Abstract: A semiconductor device includes a delay buffer, and a pipeline control circuit. The pipeline control circuit controls the delay buffer to hold read data from outputting to a read/write bus for each of banks based on a read command to the each bank while the pipeline control circuit controlling the delay buffer to output write data to the read/write bus, when a next command to the each bank is a write command for the write data. The read/write bus is common to the banks.

Abstract: A memory device includes a memory unit including a plurality of first conductive lines and a plurality of second conductive lines that cross the first conductive lines, and a driving unit module coupled with the plurality of the first conductive lines through respective ones of a plurality of contacts and coupled with and the plurality of the second conductive lines through respective ones of the plurality of contacts, wherein as the first conductive lines become farther from the driving unit module along a direction that the second conductive lines extend, the respective contacts of the first conductive lines have lower resistance values.

Abstract: A decoder circuit, responsive to a burst sequence control signal, for accessing a memory location in a memory array. The decoder circuit receives an address signal and outputs a plurality of first select lines. Logic circuitry receives these first select lines and a burst sequence control signal and outputs a plurality of second select lines. When the bust sequence control signal is unasserted, the logic circuitry passes through to the plurality of second select lines the signals received on the plurality of first select lines. When the burst sequence control signal is asserted, the logic circuitry performs a logical operation on the signals received on the plurality of first select lines and outputs the result on the plurality of second select lines.

Abstract: The apparatuses and methods described herein may comprise a memory array formed on a semiconductor substrate and including a plurality of cells associated with a plurality of word lines. The memory array may comprise a plurality of sub-blocks including a first sub-block and a second sub-block. Each sub-block may comprise a memory cell portion of the plurality of memory cells associated with a corresponding word line portion of the plurality of word lines. The memory cell portions in the first and second sub-blocks may be independently addressable with respect to each other such that a second operation can be performed on at least one memory cell of the memory cell portion of the second sub-block responsive to suspending a first operation directed to at least one memory cell of the memory cell portion of the first sub-block.

Abstract: Memories, memory arrays, and methods for selectively providing electrical power to memory sections of a memory array are disclosed. A memory array can be operated by decoupling row decoder circuitry from receiving electrical power while the memory array is not being accessed. Portions of the memory array to be accessed are determined from external memory addresses and the row decoder for the portions of the memory array to be accessed are selectively provided with electrical power. The section of memory is then accessed. One such array includes memory section voltage supply rails having decoder circuits coupled to receive electrical power, and further includes memory section power control logic. The control logic selectively couples the memory section voltage supply rail to a primary voltage supply to provide electrical power to the memory section voltage supply rail in response to being selected based on memory addresses.

Abstract: A memory includes a memory cell including a first terminal, a second terminal and a channel extending between the first terminal and the second terminal. The memory further includes an energy storage element configured to support a programming of the memory cell, the energy storage element being coupled to the first terminal, an energy supply coupled to the energy storage element, and a controller. The controller is configured to activate the energy supply and to bring the channel of the memory cell into a non-conductive state for energizing the energy storage element, and to subsequently bring the channel of the memory cell into a conductive state for programming the memory cell based on the energy stored in the energy storage element.

Abstract: An integrated circuit includes a plurality of mode register set (MRS) setting blocks configured to generate a plurality of additive latency (AL) codes in response to an MRS signal, and a decoding unit configured to decoding the plurality of AL codes in response to a stack information signal to generate a plurality of AL setting signals.

Abstract: A semiconductor memory device capable of preventing a defect caused by lowering the etching precision in an end area of the memory cell array is provided. A first block is constructed by first memory cell units each having of memory cells, a second block is constructed by second memory cell units each having memory cells, and the memory cell array is constructed by arranging the first blocks on both end portions thereof and arranging the second blocks on other portions thereof. The structure of the first memory cell unit on the end side of the memory cell array is different from the second memory cell unit. Wirings for connecting the selection gate lines of the memory cell array to corresponding transistors in a row decoder are formed of wiring layers formed above wirings for connecting control gate lines of the memory cell array to the transistors in the row decoder.

