Abstract: A semiconductor memory device is capable of performing a stable high-speed operation while inputting/outputting data. The semiconductor memory device includes an inversion output circuit configured to output a clocking pattern in a clocking mode, and an inversion pin to which the inversion output circuit is connected.

Abstract: A data alignment circuit includes: a select transmission unit configured to selectively transmit a first pulse or ground voltage as a first control pulse and selectively transmit a second pulse or ground voltage as a second control pulse, in response to a control signal; and a data latch unit configured to latch data in response to the first and second pulses and the first and second control pulses, and generate first to fourth data.

Abstract: A semiconductor device according to the present invention includes plural core chips CC0 to CC7 to which mutually different pieces of chip identification information LID are allocated, and an interface chip IF that controls the core chips CC0 to CC7. The interface chip IF receives address information ADD for specifying a memory cell, and supplies in common a part of the address information to the core chips CC0 to CC7 as chip selection information SEL to be compared with the chip identification information LID. With this configuration, it appears from a controller that an address space is simply enlarged. Therefore, an interface that is same as that for a conventional semiconductor memory device can be used.

Abstract: A semiconductor device includes a plural number of sense amplifiers that sense at least two data in parallel and that operate under a first frequency, and a multiplexer that operates under a second frequency higher than the first frequency and that sequentially serially outputs the data sensed in parallel. The semiconductor device also includes a driver circuit having a latch circuit connected to an output of the multiplexer, and an output driver circuit connected to the latch circuit and operating under the second frequency. The voltage of a power supply of the sense amplifiers is the same as the voltage of a power supply of the output driver circuit. The power supply of the sense amplifiers and the power supply of the output driver circuit are connected to respective different power supply lines.

Abstract: Provided is a read circuit for a semiconductor memory device which may have a reduced circuit scale, and a semiconductor memory device. In a plurality of sense amplifiers of the read circuit of the semiconductor memory device, for serially reading data from a serial output terminal, if a number of byte selectors which may be selected to determine an address at a predetermined time before determination of the address is four, only four sense amplifiers are required in total, and hence the read circuit and the semiconductor memory device are reduced in circuit scale.

Abstract: Data serializers, output buffers, memory devices and methods for serializing are provided, including a data serializer that may convert digits of parallel data to a stream of corresponding digits of serial data digits. One such data serializer may include a logic system receiving the parallel data digits and clock signals having phases that are equally phased apart from each other. Such a data serializer may use the clock signals to generate data sample signals having a value corresponding to the value of a respective one of the parallel data digits and a timing corresponding to a respective one of the clock signals. The data sample signals may be applied to a switching circuit that includes a plurality of switches, such as respective transistors, coupled to each other in parallel between an output node and a first voltage.

Abstract: An apparatus, system, and method for controlling data transfer to an output port of a serial data link interface in a semiconductor memory is disclosed. In one example, a flash memory device may have multiple serial data links, multiple memory banks and control input ports that enable the memory device to transfer the serial data to a serial data output port of the memory device. In another example, a flash memory device may have a single serial data link, a single memory bank, a serial data input port, a control input port for receiving output enable signals. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices.

Abstract: Various embodiments of a semiconductor memory apparatus are disclosed. In one exemplary embodiment, the semiconductor memory apparatus includes a core block configured to receive and store external input data, a control unit configured to activate a control signal in response to a test mode signal and a command, when the external input data has a predetermined value, and a fuse circuit configured to perform fuse programming when the control signal is activated.

Abstract: A system includes a memory controller and a plurality of memory devices connected in-series that communicate with the memory controller. Each of the memory devices has multiple independent serial ports for receiving and transmitting data. The memory controller a device address (DA) or ID number for designating a device that executes a command. Data contained in the command sent by the memory controller is captured by an individual link control circuit, in response to internally generated clock with appropriate latencies. The captured data is written into a corresponding memory bank. The data stored in one of a plurality of memory banks of one memory device is read in accordance with the addresses issued by the memory controller. The read data is propagated from the memory device through the series-connected memory devices to the memory controller.

Abstract: An integrated circuit can include an input/output (I/O) bank. The I/O bank can include a plurality of byte clock groups. Each byte clock group can include at least one phaser configured to clock circuit elements of the byte clock group at a frequency at which a source synchronous device coupled to the byte clock group communicates data.

Abstract: A semiconductor memory device capable of reducing off-current in a standby mode is provided. The semiconductor memory device includes an enable signal generating unit configured to receive a plurality of address decoding signals and generate a first enable signal to select a first cell block and a second enable signal to select a second cell block, and an internal voltage generating unit for generating an internal voltage by controlling a supply of a first voltage in accordance with the first or second enable signals.

