line pairs arranged corresponding to each column of the memory cells, a column selector that selects any of the plurality of bit line pairs based on a column selection signal and connects the selected bit line pair to a data line pair, a precharge circuit that precharges the data line pair, a sense amplifier that amplifies a potential difference of the data line pair, and a control circuit that controls current for driving the sense amplifier based on potentials of the data line pair after a lapse of a specified period from start of amplification of the potential difference of the precharged data line pair by the sense amplifier.

Abstract: The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is formed on or in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.

Abstract: A memory arrangement including a memory block and a controller. The memory block comprises a plurality of memory cells, wherein each memory cell operable to store one of a plurality of different levels of charge. The controller is configured to write (i) a first reference signal threshold into a first memory cell and (ii) a second reference signal threshold into a second memory cell. The first reference signal threshold corresponds to a first level of charge of the plurality of different levels of charge, and the second reference signal threshold corresponds to a second level of charge of the plurality of different levels of charge. Each of the first level of charge and the second level of charge is used to calibrate a read back of any of the one of the plurality of different levels of charge stored among the plurality of memory cells in the memory block.

Abstract: A voltage generation circuit for providing a read or verification voltage of a nonvolatile memory device includes a first voltage generation unit configured to output a first voltage using a first reference voltage, a bouncing compensation unit configured to change the first voltage using a first control signal, the first voltage, and a voltage of a global source line when a read or verification operation is performed on the nonvolatile memory device, and to output a changed first voltage as a second voltage, a second reference voltage generation unit configured to generate a second reference voltage, and an amplification unit configured to amplify a difference between the second voltage and the second reference voltage according to a set resistance ratio and to output a result of the amplification as a third voltage.

Abstract: In one implementation, a method for performing memory operations includes receiving, at a memory device, a request to read data from one or more non-volatile memory cells; and retrieving stored temperature information associated with the non-volatile memory cells, wherein the temperature information is associated with a temperature at approximately at a time when the data was written to the non-volatile memory cells. The method can further include reading, by the memory device, the data from the non-volatile memory cells. The method can also include processing the read data based on, at least, the retrieved temperature information; and providing the processed data.

Abstract: The present invention relates to a system and method for adjusting timing of memory access operations to a memory block. In one embodiment, a controller may be in communication with a memory block. The controller may be adapted to adjust timing of a memory access operation to the memory block by extending a portion of a clock pulse to compensate for delay associated with the memory block. The delay may correspond to a predecoder delay or a global decoder delay. The clock pulse may be a read clock pulse or a write clock pulse. In one embodiment, the controller may be adapted to adjust timing of a read clock pulse differently from a write clock pulse.

Abstract: A semiconductor storage device includes: a plurality of memory cell arrays, each having a memory cell arranged therein, the memory cell including a ferroelectric capacitor and a transistor; a dummy capacitor operative to provide a reference potential corresponding to a potential read from the memory cell; a sense amplifier circuit including an amplifier circuit to compare and amplify potentials between a pair of bit lines; a reference potential correction capacitor connected to the pair of bit lines together with the dummy capacitor; and a control circuit configured to output a correction signal based on shift information to correct the reference potential, the shift information being retained in at least one of the plurality of memory cell arrays. The reference potential correction capacitor shifts the reference potential by changing the amount of accumulated electric charges according to the correction signal.

Abstract: A memory arrangement including a memory block and a controller. The memory block comprises a plurality of memory cells, wherein each memory cell operable to store one of a plurality of different levels of charge. The controller is configured to write (i) a first reference signal threshold into a first memory cell and (ii) a second reference signal threshold into a second memory cell. The first reference signal threshold corresponds to a first level of charge of the plurality of different levels of charge, and the second reference signal threshold corresponds to a second level of charge of the plurality of different levels of charge. Each of the first level of charge and the second level of charge is used to calibrate a read back of any of the one of the plurality of different levels of charge stored among the plurality of memory cells in the memory block.

Abstract: A non-volatile memory device includes a sensing circuit that is configured to detect a charge of a common source line and a voltage controller that is configured to vary a level of a voltage being inputted to a word line in response to a result of the detection of the sensing circuit.