Abstract: Methods, devices, and systems associated with memory cell operation are described. One or more methods of operating a memory cell include charging a capacitor coupled to the memory cell to a particular voltage level and programming the memory cell from a first state to a second state by controlling discharge of the capacitor through a resistive switching element of the memory cell.

Abstract: A stacked semiconductor memory device comprises a semiconductor substrate having a functional circuit, a plurality of memory cell array layers, and at least one connection layer. The memory cell array layers are stacked above the semiconductor substrate. The connection layers are stacked above the semiconductor substrate independent of the memory cell array layers. The connection layers electrically connect memory cell selecting lines arranged on the memory cell array layers to the functional circuit.

Abstract: In a state where a signal (IN) is at “H” and an NMOS transistor (403) is on, when a signal (PCLK) changes to “H” and a PMOS transistor (401) turns off, an output node (N1) becomes coupled to a word-line activation signal (WACTCLK) via the NMOS transistor (403). When the word-line activation signal (WACTCLK) changes to “L,” a word line signal (MWL) changes to “L.” Since the signal (PCLK) is at “H” and the NMOS transistor (405) is on, this NMOS transistor (405) can assist discharging of the word-line activation signal (WACTCLK) to a ground voltage.

Abstract: According to an exemplary embodiment, a memory array arrangement includes a plurality of word lines, where at least two of the plurality of word lines are concurrently active word lines. Each of the plurality of word lines drive at least one group of columns. The memory array arrangement also includes a multiplexer for coupling one memory cell in a selected group of columns to at least one of the plurality of sense amps, thereby achieving a reduced sense amp-to-column ratio. The memory array arrangement further includes a plurality of I/O buffers each corresponding to the at least one of the plurality of sense amps. The memory array arrangement thereby results in the plurality of word lines having reduced resistive and capacitive loading.

Abstract: A nonvolatile memory device is provided relating to a test operation for a Low Power Double-Data-Rate (LPDDR) nonvolatile memory device. The nonvolatile memory device comprises a command decoder configured to decode a test mode signal in a test mode to output program and erasure signals into a memory, an address decoder configured to decode a command address inputted through an address pin in the test mode to output a cell array address into the memory, and an overlay window configured to store a data inputted through a data pin in the test mode.

Abstract: A bit line precharge circuit includes a precharge signal generation unit configured to generate first and second precharge signals that are enabled at different timing points by receiving a bit line equalizing signal; a first precharge unit configured to connect a pair of bit lines to each other in response to the first precharge signal and supply a bit line precharge voltage to the pair of bit lines; and a second precharge unit configured to supply the bit line precharge voltage to the bit line in response to the second precharge signal.

Abstract: A first data amplifier connects to a first memory cell identified by an X-address signal and a selection signal obtained by predecoding a Y-address signal. A second data amplifier connects to a second memory cell identified by the X-address signal and a delayed selection signal obtained by delaying the selection signal. A generator generates a delayed operation clock signal by delaying an operation clock signal of the first data amplifier. A timing controller receives a first control signal for controlling an operation of the first data amplifier and a second control signal for controlling an operation of the second data amplifier, outputs the first control signal to the first data amplifier at a timing according to the operation clock signal, and outputs the second control signal to the second data amplifier at a timing according to the delayed operation clock signal.

Abstract: A mechanism for managing peak power in a memory storage array that includes sub-array blocks may reduce the peak currents associated with read and write operations by staggering the wordline signal activation to each of the sub-array blocks. In particular, the wordline units within each sub-array block may generate the wordline signals to each sub-array block such that a read wordline signal of one sub-array block does not transition from one logic level to another logic level at the same time as the write wordline of another sub-array block. Further, the wordline units may generate the wordline signals to each sub-array block such that a read wordline of a given sub-array block does not transition from one logic level to another logic level at the same time as a read wordline signal of another sub-array block.

Abstract: Disclosed are embodiments of a multi-bank random access memory (RAM) structure that provides signal buffering at both the global and local connector level for improved performance. Specifically, inverters are incorporated into the global connector(s), which traverse groups of memory banks and which transmit signals (e.g., address signals, control signals, and/or data signals) from a memory controller, and also into alternating groups of local connectors, which connect nodes on the global connector(s) to corresponding groups of memory banks, such that any of the signals that are received by the memory banks from the memory controller via the global and local connectors are buffered by an even number of inverters and are thereby true signals. Signal buffering at both the global and local connector level results in relatively fast slews, short propagation delays, and low peak power consumption with minimal, if any, increase in area consumption.

