Abstract: An optical-waveguide device mounted on a fixing member having a pair of opposing upright walls and a sub-mount unit including a metallic sub-mount of a rectangular solid shape inserted between the opposing upright walls and a nonmetallic sub-mount of a rectangular solid shape mounted on the metallic sub-mount, and fixed onto a base table. The fixing member and the sub-mount unit as well as the fixing member and the base table are spot-welded together using YAG welding.

Abstract: The present invention provides an optical unit capable of suppressing a thermal influence on the optical element even if a heating source such as a laser driver is disposed near the optical element. A light pickup unit 9 of the present invention includes a beam splitter 12 and a collimate lens 13 at locations opposed to a laser driver 17. In a space 24 formed by the laser driver 17, the beam splitter 12 and the collimate lens 13, a thermal insulation sheet 18 is provided on the side of the laser driver 17, and a thermal conductive sheet 19 is provided on the side of the beam splitter 12 and the collimate lens 13.

Abstract: A driver circuit is coupled to an optical waveguide transmitter. The driver circuit has a current generator that is in series with the transmitter, and a current robbing circuit is coupled to the transmitter. The current robbing circuit is to divert first and second amounts of current from the transmitter, in accordance with predetermined values of first and second bit streams, respectively, in which data is received to be transmitted. Other embodiments are also described and claimed.

Abstract: The present invention is to provide a control algorithm of a thermo-electric cooler (TEC) for a laser diode (LD) where a rush current accompanied with the stepwise change of the target temperature of the TEC. First, the controller stops the TEC driver prior to the setting of the target temperature, and sets the present temperature of the LD. Subsequently, the controller gradually increases the reference temperature of the TEC in stepwise to the target temperature. Thus, the controller suppresses the rush current accompanied with the instantaneous increase of the reference temperature of the TEC.

Abstract: A compact mid-IR laser device utilizes a quantum cascade laser to provide mid-IR frequencies suitable for use in molecular detection by signature absorption spectra. The compact nature of the device is obtained owing to an efficient heat transfer structure, the use of a small diameter aspheric lens and a monolithic assembly structure to hold the optical elements in a fixed position relative to one another. The compact housing size may be approximately 20 cm×20 cm×20 cm or less. Efficient heat transfer is achieved using a thermoelectric cooler TEC combined with a high thermal conductivity heat spreader onto which the quantum cascade laser is thermally coupled. The heat spreader not only serves to dissipate heat and conduct same to the TEC, but also serves as an optical platform to secure the optical elements within the housing in a fixed relationship relative on one another.

Abstract: There is provided a semiconductor laser device capable of reducing stress occurring to a semiconductor laser element so that a life of the semiconductor laser device can be prolonged. In this semiconductor laser device, a solder layer 114 is absent over a first region R1 ranging to a specified length L1 in a perpendicular direction X from a center line J1 of a light-emitting region 150 toward both sides of the perpendicular direction X. That is, the first region R1 over which the light-emitting region 150 is present serves as an incomplete bonding region between the solder layer 114 of the semiconductor laser element 100 and a heat sink 200. Thus, stress given to the light-emitting region 150 due to differences in coefficient of thermal expansion among the semiconductor laser element 100, the solder layer 114 and the heat sink 200 during operation is reduced.

Abstract: The present invention aims to provide a miniaturized optical laser module that eliminates shift in contacting surfaces when contacting and fixing with adhesive two element carriers respectively holding an optical element and obtains a smooth adhesion fixation. A semiconductor laser module that has a configuration in which the element carriers respectively arranged with optical elements for laser oscillation are contacted and securely attached to each other to optically connect the optical elements and form a semiconductor laser, and externally outputs a laser light to an optical fiber arranged in advance via an optical system; where collar parts for setting contacting areas to an enlarged state when contacting the element carriers and being removably configured are integrally arranged on each element carrier on both side end faces at a contacting surface of each element carrier.

