Abstract: A method for determining heat and/or energy loss from a building using a thermographic image of the building, the image of the building being captured at a pre-determined angle, preferably perpendicular to the building, the method comprising analyzing automatically the image to determine the temperature of areas of the image, determining the real size of the scene associated with the image areas that are above a pre-determined temperature and using this to determine heat and/or energy loss from the building.

Abstract: In one aspect, the present invention provides techniques and apparatus for optical characterization of photonic devices and/or circuits. By way of example, the techniques can be used to identify damaged devices in photonic integrated circuits. In some embodiments, thermal imaging is employed as a diagnostic tool for characterizing the devices/circuits under investigation. For example, in one embodiment, integrated cascaded semiconductor amplifiers can be characterized using amplified spontaneous emission from one amplifier as a thermal modulation input to another amplifier. A thermoreflectance image of the second amplifier can reveal flaws, if present. Further, in some embodiments, thermal imaging in conjunction with a total energy model can be employed to characterize the elements of photonic circuits optically and/or to map the optical power distribution throughout the circuits.

Abstract: Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.

Abstract: An apparatus for determining a temperature of an object without contacting the object. An etalon filter may be used to receive spectral radiation of the object over a plurality of wavelengths and to generate a spectral output signal. A linear array detector may be used that is responsive to the spectral output signal from the etalon filter and adapted to generate an output indicative of the spectral radiation at each of one of the plurality of wavelengths. An actuator may be used that controls movement of one element of the etalon filter to assist in generating the output. A processor may be used which is responsive to the output of the linear array detector and which analyzes a known characteristic of a black body at a plurality of test temperatures, against the output of the linear array detector, to determine a specific temperature of the object.

Abstract: There is provided a lighting apparatus that is capable of accurately measuring the temperature of an optical member that transmits therethrough light emitted from a light source without blocking the optical path of the light.

Abstract: To provide a fluorescent temperature sensor capable of identifying easily the location of a failure. A fluorescent temperature sensor for producing a temperature signal from fluorescent light from a fluorescent material and that has been optically stimulated comprises a light projecting module having an LED for projecting light at the fluorescent material and a second photodiode for receiving light emitted from the LED and a light receiving module having a first photodiode for receiving the light emitted from the fluorescent material, where the location of a failure in the sensor can be identified based on, at least, the output signal from the second photodiode.

Abstract: Methods are provided for using a programmable hand-held inspection system to direct an inspection process. Methods typically involve loading a survey template application software routine into the programmable hand-held inspection system where the survey template application software routine describes at least one aspect of the inspection process. Some embodiments involve wirelessly uploading at least a portion of the survey template application software routine. Generally an image representation of an area is provided on a display. The system may be used to guide an operator through at least one aspect of the inspection process or to perform steps in a survey. A location within the vicinity of the area may be identified using a global positioning system. A record may of the survey may be created.

Abstract: A system and method is disclosed for acquiring temperature data from a plurality of features in a chamber including capturing a first image of an interior area of the chamber, capturing a second image of the interior area of the chamber, identifying a plurality of features within the data for the first image and the data for the second image, generating an interior area representation based on the first image data, the second image data, and the identification of each feature of the plurality of features in the interior area, and correlating the interior area representation to temperature information related to the interior area.

Abstract: A non-contact measurement device includes two or more detectors for sensing scene data from corresponding measurement zones within a target scene. Devices further include an optical system for imaging scene data from the target scene onto the detectors. The optical system is configured to provide a different optical profile for each detector, such that the device can be used to provide a best-fit optical profile for a variety of non-contact applications.

Abstract: Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.

Abstract: Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.

Abstract: A system includes a radiation detector array directed toward a fluid flow into a compressor. The radiation detector array is configured to output a signal indicative of a two-dimensional temperature profile of the fluid flow. The system also includes a controller communicatively coupled to the radiation detector array. The controller is configured to detect a temperature variation across the fluid flow based on the signal.

Abstract: Thermographic imaging equipment is incorporated directly into cabinets housing electrical switchgear to provide for dedicated, nearly continuous monitoring of the contained equipment. A mechanical scanning technique may allow low-cost sensors to provide essentially continuous thermographic monitoring. Dedicated thermal imaging equipment allows automatic analysis through predefined temperature threshold maps.