Abstract: There are included first and second dynamic circuits and first and second transistors. The first dynamic circuit keeps a first dynamic node at a first level when a plurality of input signals is in a first state, and switches the first dynamic node between the first level and a second level in accordance with a first clock signal when the plurality of input signals is in a second state. The second dynamic circuit includes a compensating circuit that is provided between the second dynamic node and a second power supply and connects the second dynamic node to the second power supply so as to compensate the level of the second dynamic node when the plurality of input signals is in the second state and the first dynamic node is at a level other than the first level.

Abstract: A semiconductor memory device selecting a half page based on a particular bit of a row address includes: an input unit for receiving the particular bit; a control signal generation unit for outputting a mode control signal in response to a signal related to a mode for selecting a whole page; first and second mode control units for transferring first and second output signals of the input unit corresponding to the particular bit and its inverse signal; a row precharge pulse generation unit for generating a row precharge pulse enabled in an initial period of a precharge duration; a first driving unit for pull-up/pull-down driving an output terminal corresponding to a first pre-decoding signal; a second driving unit for pull-up/pull-down driving an output terminal corresponding to a second pre-decoding signal; and first and second latch units for latching output signals of the first and second driving units.

Abstract: In a multi-level memory cell, when data to be programmed arrives, the cell is programmed to the lowest-charge state in which any bit position that is being programmed or has already been programmed has the correct value, regardless of the value in that state of any bit position that has not yet been programmed and is not being programmed. The programming of other bit positions based on subsequently arriving data should not then require a transition to an impermissible lower energy state. Although this may result in a transient condition in which some bits have the wrong value, by the time programming is complete, all bits would be expected to have the correct value. A cell may contain any number of bits equal to or greater than two, and programming may be performed cyclically (e.g., from LSB to MSB), anticyclically (e.g., from MSB to LSB), or in any random order.

Abstract: A memory device has: a plurality of memory cell blocks, the memory cell block including a plurality of memory cells, a redundancy memory cell, and a selector switching a defective memory cell among the plurality of memory cells to the redundancy memory cell; and a control circuit outputting control signals of the selectors of the plurality of memory cell blocks, based on defect information indicating whether or not each of the plurality of memory cell blocks has a defective memory cell and on specification information for specifying the defective memory cell in the memory cell block having the defective memory cell, wherein the control circuit has: a plurality of flip-flops provided in correspondence with respective bit lines of the control signals of the selectors of the plurality of memory cell blocks and for shifting the specification information serially.

Abstract: A memory system that includes a memory device and a memory bank. During operation, the memory device receives a request to concurrently access a data word at a first row in a first storage region of the memory bank and error information associated with the data at a second row in a second storage region of the memory bank. The memory request includes a first row address identifying the first row and a second row address identifying the second row. Next, the memory device routes the first row address and the second row address to a first row decoder and a second row decoder in the memory bank, respectively. Finally, the memory device uses the first row decoder to decode the first row address to access the first row and concurrently uses the second row decoder to decode the second row address to access the second row.

Abstract: A nonvolatile storage device includes: a plurality of memory mats each including a plurality of memory cells; a plurality of plate electrodes each provided for every individual one of the memory mats and each used for applying a voltage to the memory cells; a power-supply section configured to apply a voltage to each of the plate electrodes; a switch circuit having a plurality of switches provided between the power-supply section and each of the plate electrodes and between the plate electrodes; and a control section configured to control the switch circuit in order to disconnect the plate electrodes from the power-supply section and to connect the plate electrodes to each other in order to carry out electrical charging and discharging operations among the plate electrodes.

Abstract: Systems and methods for saving repair cell address information in a non-volatile magnetoresistive random access memory (MRAM) having an array of MRAM cells are disclosed. A memory access circuit is coupled to the MRAM, and is configured to store failed cell address information in the MRAM.