Abstract: Apparatus and associated method for transferring data to memory, such as resistive sense memory (RSM). In accordance with some embodiments, input data comprising a sequence of logical states are transferred to a block of memory by concurrently writing a first logical state from the sequence to each of a first plurality of unit cells during a first write step, and concurrently writing a second logical state from the sequence to each of a second non-overlapping plurality of unit cells during a second write step.

Abstract: A semiconductor memory device includes a memory cell array having plural memory cells that require a refresh operation when retaining data; a read/write control unit that performs read-access or write-access of memory cell address specified for the memory cell array based on instructions from the outside; a refresh control unit that performs hidden-refresh of memory cells without control from the outside; and a schedule control unit that makes the refresh control unit perform hidden-refresh after the read/write control unit read-accesses the memory cell array, and that also makes the refresh control unit perform hidden-refresh before the read/write access control unit performs write-access.

Abstract: A semiconductor device includes a data compression circuit that performs sequential processes based on timings of an external clock signal. The sequential processes include compressing data input in parallel, latching the compressed data, and outputting the latched data.

Abstract: A semiconductor memory apparatus includes a first data selection section inputted with the first data and second data and output one of the first data and the second data as first selection data in response to an address signal, a second data selection section inputted with the second data and the first selection data and output one of the second data and the first selection data as second selection data depending upon an input and output mode, and a data output section configured to be inputted with the first and second selection data and output first and second output data.

Abstract: A data output circuit of a semiconductor memory device includes a pipe latch unit configured to store input parallel data and align the stored data in response to a plurality of alignment control signals to output serial output data, and an alignment control signal generating unit configured to generate the plurality of alignment control signals in response to a burst-type information and a seed address group, wherein the alignment control signal generating unit generates the alignment control signals to swap data in a swap mode where the burst-type is a certain type and bits of the seed address group are certain values.

Abstract: To improve the access efficiency of a semiconductor memory that includes a plurality of memory chips. Based on a layer address, a bank address, and a row address received in synchronization with a row command, and a layer address, a bank address, and a column address received in synchronization with a column command, a memory cell selected by the row address and column address in a bank selected by the bank address included in a core chip selected by the chip address is accessed. This can increase the number of banks recognizable to a controller, thereby improving the memory access efficiency of the semiconductor device which includes the plurality of memory chips.

Abstract: A data processing system includes a first semiconductor device that has a plurality of blocks each including plural data, and a second semiconductor device that has a first control circuit controlling the first semiconductor device, and the first control circuit issues a plurality of commands to communicate with the first semiconductor device in units of access units including a plurality of first definitions that define a plurality of burst lengths indicating numbers of different data, respectively, and a plurality of second definitions that define correspondences between certain elements of data among the plural data included in the blocks, respectively, and arrangement orders in the numbers of different data that constitute the burst lengths, respectively, and communicates with the first semiconductor device through the plural data in the numbers of different data according to the first and second definitions.

Abstract: A voltage-controlled oscillator comprises a first oscillator and a second oscillator. The first oscillator may generate a plurality of intermediate clock signals at a plurality of first nodes, multiply connected to a plurality of first ring shape circuits, in response to a control voltage. The plurality of intermediate clock signals may have a different phase from each other and a same phase difference with each other. The second oscillator may generate a plurality of output clock signals at a plurality of second nodes, multiply connected to a plurality of second ring shape circuits, by changing a voltage level of the intermediate clock signals. The plurality of second ring shape circuits may pass the plurality of first nodes.

Abstract: A memory device having a memory core is described. The memory device includes a clock receiver circuit, a first interface to receive a read command, a data interface, and a second interface to receive power mode information. The data interface is separate from the first interface. The second interface is separate from the first interface and the data interface. The memory device has a plurality of power modes, including a first mode in which the clock receiver circuit, first interface, and data interface are turned off; a second mode in which the clock receiver is turned on and the first interface and data interface are turned off; and a third mode in which the clock receiver and first interface are turned on. In the third mode, the data interface is turned on when the first interface receives the command, to output data in response to the command.

Abstract: An apparatus for aligning input data in a semiconductor device includes at least one alignment block and a decision block. The at least one alignment block is for aligning serial input data into groups of parallel data synchronized to at least one divided data strobe signal for increasing margin between the maximum and minimum tDQSS values. The decision block is for selecting one of the groups of parallel data as valid data in response to synchronization information generated for removing any invalid data in the serial input data resulting from a write gap.