Abstract: The invention concerns an equipment for non-contact temperature measurement (1) of samples of materials (2) arranged in a vacuum chamber (12). A UV lamp (6) illuminates the samples (2) through a window (4), so as to subject them to a predetermined thermal cycle and to perform an environmental test, in particular for materials designed for space missions. An external pyrometer measures the temperature of the samples (2) through a window (6). It is associated with a scanning module (9) including a mobile mirror, with two axes of rotation and three orthogonal axes of translation, arranged on the optical path of the infrared radiation (Rir) so as to obtain a two-dimensional scanning of each sample (2) by means of a measuring spot focused on the surface of the samples. In a preferred embodiment, the samples are of slight thickness and locked pressed against a convex support. The whole assembly is monitored by an automatic data processing system with recorded program (10).

Abstract: In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.

Abstract: A sensing system simultaneously obtains images and surface temperatures of processing tubes inside process heaters using an imaging sensor operating in the visible or infrared regions of the spectrum and capable of detecting visible or infrared radiation emitted or reflected from surfaces within the process heater, and of providing an image signal to a display or to an image processor. One or more single element infrared detectors viewing specific regions within the aforesaid image accurately measure the intensity of radiation emitted by surfaces within those specific regions so as to allow the temperature of the surfaces within those specific regions to be inferred.

Abstract: Methods for maximum scene surface temperature estimation for blades with reflective surface properties in advanced stationary gas turbines are disclosed. The approach utilizes high speed infrared imagery provided by an online monitor system using a focal plan array (FPA) for near-infrared monitoring during engine runtime up to base load. The one waveband method for temperature estimation is assumed as starting point. A lower surface emissivity and higher surface reflectance of thermal barrier coating (TBC) in near-infrared can cause systematic estimation errors. Methods using the one wave band method, with the purpose to reduce estimation errors for maximum temperatures are also disclosed. Theoretical results, data from numerical simulations, and real data from engine test are provided. A system for performing temperature estimation methods is also disclosed.

Abstract: Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

Abstract: A method of measuring the temperature of a sheet material in which the sheet material is arranged such that it forms at least one side of a cavity so as to enhance the effective emissivity of the sheet material in the vicinity of the cavity.

Abstract: A system and method is disclosed for acquiring temperature data from a plurality of features in a chamber including capturing a first image of an interior area of the chamber, capturing a second image of the interior area of the chamber, identifying a plurality of features within the data for the first image and the data for the second image, generating an interior area representation based on the first image data, the second image data, and the identification of each feature of the plurality of features in the interior area, and correlating the interior area representation to temperature information related to the interior area.

Abstract: The invention is an optical method and apparatus for measuring the temperature of semiconductor substrates in real-time, during thin film growth and wafer processing. Utilizing the nearly linear dependence of the interband optical absorption edge on temperature, the present method and apparatus result in highly accurate measurement of the absorption edge in diffuse reflectance and transmission geometry, in real time, with sufficient accuracy and sensitivity to enable closed loop temperature control of wafers during film growth and processing. The apparatus operates across a wide range of temperatures covering all of the required range for common semiconductor substrates.

Abstract: A thermal detecting device for sensing temperature at multiple locations proximate to the detecting device is provided. The detecting device has a pair of infrared detectors each configured to measure temperature of two locations by receiving infrared energy of the two locations. A housing encloses the pair of infrared detectors. The housing is configured with an aperture to allow the infrared energy of the two locations to be received by the pair of infrared detectors. A reflective mirror or two mirrors focus the infrared energy of the two locations towards the pair of infrared detectors. The detecting device may be configured to determine if there is a temperature differential at a location as the housing moves with respect to the location.

Abstract: A system for curing a binders applied to glass fibers is disclosed. The curing of the binder is accomplished by passing the binder coated glass fibers through a curing oven having one or more temperature zones. The temperature of the binder coated glass fibers is monitored and the temperature in the curing oven is adjusted to ensure proper heating of the glass fibers thereby ensuring uniform curing of the binder composition. Temperature measurements are made either as the product traverses the oven or as the cured product exits the curing oven. The invention is particularly useful for curing acrylic thermoset binders and formaldehyde-free binders.