Abstract: One embodiment of the technology is an apparatus, a memory integrated circuit. The memory integrated circuit has word line address decoding circuitry. The circuit allows selection of a single word line to have an erase voltage. A decoder circuit includes an inverter and logic. The inverter has an input, and an output controlling a word line to perform the erase operation. A voltage range of the input extends between a first voltage reference and a second voltage reference. Examples of voltages references are a voltage supply and a ground. In some embodiments, this wide voltage range results from the input being free of a threshold voltage drop from preceding circuitry limiting the voltage range of the input. The logic of the decoder is circuit is controlled by a word line address to determine a value of the input of the inverter during the erase operation.

Abstract: A semiconductor memory apparatus comprises first and second memory blocks each comprising semiconductor elements coupled to first and second local line groups, a first switching circuit configured to couple a first global line group to the first local line group of the first memory block in response to a block selection signal, a second switching circuit configured to couple a second global line group to the second local line groups of the first and second memory blocks in response to the block selection signal, and a third switching circuit configured to couple the first global line group to the first local line group of the second memory block in response to the block selection signal.

Abstract: Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement memory architectures configured to enhance throughput for cross point arrays including memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes arrays that include memory elements being formed BEOL above a FEOL logic layer within a boundary in a plane parallel to a substrate, and array lines. Further, the integrated circuit includes array line decoders disposed in the logic layer within a region located coextensive with the boundary and between the substrate and the arrays. In some embodiments, the disposition of peripheral circuitry, such as the array line decoders, under the arrays can preserve or optimize die efficiency for throughput enhancement.

Abstract: A memory-array decoder operably coupled to a memory array comprising a sequence of rows and receiving as input a plurality of address bits whereby these address bits are transformed by transforming logic. This transforming logic may include adders. Transforming logic may alternately include comparators or exclusive-or circuits. Transforming logic comprising adders may include overflow carry bits that are discarded, ignored, or otherwise not used or the overflow logic may be omitted altogether.

Abstract: A word line driving signal control circuit of a semiconductor memory apparatus provided with a sub-redundancy cell array includes a fuse unit configured to generate a redundancy enable signal in response to a bank active signal and an address signal, and a repair determination unit configured to activate one of a normal word line driving signal, a redundancy word line driving signal, and a sub-redundancy word line driving signal in response to the bank active signal and the redundancy enable signal.

Abstract: The present application discloses a memory circuit having a first decoder coupled to a first memory bank and configured to receive a plurality of address control signals and to generate a first plurality of cell selection signals responsive to the plurality of address control signals and a second decoder coupled to a second memory bank and configured to receive a plurality of inverted address control signals and to generate a second plurality of cell selection signals responsive to the plurality of inverted address control signals. The memory circuit also has an address control signal buffer coupled to the second decoder and configured to convert the plurality of address control signals into the plurality of inverted address control signals.

Abstract: A memory system is provided. In the system, there are first and second sets of dynamic random access memories (DRAMs) and a system register. Each DRAM has at least a first and a second addressable mode register, where the binary address of the second mode register is the inverted binary address of the first mode register. The system register has an input configured to be coupled to a controller, an output coupled to the first set of DRAMs via first address lines and an inverted output coupled to the second set of DRAMs via second address lines. The system register is configured to receive mode register set commands including address bits and configuration bits at the input and to output the mode register set commands non-inverted via the output to the first set of DRAMs and in inverted form via the inverted output to the second set of DRAMs.

Abstract: Methods, apparatuses, and integrated circuits for measuring leakage current are disclosed. In one such example method, a word line is charged to a first voltage, and a measurement node is charged to a second voltage, the second voltage being less than the first voltage. The measurement node is proportionally coupled to the word line. A voltage on the measurement node is compared with a reference voltage. A signal is generated, the signal being indicative of the comparison. Whether a leakage current of the word line is acceptable or not can be determined based on the signal.

Abstract: A semiconductor memory device includes an address controller for storing fail column addresses and sequentially outputting the fail column addresses while a first control signal is activated and a control logic for performing control so that data indicating a program pass is inputted to each of main page buffers associated with the respective fail column addresses outputted from the address controller while the first control signal is activated.

