Abstract: To obtain an imaging device that can improve temperature detection accuracy. An imaging device of the present disclosure includes a processing unit formed on a first semiconductor substrate and capable of performing predetermined image processing on the basis of image data obtained by an imaging unit, a temperature sensor formed on the first semiconductor substrate and capable of generating a detection signal according to a temperature, and a first pad electrode formed on the first semiconductor substrate and electrically insulated from a circuit formed on the first semiconductor substrate.

Abstract: A thermometer includes an input unit, a control unit, a temperature sensor and an output unit. In response to an input operation is applied on the input unit, the control unit starts to perform a temperature detecting procedure, wherein the control unit instructs the temperature sensor to periodically perform a plurality of temperature detecting operations to obtain a plurality of detected temperature values corresponding to the temperature detecting operations, and only records X largest valid temperature values among the obtained temperature values. In response to determining that the performed temperature to detecting procedure is completed, the control unit removes the largest one among the recorded valid temperature values and calculates an average value of the remaining one or more target temperature values as a temperature of a target object, so as to instruct the output unit display the temperature.

Abstract: The present disclosure relates to circuitry for determining a temperature coefficient value of a resistor. The circuitry comprises circuitry for supplying an AC current signal to the resistor, circuitry for measuring a first voltage across the resistor when the AC current signal is supplied; and processing circuitry configured to determine the temperature coefficient value based on the first voltage.

Abstract: According to one embodiment, a semiconductor device 1 includes a temperature sensor module 10 that outputs a non-linear digital value with respect to temperature and a substantially linear sensor voltage value with respect to the temperature, a storage unit 30 that stores the temperature, the digital value, and the sensor voltage value, and a controller 40 that calculates a characteristic formula using the temperature, the digital value, and the sensor voltage value stored in the storage unit 30, in which the temperature, the digital value, and the sensor voltage value stored in the storage unit 30 include absolute temperature under measurement of absolute temperature, the digital value at the absolute temperature, and the sensor voltage value at the absolute temperature.

Abstract: The disclosure is directed to techniques for a thermostat to determine the air temperature of a room based on measurements of temperatures sensors located inside a housing of the thermostat. Because the thermostat for an evaporative cooler operates at line voltage and controls current flowing to the evaporative cooler, the magnitude of current flowing through the thermostat may vary from nearly zero, when the thermostat is in the powered-off state, to a current on the order of several amps. The variation in current causes a variation in temperature inside the housing of the thermostat. The techniques of this disclosure compensate for changes the internal housing temperature caused by changes in operating mode. The compensation allows the temperature sensors inside the thermostat housing to determine the air temperature of the room in which the thermostat is located, without regard for the operating mode of the evaporative cooler system.

Abstract: A system for serial communication may include a first device and a plurality of devices on a series connection. The first device may have a master circuit and the plurality devices may have a slave circuit. The master circuit may enable the first device to communicate with the plurality devices having the slave circuit on the series connection. The master circuit may enable the first device to send a command frame on the series connection. The command frame may include an execution mode command and a plurality of commands. The second devices may execute the commands within the command frame at or after the end of the command frame based on the execution mode command indicating a synchronous mode of command execution; and may execute the commands within the command frame at the ends of individual ones of the commands based on the execution mode command indicating a non-synchronous mode of command execution.

Abstract: Systems and methods for predicting, detecting, and/or mitigating a pipe freeze are provided. A system for analyzing water in a plumbing system includes a sensor that is configured to measure pressure within a pipe in the plumbing system as a function of time, and a processor that is configured to determine a state of water within the pipe by analyzing the pressure within the pipe as a function of time. The state of the water includes a prediction that the water within the pipe will freeze and/or a determination that the water within the pipe has frozen. The sensor is arranged at a first location within the plumbing system that is remote from a second location within the plumbing system that corresponds to the state of the water.