Abstract: A method of sensing the temperature of a heated object includes obtaining past temperature data relating to the heated object, capturing a thermal image of the heated object, obtaining a reference temperature of the heated object, and calculating a normalized hotspot temperature.

Abstract: Provided is an apparatus for substrate processing. The apparatus may include a radiation source emitting a photonic beam, an optical system to form a beam image, a scanning stage, a temperature monitoring means, an output signal generator that compares the monitored temperature with a preset temperature, and a controller coupled to the radiation source and the stage. The stage may be adapted to scan the substrate so the beam image heats a region of the substrate surface, and the temperature monitoring means may collect and analyzes p-polarized radiation of at least three different spectral regions emitted from one or more places on the heated substrate region. The controller in response to a temperature error signal may be programmed to alter the beam intensity and/or to provide changes in the scanning velocity between the stage and the beam. Other apparatuses and temperature monitoring systems are provided as well.

Abstract: A mechanism of a monitoring unit of an electric rotating machinery covered in a housing that intercepts photoelectron transmission, the mechanism has: a monitoring window penetrating a part of the housing and configured to allow passage of photoelectrons and not to allow passage of gas; a camera arranged outside the monitoring window and configured to receive radiated photoelectron generated in the housing and passing through the monitoring window and to generate image data from the radiated photoelectron; and a computing unit configured to process the image data. The computing unit has reference image data storage means for storing image data resulting from blackbody radiation occurring in a reference state in the housing, as reference image data, and temperature calculating means for comparing the image data with the reference image data, thereby to calculate the temperature in the housing.

Abstract: Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.

Abstract: A thermal processing system includes a source of laser radiation emitting at a laser wavelength, beam projection optics disposed between the reflective surface and a substrate support capable of holding a substrate to be processed, a pyrometer responsive to a pyrometer wavelength, and a wavelength responsive optical element having a first optical path for light in a first wavelength range including the laser wavelength, the first optical path being between the source of laser radiation and the beam projection optics, and a second optical path for light in a second wavelength range including the pyrometer wavelength, the second optical path being between the beam projection optics and the pyrometer. The system can further include a pyrometer wavelength blocking filter between the source of laser radiation and the wavelength responsive optical element.

Abstract: A process for using a hand-held infrared inspection system incorporating on-board training, on-board validation, on-board operator certification, on-board reporting information, or on-board survey instructions. Improved methods for automating area surveys are provided through exception-driven surveillance practices. Imbedded information enables less experienced operators to use more sophisticated devices more effectively. Validation or certification assures operator knowledge or ability. Multilevel classification of anomalies aids in automated analysis and report generation.

Abstract: A method for processing thermographic data is disclosed including thermally disturbing a sample collecting, as a function of time, thermal data from said sample, converting the collected data using a 2nd derivative function, and transforming the converted data using at least one Boolean operation.

Abstract: An apparatus for predicting a thermal state of a system including a semiconductor chip includes a plurality of sensors formed on the semiconductor chip for measuring a temperature at first locations of the semiconductor chip, a model developer for developing a model for estimating a temperature at second locations of the semiconductor chip which are other than the first locations, a mapping unit for mapping an instruction cache associated with the chip into a sequence of X-Y distributed quanta of heat packets, and a predicting unit for predicting a future temperature of the chip based on an execution of an instruction stream in the instruction cache.

Abstract: The invention concerns a method for the indirect determination of local irradiance in an optical system; wherein the optical system comprises optical elements between which an illuminated beam path is formed and a measurement object which absorbs the radiation in the beam path at least partially is positioned in a partial region of the beam path selected for the locally-resolved determination of the irradiance and the temperature distribution of at least one part of the measurement object is determined by means of a temperature detector.

Abstract: A non-contact measurement device includes two or more detectors for sensing scene data from corresponding measurement zones within a target scene. Devices further include an optical system for imaging scene data from the target scene onto the detectors. The optical system is configured to provide a different optical profile for each detector, such that the device can be used to provide a best-fit optical profile for a variety of non-contact applications.