Abstract: To provide a semiconductor system including a plurality of core chips and an interface chip that controls the core chips. Each of the core chips includes an internal voltage generating circuit. The interface chip includes an unused chip information holding circuit that stores therein unused chip information of the core chips. The core chips respectively receive the unused chip information from the unused chip information holding circuit. When the unused chip information indicates an unused state, the internal voltage generating circuits are inactivated, and when the unused chip information indicates a used state, the internal voltage generating circuits are activated. With this configuration, unnecessary power consumption by the unused chips is reduced.

Abstract: Control information needed for executing data transmission/reception through a data terminal is received via its own control terminal in a first operation mode, and the control information is received by using the own control terminal and also a control terminal of at least one of the other ports in a second operation mode.

Abstract: A semiconductor memory device includes a plurality of data transmission lines, a plurality of parallel-to-serial conversion sections configured to receive, serially align, and output data from at least two of the plurality of data transmission lines, a plurality of data compression circuits configured to receive, compress, and output outputs of at least two of the plurality of parallel-to-serial conversion sections, and a plurality of data output circuits configured to output respective compression results of the plurality of data compression circuits to an outside of a chip.

Abstract: A data output circuit includes a serial data output unit for outputting a plurality of parallel data as serial data according to an operation mode, an internal information output unit for outputting internal information data according to the operation mode, and a buffering unit for receiving the serial data and the internal information data through an identical input end and buffering the received data.

Abstract: A semiconductor device includes plural core chips and an interface chip that controls the plural core chips. Each of the plural core chips includes a layer address generating circuit that generates a second chip address by incrementing a value of a first chip address and a layer address comparing circuit that compares a third chip address supplied from the interface chip and the second chip address, and activates a chip selection signal when the third chip address and the second chip address are matched with each other. When a non-used chip signal is in an inactivated state, the layer address generating circuit supplies the second chip address to another core chip, and when the non-used chip signal is in an activated state, the layer address generating circuit supplies the first chip address to another core chip without a change.

Abstract: An integrated circuit for storing data, and for application in a memory card that operates in cooperation with at least one of an external acquisition system and an external processing system includes input/output terminals for receiving the data to be stored, and an electrically programmable non-volatile memory for storing the data in digital format. The memory includes a first terminal for receiving a programming signal for enabling storage of the data, and a second terminal for receiving a reading signal for enabling output of the stored data via the input/output terminals. A memory control circuit is connected to the first and second terminals of the electrically programmable non-volatile memory, and to the input/output terminals for generating programming and reading signals based upon the command signal. The electrically programmable non-volatile memory is erasable by electromagnetic radiation for permitting a non-electrical erasure of the stored data.

Abstract: A flash storage system accesses data interleaved among flash storage devices. The flash storage system receives a data block including data portions, stores the data portions in a data buffer, and initiates data transfers for asynchronously writing the data portions into storage blocks interleaved among the flash storage devices. Additionally, the flash storage system may asynchronously read data portions of a data block interleaved among the storage blocks, store the data portions in the data buffer, and access the data portions from the data buffer.

Abstract: A memory system having a serial data interface and a serial data path core for receiving data from and for providing data to at least one memory bank as a serial bitstream. The memory bank is divided into two halves, where each half is divided into upper and lower sectors. Each sector provides data in parallel to a shared two-dimensional page buffer with an integrated self column decoding circuit. A serial to parallel data converter within the memory bank couples the parallel data from either half to the serial data path core. The shared two-dimensional page buffer with the integrated self column decoding circuit minimizes circuit and chip area overhead for each bank, and the serial data path core reduces chip area typically used for routing wide data buses. Therefore a multiple memory bank system is implemented without a significant corresponding chip area increase when compared to a single memory bank system having the same density.

Abstract: Data serializers, output buffers, memory devices and methods for serializing are provided, including a data serializer that may convert digits of parallel data to a stream of corresponding digits of serial data digits. One such data serializer may include a logic system receiving the parallel data digits and clock signals having phases that are equally phased apart from each other. Such a data serializer may use the clock signals to generate data sample signals having a value corresponding to the value of a respective one of the parallel data digits and a timing corresponding to a respective one of the clock signals. The data sample signals may be applied to a switching circuit that includes a plurality of switches, such as respective transistors, coupled to each other in parallel between an output node and a first voltage. A bias element may bias the output node to a second voltage. Each of the switches may be controlled by a respective one of the sample signals.

Abstract: A data alignment circuit of a semiconductor memory apparatus for receiving and aligning parallel data group includes a first control unit, a second control unit, a first alignment unit and a second alignment unit. The first alignment unit generates a first control signal group in response to an address group, a clock signal, and a latency signal. The second control unit generates a second control signal group in response to the address group, the clock signal, and the latency signal. The first alignment unit aligns the parallel data group as a first serial data group in response to the first control signal group. The second alignment unit aligns the parallel data group as a second serial data group in response to the second control signal group.