Abstract: A row decoder is disposed on a side of a memory cell array in a column direction and supplies one of word lines with a first drive signal for selecting one of memory cells. A dummy word line is formed extending in the column direction. A dummy bit line is formed extending in a row direction. At least one of the dummy word line and the dummy bit line is disposed outside of the memory cell array. The row decoder outputs a second drive signal toward a sense amplifier circuit via the dummy bit line and the dummy word line.

Abstract: Circuits and refresh address circuits for providing a refresh address, and methods for refreshing memory cells. One such method includes refreshing a first plurality of memory cells and interrupting the refreshing of the first plurality of memory cells. A second plurality of memory cells is refreshed, at least one of the second plurality of memory cells the same as one of the first plurality of memory cells. Refreshing of the first plurality of memory cells is resumed following the refreshing of the second plurality of memory cells. One such refresh address circuit includes a refresh address counter configured to provide addresses to be refreshed and a refresh address interrupt circuit configured to interrupt the provision of addresses. An alternate refresh address circuit is configured to provide an alternate address and the refresh address counter resumes providing the addresses responsive to completing the refreshing of the alternate address.

Abstract: A system includes a control chip and a plurality of command terminals receiving a plurality of command signals, respectively; a command decoder coupled to the command terminals, the command decoder being configured to output an internal command in response to the command signals; and a layer address buffer configured to output a layer address each time the command decoder outputs a row command as the internal command and outputs a column command as the internal command; and a plurality of core chips stacked with one another, each of the core chips being configured to receive the, row command and the layer address output together with the row command, to receive the column command and the layer address output together with the column command, and to free from receiving the command signals.

Abstract: A static random-access memory (SRAM) in an integrated circuit with circuitry for timing the enabling of sense amplifiers. The memory includes read/write SRAM cells, along with word-line tracking transistors arranged in one or more rows along a side of the read/write cells, and read-tracking transistors arranged in a column along a side of the read/write cells. A reference word line extends over the word-line tracking transistors, with its far end from the driver connected to pass transistors in the read-tracking transistors. The read-tracking transistors are preset to a known data state that, when accessed responsive to the reference word line, discharges a reference bit line, which in turn drives a sense amplifier enable signal.

Abstract: A semiconductor memory device includes a read circuit configured to sequentially output a plurality of compressed data corresponding to all banks which are to be tested in response to a plurality of bank addresses and a read enable signal during a test mode and a pad configured to transfer the compressed data which are sequentially outputted from the read circuit to an outside of the semiconductor memory device.

Abstract: A circuit and a method for controlling the write timing of a non-volatile memory are provided. The method includes the following steps. First, a resistance state switching of at least one memory cell of the non-volatile memory executing a writing operation is monitored to output a control signal. The memory cell stores data states with different resistance states. A write timing is input to the memory cell through a timing control line. Next, the write timing is generated based on a clock signal and the control signal. The write timing is enabled at the beginning of a cycle of the clock signal, and is disabled when the memory cell finishes the resistance state switching.

Abstract: Block-row decoders, memory block-row decoders, memories, methods for deselecting a decoder of a memory and methods of selecting a block of memory are disclosed. An example memory block-row decoder includes a plurality of block-row decoders, each of the block-row decoders having a decoder switch tree. Each block-row decoder is configured to bias a block select switch of the decoder switch tree with a first voltage while the block-row decoder is deselected and further configured to bias decoders switches of the decoder switch tree that are coupled to the block select switch with a second voltage while the block-row decoder is deselected, the second voltage less than the first voltage. An example method of deselecting a decoder of a memory includes providing decoder signals having different voltages to decoder switches from at least two different levels of a decoder switch tree while the decoder is deselected.

Abstract: Provided is a stacked semiconductor device including n stacked chips. Each chip includes “j” corresponding upper and lower electrodes, wherein j is a minimal natural number greater than or equal to n/2, and an identification code generator including a single inverter connecting one of the j first upper electrode to a corresponding one of the j lower electrodes. The upper electrodes receive a previous identification code, rotate the previous identification code by a unit of 1 bit, and invert 1 bit of the rotated previous identification code to generate a current identification code. The current identification code is applied through the j lower electrodes and corresponding TSVs to communicate the current identification code to the upper adjacent chip.