Abstract: A thermal measurement system includes a number of detectors configured to receive radiation within respective wavelength ranges. The system also includes a mirror configured to selectively direct the radiation from an object to each of the detectors. The system further includes an actuator mechanically coupled to the mirror and configured to rotate the mirror through a number of angles. The system also includes an optical and probe subsystem disposed between the object and the mirror to focus the radiation on to the mirror.

Abstract: In one embodiment, the invention is a method and apparatus for dynamic measurement of across-chip temperatures. One embodiment of a method for measuring temperatures across an integrated circuit chip includes generating a plurality of surface images of the integrated circuit chip, deriving power values across the integrated circuit chip from the surface images, computing the temperatures across the integrated circuit chip in accordance with the power values, and outputting the temperatures.

Abstract: Method and apparatus for monitoring formation of deposits of solid particles from flue gas onto furnace walls formed of welded-together tubes through which cooling medium flows. For the entire surface of the walls, the exact surface temperature is detected with infrared cameras, offset by 90° relative to one another, via a thermal image obtained of a surface development of the furnace. This exact surface temperature is compared with the temperature of the cooling medium from measurement locations. Individual images from the cameras are composed to form an overall development of the inner surface of the furnace walls. The coordinates of the deposits on the walls are determined from the overall development, and the thickness of the deposits is determined from the temperature comparison.

Abstract: A temperature monitor for monitoring plural locations on an electrical bus structure. The temperature monitor includes an infrared sensor for receiving infrared energy from a plurality of discrete predetermined locations on the bus structure, a first member defining a stationary first mask, a second member defining a rotating second mask, and a drive member driving the second member in rotation relative to the first member. Rotation of the second member relative to the first member defines an aperture translated across the first mask member to provide a moving line-of-sight that extends from the sensor and that scans to each of the discrete predetermined locations on the bus structure.

Abstract: Method and apparatus are provided for detecting a defect in a cold plate, configured for cooling an electronics component. The method includes: establishing a first fluid flow through the cold plate, the first fluid flow being at a first temperature; impinging a second fluid flow onto the interface surface, the second fluid flow being at a second temperature, the first temperature and the second temperature being different temperatures; obtaining an isotherm mapping of the interface surface of the cold plate while the first fluid flow passes through the cold plate and the second fluid flow impinges onto the interface surface; and using the isotherm mapping to determine whether the cold plate has a defect. In one embodiment, an infrared-transparent manifold is employed in impinging the second fluid flow onto the interface surface, and the isotherm mapping of the interface surface is obtained through the infrared-transparent manifold.

Abstract: The invention provides an apparatus and method for detecting flaws in an object. The method includes the step of heating a portion of a surface of an object wherein the surface is defined by a plurality of individual surface elements. The method also includes the step of recording a plurality of thermal images of the portion over time with a thermal imaging device. Each of the plurality of thermal images is defined by a plurality of pixels. Each of the plurality of pixels has an individual pixel address and corresponds to one of the plurality of individual surface elements. The method also includes the step of determining a pixel intensity for each of the plurality pixels in each of the plurality of thermal images. The method also includes the step of integrating the pixel intensity of each of the plurality of pixels having the same individual address from respective thermal images to establish elements within an array of integrated pixel intensity.

Abstract: The present invention discloses a temperature vector analyzer, which comprises the following elements: a temperature detection device further comprising a plurality of infrared sensors; a temperature-vector display panel; a microprocessor receiving infrared-radiating heat source temperatures detected by the plurality of infrared sensors, calculating the vector components of the infrared-radiating heat source temperatures to attain a center-originating temperature vector, and presenting the temperature vector on the temperature-vector display panel; and a power source providing power for the temperature detection device, the temperature-vector display panel, and the microprocessor. The present invention can apply to detect a local heat origin or a local heat-dissipating point.