Abstract: A light source device includes a light source section for supplying a laser beam, a wavelength conversion element for converting a wavelength of the laser beam from the light source section, a temperature measuring section for measuring temperature, a temperature adjusting section for adjusting the temperature of the wavelength conversion element in accordance with a result of the measurement by the temperature measuring section, and a thermal diffusion section for diffusing heat to be conducted to the wavelength conversion element, wherein the thermal diffusion section is provided with a first surface disposed on a side of the wavelength conversion element and a second surface disposed on an opposite side to the first surface, and the temperature measuring section is provided to a part of the thermal diffusion section, which is located on a side of the second surface and has higher thermal conductivity of the thermal diffusion section between the side of the first surface and the side of the second surface t

Abstract: A laser apparatus (100) has a semiconductor laser device (12a to 12c), coolant jetting means (24), and a heatsink (18a to 18c). The semiconductor laser device has a light output surface (50) for emitting laser light. The coolant jetting means has a coolant chamber (53) for accommodating a coolant, an inflow port (54) communicating with the coolant chamber, and a jet port (25) opposing the light output surface of the laser device. The heatsink has a laser mount surface (36) for mounting the semiconductor laser device, and a flow path (68a to 68c) where the coolant (56) jetted from the jet port flows in. When the coolant chamber is fed with the coolant, the jet port jets the coolant onto the light output surface of the semiconductor laser device. Since the light output surface is directly cooled by a jet flow of the coolant, cooling efficiency is excellent.

Abstract: An active solid heatsink device and fabricating method thereof is related to a high-effective solid cooling device, where heat generated by a heat source with a small area and a high heat-generating density diffuses to a whole substrate using a heat conduction characteristic of hot electrons of a thermionic (TI) structure, and the thermionic (TI) structure and a thermo-electric (TE) structure share the substrate where the heat diffuses to. Further, the shared substrate serves as a cold end of the TE structure, and the heat diffusing to the shared substrate is pumped to another substrate of the TE structure serving as a hot end of the TE structure.

Abstract: A RF-synchronization system includes a laser that creates pulse trains for synchronization. A modulation means transfers the timing information of the pulse train into an amplitude modulation of an optical or electronic system. A synchronization module changes the driving frequency of the modulation means until it reaches a phase-locked state with the pulse train.

Abstract: A rotary disk module, having a rotary disk is interposed between a pair of heat sinks each spaced from the rotary disk by a gap. A motor is installed for driving the rotary disk to rotate. The gaps are filled with cooling medium such as helium, water or liquid nitrogen to remove the heat generated in the rotary disk by conduction, convection or evaporation. The rotary disk may be fabricated from various materials depending on the intended applications of the module, and the heat sink surfaces are preferably fabricated from materials with higher thermal conductivity. The rotation of the rotary disk allows the regions on which an optical pump radiation is delivered to be separated from the regions from which an optical radiation is extracted. In addition to improved heat dissipation effect, the rotation of the optical disk allows multiple directions of pump energy or multiple sources of pump energies and/or multiple beams of optical radiation to be applied and extracted simultaneously.

Abstract: In a semiconductor lasers using quantum well gain medium, a quantum well stack is mounted in an epi-down configuration. The epitaxial side of the device may be directly bonded to an efficient heat transport system so that heat may more easily leave the quantum well stack layers and be disposed at a heatsink. Such a device runs cooler and exhibits reduced loss mechanisms as represented by a laser system loss-line. External cavity systems using this configuration may permit a high degree of tunability, and these systems are particularly improved as the tuning range is extended by lowered cavity losses.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: A mounting improvement for the solid state laser bars used for example to pump high power lasers is provided. Solid state laser bars are mounted in side by side relationship and combined with integrated substrate and laser output directing optical elements on a disclosed Integrated Diamond Carrier. The Integrated Diamond Carrier is preferably fabricated as an essentially freestanding base plate of diamond composition with incorporated arrays of mesa structures providing mounting for the laser bars and providing integral laser output directing optical elements such as mirrored prisms. Integrated diamond carriers according to the invention provide stable positioning, desirable thermal conductivity and consistent low temperature operation for the solid state lasers.

Abstract: A laser package has at least one laser device and a hermetically sealed package including a package base and a cap having a light transmissive window for emitting light. The at least one laser device is placed in the package and fixed onto the package base. Further, a plurality of lead pins including a lead pin for supplying drive current to the laser device projects from the package base. Further, surface insulating processing has been performed on a projecting portion of at least one of the lead pins. The projecting portion is a portion which projects from the package base to the outside of the laser base.