Abstract: A thermal image positioning method for determining a heat source location of the thermal image is disclosed. The thermal image positioning method includes obtaining a temperature array corresponding to the thermal image and determining a region of interest (ROI) of the temperature array. The thermal image positioning method further includes determining an ROI center reference point of the ROI, determining a plurality of corner points corresponding to the ROI, and determining the heat source location according to at least one of the plurality of corner points. A thermal image positioning system is also disclosed herein.

Abstract: In a time-to-digital converter, a digital signal outputted by a phase information generator is inputted to each of the D terminals of first through Nth (N is a natural number equal to or greater than 2) D-type flip-flop circuits in a first flip-flop group, each of the D terminals is connected to one end of a first delay element, the C terminal of the first D-type flip-flop circuit is connected to another end of the first delay element, the other end of the first delay element is connected to an input terminal, and, when N, the number of flip-flop circuits in the first flip-flop group, is equal to or greater than 3, for each J a natural number from 2 to N?1, C terminal of the (J+1)th D-type flip-flop circuit is connected to one end of the Jth delay element and one end of the (J?1)th delay element is connected to the other end of the Jth delay element.

Abstract: A temperature-sensing bulb support for an air-conditioner indoor unit, and an air-conditioner indoor unit are disclosed. The temperature-sensing bulb support includes: a support body. The support body is adapted to be fixed to a housing of the air-conditioner indoor unit. The support body defines a filter mesh positioning groove configured to accommodate an end frame bar of a filter mesh, and the support body further defines a temperature-sensing bulb accommodating groove configured to accommodate a temperature-sensing bulb. The temperature-sensing bulb accommodating groove is isolated from the filter mesh positioning groove by a partition wall, and the temperature-sensing bulb accommodating groove is located outside the filter mesh positioning groove.

Abstract: A square wave oscillator includes a Schmitt Trigger with a first output that outputs a first output current, a capacitor connected to the first output of the Schmitt Trigger, and a resistor that connects the capacitor to an input of the Schmitt Trigger to form a closed-loop negative feedback. The closed-loop negative feedback sustains an oscillation of the square wave oscillator and causes a frequency and an amplitude of the oscillation to be independent of a supply voltage of the Schmitt Trigger.

Abstract: A temperature sensing device comprising a housing including a display, an extension at least 1.5 inches long extending from the housing, a temperature sensor, and a connector from the sensor to the housing for transmitting the output to the housing. The extension has a proximal section at the housing and an opposed distal section, the distal section being movable relative to the housing. The temperature sensor is at the distal section of the extension for sensing the temperature of a target material and providing an output related to the temperature of the target material. Optionally, the device includes a thermal insulator at the distal section of the extension protecting the temperature sensor from heat from the target material. Optionally, the device includes a light source at the distal section of the extension for aiming the sensor at the target material.

Abstract: A temperature sensor circuit that includes two banks of bipolar transistors where the bipolar transistors of each bank are coupled in parallel in a current leg of the sensor circuit. The current legs are configured to produce voltages and currents that are dependent upon the temperature sensitivity of the bipolar transistors in the current legs. The sensor circuit includes a controller that, in some embodiments, periodically enables subsets of the bipolar transistors of each of bank during operation.

Abstract: A switching power supply controller includes a pulse width modulator circuit. The pulse width modulator circuit includes a delay circuit and a delay control circuit coupled to the delay circuit. The delay control circuit includes an amplifier circuit. The amplifier circuit includes a first input terminal, a second input terminal, and an output terminal. The first input terminal is coupled to a first voltage reference terminal. The second input terminal is coupled to the second voltage reference terminal. The output terminal is coupled to a control terminal of the delay circuit.

Abstract: A method for manufacturing a heat insulation box, wherein said method involves disposing an outer box over the outside of an inner box such that there is space therebetween, covering an opening with an elastic sheet from the outside of the outer box, inserting a jig into the opening from the outside of the outer box to force the elastic sheet into the space between the inner box and the outer box, and injecting the urethane foam heat insulating material into the space between the inner box and the outer box so as to foam therein to form a recess with the elastic sheet tightly adhering to the surface thereof.