Abstract: A memory module decodes an address to determine a one or more wordline select pattern, or other spatial select pattern. An encoder determines an encoded value based upon the wordline select pattern that is compared to an expected encode value. The encode value has fewer than twice the number of address bits used to determine the wordline select pattern.

Abstract: A memory including a boost circuit configured to supply a voltage higher than a supply voltage to a word line. The boost circuit includes a first capacitor having a first capacitor dielectric thickness. The boost circuit further includes a transmission gate coupled to the word line and the first capacitor, the transmission gate having a gate-dielectric thickness that is greater than the first capacitor dielectric thickness.

Abstract: Devices and circuits for row driver architectures that can improve an existing row driver circuit including a boosting capacitor and a level shifter circuit. For example, the improvement can include a decoupling inverter that decouples the level shifter from the boosting capacitor, which can reduce the time for the row driver to turn on and drive appropriate voltages to the matrix array.

Abstract: A memory system includes a master device, such as a graphics controller or processor, and an integrated circuit memory device operable in a dual column addressing mode. The integrated circuit memory device includes an interface and column decoder to access a row of storage cells or a page in a memory bank. During a first mode of operation, a first row of storage cells in a first memory bank is accessible in response to a first column address. During a second mode of operation, a first plurality of storage cells in the first row of storage cells is accessible in response to a second column address during a column cycle time interval. A second plurality of storage cells in the first row of storage cells is accessible in response to a third column address during the column cycle time interval. The first and second pluralities of storage cells are concurrently accessible from the interface.

Abstract: Disclosed is a memory array structure, where a wordline driver selectively applies a high on-state voltage (VWLH) or a low off-state voltage (VWLL) to a wordline. VWLH has a slightly negative temperature coefficient so that it is regulated as high as the gate dielectric reliability limits allow, whereas VWLL has a substantially neutral temperature coefficient. To accomplish this, the wordline driver is coupled to one or more voltage regulation circuits. In one embodiment, the wordline driver is coupled to a single voltage regulation circuit, which incorporates a single voltage reference circuit having a single output stage that outputs multiple reference voltages. Also disclosed is a voltage reference circuit, which can be incorporated into the voltage regulation circuit of a memory array structure, as described, or, alternatively, into any other integrated circuit structure requiring voltages with different temperature coefficients. Also disclosed is a method of operating a memory array structure.

Abstract: An address decoding device may include a supply terminal for a supply voltage, a conductive path configured to provide an electric signal, associated with an address of at least one memory cell, and an address terminal connected to the conductive path and structured to receive the electric signal. An address decoder may be connected to the address terminal to receive the electric signal. The decoder may have a decoding operative voltage associated therewith. A switch circuit may be structured to electrically connect the address terminal to the supply terminal when the address terminal takes a threshold voltage imposed by the electric signal, and may bring the address terminal to the decoding operative voltage.

Abstract: A memory including a capacitor coupled to a write bit line or a word line and an initializer configured to initialize a voltage level at a first node between the capacitor and the write bit line or the word line. The memory further includes a controllable initial level adjuster configured to adjust a voltage level of a second node at one terminal of the capacitor in response to a pulse. The capacitor is configured to receive a boost signal at a third node at a terminal opposite the first node. The boost signal configured to change a voltage level of the write bit line or the word line in response to the boost signal.

Abstract: Integrated circuits with memory circuitry are provided. The memory circuitry may include rows of data line segments. Each data line segment may have associated memory cells, a programmable-strength precharge circuit, a latch circuit, a programmable-strength pull-up circuit, and a data line segment buffer. The precharge circuit may include multiple paths that can be switched into use depending on the configuration of programmable bits. The programmable-strength pull-up circuit may include multiple pull-up paths. The number of pull-up paths in use can be configured. The latch circuit may include a latch inverter that enables the programmable latch circuit during precharge operations. During a precharge period, the latch circuit can be disabled to block contending pull-down current and the data line segment buffer can be disabled to avoid crossbar currents.

Abstract: Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.