Abstract: An optical module includes a laser device, a thermal conduction member, a Peltier device disposed between the laser device and the thermal conduction member, a heat radiation part, and a variable thermal-resistance device disposed between the thermal conduction member and the heat radiation part, the variable thermal-resistance device changing a thermal resistance between the thermal conduction member and the heat radiation part according to an ambient temperature.

Abstract: A surface emitting semiconductor laser device comprising at least one surface emitting semiconductor laser (21) having a vertical emitter (1) and at least one pump radiation source (2), which are monolithically integrated alongside one another onto a common substrate (13), is described. The semiconductor laser device additionally has a heat-conducting element (18), which is in thermal contact with the semiconductor laser (21) and has a mounting area provided for mounting on a carrier (27). Methods for producing such a surface emitting semiconductor laser device are furthermore described.

Abstract: A laser arrangement has at least one laser diode apparatus with a side surface which laterally limits the laser diode apparatus. The laser arrangement has a plurality of active regions arranged laterally side by side and configured to generate radiation. The laser diode apparatus is arranged on a mount. The distance between the side surface and an edge which laterally limits the mount on the part of the side surface is shorter than the distance between the side surface and the active region closest to the side surface. Additionally or alternatively, the distance between the side surface and the edge is shorter than one of the distances between two adjacent active regions of the laser diode apparatus.

Abstract: A laser transmitter within an optical transceiver includes a heating element. The heating element is coup led to the laser package and is controlled to allow the laser to be heated to a higher temperature than the ambient temperature when low environmental temperature extremes occur. The transmitter includes a semiconductor laser having an optimal operational temperature range, a laser driver circuit coupled to the laser that provides a modulation current and a bias current to drive the laser, a heating element thermally coupled to the laser and a heating control circuit that monitors the bias current applied to the laser for drops in bias current that are indicative of drops in the surrounding ambient temperature. In response to a drop in bias current, the control circuitry energizes the heating element to provide heat to the laser.

Abstract: Arrangements for combination and fast-axis alignment of fast-axes of diode-laser beams are disclosed. Alignment arrangements include providing each diode-laser with a corresponding alignable fast-axis collimating lens, providing individually alignable mirrors for steering an re-orienting beams from each diode-laser, and providing single diode-laser slab-modules in which the diode-laser beams can be pre-aligned to a common propagation-axis direction, and in which edges and surfaces of the slabs can be used to align the fast and slow-axes of the beams. Beam combination methods include combination by dichroic elements, polarization-sensitive elements, and optical fiber bundles.

Abstract: The present invention provides a semiconductor laser package including a heat sink, a laser bar with a plurality of lasers on the heat sink, an insulated layer arranged between said heat sink and said laser bar, a solder layer combining said insulated layer with said laser bar, and a clearance crossing said solder layer defined between adjacent lasers.

Abstract: This invention relates to a semiconductor laser apparatus having a structure to prevent corrosion in a refrigerant flow path of a heat sink and cool stably a semiconductor laser array over a long period. The semiconductor laser apparatus has a semiconductor laser stack, a refrigerant supplier, an insulating piping, and a refrigerant. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. The insulating piping is an insulating piping with flexibility. An grounded conductive material is arranged inside the insulating piping. The conductive material operates to remove static electricity generated where the refrigerant flows inside the insulating piping.

Abstract: A semiconductor laser device includes a first lead having a plate-like mounting portion on which a semiconductor laser chip is mounted and a lead portion extending from the mounting portion, a second lead extending along the lead portion of the first lead, and a retention portion made of an insulative material that integrally retains the first lead and the second lead. The mounting portion of the first lead has a back surface exposed from the retention portion, and the first lead further has a tie bar portion projecting from the mounting portion along the back surface of the mounting portion.

Abstract: A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.

Abstract: A semiconductor laser diode device comprises a semiconductor laser diode, a primary lead having a sub-mount for mounting the semiconductor laser diode, at least one secondary lead electrically insulated from the primary lead, a first resin member for integrally fixing the primary lead and the secondary lead while insulating the primary lead from the secondary lead, and a second resin member having an emitting opening through which laser beams generated by the semiconductor laser diode are emitted to the outside, and surrounding the primary lead and the first resin member so as to dissipate heat transferred to the primary lead and the first resin member to the outside.

Abstract: A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.