Abstract: A control circuit configured to receive a control signal that defines a first phase and a second phase from a surgical generator. The control circuit may include a first resistor, a second resistor in parallel with the first resistor, and a switch in series with the second resistor. The switch may be configured to transition between an open state and a closed state corresponding to an operational mode of a surgical instrument. In the first phase of the control signal, the control circuit is configured to communicate surgical instrument information to the surgical generator. In the second phase of the control signal and in the open state of the switch, the control circuit is configured to provide a first output. In the second phase of the control signal and in the closed state of the switch, the control circuit is configured to provide a second output.

Abstract: Certain embodiments of the present technology relate to temperature sensors for using in an implantable medical device, and methods for use therewith. Such a method can include alternating between producing a first base-to-emitter voltage drop (VBE1) and a second base-to-emitter voltage drop (VBE2), and alternating between using a capacitor to store the VBE1, which is complimentary to absolute temperature (CTAT), and using the same capacitor to store a ?VBE=VBE2?VBE1, which is proportion to absolute temperature (PTAT). The method also includes using a sigma-delta modulator that includes the capacitor to produce a signal having a duty cycle (dc) indicative of the ?VBE stored using the capacitor, and producing a temperature measurement based on the signal having the duty cycle (dc) indicative of the ?VBE.

Abstract: Provided herein may be a temperature sensing circuit and a semiconductor device having the same. The temperature sensing circuit may include an analog voltage generation circuit configured to convert a temperature into a voltage and output a temperature voltage, an analog-digital converter configured to convert the temperature voltage into a digital code, and a compensation circuit configured to adjust the digital code and then output an operation code to remove noise from the temperature voltage.

Abstract: Performing a temperature measurement operation includes a first phase and a second phase. The first phase includes providing a voltage indicative of a measured temperature to a first input of a comparator, providing a ramp signal to a second input of the comparator, and generating at an output of the comparator, pulses based on a comparison of the first input to the second input of the comparator. The second phase includes providing the voltage indicative of a measured temperature to the second input of the comparator, providing the ramp signal to the first input of the comparator, and generating at an output of the comparator, pulses based on a comparison of the first input to the second input of the comparator. Performing the temperature measurement operation also includes utilizing the pulses generated during the first and second phases to provide a digital indication of the measured temperature.

Abstract: A multi-chip package includes a first die having temperature sensors and a second die. The first die generates temperature deviation information of m (m<n) bits based on temperature information of n bits produced by the temperature sensors. The first die provides the temperature deviation information of m bits rather than the temperature information of n bits to the second die. An internal operation of the second die is controlled using the temperature deviation information output by the first die.

Abstract: A device can include a temperature circuit that can selectively set one of a plurality of temperature ranges. Each temperature range can have a temperature range upper limit value and a temperature range lower limit value. The temperature circuit can be disabled in response to a detection of a transition in a power supply voltage. In some embodiments, the temperature circuit can also be enabled a predetermined time period after the detection of the transition in the power supply voltage.

Abstract: Reference center circuitry for a metrology system is disclosed. In one embodiment, the circuitry includes a reference sensor having a topology and characteristics identical to a number of sensors throughout an IC. The both the reference sensor and the sensors on the IC may be used to perform voltage and temperature measurements. The reference sensor may receive a voltage from a precision voltage supply, and may be used as a sensor to provide a basis for calibrating the other sensors, as well. Thereafter, temperature readings obtained from the other sensors may be correlated to the readings obtained by the reference sensor for enhanced accuracy. The reference center circuitry also includes analog process monitoring circuitry, which may be coupled to some, if not all of the transistors implemented on an IC.