Abstract: A current-sense amplifier with low-offset adjustment and a low-offset adjustment method thereof are disclosed. The current-sense amplifier includes a sensing unit, an equalizing unit and a bias compensation unit. The sensing unit includes a sense amplifier, a latch circuit, a first precharged bit line, and a second precharged bit line. The equalizing unit is electrically connected to the first and the second precharged bit line for regulating a voltage of the first precharged bit line and a voltage of the second precharged bit line to the same electric potential. The bias compensation unit is electrically connected to the sense amplifier for compensating an input offset voltage of the current-sense amplifier.

Abstract: Apparatus and associated method for asymmetric write current compensation for resistive sense memory (RSM) cells, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) cells. In accordance with some embodiments, an RSM cell includes an RSM element coupled to a switching device. The switching device has a plurality of terminals. A control circuit compensates for asymmetric write characteristics of the RSM cell by limiting a range of voltage differentials across the terminals so as to be equal to or less than a magnitude of a source voltage applied to the switching device, thereby providing bi-directional write currents of substantially equal magnitude through the RSM element.

Abstract: An array of SMT MRAM cells has a read reference circuit that provides a reference current that is the sum of a minimum current through a reference SMT MRAM cell programmed with a maximum resistance and a maximum current through an reference SMT MRAM cell programmed with a minimum resistance. The reference current forms an average reference voltage at the reference input of a sense amplifier for reading a data state from selected SMT MRAM cells of the array such that the reference SMT MRAM cells will not be disturbed during a read operation. The read reference circuit compensates for current mismatching in the reference current caused by a second order non matching effect.

Abstract: The read channel of a solid state non-volatile memory may be configured to compensate for shifts in the threshold voltages of memory cells of the memory. A log of write time information and write temperature information from one or more write operations is stored in a data unit header. The read channel configuration, which may include reference voltages used for the read operation, is determined using the write time information and the write temperature information. Memory cells of the data unit are read using the configured read channel. A historical profile spanning multiple write operations may also be developed and used to configure the read channel.

Abstract: An apparatus includes a terminal, a first plurality of driver lines, and a first phase mixer. The driver lines drive the terminal to a first logic state responsive to a first enable signal. The first phase mixer is coupled to a first one of the first plurality of driver lines. The first phase mixer is operable to receive the first enable signal and a first delayed enable signal derived from the first enable signal and generate a first signal on the first driver line having a first configurable delay with respect to the first enable signal by mixing the first enable signal and the first delayed enable signal.

Abstract: Disclosed is a resistance variable memory device including a memory cell connected with a bit line, a sense amplifier circuit sensing a voltage level on the bit line, and a pseudo-replica providing the sense amplifier circuit with a control signal that compensates for a drop in the sensing capacity of the sense amplifier circuit in relation to process, voltage and temperature (PVT) variations.

Abstract: A resistive memory device includes a resistive memory cell array, an output circuit and an input circuit. The resistive memory cell array includes a plurality of memory cells that are coupled to bitlines. The output circuit generates a sensing output signal during a write operation by sensing a bitline voltage, and generates output data during a read operation by sensing the bitline voltage. The input circuit controls the bitline voltage based on input data for the write operation, and limits the bitline voltage in response to the sensing output signal during the write operation. The memory cells are protected by effectually limiting bitline voltage.

Abstract: A circuit for generating a reference voltage includes at least one reference cell, a reference cell write driver, a reference cell sense amplifier, and a voltage compensation unit. The reference cell is a variable resistance memory cell. The reference cell write driver writes data to the reference cell. The reference cell sense amplifier reads out the data stored in the reference cell on the basis of a predetermined reference voltage. A voltage compensation unit outputs a compensation reference voltage by controlling the reference voltage in accordance with the output value of the sense amplifier.

Abstract: Systems and methods are disclosed including features that compensate for variations in the magnitude of supply voltages used in memory arrays. According to some aspects, compensation circuits may provide a tunable current-limiting load for data columns, where the load can be tuned to dynamically compensate for variations in supply voltage. In certain aspects, a compensation circuit may employ an operational amplifier configured as a voltage follower. The voltage follower compensates for any variations in supply voltage, forcing a constant voltage drop across the load element(s), thus maintaining a constant load. Other circuits may also be included, such as precharge circuits, clamp circuits, buffer circuits, trimming circuit, and sense amplifier circuits with sensed body effect. System-On-Chip integrated system aspects may include a microcontroller, a mixed IP, and a flash memory system having functionality and blocks that interface and interoperate with each other for load compensation.