Abstract: A red laser portion and an infrared laser portion are integrated on an n-type GaAs substrate. A p-type cladding layer made of p-type AlGaInP in the red laser portion and a p-type cladding layer made of p-type AlGaInP in the infrared laser portion have a ridge stripe portion having a light emitting point. A current block layer made of SiNx is formed on both sides of each ridge stripe portion, and a strain relaxing layer made of ZrO2 is selectively formed on an outer side of each ridge stripe region on the current block layer. Provided that Tc is a thermal expansion coefficient of the p-type cladding layers, Tb is a thermal expansion coefficient of the current block layer, and Ts is a thermal expansion coefficient of the strain relaxing layer, the relation of Tb<Tc<Ts is satisfied.

Abstract: A method and system is disclosed for making timing alignment for a data transmission system, the method comprising providing a reference clock signal with a first frequency to a multiplexer through a phase shifter, generating a multiplexed signal with a second frequency by the multiplexer, wherein the second frequency follows the first frequency and is higher than the first frequency by a predetermined proportion, sending the multiplexed signal to a modulator, and phase shifting the reference clock signal by the phase shifter before the reference clock signal is provided to the multiplexer, wherein a timing of the multiplexed signal at the second frequency level can be adjusted by adjusting a timing of the reference clock signal at the lower first frequency level.

Abstract: An optical transmitter has a case. The case houses a laser beam generator, a lens, a cooler, and a high heat conductivity member. The lens concentrates the laser beam generated by the laser beam generator and leads the laser beam to an optical fiber. The high heat conductivity member is arranged between the laser beam generator and the lens and the cooler. The laser beam generator has higher heat conductivity than that of the case. The laser beam generator conveys the heat generated in the laser beam generator to the cooler.

Abstract: A structure of a projector engine section includes: an engine section that projects through a projector lens an optical image formed by modulating a light flux depending on image information; a circuit board that has a digital mirror device control circuit and attached to the engine section; a heat sink that faces the circuit board so as to prevent a heat generation due to the fullness of heat in the engine section; and a gasket plate that is made of a sheet metal and is inserted into the space between the circuit board and the heat sink, such that the gasket plate elastically contacts with a ground pattern of the circuit board and the heat sink.

Abstract: An automatic bias controller for an optical modulator is provided. The automatic bias controller comprises a driver for providing an electrical data signal to the modulator and a bias voltage source for providing a bias voltage to the modulator. A microprocessor provides a low frequency digital modulation signal, which is converted to an analogue modulation signal by a digital to analogue converter. The analogue modulation signal is applied to the bias voltage source (so as to modulate the bias voltage) or to the driver (so as to modulate the amplitude of the data signal). Intensity detectors for detecting the intensity of light emitted by the modulator are provided, and an analogue to digital converter converts the output of the intensity detectors to a digital intensity signal which is passed to the microprocessor. The digital intensity signal is analysed, and the bias voltage source instructed to adjust the bias voltage on the basis of the analysed signal.

Abstract: An optical assembly with mounting provided to effectively transfer heat away from an optic, such as a slab or waveguide amplifier or laser disk, while limiting internal stresses. The assembly includes an optic with a planar surface. A heat sink is positioned in the assembly with an upper surface next to the planar surface of the optic. The upper surface of the heat sink comprises a recessed surface defining a reservoir for containing a compliant heat transfer material. The assembly may further include a volume of the heat transfer material, such as a liquid metal or thermally conductive gel, in the reservoir of the heat sink. In one embodiment, the optic is a slab amplifier with a reflective coating or layer that directly contacts the heat transfer material in the heat sink reservoir or a foil or membrane is provided between the heat transfer material and the slab.

Abstract: Provided are a multilayer board and a light-emitting module having the same. The light-emitting module comprises a light-emitting diode chip and a multilayer board. The multilayer board is electrically connected to the light-emitting diode chip and comprises a nonconductive heat sink via and a thin copper layer.

Abstract: A high-power optically end-pumped external-cavity semiconductor laser is provided having a laser chip including an active layer and a distributed Bragg reflector (DBR) for emitting light of a fundamental wavelength; an external mirror spaced apart from a first surface of the laser chip and forming a cavity resonator with the DBR; a second harmonic generation (SHG) crystal positioned between the external mirror and the laser chip; and a micro-lens integrated heat sink dissipating heat generated by the laser chip and bonded to a second surface of the laser chip to focus a pumping beam to be incident on the second surface of the laser chip.