Abstract: A hardware monitoring system and a method therefor are disclosed. The hardware monitoring method includes: sensing a first temperature value of a first temperature area by a first temperature sensor and sensing a second temperature value of a second temperature area by a second temperature sensor; reading and compensating for the second temperature value by a complex programmable logic device (CPLD); and reading the first temperature value and the compensated second temperature value and controlling heat dissipation of the computer system based on the first temperature value and the compensated second temperature value, by a hardware monitor. In this method, temperature values of different areas are sensed with multiple temperature sensors and are read and modified by the CPLD, thereby allowing temperature compensation for the temperature sensors and addressing the problem of inability to individually compensate for temperature values of different areas.

Abstract: A circulator blower controller for a circulator blower of a heating, ventilation, and air conditioning (HVAC) system of a building includes an interface configured to receive a demand signal with an operating mode from a thermostat. A switching circuit selectively connects power to a tap of a motor of the circulator blower. A data store configured to store a mapping from a speed to the tap. For each tap, a processor observes power consumed by the circulator blower while power is connected to the tap by the switching circuit. The processor determines the mapping by sorting the taps based on observed power consumption. The processor selects a first speed based on the demand signal from the thermostat. The processor identifies a first tap from the mapping based on the first speed and generates the tap selection signal to control the switching circuit to connect power to the first tap.

Abstract: A temperature sensor for generating bit stream having duty ratio depending on temperature, includes: voltage generator to receive control bit and output first voltage having CTAT characteristic when the control bit is in first state and to output second voltage having PTAT characteristic when the control bit is in second state; integrating circuit to integrate value obtained by multiplying input voltage with a first coefficient in the first state and to integrate value obtained by multiplying the input voltage with second coefficient in the second state; quantizer to generate the bit stream by quantizing an output of the integrating circuit; pattern generator which is enabled in calibration mode and generates test signal having predetermined duty ratio; and subtraction circuit which is enabled in the calibration mode and subtracts reference voltage for calibration from an output voltage of the voltage generator in the first state.

Abstract: Temperature sensing circuits are provided. The temperature sensing circuits may include a temperature sensing unit and a buffer unit. The temperature sensing unit may include a transistor that has a first pair of terminals having a first PN junction of the transistor therebetween and a second pair of terminals having a second PN junction of the transistor therebetween. The first pair of terminals are connected together. The temperature sensing unit may output a first temperature sensing voltage comprising a voltage between the second pair of terminals at a first node. The buffer unit may be connected to the first node. The buffer unit may have a cascode follower structure and may output a second temperature sensing voltage that has a magnitude proportional to a magnitude of the first temperature sensing voltage at a second node.

Abstract: A user device may detect a connect event associated with a sensor device. The user device may be associated with a first sensor, and the sensor device may be associated with a second sensor. The user device may identify the second sensor based on detecting the connect event associated with the sensor device. The user device may replace the first sensor with the second sensor based on identifying the second sensor associated with the sensor device. The user device may provide data associated with the second sensor for use by an application of the user device.

Abstract: A temperature detection element of a temperature sensor is connected to a print wire and three print wires for an input and output of a print substrate, one end of a lead wire for a connection is connected and fixed with solder to an external circuit for connection electrodes of the print wire, and the other end is externally drawn out of a sealing member of a hardened resin. Within the housing, the entire bottom surface of the print substrate is supported by a lower fixed member, and an end, closer to an opening part of the housing, of the print substrate, is sandwiched and fixed by an upper fixed member and the lower fixed member. The housing is configured with the same material and size as the housing of the temperature control element, and the temperature detection element inside is placed at a position approximated to a placement of a thermal response element of the temperature control element.

Abstract: A semiconductor device that may include at least one temperature sensing circuit is disclosed. The temperature sensing circuits may be used to control various operating parameters to improve the operation of the semiconductor device over a wide temperature range. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at other operating temperatures. The temperature sensing circuit may provide a plurality of temperature ranges for setting the operational parameters. Each temperature range can include a temperature range upper limit value and a temperature range lower limit value and adjacent temperature ranges may overlap. The temperature ranges may be set in accordance with a count value that can incrementally change in response to the at least one temperature sensing circuit.