Abstract: Method and apparatus for monitoring formation of deposits of solid particles from flue gas onto furnace walls formed of welded-together tubes through which cooling medium flows. For the entire surface of the walls, the exact surface temperature is detected with infrared cameras, offset by 90° relative to one another, via a thermal image obtained of a surface development of the furnace. This exact surface temperature is compared with the temperature of the cooling medium from measurement locations. Individual images from the cameras are composed to form an overall development of the inner surface of the furnace walls. The coordinates of the deposits on the walls are determined from the overall development, and the thickness of the deposits is determined from the temperature comparison.

Abstract: A process for using a hand-held infrared inspection system incorporating on-board training, on-board validation, on-board operator certification, on-board reporting information, or on-board survey instructions. Improved methods for automating area surveys are provided through exception-driven surveillance practices. Imbedded information enables less experienced operators to use more sophisticated devices more effectively. Validation or certification assures operator knowledge or ability. Multilevel classification of anomalies aids in automated analysis and report generation.

Abstract: A method for recalibrating a bilateral thermal scanner comprising a first thermal sensor and a second thermal sensor can comprise acquiring a first set of thermal scanning data with the thermal sensors in their normal positions; optionally analyzing the first set of thermal scanning data is analyzed to determine if the data has a one-sided bias; acquiring a second set of thermal scanning data with the positions of the thermal sensors reversed; determining a calibration from the first and second sets of thermal scanning data; and optionally correcting at least one of the first and/or second set of thermal scanning data using the calibration.

Abstract: A thermal processing system includes a source of laser radiation emitting at a laser wavelength, beam projection optics disposed between the reflective surface and a substrate support capable of holding a substrate to be processed, a pyrometer responsive to a pyrometer wavelength, and a wavelength responsive optical element having a first optical path for light in a first wavelength range including the laser wavelength, the first optical path being between the source of laser radiation and the beam projection optics, and a second optical path for light in a second wavelength range including the pyrometer wavelength, the second optical path being between the beam projection optics and the pyrometer. The system can further include a pyrometer wavelength blocking filter between the source of laser radiation and the wavelength responsive optical element.

Abstract: A method of detecting subsurface anomalies that includes the steps of utilizing a detector to determine the existence of a subsurface anomaly at a location behind the surface, and generating a signal representative of the anomaly. The signal is transmitted to a projector mounted in image alignment with the detector. The signal is converted into a visual representation of the anomaly; and the visual representation of the anomaly is projected onto the surface at the location on the surface behind which the subsurface anomaly is present. An apparatus for carrying out the method is also disclosed.

Abstract: The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.

Abstract: A cooking device containing a housing with a cooking chamber and a door to close off the cooking chamber and at least one control and display panel with an optical luminous display. The control and display panel can display the different operation modes of the cooking chamber and the on and/or off modes of the cooking chamber.

Abstract: A hot melt adhesive sensing system and method including detecting (410) multiple areas of a target, for example, a hot adhesive material, by sensing changes in temperature with a corresponding number of thermal sensors, summing (420) an output of the thermal sensors, and evaluating (430) the summed output by comparing the summed output with a reference, the results of which may be assessed relative to a specified tolerance.

Abstract: A humidity meter with non-contact temperature measurement capability, including a humidity meter contained at least partially in a housing and having outputs relating to measured humidity parameters including humidity and ambient temperature, an output display contained in the housing, for displaying measurements to a user, a non-contact optically-based temperature sensing device coupled to the housing, having an output related to sensed temperature, and circuitry contained in the housing for processing both the humidity meter outputs and the temperature sensing device output, and transmitting the processed output to the output display.

Abstract: A temperature monitoring system includes a device for monitoring temperature over a period of time, an adaptor in communication with the temperature monitoring device (TMD) and a data programming device (DPD) in communication with the adaptor. The TMD includes a temperature sensor, a central processing unit (CPU) electrically connected to the temperature sensor, and a power source for continuously supplying power to the CPU. The CPU includes volatile memory into which measurements made by the temperature sensor are stored, the volatile memory in the CPU serving as the sole memory device in the TMD. The TMD is free of means for suspending power from the power source to the CPU. In use, each successive measurement taken by the temperature sensor overwrites the previous measurement stored into the CPU volatile memory. In this manner, the TMD stores no historical data throughout its monitoring process.