Abstract: A hand-held laser device includes a casing formed with a substantially hollow interior space and having a laser emitter thereinside. The laser emitter is formed with an exciting lamp and a laser rod. A source generating a stream of gaseous coolant is provided within the interior space. A fluid cooling arrangement at least partially surrounding the laser rod is disposed within the stream of gaseous coolant for heat removal therefrom.

Abstract: The present invention relates to an analog transmitter using an external cavity laser (ECL) in which specific characteristics of the ECL are enhanced and exploited to improve 2nd and 3rd order distortion while increasing the threshold for the occurrence of deleterious stimulated Brillouin scattering (SBS). The performance of the ECL shows a substantial reduction in distortion occurring over certain narrow ranges of operating temperatures. Optical, electronic, thermal and/or mechanical methods are described that cause this “distortion dip” to be moved to, or created at, stable regions of ECL operation, away from mode hops. Methods are also described that allow the distortion dip to be moved to, or created at, ECL operating regions in which sufficiently high chirp occurs, thereby reducing SBS. Transmitters and other devices employing these and related techniques are also described.

Abstract: The present invention relates to a semiconductor laser apparatus having a structure for preventing the corrosion of a refrigerant flow path in a heat sink and for cooling a semiconductor laser array stably over a long period of time. The semiconductor laser apparatus comprises a semiconductor laser stack in which a plurality of semiconductor laser units are stacked, a refrigerant supplier, a piping for connecting these components, and a refrigerant flowing through these components. The refrigerant supplier supplies the refrigerant to the semiconductor laser stack. The refrigerant is comprised of fluorocarbon. Each of the semiconductor laser units is constituted by a pair of a semiconductor laser array and a heat sink. The heat sink has a refrigerant flow path.

Abstract: A novel approach for providing temperature compensation for semiconductor lasers is disclosed. This approach utilizes reflectivity characteristics in the at least one of the mirrors of the semiconductor laser to provide temperature compensation to the device.

Abstract: A semiconductor laser device including an edge-emitting type laser chip having at least three emitting points in one light emitting edge, a sub-mount mounted with the laser chip, and a heat sink bonded to the sub-mount through a solder layer. When R designates a linear expansion coefficient ratio of the heat sink to the sub-mount and D designates a distance between light emitting points at opposite ends in the light emitting edge of the laser chip, materials of the sub-mount and the heat sink and the distance D are set to satisfy the following relation: D?5.48×R?2.13 A difference between stress acting on one laser element and another in the laser chip due to shrinkage of the heat sink when melted solder is cooled down is reduced so that a difference in light output characteristics between one light emitting point and another can be reduced.

Abstract: A method for a fiber optic device to conserve power includes turning off components in the fiber optic device and turning them back on when a detection signal is at a specified level. A method for a laser system to adjust a threshold level for signal detection includes generating a digital gain signal, amplifying at least one data signal with a gain based on the gain signal, comparing the at least one amplified data signal with a reference signal, and generating a signal based on the comparison. A method for a laser system to set error warnings includes receiving control bits that indicate if a host desires to be notified of certain error conditions and generating at least one signal based on the control bits to indicate at least one error condition.

Abstract: The present invention provides an optical transmitter that prevent the overshoot and undershoot appeared in the emission wavelength caused by the fluctuation of the temperature of the laser diode installed therein. The optical transmitter includes a TEC driver, and a master controller. The TEC driver, by comparing the monitored temperature with the target temperature, outputs the error signal to the master controller, which enables the LD-Driver only when the error signal continuously stays within a convergent range by a preset period.

Abstract: The present invention discloses a laser amplifier with high gain and low thermally induced optical aberrations on the amplified laser beam. The amplifier designs allow simple multipass configurations to optimally extract the gain and reduce thermally induced index of refraction aberrations, making it possible to obtain an amplified laser beam of high quality combined with very high overall gains comparable to those achievable with expensive regenerative amplifiers. The amplifier includes a thin active laser solid to create the population inversion and associated heat generation within the thin laser active solid possible for the desired gain value. The system includes a cooling device in thermal contact with the thin active laser solid to provide good heat transport and high reflectivity coatings at the wavelengths of the pump and laser wavelengths. The pump light sources are laser diodes tuned to the maximum absorption of the laser active material.