Abstract: A field programmable gate array (FPGA) includes a temperature sensor array. The FPGA also includes a supply voltage modulation circuit. The supply voltage modulation circuit is coupled to the temperature sensor array.

Abstract: A driving signal control circuit includes a discharge circuit, a counter circuit, and a control circuit. The discharge circuit is configured to compare a monitored voltage and a reference voltage, and generate a discharge signal. The monitored voltage is proportional to a core voltage. The counter circuit is configured to perform an up/down count operation according to the discharge signal, and generate a count signal. The control circuit is configured to generate a driving signal which has an enable period proportional to the count signal.

Abstract: A current-to-voltage converter receives a current which varies with temperature according to a selected one of two or more temperature coefficient factors and converts it to a temperature-dependent voltage to be used as a control signal to a varactor in a voltage controlled oscillator, VCO, to compensate for temperature-induced frequency drift in the VCO. A feedback arrangement with hysteresis is provided for controlling the selection of the temperature coefficient factor and operates by comparing the temperature-dependent voltage with a reference voltage. The reference voltage may be pre-set and equivalent to a known operating temperature. A switching signal is generated when Vout approaches the reference voltage and in response, a control module generates a selection signal for selecting a different temperature coefficient factor.

Abstract: An automated method for diagnosing an EGHR having a coolant path, an exhaust path, a heat exchanger, and a valve. The coolant path passes through the heat exchanger and the valve selectively directs the exhaust path through the heat exchanger. The method includes monitoring an inlet temperature and an outlet temperature of the coolant path, determining an instantaneous coolant power from the monitored inlet temperature and outlet temperature, and integrating the instantaneous coolant power to determine a total energy recovered by the coolant path. The method monitors an instantaneous exhaust power, determines an instantaneous available EGHR power from the instantaneous exhaust power, and integrates the instantaneous available EGHR power to determine a nominal EGHR energy. A differential is calculated between the nominal EGHR energy and the total energy recovered by the coolant path. If the calculated differential is greater than an allowable tolerance, an EGHR error signal is sent.

Abstract: The monitoring circuit of a semiconductor device includes: a boot-up controller configured to generate a boot-up enable signal in response to a power-up signal and a boot-up command signal; a read-period generator configured to output a read-period signal in response to a boot-up read signal; and a monitoring unit configured to output the read-period signal to an external output terminal during activation of the boot-up enable signal to allow the read-period signal to be monitored.

Abstract: A temperature sensor in a semiconductor device includes a temperature detection circuit for outputting a voltage according to the chip temperature, a reference voltage generating circuit for generating a plurality of reference voltages, and a plurality of voltage comparators for comparing each reference voltage with an output voltage of the temperature detection circuit and thereby generating a chip temperature detection signal configured with multiple bits. Further, the temperature sensor includes a control circuit for controlling the reference voltages generated by the reference voltage generating circuit based on the chip temperature detection signal and thereby changing correspondence between the chip temperature detection signal and the chip temperature to shift a chip temperature detection range.

Abstract: A thermal sensing system includes a circuit having a layout including standard cells arranged in rows and columns. First and second current sources provide first and second currents, respectively. The thermal sensing system includes thermal sensing units, first and second switching modules, and an analog to digital converter (ADC). Each thermal sensing unit is configured to provide a voltage drop dependent on a temperature at that thermal sensing unit. The first switching module is configured to select one of the thermal sensing units. The second switching module includes at least one switch controllable by a control signal. The at least one switch is configured to selectively couple the thermal sensing units, based on the control signal, to one of the first and second current sources, via the first switching module. The ADC is configured to convert an analog voltage, provided by the selected thermal sensing unit, to a digital value.