Abstract: A data output circuit for a semiconductor memory apparatus includes a data output control unit that generates a selection signal, an output timing signal, and an input control signal in response to a read command and a clock, and a signal-responsive data output unit that receives parallel data in response to the input control signal, arranges the parallel data in response to the selection signal, and sequentially outputs the arranged parallel data as serial data in synchronization with the output timing signal.

Abstract: A semiconductor device includes a plural number of sense amplifiers that sense at least two data in parallel and that operate under a first frequency, and a multiplexer that operates under a second frequency higher than the first frequency and that sequentially serially outputs the data sensed in parallel. The semiconductor device also includes a driver circuit having a latch circuit connected to an output of the multiplexer, and an output driver circuit connected to the latch circuit and operating under the second frequency. The voltage of a power supply of the sense amplifiers is the same as the voltage of a power supply of the output driver circuit. The power supply of the sense amplifiers and the power supply of the output driver circuit are connected to respective different power supply lines.

Abstract: An apparatus, system, and method for controlling data transfer to an output port of a serial data link interface in a semiconductor memory is disclosed. In one example, a flash memory device may have multiple serial data links, multiple memory banks and control input ports that enable the memory device to transfer the serial data to a serial data output port of the memory device. In another example, a flash memory device may have a single serial data link, a single memory bank, a serial data input port, a control input port for receiving output enable signals. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices.

Abstract: A memory system having a serial data interface and a serial data path core for receiving data from and for providing data to at least one memory bank as a serial bitstream. The memory bank is divided into two halves, where each half is divided into upper and lower sectors. Each sector provides data in parallel to a shared two-dimensional page buffer with an integrated self column decoding circuit. A serial to parallel data converter within the memory bank couples the parallel data from either half to the serial data path core. The shared two-dimensional page buffer with the integrated self column decoding circuit minimizes circuit and chip area overhead for each bank, and the serial data path core reduces chip area typically used for routing wide data buses. Therefore a multiple memory bank system is implemented without a significant corresponding chip area increase when compared to a single memory bank system having the same density.

Abstract: A signal aligning circuit includes a plurality of pads receiving input signals in parallel 1 bit by 1 bit; a first transferring unit for transferring the input signals as first signals in synchronization with a first clock signal of an internal clock, and transferring the input signals as second signals in synchronization with a second clock signal of the internal clock; a second transferring unit for transferring the first signals in synchronization with the second clock signal of the internal clock; and an aligning unit for aligning the first and second signals transferred from the first and second transferring units and outputting the aligned signal as output signals.

Abstract: Correction data is written in fuse circuits of q bits. A reading circuit sequentially reads information of the fuse circuits through a selector and writes the information in a storage circuit. Therefore, read data is output from the storage circuit in parallel.

Abstract: A semiconductor device having a register and an information generation circuit can reduce data to be transferred, and consequently save electric power. The register stores first information. The information generation circuit generates, in response to a signal acquired from the an exterior of the device, second information indicating which bits of the first information is to be inverted.

Abstract: Disclosed is a FIFO peek access device that utilizes a peek signal to access data stored in a FIFO without losing or erasing data. The peek signal is applied to read address logic and prevents the incrementing of the pointers in the peek address logic, so that after a read enable signal is asserted, the same data block can be accessed again on the next read enable signal.

Abstract: To provide a semiconductor memory device including a mode register in which a mode signal is set, a data amplifier that amplifies read data read from a memory cell array, a data bus onto which the read data amplified by the data amplifier is transmitted, a data input/output circuit that outputs a signal on the data bus to outside, and a mode signal output circuit that outputs the mode signal set in the mode register onto the data bus. Because the mode signal is not caused to interrupt halfway along the data input/output circuit, but supplied onto the data bus that connects the data amplifier to the data input/output circuit, no collision of the read data with the mode signal occurs in the data input/output circuit.

Abstract: A semiconductor device comprises a plurality of terminals, a plurality of drive units corresponding to the plurality of terminals, and a data control unit. The data control unit outputs parallel data applied to the plurality of terminals to the plurality of drive unit in a normal operation mode, and converts serial data applied to a particular terminal, which is one of the plurality of terminals, to parallel data, and outputs the parallel data to which the serial data applied to the particular terminal is converted to the plurality of drive units in a test mode.