Abstract: A compact mid-IR laser device utilizes an external cavity to tune the laser. The external cavity may employ a Littrow or Littman cavity arrangement. In the Littrow cavity arrangement, a filter, such as a grating, is rotated to provide wavelength gain medium selectivity. In the Littman cavity arrangement, a reflector is rotated to provide tuning. A quantum cascade laser gain medium provides mid-IR frequencies suitable for use in molecular detection by signature absorption spectra. The compact nature of the device is obtained owing to an efficient heat transfer structure, the use of a small diameter aspheric lens for both the output lens and the external cavity lens and a monolithic assembly structure to hold the optical elements in a fixed position relative to one another. The compact housing size may be approximately 20 cm×20 cm×20 cm or less.

Abstract: There is provided an end-pumped vertical external cavity surface emitting laser (VECSEL) in which a pump laser beam is incident on a laser chip at a right angle. In the external cavity surface emitting laser, a laser chip package is provided with a laser chip emitting light at a first wavelength by optical pumping, an external mirror is spaced apart from a top surface of the laser chip package to transmit a portion of the light emitted from the laser chip to the outside and to reflect the remainder to the laser chip, a heat sink is coupled to the bottom surface of the laser chip package to discharge heat generated by the laser chip, and a pump laser faces a bottom surface of the heat sink to emit pump light at a second wavelength perpendicular to the laser chip.

Abstract: In a semiconductor laser device, in a case where an emission direction of a laser beam from a semiconductor laser element portion is a front side, a first front end of a first lead is arranged rearward beyond a first rear end of a second heatsink, and a second surface portion of the second heatsink electrically connected to the semiconductor laser element portion is electrically connected to the first front end.

Abstract: A transmitter (11) emits a single wavelength optical signal and transmits this as a wavelength channel (13) in a compound multiplex signal through the WDM network. The receiver (12) selects the single wavelength optical signal (21) from the compound multiplex signal using a band-pass filter. A wavelength fit detector (15) determines a feedback signal by correlating variations of the amplitude of the received signal with variations of the traffic density. This feedback signal is then returned to the transmitter (11) via a back channel (16) and serves to tune the wavelength of the single wavelength optical signal.

Abstract: The present invention relates to a semiconductor laser apparatus having a metal body which efficiently cools a semiconductor laser element, in which joining of copper-made members coated with DLC layers and prevention of corrosion in the vicinity of joined portions are possible. The semiconductor laser apparatus has a metal body as a heat sink for cooling the semiconductor laser element. The metal body is constituted by a plurality of copper-made members, and the surfaces of each copper-made members are continuously coated with a diamond carbon layer except for regions corresponding to an exposed region in which the semiconductor laser element is mounted.

Abstract: A circuit board structure with optoelectronic component embedded therein comprises a carrier board with at least two through openings; a first optoelectronic component and a second optoelectronic component disposed in the openings respectively, wherein a plurality of electrode pads and optical active areas are formed on the active surfaces of the optoelectronic components; a dielectric layer formed on a surface of the carrier board and the active surface of the optoelectronic components, wherein a plurality of vias for exposing the electrode pads and two holes for exposing the optical active areas are formed in the dielectric layer; a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads of the optoelectronic components; an insulating protecting layer formed on the dielectric layer and the circuit layer; and at least one optical transmission element formed on a surface of the insulating protecting layer.

Abstract: A laser diode system is disclosed in which a substrate made of a semiconductor material containing laser diodes is bonded to a substrate made from a metallic material without the use of any intermediate joining or soldering layers between the two substrates. The metal substrate acts as an electrode and/or heat sink for the laser diode semiconductor substrate. Microchannels may be included in the metal substrate to allow coolant fluid to pass through, thereby facilitating the removal of heat from the laser diode substrate. A second metal substrate including cooling fluid microchannels may also be bonded to the laser diode substrate to provide greater heat transfer from the laser diode substrate. The bonding of the substrates at low temperatures, combined with modifications to the substrate surfaces, enables the realization of a low electrical resistance interface and a low thermal resistance interface between the bonded substrates.