Abstract: A temperature sensor includes a current generator that detects a temperature and generates a temperature dependent current, the temperature dependent current having a current level corresponding to the detected temperature. A current-to-voltage converter converts the temperature dependent current into a temperature dependent voltage, the temperature dependent voltage having a voltage level corresponding to the detected temperature. A signal generator generates a pulse signal having a period determined from a voltage difference between the temperature dependent voltage and a reference voltage. A counter counts a number of cycles of a reference clock signal that occur during one cycle of the pulse signal to output a temperature code indicative of the temperature.

Abstract: A temperature sensing device includes a first frequency generator for generating a first clock signal having a first frequency that is constant regardless of a temperature; a second frequency generator for generating a second clock signal having a second frequency that is changed according to the temperature; and a data holding unit for outputting a temperature code indicating a number of pulses of the second clock signal counted for a reference time at which a number of pulses of the first clock signal reaches a predetermined threshold. The temperature sensing device does not require a reference clock signal input from the outside and is insensitive to the change in the process, thereby being capable of improving the performance of the temperature sensing device.

Abstract: The invention relates to methods and devices for control of an integrated thin-film device with a plurality of microfluidic channels. In one embodiment, a microfluidic device is provided that includes a microfluidic chip having a plurality of microfluidic channels and a plurality of multiplexed resistive thermal detectors (RTDs). Each of the RTDs is associated with one of the microfluidic channels. The RTDs are connected to a power supply through individual electrodes and pairs of common electrodes. Adjacent RTDs may be driven with alternating polarities, and the current in the common electrodes may be minimized using a virtual ground circuit. The compact microfluidic device is capable of fast heating and highly precise thermal control. The compact microfluidic device is also capable using the RTDs to sense temperature without their heating capability.

Abstract: A system and method are provided for monitoring in real time the operating state of an IGBT device, to determine a junction temperature and/or the remaining lifetime of an IGBT device. The system includes a differential unit configured to receive a gate-emitter voltage characteristic of the IGBT device to be measured and to differentiate the gate-emitter voltage characteristic to obtain pulses correlating with edges formed by a Miller plateau phase during a switch-off phase of the IGBT device. The system also includes a timer unit configured to measure the time delay between the obtained pulses indicating the start and end of the Miller plateau phase during the switch-off phase of the IGBT device, and a junction temperature calculation unit configured to determine at least one of the junction temperature of the IGBT device and/or the remaining lifetime of the IGBT device based on the measured time delay.

Abstract: A ratio meter includes a converter circuit, a first counter, a delay circuit, and a second counter. The converter circuit is configured to receive a temperature-independent signal, to convert the received temperature-independent signal into a first frequency signal during a first phase, to receive a temperature-dependent signal, and to convert the temperature-dependent signal into a second frequency signal during a second phase. The first counter is configured to receive the first frequency signal and to generate a control signal by counting a predetermined number of pulses of the first frequency signal count. The delay circuit is configured to delay the control signal for a predetermined time delay. The second counter is configured to receive the second frequency signal and to generate a count value by counting the second frequency signal.

Abstract: A control unit sets a time interval for measuring a temperature of a liquid crystal panel as a first time interval (1 second), and thereafter measures the temperature of the liquid crystal panel each time the first time interval elapses. When the temperature of the liquid crystal panel is stabilized, the control unit sets a time interval for measuring the temperature of the liquid crystal panel as a second time interval (5 seconds). The control unit measures the temperature of the liquid crystal panel each time the second time interval elapses. Moreover, if an operation to change the amount of light reaching the liquid crystal panel is performed, the control unit restores the time interval for measuring the temperature of the liquid crystal panel to the first time interval.

Abstract: An on die thermal sensor (ODTS) of a semiconductor memory device includes a high voltage generating unit for generating a high voltage having a voltage level higher than that of a power supply voltage of the semiconductor memory device; and a thermal information output unit for sensing and outputting a temperature as a thermal information code, wherein the thermal information output unit uses the high voltage as its driving voltage.