Abstract: Embodiments of the invention relate generally to a coupling device, to a processor arrangement, to a data processing arrangement, and to methods for transmitting data. In an embodiment of the invention, a coupling device for coupling a memory, which has a serial data output, with a processor, which has a parallel data input, is provided. The coupling device may include a serial data interface configured to receive data, a parallel data interface configured to transmit data, and a cache memory coupled to the serial data interface and to the parallel data interface, wherein the cache memory is configured to receive and store data, which have been received in a serial data format via the serial data interface, and to transmit data stored in the cache memory to the parallel data interface.

Abstract: The invention relates to an interface for providing multiple modes of accessing data, including serial and parallel modes. Controllable non-volatile memory interfaces are described, including a serial module configured to provide a serial connection between a non-volatile memory array and another non-volatile memory array. The serial module can provide access to the non-volatile memory array. A mode module can be configured to determine which type of interface operation (i.e., serial mode or parallel mode) will be used for the non-volatile memory array and the another non-volatile memory array. In some cases, a controller can be configured to select the serial module independent of the mode module. Circuitry for performing data operations on the non-volatile memories can be fabricated FEOL on a substrate and the non-volatile memories can be fabricated BEOL directly on top of the substrate in one or more layers of memory.

Abstract: A voltage-controlled oscillator comprises a first oscillator and a second oscillator. The first oscillator may generate a plurality of intermediate clock signals at a plurality of first nodes, multiply connected to a plurality of first ring shape circuits, in response to a control voltage. The plurality of intermediate clock signals may have a different phase from each other and a same phase difference with each other. The second oscillator may generate a plurality of output clock signals at a plurality of second nodes, multiply connected to a plurality of second ring shape circuits, by changing a voltage level of the intermediate clock signals. The plurality of second ring shape circuits may pass the plurality of first nodes.

Abstract: An address counter includes FIFO units and first to third command counters that controls the groups. In the FIFO units, latch circuits including input gates and output gates are connected in parallel. The first command counter conducts any one of the input gates in response to a first internal command; the second command counter conducts any one of the output gates in response to a second internal command; and the third command counter conducts any one of the output gates in response to a third internal command. Thereby, the same address signals can be outputted successively at a plurality of timings, and thus, a circuit scale of the address counter can be reduced.

Abstract: A data input circuit for a semiconductor memory apparatus includes a data latch block that, according to a data strobe signal, latches data and outputs the latched data; a data output controlling unit that determines a phase difference between the data strobe signal and a clock signal, and activates a data output control signal; and a data delay block that, when the data output control signal is activated, delays the data output from the data latch block for a predetermined time, and outputs the delayed data.

Abstract: A semiconductor memory device is capable of performing a stable high-speed operation while inputting/outputting data. The semiconductor memory device includes an inversion output circuit configured to output a clocking pattern in a clocking mode, and an inversion pin to which the inversion output circuit is connected.

Abstract: Embodiments of the invention provide a layout for a semiconductor memory device that splits each memory bank into two blocks. Embodiments of the invention dispose input/output sense amplifiers between the two memory blocks to achieve relatively short global input/output lines to all areas of the memory bank. Shorter global input/output lines have less loading and therefore enable higher-speed data transfer rates. Some embodiments of the invention include column selection line repeaters between the two memory blocks. The column selection line repeaters reduce loading in the column selection lines, and increase column selection speed. Embodiments of the invention include both input/output sense amplifiers and column selection line repeaters disposed between the two memory blocks to increase data transfer rates on the global input/output lines and also increase column selection speed.

Abstract: The semiconductor memory device proposed in the present invention comprises memory cells disposed in the row direction and the column direction, a plurality of first lines by which supply voltages are supplied in order to select memory cells disposed in the row direction among the plurality of cells, a plurality of second lines by which supply voltages are supplied in order to select memory cells disposed in the column direction among the plurality of cells, the data lines which input and output the data to the selected memory cells, the first power voltage supply circuit which supplies the predetermined supply voltages to the first lines corresponding with the externally input row address synchronizing with an act command, and the second power voltage supply circuit which supplies the predetermined supply voltages to the second lines corresponding with the externally input column address synchronizing with an act command.

Abstract: A data output circuit includes a strobe signal controlling block configured to generate a first delayed strobe signal by delaying a first strobe signal by a certain delay amount, an input/output sense amplifying block configured to amplify first parallel data signals to generate second parallel data signals having the same number of bits as that of the first parallel data signals in response to the first strobe signal and the first delayed strobe signal, a storing block configured to latch the second parallel data signals in response to a second strobe signal and a second delayed strobe signal, and a parallel-to-serial converting block configured to sequentially output the second parallel data signals latched in the storing block, wherein the first strobe signal is used to generate a data signal that is outputted first among the second parallel data signals.