Abstract: A method, system or computer usable program product for providing alerts of inefficiency of an environmental conditioning system including, responsive to a cycle initiation by the environmental conditioning system, measuring a difference between an intake temperature and an outlet temperature after a predetermined period of time, and responsive to the difference being below a minimum level, generating an alert.

Abstract: A temperature detecting apparatus includes a temperature detecting circuit configured to output a first pulse signal according to a temperature detected by a temperature sensor, and an insulating transformer configured to transmit the first pulse signal to an integrated circuit which is operated by an operation voltage different from that of the temperature detecting circuit. The insulating transformer is installed between the temperature detecting circuit and the integrated circuit. The temperature detecting circuit and the insulating transformer are mounted on a common substrate.

Abstract: Some embodiments of the present disclosure relate to a stacked integrated chip structure having a thermal sensor that detects a temperature of one or a plurality of integrated chips. In some embodiments, the stacked integrated chip structure has a main integrated chip and a secondary integrated chip located on an interposer wafer. The main integrated chip has a reference voltage source that generates a bias current. The secondary integrated chip has a second thermal diode that receives the bias current and based thereupon generates a second thermal sensed voltage and a second reference voltage that is proportional to a temperature of the secondary integrated chip. A digital thermal sensor within the main integrated chip determines a temperature of the secondary integrated chip based upon as comparison of the second thermal sensed voltage and the reference voltage.

Abstract: A time-domain temperature sensing system includes a cyclic delay line, a path selection circuit and a counter. The cyclic delay line includes a plurality of logic components connected. The path selection circuit connects with the cyclic delay line and the counter connects with the path selection circuit. The cyclic delay line is operated to sense and convert a temperature into a time pulse to generate a temperature-related time pulse width signal, and the cyclic delay line is further operated to measure the temperature-related time pulse width signal via the path selection circuit. The cyclic delay line is operated to convert the temperature into the time pulse and the counter is further operated to convert the temperature-related time pulse width signal into a digital signal via the path selection circuit, thereby generating a temperature-to-digital signal.

Abstract: Embodiments disclosed in the detailed description include digital temperature estimators (DTEs) disposed in integrated circuits (ICs) for estimating temperature within the ICs. Related systems and methods are also disclosed. In one embodiment, the DTEs can be used to estimate temperatures in an IC by implementing a temperature estimation model (TEM). The TEM can provide an estimated temperature of an IC block disposed in the IC based on activity event(s) associated with the IC block, as opposed to providing temperature sensors in the IC to measure temperature of the IC block directly. The DTEs can be operated in real time so that power and/or thermal regulation systems of the IC can obtain accurate and reliable temperature estimation from the DTEs. In this manner, thermal dissipation in the IC may be regulated more effectively.

Abstract: A thermal sensor includes a comparator having a first and second input nodes. A reference voltage generator is electrically coupled with the first input node. The reference voltage generator is configured to provide a reference voltage that is substantially temperature-independent. A temperature sensing circuit is electrically coupled with the second input node. The temperature sensing circuit is configured to provide a temperature-dependent voltage. The temperature sensing circuit includes a current mirror. A first metal-oxide-semiconductor (MOS) transistor is electrically coupled between the current mirror and ground. A first resistor is electrically coupled with the current mirror. A second MOS transistor is electrically coupled with the first resistor in series. The second MOS transistor and the first resistor are electrically coupled with the first MOS transistor in a parallel fashion.

Abstract: A temperature sensor includes a signal delaying apparatus, a comparison apparatus, a multiplier and a counting apparatus. The signal delaying apparatus is configured to receive a step signal, perform a phase delay operation on the received step signal according to a temperature degree, and thereby forming a first output signal. The comparison apparatus is configured to receive the first output signal and the step signal, and accordingly output a second output signal. The multiplier is configured to receive the second output signal and a clock signal, and accordingly output a third output signal. The counting apparatus is configured to receive the third output signal, count the number of pulses of the third output signal, and generate a digital code accordingly.